CN213721925U

CN213721925U - Monitoring assembly and intelligent equipment

Info

Publication number: CN213721925U
Application number: CN202020642572.0U
Authority: CN
Inventors: 郑楠楠; 马颖江; 史波; 敖利波; 曾丹
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2020-04-24
Filing date: 2020-04-24
Publication date: 2021-07-20
Anticipated expiration: 2030-04-24

Abstract

The utility model relates to a technical field that intelligence was dressed, concretely relates to monitoring subassembly and contain its smart machine. The monitoring assembly comprises a substrate, a first cavity, a second cavity and a third cavity, wherein the first cavity, the second cavity and the third cavity are formed on the same side of the substrate, one end, opposite to the substrate, of the first cavity is an opening covered with protective glass, one end, opposite to the substrate, of the second cavity is an opening covered with a first optical filter, one end, opposite to the substrate, of the third cavity is an opening covered with a second optical filter, a first chip is arranged in the first cavity, a second chip is arranged in the second cavity, and a body temperature detection chip is arranged in the third cavity. This scheme adopts the mode of integrated body temperature detection chip in the original monitoring subassembly in the smart machine, can be so that the smart machine has the temperature detection function to satisfy the demand that people used at any time, and body temperature detection subassembly does not occupy the inner space of smart machine, need not at smart machine surface trompil, and thus improve the utilization ratio of smart machine inner space.

Description

Monitoring assembly and intelligent equipment

Technical Field

The utility model relates to a technical field that intelligence was dressed, concretely relates to monitoring subassembly and contain its smart machine.

Background

At present, people are more and more to the demand that detects body temperature, and especially people appear uncomfortable under outdoor or business trip condition, when can't seek medical advice, people often can measure the body temperature of oneself at first, detect whether the condition such as generate heat appears, however, because people often can not hand-carry the thermometer.

Along with the popularity of intelligent wearing products such as bracelet, more and more functions are added on intelligent products such as bracelet, and the bracelet also develops towards slimming, miniaturization. The temperature detection function can be integrated on an intelligent wearable product aiming at the urgent need of detecting the body temperature at any time and any place and realizing the monitoring management of the body temperature detection result.

The integrated temperature of wearing the product to present intelligence detects the function, often needs to carry out the trompil, destroys its appearance aesthetic feeling and can't the original inner space of rational utilization product.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems or at least partially solve the above technical problems, an object of the present application is to increase an element for body temperature detection inside a product by reasonably utilizing an inner space of the product without increasing openings of an original product.

To achieve the above object, a first aspect of the present application provides a monitoring assembly.

According to the monitoring subassembly that this application embodiment provided, it includes the base plate and forms first cavity, second cavity and the third cavity that the base plate was with one side, first cavity with the one end that the base plate is relative is for having the opening that covers protection glass, the second cavity with the one end that the base plate is relative is for having the opening that covers first light filter, the third cavity with the one end that the base plate is relative is for having the opening that covers the second light filter, be provided with first chip in the first cavity, be provided with the second chip in the second cavity, be provided with the body temperature in the third cavity and detect the chip.

Furthermore, the first chip, the second chip and the body temperature detection chip are electrically connected with the substrate.

Furthermore, the first chip is a heart rate monitoring transmitting chip, the second chip is a heart rate monitoring receiving chip, and a coating film matched with the heart rate monitoring receiving chip is arranged on the first optical filter.

Furthermore, the body temperature detection chip is an infrared thermopile chip, and the second optical filter is provided with a coating film matched with the infrared thermopile chip.

Further, the monitoring assembly further comprises a bracket, and the bracket and the substrate form the first chamber, the second chamber and the third chamber.

Further, the first optical filter and the second optical filter are integrally arranged.

Furthermore, a partition plate is arranged between the second chamber and the third chamber, and one end, connected with the first optical filter and the second optical filter which are integrally arranged, of the partition plate is of a T-shaped structure.

Furthermore, the integrally arranged parts of the first optical filter and the second optical filter, which are connected with the partition board, are arranged as non-functional areas.

To achieve the above object, a second aspect of the present application provides a smart device comprising the monitoring component provided by the first aspect of the present application.

Further, the smart device is a smart watch or a smart bracelet.

Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the utility model provides a monitoring subassembly includes the base plate and forms the base plate is in with first cavity, second cavity and the third cavity of one side, be provided with first chip in the first cavity, be provided with the second chip in the second cavity, be provided with the body temperature in the third cavity and detect the chip. The mode of this scheme adoption integrated body temperature detection chip in the original monitoring subassembly in the smart machine can make the smart machine among the prior art have the temperature and detect the function to satisfy the demand that people used at any time, and body temperature detection subassembly does not occupy the inner space of smart machine, need not at the surperficial trompil of smart machine, thereby improves the utilization ratio of smart machine inner space.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

FIG. 1 is a schematic view of the installation position of a monitoring component in a smart bracelet in the prior art;

fig. 2 is a schematic structural diagram of a monitoring assembly for a smart bracelet in the prior art;

fig. 3 is a schematic structural diagram of a monitoring assembly according to an embodiment of the present disclosure;

FIG. 4 is a diagram illustrating a structure of an optical filter in a monitoring assembly according to an embodiment of the present disclosure;

FIG. 5 is a diagram illustrating a chip-to-substrate connection in a monitoring assembly according to an embodiment of the present disclosure;

FIG. 6 is a reference view of a bracket coupled to a filter in a monitoring assembly according to an embodiment of the present disclosure; and

fig. 7 is a structural reference diagram of an intelligent device and a schematic position diagram of a monitoring component in the intelligent device according to an embodiment of the present application.

In the figure:

1. a substrate; 2. a first chamber; 3. a second chamber; 4. a third chamber; 5. protecting glass; 6. a first optical filter; 7. a second optical filter; 8. a first chip; 9. a second chip; 10. A body temperature detection chip; 11. a support; 1101. a partition plate; 12. a non-functional region.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings. In the drawings, the thicknesses of layers and regions are adjusted for convenience of explanation, and the illustrated sizes do not represent actual dimensions. Although these figures do not reflect the actual dimensions of the device exactly, they do reflect the mutual positions of the regions and the constituent structures, in particular the upper and lower and adjacent relationships between the constituent structures. The reference figures are schematic illustrations of idealized embodiments of the present invention which should not be construed as limited to the particular shapes of regions illustrated in the figures, but are to include resulting shapes.

As shown in fig. 1 and 2, a monitoring component used in an intelligent bracelet in the prior art is provided, and is located inside the intelligent bracelet, where 1 'is a substrate, 2' is a support, 3 'is a transmitting chip, 4' is a receiving chip, 5 'is protective glass, and 6' is an optical filter. The heart rate of the wearer can be acquired through the cooperation of the transmitting chip and the receiving chip. But it does not possess the function of acquireing using body temperature, consequently need increase body temperature determine module in intelligent product, for the utilization ratio that has improved intelligent product inner space and do not destroy its outward appearance aesthetic feeling, need be in the same place body temperature determine module and original heart rate monitoring subassembly integration.

In order to solve the above problem, as shown in fig. 3, the monitoring assembly provided in the embodiment of the present application includes a substrate 1, and a first chamber 2, a second chamber 3, and a third chamber 4 which are formed on the same side of the substrate 1, where the first chamber 2 and the opposite end of the substrate 1 are openings covered with a protection glass 5, the second chamber 3 and the opposite end of the substrate 1 are openings covered with a first optical filter 6, the opposite end of the third chamber 4 and the opposite end of the substrate 1 are openings covered with a second optical filter 7, a first chip 8 is disposed in the first chamber 2, a second chip 9 is disposed in the second chamber 3, and a body temperature detection chip 10 is disposed in the third chamber 4. The first chip 8, the second chip 9 and the body temperature detection chip 10 are all electrically connected with the substrate 1. The first chip 8, the second chip 9 and the body temperature detecting chip 10 are integrated on the same substrate 1, so that the control is convenient and the production cost is reduced. The arrangement of the first chamber 2, the second chamber 3 and the third chamber 4 can prevent the first chip 8, the second chip 9 and the body temperature detecting chip 10 from interfering with each other during operation.

The mode that this embodiment adopted integrated body temperature detection chip 10 in the original monitoring subassembly in the smart machine can make the smart machine among the prior art have the temperature and detect the function to satisfy the demand that people used at any time, and body temperature detection chip 10 is integrated on original monitoring subassembly, does not occupy the inner space of smart machine, need not at smart machine surface trompil, thereby improves smart machine inner space's utilization ratio.

It should be noted that the first chip 8 and the second chip 9 are original functional structures of the monitoring component, and are used for implementing basic functions of the smart device, including but not limited to a heart rate monitoring function. For example, in some embodiments, the first chip 8 is a heart rate monitoring transmitting chip, the second chip 9 is a heart rate monitoring receiving chip, the first optical filter 6 is provided with a coating film matched with the heart rate monitoring receiving chip, and specifically, the first optical filter 7 is used for being matched with the heart rate monitoring receiving chip and only allowing light rays in a wavelength band required by the heart rate monitoring receiving chip to enter.

In some embodiments, the body temperature detecting chip 10 is configured as an infrared thermopile chip, and the second optical filter 7 is configured with a coating film that is matched with the infrared thermopile chip, so that it only allows the infrared light required by the infrared thermopile chip to pass through, for example, the second optical filter 7 only allows the infrared light in the wavelength band of 9.67um to 9.64um to enter. During the use, the infrared ray that the human body sent will be received by infrared thermopile chip via second light filter 7, and the voltage stack output of each thermocouple on the thermopile chip to convert temperature signal into voltage signal, and carry out temperature data through the temperature processing subassembly that sets up in the equipment and calculate, and finally show the temperature that calculates on the screen of smart machine.

As a specific implementation manner, as shown in fig. 3, the monitoring assembly further includes a bracket 11, and the bracket 11 and the substrate 1 form the first chamber 2, the second chamber 3, and the third chamber 4. The support 11 comprises a partition 1101 arranged between the second chamber 3 and the third chamber 4, the partition 1101 serving the purpose of separating the second chamber 3 from the third chamber 4.

In some embodiments, as shown in fig. 4, the first filter 6 and the second filter 7 are integrally disposed, so that the number of components can be reduced, and assembly and connection are facilitated. Preferably, one end of the partition 1101, which is connected to the first optical filter 6 and the second optical filter 7 that are integrally arranged, is set to be a T-shaped structure, so that the first optical filter 6 and the second optical filter 7 that are integrally arranged are stably supported. The integrally arranged parts of the first optical filter 6 and the second optical filter 7 connected with the partition 1101 can be set as a non-functional area 12, so that isolation is realized, and mutual interference of light rays in the first optical filter 6 and the second optical filter 7 is avoided.

As shown in fig. 5 and 6, an assembling method of the monitoring assembly provided by the embodiment of the application is provided. First, as shown in fig. 5, a first chip 8, a second chip 9 and a body temperature detecting chip 10 are soldered on the same substrate; then, as shown in fig. 6, the support 11 is combined with the filter and the protective glass, and then the two parts, i.e., the chip-substrate and the support-filter-protective glass, are combined together to form the structure shown in fig. 3 and are installed inside the smart device.

It should be noted that, the structural improvement that the purpose of this application was made with body temperature detection chip integration on original monitoring subassembly, to first chip, second chip and be used for infrared thermopile chip's of body temperature detection chip principle and type selection all be applicable to prior art, and the realization of each chip detection function and subsequent information processing part all are applicable to prior art, no longer give unnecessary details.

The monitoring assembly according to the above embodiments may further include other necessary components or structures, and the corresponding arrangement positions and connection relationships may refer to the monitoring assembly structure in the prior art, and the connection relationships, operation and working principles of the structures that are not mentioned are known to those skilled in the art and will not be described in detail herein.

As shown in fig. 7, the embodiment of the present application also correspondingly protects the smart device using the monitoring component, where the smart device includes, but is not limited to, a smart band and a smart watch, and the monitoring component is located inside the smart band or the smart watch.

The intelligent device disclosed in the embodiment of the present application includes the monitoring component provided in the above embodiment, and therefore the intelligent device having the monitoring component also has all the above technical effects, which is not described in detail herein. Other configurations and operations of the smart device will be known to those of ordinary skill in the art and will not be described in detail herein.

Some embodiments in this specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The foregoing is merely a detailed description of the invention that enables those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a monitoring assembly, its characterized in that includes base plate (1) and forms first cavity (2), second cavity (3) and third cavity (4) that base plate (1) was same one side, first cavity (2) with the one end that base plate (1) is relative is for having the opening that covers protection glass (5), second cavity (3) with the one end that base plate (1) is relative is for having the opening that covers first light filter (6), third cavity (4) with the one end that base plate (1) is relative is for having the opening that covers second light filter (7), be provided with first chip (8) in first cavity (2), be provided with second chip (9) in second cavity (3), be provided with body temperature detection chip (10) in third cavity (4).

2. The monitoring assembly according to claim 1, characterized in that the first chip (8), the second chip (9) and the body temperature detection chip (10) are all electrically connected to the substrate (1).

3. The monitoring assembly according to claim 1, wherein the first chip (8) is a heart rate monitoring transmitting chip, the second chip (9) is a heart rate monitoring receiving chip, and the first optical filter (6) is provided with a coating film matched with the heart rate monitoring receiving chip.

4. The monitoring assembly according to claim 3, wherein the body temperature detecting chip (10) is configured as an infrared thermopile chip, and the second filter (7) is provided with a coating film matched with the infrared thermopile chip.

5. The monitoring assembly according to claim 1, further comprising a bracket (11), the bracket (11) forming with the substrate (1) the first chamber (2), the second chamber (3) and the third chamber (4).

6. The monitoring assembly according to claim 1, wherein the first filter (6) and the second filter (7) are integrally provided.

7. The monitoring assembly according to claim 6, wherein a partition plate (1101) is arranged between the second chamber (3) and the third chamber (4), and one end of the partition plate (1101) connected with the first optical filter (6) and the second optical filter (7) which are integrally arranged is arranged in a T-shaped structure.

8. The monitoring assembly according to claim 7, wherein the portions of the first filter (6) and the second filter (7) that are integrally provided and connected to the partition (1101) are provided as the non-functional region (12).

9. A smart device comprising a monitoring assembly as claimed in any one of claims 1 to 8.

10. The smart device of claim 9, wherein the smart device is a smart watch or a smart bracelet.