CN105118909A - Vacuum defoaming method during direct insert type LED lamp gluing packaging process - Google Patents
Vacuum defoaming method during direct insert type LED lamp gluing packaging process Download PDFInfo
- Publication number
- CN105118909A CN105118909A CN201510459427.2A CN201510459427A CN105118909A CN 105118909 A CN105118909 A CN 105118909A CN 201510459427 A CN201510459427 A CN 201510459427A CN 105118909 A CN105118909 A CN 105118909A
- Authority
- CN
- China
- Prior art keywords
- led
- bowl cup
- led lamp
- colloid
- sealing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004026 adhesive bonding Methods 0.000 title abstract 4
- 238000012858 packaging process Methods 0.000 title abstract 2
- 239000003292 glue Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims description 34
- 239000000084 colloidal system Substances 0.000 claims description 32
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 8
- 230000027455 binding Effects 0.000 claims description 6
- 238000009739 binding Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 5
- 238000005187 foaming Methods 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005266 casting Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005273 aeration Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a vacuum defoaming method during a direct insert type LED lamp gluing packaging process. The method comprises the following steps of arranging a heating device, a temperature sensor and a distance measuring sensor on a loading frame of a gluing packaging machine; arranging a heat insulation device on the outer side of the heating device; acquiring depths and calibers of LED lamp bowl cups; heating the LED lamp support bowl cups; setting a glue dispensing speed of an automatic glue pouring machine; starting the glue pouring machine to perform gluing processing on the bound LED support bowl cups, and keeping a constant temperature for vacuum de-foaming; and replacing the LED lamp support bowl cups on the loading frame until all bound LED support bowl cups are glued and packaged. When the arranged heating device is used for heating the support, the glue is diluted and the flow velocity thereof is increased. The glue rapidly flows down along the support bowl cup edges. Bubbles inside the cups are extruded. The glue pouring speed is increased. Bubbles can be more easily reduced by adopting a constant-temperature de-foaming way. The LED packaging yield can be effectively improved. Furthermore, the service lifetime of an LED display screen can be prolonged.
Description
Technical field
The invention belongs to LED chip encapsulation field, be specifically related to the method for vacuum defoamation in a kind of direct insertion LED sealing process.
Background technology
In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material, the reflection loss that photon causes due to refringence at outgoing interface; And the total reflection loss to cause because incidence angle is greater than the cirtical angle of total reflection.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high substratum transparent of one deck refractive index at chip surface---LED silica gel, because this glue-line is between chip and air, thus effectively reduces the loss of photon at interface, improves and get optical efficiency.In addition, the effect of casting glue also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require that its light transmittance is high, refractive index is high, Heat stability is good, good fluidity, is easy to spraying.For improving the reliability of LED, also require that casting glue has agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Casting glue conventional at present comprises epoxy resin and silica gel.Silica gel is high owing to having light transmittance, and refractive index is large, and Heat stability is good, the features such as stress is little, and moisture absorption is low, be obviously better than epoxy resin, be used widely in high-power LED encapsulation, but cost are higher.Research shows, raising silica gel refractive index effectively can reduce the photon loss that refractive index physical barriers brings, and improve external quantum efficiency, but silica gel performance is influenced by environmental temperature.Along with temperature raises, the thermal stress of silica gel inside strengthens, and causes the refractive index of silica gel to reduce, thus affects LED light effect and light distribution.
At present, packaging plastic of the prior art mainly contains following characteristics:
Mixed proportion: A:B=100:100(weight ratio);
Mixing viscosity 25 DEG C: 650 ~ 900cps;
Gel time: 150 DEG C × 85 ~ 105 seconds;
Up time: 25 DEG C × 4 hours;
Condition of cure: initial cure 120 DEG C ~ 125 DEG C × 35 ~ 45 minutes;
Cured later 120 DEG C × 6 ~ 8 hours or 130 DEG C × 6 hours;
Casting glue should be noted that some:
The product surface of sealing is wanted to need to keep dry, clean;
By proportioning taken amount, and weigh accurately, proportioning please be make sure to keep in mind and be weight ratio but not volume ratio, need to stir after A, B agent mixing, to avoid solidification not exclusively;
Please carry out encapsulating in time after stirring, and within the up time, use the glue mixed as far as possible;
Can arrange in pairs or groups diffusant and color of 809A/B uses.
When the problem produced possibly in LED produces is chip package, in cup, bubble Accounting has very large bad proportion, if but product air bubble problem in manufacturing process is not well solved or prevents and treats, the factor that product decay is accelerated will be caused, thus can show that IV reduces, IR becomes large, VF raises, the encapsulation bubble of LED is problem demanding prompt solution in the sector.
In prior art, in the process of vacuum defoamation, resin and curing agent temperature too high, often have the phenomenon that curing agent constantly volatilizees, enter after thickening bubble in bowl cup be not easy discharge.
Summary of the invention
Technical problem to be solved by this invention is: the method providing vacuum defoamation in a kind of direct insertion LED sealing process, solves curing agent volatilization in prior art and causes bubble to be not easy the problem of deviating from.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 ~ 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid enters bowl cup along LED support;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 ~ 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Described diffusant is the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Described distance measuring sensor is infrared distance sensor.
Described temperature sensor is DS18B20.
In described step 7, the temperature of vacuum defoaming device remains on 50 DEG C.
Compared with prior art, the present invention has following beneficial effect:
1, stock shelf arranges heater, colloid can be made during heated holder thinning and accelerate flow velocity, flow down fast along support bowl cup edge, bubble in cup is extruded, accelerate casting glue speed, decrease bubble, effectively improve the rate of finished products of LED, and then improve the useful life of LED display.
2, the heating-up temperature of LED lamp holder bowl cup remains between 50 ~ 80 DEG C, avoids temperature too high, causes curing agent volatilization in de-aeration, is difficult to the phenomenon of deaeration.
3, epoxy resin A, epoxy resin B are mixed according to certain ratio, add diffusant, and stir, by controlling mixed proportion and incorporation time, the problem that after avoiding baking, LED turns yellow, improves quality and the rate of finished products of LED, and then improves the cost performance of LED display.
4, the plastic emitting speed of automatic glue filling machine is set according to the degree of depth of support bowl cup and bore, improves the automaticity of LED casting glue, saved time and cost.
Embodiment
Below structure of the present invention and the course of work are described further.
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 ~ 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid enters bowl cup along LED support;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 ~ 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Described diffusant is the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Described distance measuring sensor is infrared distance sensor.
Described temperature sensor is DS18B20.
In described step 7, the temperature of vacuum defoaming device remains on 50 DEG C.
Stock shelf arranges heater, colloid can be made during heated holder thinning and accelerate flow velocity, flowing down fast along support bowl cup edge, bubble in cup is extruded, accelerates casting glue speed, decrease bubble, effectively improve the rate of finished products of LED, and then improve the useful life of LED display.The heating-up temperature of LED lamp holder bowl cup remains between 50 ~ 80 DEG C, avoids temperature too high, causes curing agent volatilization in de-aeration, is difficult to the phenomenon of deaeration.
Specific embodiment one,
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 65 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid is along LED support bowl cup; Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing, and the weight ratio of epoxy resin A, epoxy resin B and diffusant is 5:3:1; Diffusant is the transparent fog-like liquid of DP series, and viscosity is 50000CPS under normal temperature;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 50 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Specific embodiment two,
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid is along LED support bowl cup; Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing, and the weight ratio of epoxy resin A, epoxy resin B and diffusant is 12:4:1; Diffusant is the transparent fog-like liquid of DP-100H, and viscosity is 30000CPS under normal temperature;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Specific embodiment three,
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid is along LED support bowl cup; Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing, and the weight ratio of epoxy resin A, epoxy resin B and diffusant is 10:5:1; Diffusant is the transparent fog-like liquid of DP-100H, and viscosity is 40000CPS under normal temperature;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Claims (7)
1. a method for vacuum defoamation in direct insertion LED sealing process, is characterized in that: comprise the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 ~ 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid enters bowl cup along LED support;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 ~ 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
2. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing.
3. the method for vacuum defoamation in direct insertion LED sealing process according to claim 2, is characterized in that: the weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
4. the method for vacuum defoamation in direct insertion LED sealing process according to claim 3, it is characterized in that: described diffusant is the transparent fog-like liquid of DP series ~ DP-100H, viscosity is 30000-50000CPS under normal temperature.
5. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: described distance measuring sensor is infrared distance sensor.
6. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: described temperature sensor is DS18B20.
7. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: in described step 7, the temperature of vacuum defoaming device remains on 50 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510459427.2A CN105118909A (en) | 2015-07-31 | 2015-07-31 | Vacuum defoaming method during direct insert type LED lamp gluing packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510459427.2A CN105118909A (en) | 2015-07-31 | 2015-07-31 | Vacuum defoaming method during direct insert type LED lamp gluing packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105118909A true CN105118909A (en) | 2015-12-02 |
Family
ID=54666852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510459427.2A Pending CN105118909A (en) | 2015-07-31 | 2015-07-31 | Vacuum defoaming method during direct insert type LED lamp gluing packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105118909A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112915594A (en) * | 2021-01-22 | 2021-06-08 | 深圳市鑫路远电子设备有限公司 | Artificial intelligence-based vacuum stirring, defoaming and material preparation method and system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442093A (en) * | 2008-08-22 | 2009-05-27 | 江苏稳润光电有限公司 | Encapsulation method for LED |
| CN104538535A (en) * | 2014-11-20 | 2015-04-22 | 无锡科思电子科技有限公司 | Glue sealing method for preventing LED (Light Emitting Diode) lamp from generating bubble |
| CN104624397A (en) * | 2014-12-31 | 2015-05-20 | 厦门华联电子有限公司 | Centrifugal debubbling device |
-
2015
- 2015-07-31 CN CN201510459427.2A patent/CN105118909A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442093A (en) * | 2008-08-22 | 2009-05-27 | 江苏稳润光电有限公司 | Encapsulation method for LED |
| CN104538535A (en) * | 2014-11-20 | 2015-04-22 | 无锡科思电子科技有限公司 | Glue sealing method for preventing LED (Light Emitting Diode) lamp from generating bubble |
| CN104624397A (en) * | 2014-12-31 | 2015-05-20 | 厦门华联电子有限公司 | Centrifugal debubbling device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112915594A (en) * | 2021-01-22 | 2021-06-08 | 深圳市鑫路远电子设备有限公司 | Artificial intelligence-based vacuum stirring, defoaming and material preparation method and system |
| CN112915594B (en) * | 2021-01-22 | 2022-08-02 | 深圳市鑫路远电子设备有限公司 | Artificial intelligence-based vacuum stirring, defoaming and material preparation method and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108133670A (en) | Integration packaging LED display module packaging method and LED display module | |
| CN101030611B (en) | Large-power light-emitting diodes gluing process | |
| CN104804688B (en) | A kind of outdoor LED encapsulation dumb light type epoxy encapsulation glue and preparation method thereof | |
| CN102593283A (en) | High light-efficiency LED (light-emitting diode) packaging preparation method | |
| CN101521257B (en) | White-light LED package structure with prefabricated fluorescent powder film and preparation method | |
| US20180057714A1 (en) | Silicone Resin Film, Curable Silicone Resin Composition, Optical Semiconductor Device, and Packaging Method for Optical Semiconductor Device | |
| CN103951984A (en) | Solidifiable silicon resin composition and optical semiconductor device using same | |
| CN104362245A (en) | Potting compound method of LED lamp | |
| CN109777039B (en) | Epoxy resin composition rubber cake for chip LED packaging and preparation method and packaging process thereof | |
| CN105418928A (en) | Trifluoropropyl-group-modification methyl phenyl vinyl silicon resin and LED packaging adhesive | |
| CN207753046U (en) | A kind of LED packagings | |
| CN103311406A (en) | Packaging process for white light-emitting diodes (LEDs) | |
| CN105118909A (en) | Vacuum defoaming method during direct insert type LED lamp gluing packaging process | |
| CN104538535A (en) | Glue sealing method for preventing LED (Light Emitting Diode) lamp from generating bubble | |
| CN102148298B (en) | Multipoint dispensing process and LED (light emitting diode) device | |
| CN109127284A (en) | A kind of electronics member device point glue equipment | |
| CN103666367B (en) | LED (light-emitting diode) organosilicon pouring sealant and application thereof | |
| CN107452855A (en) | Paster LED is without mould method for packing | |
| CN105047802A (en) | Sealing method for direct-insert type light-emitting diode (LED) lamp | |
| CN112011301B (en) | Ultraviolet-heat dual-curing adhesive and application thereof | |
| CN203103352U (en) | UV silica gel packaged LED | |
| CN104409611A (en) | Adhesive sealing method in LED (light-emitting diode) encapsulating process | |
| CN109266302A (en) | A kind of high refractive index LED packaging silicon rubber of modification | |
| CN111849366A (en) | Using method of LED mould pressing packaging film | |
| CN104576900A (en) | Packaging method of LED chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151202 |