CN208781856U - A kind of photosensor package structure - Google Patents
A kind of photosensor package structure Download PDFInfo
- Publication number
- CN208781856U CN208781856U CN201821533002.7U CN201821533002U CN208781856U CN 208781856 U CN208781856 U CN 208781856U CN 201821533002 U CN201821533002 U CN 201821533002U CN 208781856 U CN208781856 U CN 208781856U
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- CN
- China
- Prior art keywords
- chip
- substrate
- package structure
- cushion block
- glass
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of photosensor package structure, including substrate, the second chip is provided on substrate, the second chip is connect with electrical property of substrate；Cushion block is provided on second chip；The first chip is provided on second cushion block；Glass is covered with above first chip；Second chip is control processing chip, and the first chip is photoelectric sensor chip；The glass is covered on the positive pole-face of the first chip, is connect by metallic conductor with electrical property of substrate on the positive pole-face of the first chip.Solving can make existing photosensor package structure size smaller, keep its induction sensitiveer, meet existing demand.
Description
Technical field
The utility model belongs to sensor packaging techniques field；More particularly to a kind of photosensor package structure.
Background technique
Cardiovascular disease is the primary disease of current threat human health, and human pulse wave reflects the machine of cardiovascular system
Energy.The information such as organism physiology, the state of mind, physical strength level that intensity, speed and the rhythm and pace of moving things of pulse wave reflect can be shown
Personal health state, or as other Medical Instruments auxiliary monitoring, for doctor provide diagnosis with reference to etc..
The monitoring method of pulse wave is reversed between mainly using photoplethymograph (PPG) or piezoelectric inductor principle at present
Reflect the variation of pulse wave.Photoplethymograph is changed and is irradiated on skin using the optical absorption of hemoglobin in blood
The light intensity of light emitting diode (LED) obtains pulse waveform and measuring to the light through skin reflex indirectly.Other one
Kind voltage inductance answers rule to cause the fluctuation of skin to work as skin since the interval of sensor and skin is very small by the fluctuation of pulse
When skin fluctuates, cause the fluctuation of the air between pressure element, remake with electric signal is generated on piezoelectric membrane, thus
The mechanical wave of pulse is converted into the variation of electric signal.
Utility model content
The utility model provides a kind of photosensor package structure；Solving can be such that existing photoelectric sensor seals
Assembling structure is smaller, keeps its induction sensitiveer, meets existing demand.
The technical solution of the utility model is: a kind of photosensor package structure, including substrate, and is provided on substrate
Two chips, the second chip are connect with electrical property of substrate；Cushion block is provided on second chip；The first chip is provided on second cushion block；
Glass is covered with above first chip；Second chip is control processing chip, and the first chip is photoelectric sensor chip；Institute
It states glass to be covered on the positive pole-face of the first chip, be connected on the positive pole-face of the first chip by metallic conductor and electrical property of substrate
It connects；The cathode face of first chip is connect by metallic conductor with electrical property of substrate；It is provided with plastic package structure on the substrate,
Plastic package structure wraps up the second chip, cushion block, the first chip and glass and metallic conductor；The upper surface of the glass is exposed.
Further, the utility model is also characterized by:
Wherein four sides of encapsulating structure are flushed with four sides of substrate, and the upper surface of encapsulating structure and glass are neat
It is flat.
Metal layer is wherein coated on cushion block, the cathode face of the first chip passes through metal layer and metallic conductor and electrical property of substrate
Connection.
The wherein cathode face contact of a part of the metal layer on cushion block and the first chip；Lead on another part of metal layer
Welding metal electric conductor is crossed to connect with electrical property of substrate.
Wherein the positive face of the first chip includes sensing unit and non-sensing unit, and the glass is covered on sensing unit, non-biography
It is provided with several pads on sensillary area, metallic conductor is connected between pad and substrate.
Wherein the second chip has being disposed on the substrate on one side for projection piece.
Wherein the bottom surface of cushion block is provided with adhesive film, and cushion block is bonded the second chip by adhesive film.
Compared with prior art, the utility model has the beneficial effects that passing to photoelectric transfer using glass in the encapsulating structure
Sensor, and be packaged glass, the first chip, cushion block, the second chip and metallic conductor by encapsulating structure, and
First chip connect by metallic conductor with substrate, and the second chip is directly connect with substrate, realization photoelectric sensor chip and
Control processing chip between information exchange, using cushion block realize photoelectric sensor chip and control processing chip between every
From.
Further, it is coated with metal layer on cushion block, photoelectric sensor cathode face and substrate are realized by metal layer
Connection.
Further, glass only needs to cover the sensing unit of the positive pole-face of photoelectric sensor chip, and non-sensing unit is for connecting
Connect substrate.
Further, it is realized by adhesive film to the bonding of the second chip on cushion block, prevents from padding during encapsulation
Block is slided with respect to the second chip.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model photosensor package structure.
In figure: 1 is glass；2 be the first chip；3 be cushion block；4 be the second chip；5 be metallic conductor；6 be substrate；7
For plastic package structure；8 be projection piece.
Specific embodiment
The technical solution of the utility model is further illustrated in the following with reference to the drawings and specific embodiments.
The utility model provides a kind of photosensor package structure, as shown in Figure 1, including substrate 6, sets on substrate 6
It is equipped with the second chip 4, the second chip 4 is control processing chip, and there is the second chip 4 one side of projection piece 8 to connect with substrate 6
Touching, the second chip 4 are electrically connected by projection piece 8 and substrate 6；Cushion block 3 is provided on second chip 4, cushion block 3 is silicon wafer, pottery
The materials such as porcelain or glass are made, and four sides of cushion block 3 are flushed with four sides of the second chip 4；The top of cushion block 3 is provided with
First chip 2；First chip 2 includes positive pole-face and cathode face, and upper surface of the cathode of the first chip 2 down with cushion block 3 connects
The anode of touching, the first chip 2 is face-up, and the positive pole-face of the first chip 2 and cathode face are electrically connected with substrate 6；First core
Glass 1 is covered on the positive pole-face of piece 2.
Wherein, the first chip 2 is photoelectric sensor chip, and the second chip 4 is control processing chip.
Preferably, the positive pole-face of the first chip 2 and cathode face pass through metallic conductor 5 and substrate 6 is electrically connected.
Preferably, the upper surface of cushion block 3 is coated with metal layer, and metal layer is Gold plated Layer, silver coating, copper plate or aluminium coated；
The cathode face of first chip 2 and metal layer are electrically connected, and the metallic conductor with 6 electrical communication of substrate is welded on metal layer,
To realize that the cathode face of the first chip 2 is electrically connected by the metal layer of 3 upper surface of cushion block, metallic conductor 5 and substrate 6.
The positive face of first chip 2 includes sensing unit and non-sensing unit, and wherein glass 1 is covered on sensing unit, non-biography
Pad is provided on sensillary area, pad solder has the metallic conductor connecting with substrate 6, realizes the positive pole-face of the first chip 2 and substrate 6
Electric connection.
Preferably, the lower surface of cushion block 3 is provided with adhesive film, and cushion block 3 is bonded on the second chip 4 by adhesive film.
Wherein, encapsulating structure 7 is provided on substrate 6, encapsulating structure 7 includes the second chip 4, cushion block 3, the first chip 2, glass
Glass 1 and several metallic conductors 5；Four sides of encapsulating structure 7 are flushed with four sides of substrate 6, and glass 1 is naked
Dew.Wherein encapsulating compound is also filled between the projection piece 8 on the second chip 4.
Preferably, the upper surface of encapsulating structure 7 is flushed with the upper surface of glass 1, and keeps the upper surface of glass 1 exposed.
The specific encapsulation process that the utility model provides photosensor package structure is:
The upper surface of substrate 6 is arranged in second chip 4 by step S1, wherein the second chip 4 has the one side of projection piece 8
It is electrically connected downward with the upper surface of substrate 6, glue or plastic packaging material is filled between two neighboring projection piece 8, wherein second
Chip 4 is control processing chip.
Cushion block 3 is bonded in the top of the second chip 4, and four sides of cushion block 3 and the four of the second chip 4 by step S2
A side flushes；Wherein the material of cushion block 3 is silicon wafer, ceramics or glass, it is preferable to use silicon wafer.
Preferably, the upper surface of cushion block 3 is coated with metal layer, preferably Gold plated Layer, silver coating, copper plate or aluminium coated, pad
The upper surface of block 3 is bonded with pad, the metallic conductor 5 that pad solder and substrate 6 are electrically connected.
The lower surface of cushion block 3 is coated with adhesive film, and specific its is coated with DAF glue film, and cushion block 3 is bonded in the by adhesive film
The top of two chips 4.
The cathode of first chip 2 is bonded with the upper surface of cushion block 3 by step S3 down, and the anode of the first chip 2 faces
On；Wherein the first chip 2 is photoelectric sensor chip, and the cathode face of the first chip 2 and the metal layer of 3 upper surface of cushion block electrically connect
It connects；The cathode face of the first chip 2 is electrically connected by metal layer, metallic conductor and substrate 6 at this time.
The area in preferred first chip, 2 cathode face is less than the area of 3 upper surface metal layer of cushion block, and the first chip 2 is not
The pad being bonded on metal layer can be covered.
Glass 1 is bonded on the positive pole-face of the first chip 2 by step S4；Wherein the positive face of the first chip 2 includes sensing
Area and non-sensing unit, wherein glass 1 is bonded on sensing unit, and pad is bonded on non-sensing unit, is welded on pad and substrate 6
The metallic conductor of electric connection；Wherein glass 1 is transparent glass, can penetrate visible light, the surface of glass 1 can also plate
Film makes glass 1 have filtering functions, can penetrate the light of different wave length.
Wherein use light transmittance that glass 1 is bonded on sensing unit for 90% or more DAF glue film.
Step S5, using plastic packaging material on substrate 6 the second chip 4, cushion block 3, the first chip 2, glass 1 and several
Metallic conductor 5 carries out plastic packaging, obtains plastic package structure 7；Wherein plastic packaging material is black or other lighttight plastic packaging materials, wherein the
Plastic packaging material is also filled between the projection piece 8 of two chips 4.
Step S6 cuts plastic package structure 7, keeps four sides of plastic package structure 7 and four sides of substrate 6 neat
It is flat；Keep the upper surface of glass 1 exposed, and the upper surface of plastic package structure 7 is flushed with the upper surface of glass 1.
Finally obtain photoelectric sensor plastic package structure described in the utility model.
Claims (7)
1. a kind of photosensor package structure, which is characterized in that including substrate (6), substrate is provided with the second chip on (6)
(4), the second chip (4) and substrate (6) are electrically connected；Cushion block (3) are provided on second chip (4)；Second cushion block is arranged on (3)
There are the first chip (2)；Glass (1) is covered with above first chip (2)；
Second chip (4) is control processing chip, and the first chip (2) is photoelectric sensor chip；
The glass (1) is covered on the positive pole-face of the first chip (2), passes through metallic conduction on the positive pole-face of the first chip (2)
Body (5) and substrate (6) are electrically connected；
The cathode face of first chip (2) is electrically connected by metallic conductor (5) and substrate (6)；
It is provided with plastic package structure (7) on the substrate (6), plastic package structure (7) wraps up the second chip (4), cushion block (3), the first core
Piece (2) and glass (1) and metallic conductor (5)；
The upper surface of the glass (1) is exposed.
2. photosensor package structure according to claim 1, which is characterized in that four of the plastic package structure (7)
Side is flushed with four sides of substrate (6), and the upper surface of plastic package structure (7) is flushed with glass (1).
3. photosensor package structure according to claim 1, which is characterized in that be coated with metal on the cushion block (3)
The cathode face of layer, the first chip (2) is electrically connected by metal layer and metallic conductor (5) and substrate (6).
4. photosensor package structure according to claim 3, which is characterized in that the metal layer on the cushion block (3)
A part and the first chip (2) cathode face contact；Welding metal electric conductor (5) on another part of metal layer.
5. photosensor package structure according to claim 1, which is characterized in that the anode of first chip (2)
Face includes sensing unit and non-sensing unit, and the glass (1) is covered on sensing unit, and several pads are provided on non-sensing unit, weldering
Metallic conductor (5) are connected between disk and substrate (6).
6. photosensor package structure according to claim 1, which is characterized in that second chip (4) has convex
The one side for playing part is arranged on substrate (6).
7. photosensor package structure according to claim 1, which is characterized in that the bottom surface of the cushion block (3) is arranged
There is adhesive film, cushion block (3) is bonded the second chip (4) by adhesive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821533002.7U CN208781856U (en) | 2018-09-19 | 2018-09-19 | A kind of photosensor package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821533002.7U CN208781856U (en) | 2018-09-19 | 2018-09-19 | A kind of photosensor package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208781856U true CN208781856U (en) | 2019-04-23 |
Family
ID=66161870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821533002.7U Active CN208781856U (en) | 2018-09-19 | 2018-09-19 | A kind of photosensor package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208781856U (en) |
-
2018
- 2018-09-19 CN CN201821533002.7U patent/CN208781856U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: A packaging structure of photoelectric sensor Granted publication date: 20190423 License type: Common License Record date: 20210526 |