CN105118909A - Vacuum defoaming method during direct insert type LED lamp gluing packaging process - Google Patents

Vacuum defoaming method during direct insert type LED lamp gluing packaging process Download PDF

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Publication number
CN105118909A
CN105118909A CN201510459427.2A CN201510459427A CN105118909A CN 105118909 A CN105118909 A CN 105118909A CN 201510459427 A CN201510459427 A CN 201510459427A CN 105118909 A CN105118909 A CN 105118909A
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CN
China
Prior art keywords
led
bowl cup
led lamp
colloid
sealing process
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Application number
CN201510459427.2A
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Chinese (zh)
Inventor
陈国玉
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Suzhou Nanguang Electronic Technology Co Ltd
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Suzhou Nanguang Electronic Technology Co Ltd
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Priority to CN201510459427.2A priority Critical patent/CN105118909A/en
Publication of CN105118909A publication Critical patent/CN105118909A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses a vacuum defoaming method during a direct insert type LED lamp gluing packaging process. The method comprises the following steps of arranging a heating device, a temperature sensor and a distance measuring sensor on a loading frame of a gluing packaging machine; arranging a heat insulation device on the outer side of the heating device; acquiring depths and calibers of LED lamp bowl cups; heating the LED lamp support bowl cups; setting a glue dispensing speed of an automatic glue pouring machine; starting the glue pouring machine to perform gluing processing on the bound LED support bowl cups, and keeping a constant temperature for vacuum de-foaming; and replacing the LED lamp support bowl cups on the loading frame until all bound LED support bowl cups are glued and packaged. When the arranged heating device is used for heating the support, the glue is diluted and the flow velocity thereof is increased. The glue rapidly flows down along the support bowl cup edges. Bubbles inside the cups are extruded. The glue pouring speed is increased. Bubbles can be more easily reduced by adopting a constant-temperature de-foaming way. The LED packaging yield can be effectively improved. Furthermore, the service lifetime of an LED display screen can be prolonged.

Description

The method of vacuum defoamation in a kind of direct insertion LED sealing process
Technical field
The invention belongs to LED chip encapsulation field, be specifically related to the method for vacuum defoamation in a kind of direct insertion LED sealing process.
Background technology
In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material, the reflection loss that photon causes due to refringence at outgoing interface; And the total reflection loss to cause because incidence angle is greater than the cirtical angle of total reflection.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high substratum transparent of one deck refractive index at chip surface---LED silica gel, because this glue-line is between chip and air, thus effectively reduces the loss of photon at interface, improves and get optical efficiency.In addition, the effect of casting glue also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require that its light transmittance is high, refractive index is high, Heat stability is good, good fluidity, is easy to spraying.For improving the reliability of LED, also require that casting glue has agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Casting glue conventional at present comprises epoxy resin and silica gel.Silica gel is high owing to having light transmittance, and refractive index is large, and Heat stability is good, the features such as stress is little, and moisture absorption is low, be obviously better than epoxy resin, be used widely in high-power LED encapsulation, but cost are higher.Research shows, raising silica gel refractive index effectively can reduce the photon loss that refractive index physical barriers brings, and improve external quantum efficiency, but silica gel performance is influenced by environmental temperature.Along with temperature raises, the thermal stress of silica gel inside strengthens, and causes the refractive index of silica gel to reduce, thus affects LED light effect and light distribution.
At present, packaging plastic of the prior art mainly contains following characteristics:
Mixed proportion: A:B=100:100(weight ratio);
Mixing viscosity 25 DEG C: 650 ~ 900cps;
Gel time: 150 DEG C × 85 ~ 105 seconds;
Up time: 25 DEG C × 4 hours;
Condition of cure: initial cure 120 DEG C ~ 125 DEG C × 35 ~ 45 minutes;
Cured later 120 DEG C × 6 ~ 8 hours or 130 DEG C × 6 hours;
Casting glue should be noted that some:
The product surface of sealing is wanted to need to keep dry, clean;
By proportioning taken amount, and weigh accurately, proportioning please be make sure to keep in mind and be weight ratio but not volume ratio, need to stir after A, B agent mixing, to avoid solidification not exclusively;
Please carry out encapsulating in time after stirring, and within the up time, use the glue mixed as far as possible;
Can arrange in pairs or groups diffusant and color of 809A/B uses.
When the problem produced possibly in LED produces is chip package, in cup, bubble Accounting has very large bad proportion, if but product air bubble problem in manufacturing process is not well solved or prevents and treats, the factor that product decay is accelerated will be caused, thus can show that IV reduces, IR becomes large, VF raises, the encapsulation bubble of LED is problem demanding prompt solution in the sector.
In prior art, in the process of vacuum defoamation, resin and curing agent temperature too high, often have the phenomenon that curing agent constantly volatilizees, enter after thickening bubble in bowl cup be not easy discharge.
Summary of the invention
Technical problem to be solved by this invention is: the method providing vacuum defoamation in a kind of direct insertion LED sealing process, solves curing agent volatilization in prior art and causes bubble to be not easy the problem of deviating from.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 ~ 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid enters bowl cup along LED support;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 ~ 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Described diffusant is the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Described distance measuring sensor is infrared distance sensor.
Described temperature sensor is DS18B20.
In described step 7, the temperature of vacuum defoaming device remains on 50 DEG C.
Compared with prior art, the present invention has following beneficial effect:
1, stock shelf arranges heater, colloid can be made during heated holder thinning and accelerate flow velocity, flow down fast along support bowl cup edge, bubble in cup is extruded, accelerate casting glue speed, decrease bubble, effectively improve the rate of finished products of LED, and then improve the useful life of LED display.
2, the heating-up temperature of LED lamp holder bowl cup remains between 50 ~ 80 DEG C, avoids temperature too high, causes curing agent volatilization in de-aeration, is difficult to the phenomenon of deaeration.
3, epoxy resin A, epoxy resin B are mixed according to certain ratio, add diffusant, and stir, by controlling mixed proportion and incorporation time, the problem that after avoiding baking, LED turns yellow, improves quality and the rate of finished products of LED, and then improves the cost performance of LED display.
4, the plastic emitting speed of automatic glue filling machine is set according to the degree of depth of support bowl cup and bore, improves the automaticity of LED casting glue, saved time and cost.
Embodiment
Below structure of the present invention and the course of work are described further.
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 ~ 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid enters bowl cup along LED support;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 ~ 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Described diffusant is the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Described distance measuring sensor is infrared distance sensor.
Described temperature sensor is DS18B20.
In described step 7, the temperature of vacuum defoaming device remains on 50 DEG C.
Stock shelf arranges heater, colloid can be made during heated holder thinning and accelerate flow velocity, flowing down fast along support bowl cup edge, bubble in cup is extruded, accelerates casting glue speed, decrease bubble, effectively improve the rate of finished products of LED, and then improve the useful life of LED display.The heating-up temperature of LED lamp holder bowl cup remains between 50 ~ 80 DEG C, avoids temperature too high, causes curing agent volatilization in de-aeration, is difficult to the phenomenon of deaeration.
Specific embodiment one,
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 65 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid is along LED support bowl cup; Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing, and the weight ratio of epoxy resin A, epoxy resin B and diffusant is 5:3:1; Diffusant is the transparent fog-like liquid of DP series, and viscosity is 50000CPS under normal temperature;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 50 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Specific embodiment two,
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid is along LED support bowl cup; Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing, and the weight ratio of epoxy resin A, epoxy resin B and diffusant is 12:4:1; Diffusant is the transparent fog-like liquid of DP-100H, and viscosity is 30000CPS under normal temperature;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
Specific embodiment three,
A method for vacuum defoamation in direct insertion LED sealing process, comprises the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid is along LED support bowl cup; Described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing, and the weight ratio of epoxy resin A, epoxy resin B and diffusant is 10:5:1; Diffusant is the transparent fog-like liquid of DP-100H, and viscosity is 40000CPS under normal temperature;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.

Claims (7)

1. a method for vacuum defoamation in direct insertion LED sealing process, is characterized in that: comprise the steps:
Step 1, heater, temperature sensor, distance measuring sensor are set on molding machine stock shelf;
Step 2, at heater arranged outside heat-proof device;
Step 3, be fixed on stock shelf by the LED lamp holder bowl cup bound, distance measuring sensor obtains the degree of depth and the bore of LED bowl cup;
Step 4, heater are heated to 50 ~ 80 DEG C to LED lamp holder bowl cup;
Step 5, according to the degree of depth of bowl cup and bore, the plastic emitting speed of setting automatic glue filling machine;
Step 6, startup glue pouring machine carry out sealing process to the LED support bowl cup bound, and colloid enters bowl cup along LED support;
Step 7, carry out vacuum defoamation to the colloid in bowl cup, the temperature keeping defoaming device is 48 ~ 52 DEG C;
Step 8, when colloid reaches the edge of LED support bowl cup, judge whether still have bubble in bowl cup, if there is bubble, continue to perform step 7, otherwise, perform step 9;
Step 9, stop sealing, replace with the LED lamp holder bowl cup on bin, repeated execution of steps 6 to step 8, until the good equal sealing of LED support bowl cup of all bindings completes.
2. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: described colloid is the colloid of epoxy resin A, epoxy resin B and diffusant mixing.
3. the method for vacuum defoamation in direct insertion LED sealing process according to claim 2, is characterized in that: the weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
4. the method for vacuum defoamation in direct insertion LED sealing process according to claim 3, it is characterized in that: described diffusant is the transparent fog-like liquid of DP series ~ DP-100H, viscosity is 30000-50000CPS under normal temperature.
5. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: described distance measuring sensor is infrared distance sensor.
6. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: described temperature sensor is DS18B20.
7. the method for vacuum defoamation in direct insertion LED sealing process according to claim 1, is characterized in that: in described step 7, the temperature of vacuum defoaming device remains on 50 DEG C.
CN201510459427.2A 2015-07-31 2015-07-31 Vacuum defoaming method during direct insert type LED lamp gluing packaging process Pending CN105118909A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112915594A (en) * 2021-01-22 2021-06-08 深圳市鑫路远电子设备有限公司 Artificial intelligence-based vacuum stirring, defoaming and material preparation method and system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442093A (en) * 2008-08-22 2009-05-27 江苏稳润光电有限公司 Encapsulation method for LED
CN104538535A (en) * 2014-11-20 2015-04-22 无锡科思电子科技有限公司 Glue sealing method for preventing LED (Light Emitting Diode) lamp from generating bubble
CN104624397A (en) * 2014-12-31 2015-05-20 厦门华联电子有限公司 Centrifugal debubbling device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442093A (en) * 2008-08-22 2009-05-27 江苏稳润光电有限公司 Encapsulation method for LED
CN104538535A (en) * 2014-11-20 2015-04-22 无锡科思电子科技有限公司 Glue sealing method for preventing LED (Light Emitting Diode) lamp from generating bubble
CN104624397A (en) * 2014-12-31 2015-05-20 厦门华联电子有限公司 Centrifugal debubbling device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112915594A (en) * 2021-01-22 2021-06-08 深圳市鑫路远电子设备有限公司 Artificial intelligence-based vacuum stirring, defoaming and material preparation method and system
CN112915594B (en) * 2021-01-22 2022-08-02 深圳市鑫路远电子设备有限公司 Artificial intelligence-based vacuum stirring, defoaming and material preparation method and system

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Application publication date: 20151202