CN211929487U - Optical sensor packaging structure and electronic equipment - Google Patents
Optical sensor packaging structure and electronic equipment Download PDFInfo
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- CN211929487U CN211929487U CN202020965671.2U CN202020965671U CN211929487U CN 211929487 U CN211929487 U CN 211929487U CN 202020965671 U CN202020965671 U CN 202020965671U CN 211929487 U CN211929487 U CN 211929487U
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Abstract
The utility model discloses an optical sensor packaging structure and electronic equipment. Wherein the optical sensor package structure comprises: a substrate; the signal processing chip is arranged on the surface of the substrate, a conductive through hole is formed in the signal processing chip, and the signal processing chip is electrically connected to the substrate through the conductive through hole; the photodiode is arranged on the surface of the signal processing chip, which is back to the substrate, and is electrically connected to the substrate through the conductive through hole; and the potting adhesive layer coats the signal processing chip and the photodiode. The technical scheme of the utility model the incomplete problem of bottom glue solidification that can solve because of the great appearance of thickness on casting glue layer to improve optical sensor packaging structure's reliability.
Description
Technical Field
The utility model relates to a system in package technical field, in particular to optical sensor packaging structure and electronic equipment.
Background
The optical sensor (such as a heart rate and blood oxygen sensor) generally includes a photodiode and a light emitting diode, light emitted by the light emitting diode is reflected by capillary vessels in human tissue and then irradiates the photodiode, and the heart rate or blood oxygen of a user is measured according to the change rule of a photocurrent alternating current component. In the related art, the optical sensor package structure includes a substrate and a photodiode, the photodiode is usually electrically connected to the substrate in a wire bonding manner, when the photodiode is sealed by a potting adhesive, the potting adhesive needs to completely coat the photodiode and a lead thereof, so that the thickness of the potting adhesive layer is large, and when the potting adhesive is cured, the problem of incomplete curing of bottom glue often occurs, thereby resulting in poor reliability of the optical sensor package structure.
The above is only for the purpose of assisting understanding of the technical solutions of the present invention, and does not represent an admission that the above is the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an optical sensor packaging structure and electronic equipment aims at solving because of the great not thorough problem of bottom glue solidification that appears of the thickness on casting glue layer to improve optical sensor packaging structure's reliability.
In order to achieve the above object, the utility model provides an optical sensor packaging structure, include: a substrate; the signal processing chip is arranged on the surface of the substrate, a conductive through hole is formed in the signal processing chip, and the signal processing chip is electrically connected to the substrate through the conductive through hole; the photodiode is arranged on the surface of the signal processing chip, which is back to the substrate, and is electrically connected to the substrate through the conductive through hole; and the potting adhesive layer coats the signal processing chip and the photodiode.
Optionally, a first pad is disposed on a surface of the substrate facing the signal processing chip, a redistribution layer is disposed on a surface of the signal processing chip facing the substrate, and the signal processing chip is electrically connected to the first pad through the conductive through hole and the redistribution layer.
Optionally, a solder ball is disposed on a surface of the signal processing chip facing the substrate, the solder ball is electrically connected to the redistribution layer, the first pad is provided with a solder joint, and the solder ball is electrically abutted to the solder joint.
Optionally, a photoelectric electrode of the photodiode is disposed toward the signal processing chip, and the photoelectric electrode is electrically connected to the substrate through the conductive via.
Optionally, the young's modulus of the potting adhesive layer is less than 100 MPa.
Optionally, the elongation at break of the potting adhesive layer is greater than 40%.
Optionally, a distance between a surface of the potting adhesive layer facing away from the photodiode and a surface of the photodiode facing away from the signal processing chip is defined as L, and L is greater than 0 and less than or equal to 0.1 mm.
Optionally, the optical sensor package structure further includes a housing, the housing is disposed on a surface of the substrate facing the signal processing chip, a first mounting through groove exposing the substrate is disposed on a surface of the housing facing away from the substrate, the signal processing chip and the photodiode are both located in the first mounting through groove, and the potting adhesive layer is disposed in the first mounting through groove and coats the signal processing chip and the photodiode.
Optionally, the optical sensor package structure further includes a light emitting diode, the light emitting diode is disposed on a surface of the substrate facing the signal processing chip and electrically connected to the substrate; the surface of the shell, which faces away from the substrate, is also provided with a second mounting through groove for exposing the substrate, the light-emitting diode is positioned in the second mounting through groove, and the encapsulating adhesive layer is also arranged in the second mounting through groove and coats the light-emitting diode.
The transmittance of the encapsulating adhesive layer to the light emitted by the light-emitting diode is more than 90%.
The second installation leads to the groove and includes mounting groove section and leaded light groove section, the mounting groove section with leaded light groove section is followed and is deviated from emitting diode's direction sets gradually and is connected, emitting diode locates in the mounting groove section, the area that the leaded light groove section encloses closes is followed and is deviated from emitting diode's direction crescent.
The surface of the substrate facing the signal processing chip is provided with a second bonding pad and a third bonding pad, the light emitting diode is provided with two light emitting electrodes, and the two light emitting electrodes are electrically connected to the second bonding pad and the third bonding pad respectively.
The signal processing chips are arranged on the surface of the substrate at intervals, each signal processing chip is provided with a conductive through hole, and each signal processing chip is electrically connected to the substrate through the conductive through hole; the signal processing chip is arranged on the surface of the substrate opposite to the substrate, and is electrically connected with the substrate through the corresponding conductive through hole; the encapsulating adhesive layer coats each signal processing chip and the corresponding photodiode.
The utility model also provides an electronic equipment, electronic equipment includes optical sensor packaging structure, optical sensor packaging structure includes: a substrate; the signal processing chip is arranged on the surface of the substrate, a conductive through hole is formed in the signal processing chip, and the signal processing chip is electrically connected to the substrate through the conductive through hole; the photodiode is arranged on the surface of the signal processing chip, which is back to the substrate, and is electrically connected to the substrate through the conductive through hole; and the potting adhesive layer coats the signal processing chip and the photodiode.
The technical scheme of the utility model, optical sensor packaging structure includes base plate, signal processing chip, photodiode and casting glue layer, and the surface of base plate is located to the signal processing chip, and signal processing chip locates the surface of signal processing chip dorsad base plate, and the signal processing chip sets up electrically conductive through-hole, and signal processing chip and photodiode are all through electrically conductive through-hole electric connection in base plate, and casting glue layer cladding signal processing chip and photodiode. Because the utility model discloses photodiode realizes and base plate electric connection through the electrically conductive through-hole of signal processing chip among the optical sensor packaging structure, rather than adopting lead bonding to realize and base plate electric connection, has left out and has shown the required pouring sealant part that covers of lead wire externally to can reduce the thickness of pouring sealant layer relatively, effectively improve the not thorough problem of solidification of bottom pouring sealant because of the great and arouse of pouring sealant layer thickness, thereby improved optical sensor packaging structure's reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an embodiment of an optical sensor package structure according to the present invention;
FIG. 2 is a partially enlarged schematic view of the optical sensor package of FIG. 1;
fig. 3 is another enlarged partial structural view of the optical sensor package structure of fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Optical |
30 | |
| 10 | |
31 | |
| 11 | |
40 | |
| 12 | |
50 | |
| 13 | |
51 | First installation through |
| 14 | Show the |
52 | Second installation through |
| 20 | |
521 | |
| 21 | |
522 | Light |
| 22 | |
60 | Potting |
| 23 | Solder ball |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
The utility model provides an optical sensor packaging structure 100, optical sensor can be heart rate sensor, blood oxygen sensor or other types's optical sensor.
Referring to fig. 1, in an embodiment of the optical sensor package structure 100 of the present invention, the optical sensor package structure 100 includes: a substrate 10; the signal processing chip 20 is arranged on the surface of the substrate 10, the signal processing chip 20 is provided with a conductive through hole 21, and the signal processing chip 20 is electrically connected to the substrate 10 through the conductive through hole 21; the photodiode 30 is arranged on the surface, back to the substrate 10, of the signal processing chip 20, and the photodiode 30 is electrically connected to the substrate 10 through the conductive through hole 21; and a potting adhesive layer 60, the potting adhesive layer 60 covering the signal processing chip 20 and the photodiode 30.
Here, the substrate 10 is a printed circuit board, and may be a silicon substrate 10, an epoxy resin substrate 10, or the like, which has a circuit formed on a surface thereof for electrical connection, and is provided with a signal lead-out pad electrically connected to the circuit. The signal processing chip 20 is generally an analog front end or a microprocessor chip AFE/MPU chip), and generally, the signal processing chip 20 is mounted on the surface of the circuit substrate 10 with the bonding pad by using a flip chip method, the flip chip method is a conventional mounting method, and the specific operation thereof is not described herein. The conductive through holes 21 are generally through silicon vias, and may be formed in the signal processing chip 20 by using a Through Silicon Via (TSV) technology, where the through silicon vias penetrate through two surfaces of the signal processing chip 20, and the signal processing chip 20 is electrically connected to the pads on the surface of the substrate 10 through the through silicon vias. Certainly, the conductive through hole 21 may also be a conductive through hole 21 made of other materials, such as a tin through hole, and the like, which are all within the protection scope of the present invention. The photodiode 30(PD) may be mounted on the surface of the signal processing chip 20 opposite to the substrate 10 by a flip chip or a die attach process, and the photodiode 30 may be electrically connected to the substrate 10 through the conductive via 21. The flip chip and the chip adhesion process are both conventional processes, and the specific operations thereof are not described in detail herein. The potting adhesive is transparent glue, coats the surfaces of the signal processing chip 20 and the photodiode 30, plays a role in positioning the signal processing chip 20 and the photodiode 30, and forms a transparent potting adhesive layer 60 after the potting adhesive is cured. Since the photodiode 30 is electrically connected to the substrate 10 through the conductive via 21, compared with the photodiode 30 electrically connected to the substrate 10 by wire bonding, a portion of the potting adhesive that is required to be covered by an externally exposed lead is omitted, so that the thickness of the potting adhesive layer 60 can be relatively reduced, and further the situation that the bottom layer potting adhesive is not completely cured due to the large thickness of the potting adhesive layer 60 can be improved, thereby improving the reliability of the optical sensor package structure 100.
Here, the electrical connection between the conductive via 21 and the substrate 10 is generally achieved by a connection wire, but may be achieved by using solder paste. Similarly, the conductive via 21 and the photodiode 30 can be electrically connected by a connecting wire, or by using solder paste.
Therefore, it can be understood that, according to the technical solution of the present invention, the optical sensor package structure 100 includes the substrate 10, the signal processing chip 20, the photodiode 30 and the potting adhesive layer 60, the signal processing chip 20 is disposed on the surface of the substrate 10, the photodiode 30 is disposed on the surface of the signal processing chip 20 opposite to the substrate 10, and the signal processing chip 20 is disposed with the conductive through hole 21, the photodiode 30 is electrically connected to the substrate 10 through the conductive through hole 21, and the potting adhesive layer 60 covers the signal processing chip 20 and the photodiode 30. Because the utility model discloses photodiode 30 realizes and base plate 10 electric connection through signal processing chip 20's electrically conductive through-hole 21 in optical sensor packaging structure 100, rather than adopting lead bonding to realize and base plate 10 electric connection, the potting adhesive part that the lead wire that has revealed externally needs to cover has been omitted, thereby can reduce the thickness of potting adhesive layer 60 relatively, effectively improve the problem that the solidification is incomplete because of the great bottom potting adhesive that arouses of potting adhesive layer 60 thickness, thereby optical sensor packaging structure 100's reliability has been improved.
In an embodiment of the present invention, the substrate 10 is provided with the first pad 11 toward the surface of the signal processing chip 20, the signal processing chip 20 is provided with the redistribution layer 22 toward the surface of the substrate 10, and the signal processing chip 20 is electrically connected to the first pad 11 through the conductive through hole 21 and the redistribution layer 22.
Here, a redistribution layer 22(RDL) is provided on the surface of the signal processing chip 20 facing the substrate 10, and the redistribution layer 22 is electrically in contact with the conductive via 21 and is electrically connected thereto. After the signal processing chip 20 is mounted, the signal processing chip 20 can be electrically abutted and electrically conducted with the first pad 11 on the surface of the substrate 10 through the conductive through hole 21 and the redistribution layer 22, so that the thickness of the potting adhesive layer 60 can be further reduced, the problem of incomplete curing of the bottom layer potting adhesive due to the large thickness of the potting adhesive can be further effectively solved, and the reliability of the optical sensor packaging structure 100 can be further improved.
In an embodiment of the present invention, the surface of the signal processing chip 20 facing the substrate 10 is provided with a solder ball 23, the solder ball 23 is electrically connected to the redistribution layer 22, the first pad 11 is provided with a solder joint, and the solder ball 23 is electrically abutted to the solder joint.
When the signal processing chip 20 is mounted, the solder balls 23 on the surface of the signal processing chip 20 face the first bonding pads 11 on the surface of the substrate 10, and after the mounting, the solder balls 23 are soldered to the solder points (not labeled) of the bonding pads to electrically conduct the bonding pads, so that the electrical conduction between the signal processing chip 20 and the substrate 10 is realized.
Further, the photoelectric electrode 31 of the photodiode 30 is disposed toward the signal processing chip 20, and the photoelectric electrode 31 is electrically connected to the substrate 10 through the conductive via 21.
The photodiode 30 has two photoelectric electrodes 31, i.e. a photoelectric anode and a photoelectric cathode, the two photoelectric electrodes 31 are located on the same side of the photodiode 30, when the photodiode 30 is mounted, the photoelectric electrodes 31 face the signal processing chip 20, and the two photoelectric electrodes 31 are electrically connected to the substrate 10 through the conductive through holes 21 after the photodiode 30 is mounted, where the electrical connection may be realized by using a connecting wire or a solder paste. Such a configuration can further reduce the thickness of the potting adhesive layer 60, thereby further effectively improving the incomplete curing of the bottom layer potting adhesive due to the large thickness of the potting adhesive, and further improving the reliability of the optical sensor package structure 100.
Optionally, the material of the potting adhesive layer 60 may be at least one of silicone resin, epoxy resin, and acrylate.
Optionally, the young's modulus of the potting adhesive layer 60 is less than 100 MPa.
Because the pouring sealant is made of a high polymer material and has a large thermal expansion coefficient, the cured glue with the Young modulus lower than 100MPa is adopted, so that the thermal stress generated by the optical sensor packaging structure 100 when the optical sensor packaging structure is heated can be reduced, and the problem of large warpage generated by the packaging structure during backflow is effectively solved.
Further, the elongation at break of the potting adhesive layer 60 is greater than 40%.
When the optical sensor package structure 100 reflows to generate warpage, the deformation of the upper surface of the potting adhesive layer 60 is large, and a large positive stress is generated, so that the stress concentration exists in the potting adhesive layer 60 near the corners of the photodiode 30, and the thickness of the potting adhesive layer 60 is reduced by using glue with the breaking elongation of 40% or more after curing, so that the problem of brittle fracture of the potting adhesive layer 60 can be effectively solved.
The distance between the surface of the encapsulating adhesive layer 60 facing away from the photodiode 30 and the surface of the photodiode 30 facing away from the signal processing chip 20 is defined as L, wherein L is greater than 0 and less than or equal to 0.1 mm. The height of the glue surface of the cured pouring sealant layer 60 is reduced, the height of the glue surface is not more than 0.1mm, and the problem of brittle fracture of the pouring sealant layer 60 can be effectively solved.
It can be understood that, because the casting glue is macromolecular material, coefficient of thermal conductivity itself is not high, the utility model discloses the thickness of casting glue layer 60 is less, and glues the face height lower, can improve optical sensor packaging structure 100's heat dissipation condition like this. Meanwhile, the temperature gradient of the potting adhesive layer 60 can be effectively reduced, and the stress of the potting adhesive layer 60 is optimized.
Further, referring to fig. 1 again, the optical sensor package structure 100 further includes a housing 50, the housing 50 is disposed on a surface of the substrate 10 facing the signal processing chip 20, a first mounting through groove 51 exposing the substrate 10 is disposed on a surface of the housing 50 facing away from the substrate 10, the signal processing chip 20 and the photodiode 30 are both disposed in the first mounting through groove 51, and the potting adhesive layer 60 is disposed in the first mounting through groove 51 and covers the signal processing chip 20 and the photodiode 30.
The housing 50 may be obtained by an injection molding process, and is attached to the surface of the substrate 10 facing the signal processing chip 20 by a Surface Mount Technology (SMT), the housing 50 is provided with a first mounting through groove 51 exposing the substrate 10, the first mounting through groove 51 is substantially a square groove, and the signal processing chip 20 and the photodiode 30 are both located in the first mounting through groove 51. The first mounting through groove 51 is filled with a potting adhesive layer, and covers the signal processing chip 20 and the photodiode 30, it can be understood that the potting adhesive layer 60 also covers the substrate 10 on the surface of the first mounting through groove 51. The housing 50 is disposed to position the photodiode 30 and the signal processing chip 20, and facilitate the filling operation of the potting adhesive. Of course, the housing 50 may also be a ceramic material sintered with the substrate 10 as a whole, and is within the scope of the present invention.
Referring to fig. 1 again, the optical sensor package structure 100 further includes a light emitting diode 40, wherein the light emitting diode 40 is disposed on a surface of the substrate 10 facing the signal processing chip 20 and electrically connected to the substrate 10; the surface of the housing 50 facing away from the substrate 10 is further opened with a second mounting through groove 52 exposing the substrate 10, the light emitting diode 40 is located in the second mounting through groove 52, and the encapsulating layer 60 is further located in the second mounting through groove 52 and covers the light emitting diode 40.
Here, the light emitting diode 40(LED) may be mounted on the surface of the substrate 10 facing the signal processing chip 20 by using a flip chip or a die attach process, and the light emitting diode 40 is electrically connected to the substrate 10. The flip chip and the chip adhesion process are both conventional processes, and the specific operations thereof are not described in detail herein. The housing 50 has a second mounting through groove 52 exposing the substrate 10 corresponding to the light emitting diode 40 for accommodating the light emitting diode 40, and similarly, the potting adhesive is filled in the second mounting through groove 52 and covers the surface of the light emitting diode 40, and the potting adhesive layer 60 also covers the surface of the substrate 10 located in the first mounting through groove 51, so that the potting adhesive layer 60 is obtained after the potting adhesive layer 60 is cured. When the optical sensor package structure 100 works, the light emitting diode 40 emits light, the light passes through the transparent potting adhesive layer 60 to be emitted, irradiates the capillary in the human tissue, is reflected and then irradiates the light emitting diode 40, transmits a signal reflecting the change rule of the photocurrent alternating current component to the signal processing chip 20, and outputs the signal after photoelectric data conversion so as to reflect the heart rate and blood oxygen of a user.
As can be appreciated, since the light emitting diode 40 is disposed in the second mounting through groove 52, the second mounting through groove 52 not only serves to position the light emitting diode 40, but also the sidewall of the second mounting through groove 52 can serve to effectively prevent the LED light from directly reaching the PD, thereby ensuring the measurement accuracy of the optical sensor package structure 100.
Optionally, the transmittance of the potting adhesive layer 60 to the light emitted by the light emitting diode 40 is greater than 90%. The potting adhesive layer 60 is a transparent adhesive layer, and the transmittance of the LED light is greater than 90%, which is beneficial to improving the detection accuracy of the optical sensor package structure 100.
Referring to fig. 1 again, the second installation through groove 52 includes an installation groove section 521 and a light guide groove section 522, the installation groove section 521 and the light guide groove section 522 are sequentially disposed and connected along a direction away from the light emitting diode 40, the light emitting diode 40 is disposed in the installation groove section 521, and an area enclosed by the light guide groove section 522 is gradually increased along the direction away from the light emitting diode 40.
Here, the mounting groove section 521 is a substantially square groove for mounting the light emitting diode 40, and the light guide groove section 522 is a substantially trapezoidal groove for guiding light of the light emitting diode 40. The area enclosed by the light guide groove section 522 is gradually increased along the direction departing from the light emitting diode 40, so that the light of the light emitting diode 40 can be effectively focused and then emitted, and the detection accuracy of the optical sensor packaging structure 100 is improved. Of course, the light guide groove section 522 may have other shapes, such as a stepped groove shape gradually increasing in a direction away from the light emitting diode 40, and is within the scope of the present invention.
In an embodiment of the present invention, the surface of the substrate 10 facing the signal processing chip 20 is provided with a second pad 12 and a third pad (not shown), and the light emitting diode 40 has two light emitting electrodes electrically connected to the second pad 12 and the third pad, respectively.
The light emitting diode 40 has two light emitting electrodes (not labeled), namely a light emitting positive electrode and a light emitting negative electrode, when the light emitting diode 40 is mounted, the light emitting negative electrode of the light emitting diode 40 faces the surface of the substrate 10 where the second bonding pad 12 is disposed, and the light emitting negative electrode is adhered to the second bonding pad 12 through a conductive silver adhesive, so that the light emitting negative electrode and the second bonding pad 12 are electrically conducted. Meanwhile, the light-emitting positive electrode of the light-emitting diode 40 is electrically connected to the third pad through the connection wire, so that the electrical connection between the light-emitting diode 40 and the substrate 10 can be realized.
In addition, a conductive layer (not shown) and a metal trace (not shown) are formed inside the substrate 10, and the first pad 11, the second pad 12 and the third pad on the surface of the substrate 10 are electrically connected to each other through the metal trace and the conductive layer.
In addition, the substrate 10 is further provided with an external bonding pad 13, the external bonding pad 13 is electrically connected to the first bonding pad 11, the second bonding pad 12 and the third bonding pad through a metal trace and a conductive layer, and an exposure opening 14 is further formed on a surface of the substrate 10 facing away from the housing 50 to expose the external bonding pad 13. The external connection pads 13 are used to electrically connect the entire optical sensor package structure 100, and generally, the external connection pads 13 are electrically connected to an external circuit board through connection wires.
In an embodiment of the present invention, the signal processing chips 20 are disposed in plural, the plural signal processing chips 20 are disposed on the surface of the substrate 10 at intervals, each signal processing chip 20 is provided with a conductive through hole 21, and each signal processing chip 20 is electrically connected to the substrate 10 through the conductive through hole 21; a plurality of photodiodes 30 are correspondingly arranged, one photodiode 30 is arranged on the surface of the signal processing chip 20 opposite to the substrate 10, and is electrically connected to the substrate 10 through the corresponding conductive through hole 21; the potting adhesive layer 60 encapsulates each signal processing chip 20 and the corresponding photodiode 30.
Correspondingly, the housing 50 is correspondingly provided with a plurality of first mounting through grooves 51, and a corresponding signal processing chip 20 and a corresponding photodiode 30 are both located in one of the first mounting through grooves 51; the potting adhesive fills each first mounting through groove 51 and covers the corresponding signal processing chip 20 and the photodiode 30. Here, the signal processing chip 20 and the photodiode 30 are correspondingly provided with a plurality of sets to realize various functions. Alternatively, the signal processing chip 20 may be an analog front end chip, an accelerometer chip, a power management chip, an electrocardiograph chip, or the like.
The utility model discloses still provide an electronic equipment, electronic equipment includes as before optical sensor packaging structure 100, and this optical sensor packaging structure 100's concrete structure refers to aforementioned embodiment. Since the electronic device adopts all technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
It should be noted that, the electronic device includes a housing, a circuit board is disposed in the housing, the optical sensor package structure 100 is fixed in the housing, the fixing manner may be a fastening manner, a screw fastening manner, a glue fastening manner or other reasonable and effective fixing manners, and the housing has a detection port corresponding to the light emitting diode 40 of the optical sensor package structure 100, so that light emitted by the light emitting diode 40 passes through the detection port. The external bonding pad 13 of the substrate 10 in the optical sensor package structure 100 is electrically connected to the circuit board in the housing through a connecting wire, so as to implement the function of the optical sensor. Here, the electronic device is generally a wearable electronic device, such as a mobile phone, a watch, an earphone, a bracelet, and the like.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (14)
1. An optical sensor package, comprising:
a substrate;
the signal processing chip is arranged on the surface of the substrate, a conductive through hole is formed in the signal processing chip, and the signal processing chip is electrically connected to the substrate through the conductive through hole;
the photodiode is arranged on the surface of the signal processing chip, which is back to the substrate, and is electrically connected to the substrate through the conductive through hole; and
and the potting adhesive layer coats the signal processing chip and the photodiode.
2. The optical sensor package structure of claim 1, wherein a surface of the substrate facing the signal processing chip is provided with a first pad, a surface of the signal processing chip facing the substrate is provided with a redistribution layer, and the signal processing chip is electrically connected to the first pad through the conductive via and the redistribution layer.
3. The optical sensor package structure of claim 2, wherein a solder ball is disposed on a surface of the signal processing chip facing the substrate, the solder ball is electrically connected to the redistribution layer, the first pad is disposed with a solder joint, and the solder ball is electrically abutted to the solder joint.
4. The optical sensor package structure of claim 1, wherein the photo-electrode of the photodiode is disposed toward the signal processing chip, and the photo-electrode is electrically connected to the substrate through the conductive via.
5. The optical sensor package structure of claim 1, wherein the young's modulus of the encapsulant layer is less than 100 MPa.
6. The optical sensor package structure of claim 1, wherein the elongation at break of the encapsulant layer is greater than 40%.
7. The optical sensor package structure of claim 1, wherein a distance between a surface of the potting adhesive layer facing away from the photodiode and a surface of the photodiode facing away from the signal processing chip is defined as L, and L is greater than 0 and less than or equal to 0.1 mm.
8. The optical sensor package structure as claimed in any one of claims 1 to 7, further comprising a housing, wherein the housing is disposed on a surface of the substrate facing the signal processing chip, and a first mounting through slot exposing the substrate is disposed on a surface of the housing facing away from the substrate, the signal processing chip and the photodiode are both disposed in the first mounting through slot, and the encapsulant layer is disposed in the first mounting through slot and encapsulates the signal processing chip and the photodiode.
9. The optical sensor package structure of claim 8, further comprising a light emitting diode disposed on a surface of the substrate facing the signal processing chip and electrically connected to the substrate;
the surface of the shell, which faces away from the substrate, is also provided with a second mounting through groove for exposing the substrate, the light-emitting diode is positioned in the second mounting through groove, and the encapsulating adhesive layer is also arranged in the second mounting through groove and coats the light-emitting diode.
10. The optical sensor package of claim 9, wherein the encapsulant layer has a transmittance of greater than 90% for light emitted by the led.
11. The optical sensor package structure of claim 9, wherein the second mounting through groove comprises a mounting groove section and a light guide groove section, the mounting groove section and the light guide groove section are sequentially disposed and connected in a direction away from the light emitting diode, the light emitting diode is disposed in the mounting groove section, and an area enclosed by the light guide groove section is gradually increased in a direction away from the light emitting diode.
12. The optical sensor package structure of claim 9, wherein a surface of the substrate facing the signal processing chip is provided with a second pad and a third pad, the light emitting diode has two light emitting electrodes, and the two light emitting electrodes are electrically connected to the second pad and the third pad, respectively.
13. The optical sensor package structure as claimed in any one of claims 1 to 7, wherein a plurality of signal processing chips are disposed on the surface of the substrate at intervals, each of the signal processing chips has a conductive via, and each of the signal processing chips is electrically connected to the substrate through the conductive via;
the signal processing chip is arranged on the surface of the substrate opposite to the substrate, and is electrically connected with the substrate through the corresponding conductive through hole;
the encapsulating adhesive layer coats each signal processing chip and the corresponding photodiode.
14. An electronic device, characterized in that the electronic device comprises an optical sensor package structure according to any one of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020965671.2U CN211929487U (en) | 2020-05-29 | 2020-05-29 | Optical sensor packaging structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020965671.2U CN211929487U (en) | 2020-05-29 | 2020-05-29 | Optical sensor packaging structure and electronic equipment |
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| CN211929487U true CN211929487U (en) | 2020-11-13 |
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| CN202020965671.2U Active CN211929487U (en) | 2020-05-29 | 2020-05-29 | Optical sensor packaging structure and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111640739A (en) * | 2020-05-29 | 2020-09-08 | 青岛歌尔智能传感器有限公司 | Optical sensor packaging structure and electronic equipment |
| WO2021238150A1 (en) * | 2020-05-29 | 2021-12-02 | 青岛歌尔智能传感器有限公司 | Optical sensor encapsulation structure and electronic device |
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