CN104409611A - Adhesive sealing method in LED (light-emitting diode) encapsulating process - Google Patents
Adhesive sealing method in LED (light-emitting diode) encapsulating process Download PDFInfo
- Publication number
- CN104409611A CN104409611A CN201410666588.4A CN201410666588A CN104409611A CN 104409611 A CN104409611 A CN 104409611A CN 201410666588 A CN201410666588 A CN 201410666588A CN 104409611 A CN104409611 A CN 104409611A
- Authority
- CN
- China
- Prior art keywords
- led
- bowl cup
- glue
- sealing
- adhesive sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000853 adhesive Substances 0.000 title abstract 13
- 230000001070 adhesive effect Effects 0.000 title abstract 13
- 239000003292 glue Substances 0.000 claims description 53
- 239000003822 epoxy resin Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- 238000005266 casting Methods 0.000 claims description 19
- 238000005538 encapsulation Methods 0.000 claims description 18
- 229920000297 Rayon Polymers 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 14
- 239000000084 colloidal system Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 239000007788 liquid Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 206010033799 Paralysis Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an adhesive sealing method in an LED (light-emitting diode) encapsulating process. The adhesive sealing method comprises the following steps of: firstly, arranging a distance measuring sensor connected to a controller on an adhesive sealing machine stand; then, obtaining the depth and the bowl cup mouth caliber of an LED lamp bowl cup; regulating the rotation speed and the binding time of roller wheel of the adhesive sealing machine stand according to the bowl cup depth, the bowl cup caliber and the preset adhesive filling and sealing parameters; regulating the distance between the bracket and the roller wheel of the adhesive sealing stand; and starting an adhesive sealing machine to perform adhesive sealing operation on the bowl cup on the bracket in sequence. The adhesive sealing method can be used for automatically regulating the rotation speed and the binding time of the roller wheel of the adhesive sealing stand, so that the automation degree is improved. Meanwhile, the distance between the bracket and the roller wheel and the adhesive sealing stand is automatically regulated, so that the impurities produced by grinding off the coating on the edge of the bowl cup by virtue of the roller wheel due to too short distance are avoided, and a phenomenon that the bowl cup is deformed and not adhered with the adhesive due to too long distance is avoided.
Description
Technical field
The invention belongs to LED chip encapsulation field, be specifically related to the glue sealing method in a kind of LED encapsulation process.
Background technology
LED is under different ambient temperatures, humidity, in addition the expanding with heat and contract with cold and difference that internal stress is different of own each several part, inner steam bubble constantly affects the transmission of electronics, destroy internal structure, whole luminescent system is finally made to paralyse, there is leakage phenomenon and dead lamp phenomenon, therefore, in encapsulation process, just pay particular attention to the eliminating of steam bubble.
Casting glue is a kind of auxiliary material of LED, has high index of refraction and high transmission rate, and can play the luminous flux that protection LED chip increases LED, viscosity is little, easy deaeration, is applicable to embedding and compression molding, makes LED have good durability and reliability.
In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material; The reflection loss that photon causes due to refringence at outgoing interface; And the total reflection loss to cause because incidence angle is greater than the cirtical angle of total reflection.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high substratum transparent of one deck refractive index at chip surface---LED silica gel, because this glue-line is between chip and air, thus effectively reduces the loss of photon at interface, improves and get optical efficiency.In addition, the effect of casting glue also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require that its light transmittance is high, refractive index is high, Heat stability is good, good fluidity, is easy to spraying.For improving the reliability of LED, also require that casting glue has agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Casting glue conventional at present comprises epoxy resin and silica gel.Silica gel is high owing to having light transmittance, and refractive index is large, and Heat stability is good, the features such as stress is little, and moisture absorption is low, be obviously better than epoxy resin, be used widely in high-power LED encapsulation, but cost are higher.Research shows, raising silica gel refractive index effectively can reduce the photon loss that refractive index physical barriers brings, and improve external quantum efficiency, but silica gel performance is influenced by environmental temperature.Along with temperature raises, the thermal stress of silica gel inside strengthens, and causes the refractive index of silica gel to reduce, thus affects LED light effect and light distribution.
At present, packaging plastic of the prior art mainly contains following characteristics:
Mixed proportion: A:B=100:100(weight ratio);
Mixing viscosity 25 DEG C: 650 ~ 900cps;
Gel time: 150 DEG C × 85 ~ 105 seconds;
Up time: 25 DEG C × 4 hours;
Condition of cure: initial cure 120 DEG C ~ 125 DEG C × 35 ~ 45 minutes;
Cured later 120 DEG C × 6 ~ 8 hours or 130 DEG C × 6 hours;
Casting glue should be noted that some:
The product surface of sealing is wanted to need to keep dry, clean;
By proportioning taken amount, and weigh accurately, proportioning please be make sure to keep in mind and be weight ratio but not volume ratio, need to stir after A, B agent mixing, to avoid solidification not exclusively;
Please carry out encapsulating in time after stirring, and within the up time, use the glue mixed as far as possible;
Can arrange in pairs or groups diffusant and color of 809A/B uses.
Existing sealing system and glue sealing method all need operating personnel or the real-time regulating parameter of maintenance personal, some factory needs to change a variety of type every day, this just needs operating personnel's ceaselessly parameters, require high especially to the sense of duty of operating personnel, once there is human negligence, the qualification rate in LED process will be caused low, or the problem that steam bubble is many.
Summary of the invention
Technical problem to be solved by this invention is: provide the glue sealing method in a kind of LED encapsulation process, solves the low problem causing conforming product rate low of automaticity in prior art.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A glue sealing method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets;
Step 4, regulate distance between support and sealing rolling wheel of platform;
Step 5, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation.
The described degree of depth of LED bowl cup and the wheel speeds of sealing board are inversely proportional to.
The described bore of LED bowl cup was directly proportional to the viscose glue time of sealing board.
The described viscose glue time is 2 ~ 7 seconds.
Described distance measuring sensor is infrared distance sensor.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Compared with prior art, the present invention has following beneficial effect:
1, the degree of depth and the bore of bowl cup is first measured by distance measuring sensor, then rotating speed and the viscose glue time of casting glue rolling wheel of platform is automatically regulated by the bowl cup degree of depth and bore, improve automaticity, simultaneously, distance between automatic adjusting support and casting glue rolling wheel of platform, avoid distance too near, roller grinds off the coating at bowl cup edge and produces foreign material, avoid apart from too far away, have bowl cup owing to being out of shape the phenomenon of being stained with less than glue.
2, epoxy resin A, B are mixed according to certain ratio, add diffusant, and stir, by controlling mixed proportion and incorporation time, the problem that after avoiding baking, LED turns yellow, improves quality and the rate of finished products of LED, and then improves the cost performance of LED display.
3, the method can get rid of bubble fully, improves the reliability of LED.
Embodiment
Below structure of the present invention and the course of work are described further.
A glue sealing method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets;
Step 4, regulate distance between support and sealing rolling wheel of platform;
Step 5, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation.
The described degree of depth of LED bowl cup and the wheel speeds of sealing board are inversely proportional to.
The described bore of LED bowl cup was directly proportional to the viscose glue time of sealing board.
The described viscose glue time is 2 ~ 7 seconds.
Described distance measuring sensor is infrared distance sensor.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Described diffusant can select the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Specific embodiment one,
A glue sealing method in LED encapsulation process, comprises the steps:
Step 1, the infrared distance sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth being obtained LED bowl cup by infrared distance sensor and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets; The degree of depth of LED bowl cup is darker, and the wheel speeds of sealing board is less, otherwise the degree of depth of LED bowl cup is less, and the wheel speeds of sealing board is larger; Each viscose glue time is 2 seconds;
Step 4, regulate distance between support and sealing rolling wheel of platform;
Step 5, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1.
Described diffusant can select the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Specific embodiment two,
A glue sealing method in LED encapsulation process, comprises the steps:
Step 1, the infrared distance sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth being obtained LED bowl cup by infrared distance sensor and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets; The degree of depth of LED bowl cup is darker, and the wheel speeds of sealing board is less, otherwise the degree of depth of LED bowl cup is less, and the wheel speeds of sealing board is larger; Each viscose glue time is 7 seconds;
Step 4, regulate distance between support and sealing rolling wheel of platform;
Step 5, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 12:4:1.
Described diffusant can select the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Specific embodiment three,
A glue sealing method in LED encapsulation process, comprises the steps:
Step 1, the infrared distance sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth being obtained LED bowl cup by infrared distance sensor and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets; The degree of depth of LED bowl cup is darker, and the wheel speeds of sealing board is less, otherwise the degree of depth of LED bowl cup is less, and the wheel speeds of sealing board is larger; Each viscose glue time is 5 seconds;
Step 4, regulate distance between support and sealing rolling wheel of platform;
Step 5, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 10:5:1.
Described diffusant can select the transparent fog-like liquid of DP series ~ DP-100H, and viscosity is 30000-50000CPS under normal temperature.
Claims (7)
1. the glue sealing method in LED encapsulation process, is characterized in that: comprise the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets;
Step 4, regulate distance between support and sealing rolling wheel of platform;
Step 5, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation.
2. the glue sealing method in LED encapsulation process according to claim 1, is characterized in that: the described degree of depth of LED bowl cup and the wheel speeds of sealing board are inversely proportional to.
3. the glue sealing method in LED encapsulation process according to claim 1, is characterized in that: the described bore of LED bowl cup was directly proportional to the viscose glue time of sealing board.
4. the glue sealing method in LED encapsulation process according to claim 1, is characterized in that: the described viscose glue time is 2 ~ 7 seconds.
5. the glue sealing method in LED encapsulation process according to claim 1, is characterized in that: described distance measuring sensor is infrared distance sensor.
6. the glue sealing method in LED encapsulation process according to claim 1, is characterized in that: described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
7. the glue sealing method in LED encapsulation process according to claim 6, is characterized in that: the weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410666588.4A CN104409611A (en) | 2014-11-20 | 2014-11-20 | Adhesive sealing method in LED (light-emitting diode) encapsulating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410666588.4A CN104409611A (en) | 2014-11-20 | 2014-11-20 | Adhesive sealing method in LED (light-emitting diode) encapsulating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104409611A true CN104409611A (en) | 2015-03-11 |
Family
ID=52647223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410666588.4A Pending CN104409611A (en) | 2014-11-20 | 2014-11-20 | Adhesive sealing method in LED (light-emitting diode) encapsulating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104409611A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105024000A (en) * | 2015-07-31 | 2015-11-04 | 苏州南光电子科技有限公司 | Coloring method in LED lamp encapsulating process |
| CN108864956A (en) * | 2018-06-14 | 2018-11-23 | 深圳市德彩光电有限公司 | LED encapsulates glue formula and preparation method |
-
2014
- 2014-11-20 CN CN201410666588.4A patent/CN104409611A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105024000A (en) * | 2015-07-31 | 2015-11-04 | 苏州南光电子科技有限公司 | Coloring method in LED lamp encapsulating process |
| CN108864956A (en) * | 2018-06-14 | 2018-11-23 | 深圳市德彩光电有限公司 | LED encapsulates glue formula and preparation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106019416A (en) | Anti-UV/infrared and color-and-color-fastness-enhanced photonic crystal material | |
| CN101826590B (en) | LED lamp with lens injected with fluorescent glue and packaging method thereof | |
| CN105140379B (en) | One kind is in the uniform white light LED part of space multistory angle light emission color temperature and its method for packing | |
| CN107248546B (en) | The consistent integration packaging display module of surfacing and its manufacturing method | |
| CN104017536A (en) | High-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive | |
| CN104409611A (en) | Adhesive sealing method in LED (light-emitting diode) encapsulating process | |
| CN103700727B (en) | The method for packing of photoelectrical coupler | |
| CN103951984A (en) | Solidifiable silicon resin composition and optical semiconductor device using same | |
| CN104362245A (en) | Potting compound method of LED lamp | |
| CN103022326B (en) | Intensive packaging method of LEDs | |
| CN104538535A (en) | Glue sealing method for preventing LED (Light Emitting Diode) lamp from generating bubble | |
| CN104151939A (en) | High-adhesion glass printing ink for code spraying | |
| CN102120213B (en) | LED fluorescent powder spraying process | |
| CN110429170A (en) | It is a kind of to use the cured chip device packaging technology of ultraviolet light | |
| CN105024000A (en) | Coloring method in LED lamp encapsulating process | |
| CN104057669A (en) | Manufacturing process of fluorine element release film | |
| CN105047802A (en) | Sealing method for direct-insert type light-emitting diode (LED) lamp | |
| CN205790054U (en) | EMC upside-down mounting support adds a package lens structure | |
| CN105322071B (en) | A kind of chip-scale white light LEDs and preparation method thereof | |
| CN105449083B (en) | A kind of method of LED fluorescent powder glue coating | |
| CN105355761B (en) | The photochromic uniform LED fluorescent powder encapsulating structure of one kind and its transparent mould | |
| CN105118909A (en) | Vacuum defoaming method during direct insert type LED lamp gluing packaging process | |
| CN102738372A (en) | Novel LED (light emitting diode) integrated light source module and preparation method thereof | |
| CN102832316A (en) | Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device | |
| CN103779455B (en) | A kind of glue sealing method of LED car lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |
|
| RJ01 | Rejection of invention patent application after publication |