CN105024000A - Coloring method in LED lamp encapsulating process - Google Patents
Coloring method in LED lamp encapsulating process Download PDFInfo
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- CN105024000A CN105024000A CN201510459998.6A CN201510459998A CN105024000A CN 105024000 A CN105024000 A CN 105024000A CN 201510459998 A CN201510459998 A CN 201510459998A CN 105024000 A CN105024000 A CN 105024000A
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- Prior art keywords
- led
- cup
- sealing
- casting glue
- encapsulation process
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- Pending
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004040 coloring Methods 0.000 title claims abstract description 24
- 238000003756 stirring Methods 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims description 61
- 238000007789 sealing Methods 0.000 claims description 44
- 238000005266 casting Methods 0.000 claims description 41
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 238000005538 encapsulation Methods 0.000 claims description 18
- 229920000297 Rayon Polymers 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 12
- 239000000084 colloidal system Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 4
- 239000008393 encapsulating agent Substances 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000005253 cladding Methods 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 230000035882 stress Effects 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 206010033799 Paralysis Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a coloring method in an LED lamp encapsulating process. The method comprises the steps as follows: firstly setting a distance measuring sensor connected with a controller on an encapsulating platform; obtaining the depth and the diameter of the cup of an LED lamp; then adjusting the roller revolving speed and gluing time of the encapsulating platform according the cup depth, the cup diameter and preset encapsulant parameters; adjusting the distance between a bracket and the roller of the encapsulating platform, adding a coloring agent with a preset proportion into an encapsulant, and stirring the mixture evenly; and finally starting an encapsulator and encapsulating the cup on the bracket. The method of the invention could automatically adjust the distance between the bracket and the roller of the encapsulating platform to avoid the phenomenon that the distance is too small, and debris is generated because the cladding material at the edge of the cup is wore off by the roller, and the phenomenon that the distance is too large, and the encapsulant cannot be applied to the cup due to the deformation of the cup. The step of stirring the mixture evenly avoids inconsistency of the color.
Description
Technical field
The invention belongs to LED chip encapsulation field, be specifically related to the colorize method in a kind of LED encapsulation process.
Background technology
LED is under different ambient temperatures, humidity, in addition the expanding with heat and contract with cold and difference that internal stress is different of own each several part, inner steam bubble constantly affects the transmission of electronics, destroy internal structure, whole luminescent system is finally made to paralyse, there is leakage phenomenon and dead lamp phenomenon, therefore, in encapsulation process, just pay particular attention to the eliminating of steam bubble.
Casting glue is a kind of auxiliary material of LED, has high index of refraction and high transmission rate, and can play the luminous flux that protection LED chip increases LED, viscosity is little, easy deaeration, is applicable to embedding and compression molding, makes LED have good durability and reliability.
In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material; The reflection loss that photon causes due to refringence at outgoing interface; And the total reflection loss to cause because incidence angle is greater than the cirtical angle of total reflection.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high substratum transparent of one deck refractive index at chip surface---LED silica gel, because this glue-line is between chip and air, thus effectively reduces the loss of photon at interface, improves and get optical efficiency.In addition, the effect of casting glue also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require that its light transmittance is high, refractive index is high, Heat stability is good, good fluidity, is easy to spraying.For improving the reliability of LED, also require that casting glue has agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Casting glue conventional at present comprises epoxy resin and silica gel.Silica gel is high owing to having light transmittance, and refractive index is large, and Heat stability is good, the features such as stress is little, and moisture absorption is low, be obviously better than epoxy resin, be used widely in high-power LED encapsulation, but cost are higher.Research shows, raising silica gel refractive index effectively can reduce the photon loss that refractive index physical barriers brings, and improve external quantum efficiency, but silica gel performance is influenced by environmental temperature.Along with temperature raises, the thermal stress of silica gel inside strengthens, and causes the refractive index of silica gel to reduce, thus affects LED light effect and light distribution.
At present, packaging plastic of the prior art mainly contains following characteristics:
Mixed proportion: A:B=100:100(weight ratio);
Mixing viscosity 25 DEG C: 650 ~ 900cps;
Gel time: 150 DEG C × 85 ~ 105 seconds;
Up time: 25 DEG C × 4 hours;
Condition of cure: initial cure 120 DEG C ~ 125 DEG C × 35 ~ 45 minutes;
Cured later 120 DEG C × 6 ~ 8 hours or 130 DEG C × 6 hours;
Casting glue should be noted that some:
The product surface of sealing is wanted to need to keep dry, clean;
By proportioning taken amount, and weigh accurately, proportioning please be make sure to keep in mind and be weight ratio but not volume ratio, need to stir after A, B agent mixing, to avoid solidification not exclusively;
Please carry out encapsulating in time after stirring, and within the up time, use the glue mixed as far as possible;
Can arrange in pairs or groups diffusant and color of 809A/B uses.
LED color after existing sealing easily produces aberration and colloid generation point-like glue splits phenomenon, and this phenomenon is generally owing to having crystalloid in colouring agent, or uneven concentration, and crystallization sedimentation causes.
Summary of the invention
Technical problem to be solved by this invention is: provide the colorize method in a kind of LED encapsulation process, solves the problem that colouring agent crystallization sedimentation in prior art causes LED to have aberration or colloid glue to split.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A colorize method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets;
Step 4, the colouring agent of pre-set ratio to be added in casting glue, and to carry out uniform stirring;
Step 5, judge stir after whether there is crystalloid colouring agent, if exist, proceed to stir the time preset, repeated execution of steps 5, otherwise, perform step 6;
Step 5, the casting glue that stirs is loaded in molding machine, regulate the distance between support and sealing rolling wheel of platform;
Step 6, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation;
The colourity of the LED after step 7, acquisition casting glue, and compare with the colourity preset, judge whether colour difference is greater than Chroma threshold, if be greater than Chroma threshold, regulate the ratio of colouring agent and casting glue, return and perform step 4, otherwise, perform step 8;
Step 8, repeated execution of steps 5 to step 8, until LED sealing completes.
The described degree of depth of LED bowl cup and the wheel speeds of sealing board are inversely proportional to.
The described bore of LED bowl cup and the viscose glue time of sealing board are inversely proportional to.
The described viscose glue time is 2 ~ 7 seconds.
Described distance measuring sensor is infrared distance sensor.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Compared with prior art, the present invention has following beneficial effect:
1, the degree of depth and the bore of bowl cup is first measured by distance measuring sensor, then rotating speed and the viscose glue time of casting glue rolling wheel of platform is automatically regulated by the bowl cup degree of depth and bore, improve automaticity, simultaneously, distance between automatic adjusting support and casting glue rolling wheel of platform, avoid distance too near, roller grinds off the coating at bowl cup edge and produces foreign material, avoid apart from too far away, have bowl cup owing to being out of shape the phenomenon of being stained with less than glue.
2, regulate the ratio of colouring agent according to colour difference, and carry out uniform stirring, make the color of LED more even, colourity consistency is better, avoids producing colouring agent crystallization sedimentation.
3, epoxy resin A, B are mixed according to certain ratio, add diffusant, and stir, by controlling mixed proportion and incorporation time, the problem that after avoiding baking, LED turns yellow, improves quality and the rate of finished products of LED, and then improves the cost performance of LED display.
4, the method can get rid of bubble fully, improves the reliability of LED.
Embodiment
Below structure of the present invention and the course of work are described further.
A colorize method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets;
Step 4, the colouring agent of pre-set ratio to be added in casting glue, and to carry out uniform stirring;
Step 5, judge stir after whether there is crystalloid colouring agent, if exist, proceed to stir the time preset, repeated execution of steps 5, otherwise, perform step 6;
Step 5, the casting glue that stirs is loaded in molding machine, regulate the distance between support and sealing rolling wheel of platform;
Step 6, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation;
The colourity of the LED after step 7, acquisition casting glue, and compare with the colourity preset, judge whether colour difference is greater than Chroma threshold, if be greater than Chroma threshold, regulate the ratio of colouring agent and casting glue, return and perform step 4, otherwise, perform step 8;
Step 8, repeated execution of steps 5 to step 8, until LED sealing completes.
The described degree of depth of LED bowl cup and the wheel speeds of sealing board are inversely proportional to.
The described bore of LED bowl cup and the viscose glue time of sealing board are inversely proportional to.
The described viscose glue time is 2 ~ 7 seconds.
Described distance measuring sensor is infrared distance sensor.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Specific embodiment one,
A colorize method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets; The degree of depth of LED bowl cup is darker, and the wheel speeds of sealing board is less, otherwise the degree of depth of LED bowl cup is less, and the wheel speeds of sealing board is larger; Each viscose glue time is 2 seconds;
Step 4, the colouring agent of pre-set ratio to be added in casting glue, and to carry out uniform stirring;
Step 5, judge stir after whether there is crystalloid colouring agent, if exist, proceed to stir the time preset, repeated execution of steps 5, otherwise, perform step 6;
Step 5, the casting glue that stirs is loaded in molding machine, regulate the distance between support and sealing rolling wheel of platform;
Step 6, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation;
The colourity of the LED after step 7, acquisition casting glue, and compare with the colourity preset, judge whether colour difference is greater than Chroma threshold, if be greater than Chroma threshold, regulate the ratio of colouring agent and casting glue, return and perform step 4, otherwise, perform step 8;
Step 8, repeated execution of steps 5 to step 8, until LED sealing completes.
Described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1.
Specific embodiment two,
A colorize method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets; The degree of depth of LED bowl cup is darker, and the wheel speeds of sealing board is less, otherwise the degree of depth of LED bowl cup is less, and the wheel speeds of sealing board is larger; Each viscose glue time is 7 seconds;
Step 4, the colouring agent of pre-set ratio to be added in casting glue, and to carry out uniform stirring;
Step 5, judge stir after whether there is crystalloid colouring agent, if exist, proceed to stir the time preset, repeated execution of steps 5, otherwise, perform step 6;
Step 5, the casting glue that stirs is loaded in molding machine, regulate the distance between support and sealing rolling wheel of platform;
Step 6, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation;
The colourity of the LED after step 7, acquisition casting glue, and compare with the colourity preset, judge whether colour difference is greater than Chroma threshold, if be greater than Chroma threshold, regulate the ratio of colouring agent and casting glue, return and perform step 4, otherwise, perform step 8;
Step 8, repeated execution of steps 5 to step 8, until LED sealing completes.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 12:4:1.
Specific embodiment three,
A colorize method in LED encapsulation process, comprises the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets; The degree of depth of LED bowl cup is darker, and the wheel speeds of sealing board is less, otherwise the degree of depth of LED bowl cup is less, and the wheel speeds of sealing board is larger; Each viscose glue time is 5 seconds;
Step 4, the colouring agent of pre-set ratio to be added in casting glue, and to carry out uniform stirring;
Step 5, judge stir after whether there is crystalloid colouring agent, if exist, proceed to stir the time preset, repeated execution of steps 5, otherwise, perform step 6;
Step 5, the casting glue that stirs is loaded in molding machine, regulate the distance between support and sealing rolling wheel of platform;
Step 6, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation;
The colourity of the LED after step 7, acquisition casting glue, and compare with the colourity preset, judge whether colour difference is greater than Chroma threshold, if be greater than Chroma threshold, regulate the ratio of colouring agent and casting glue, return and perform step 4, otherwise, perform step 8;
Step 8, repeated execution of steps 5 to step 8, until LED sealing completes.
The weight ratio of described epoxy resin A, epoxy resin B and diffusant is 10:5:1.
Claims (7)
1. the colorize method in LED encapsulation process, is characterized in that: comprise the steps:
Step 1, the distance measuring sensor that setting is connected with controller on sealing board;
Step 2, the degree of depth obtaining LED bowl cup and bowl rim of a cup footpath;
Step 3, regulate rotating speed and the viscose glue time of sealing rolling wheel of platform according to the bowl cup degree of depth, bowl rim of a cup footpath and the casting glue parameter that presets;
Step 4, the colouring agent of pre-set ratio to be added in casting glue, and to carry out uniform stirring;
Step 5, judge stir after whether there is crystalloid colouring agent, if exist, proceed to stir the time preset, repeated execution of steps 5, otherwise, perform step 6;
Step 5, the casting glue that stirs is loaded in molding machine, regulate the distance between support and sealing rolling wheel of platform;
Step 6, startup molding machine, the bowl cup be opposite to successively on support carries out sealing operation;
The colourity of the LED after step 7, acquisition casting glue, and compare with the colourity preset, judge whether colour difference is greater than Chroma threshold, if be greater than Chroma threshold, regulate the ratio of colouring agent and casting glue, return and perform step 4, otherwise, perform step 8;
Step 8, repeated execution of steps 5 to step 8, until LED sealing completes.
2. the colorize method in LED encapsulation process according to claim 1, is characterized in that: the described degree of depth of LED bowl cup and the wheel speeds of sealing board are inversely proportional to.
3. the colorize method in LED encapsulation process according to claim 1, is characterized in that: the described bore of LED bowl cup and the viscose glue time of sealing board are inversely proportional to.
4. the colorize method in LED encapsulation process according to claim 1, is characterized in that: the described viscose glue time is 2 ~ 7 seconds.
5. the colorize method in LED encapsulation process according to claim 1, is characterized in that: described distance measuring sensor is infrared distance sensor.
6. the colorize method in LED encapsulation process according to claim 1, is characterized in that: described casting glue is the colloid of epoxy resin A, B and diffusant mixing.
7. the colorize method in LED encapsulation process according to claim 6, is characterized in that: the weight ratio of described epoxy resin A, epoxy resin B and diffusant is 5:3:1 ~ 12:4:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510459998.6A CN105024000A (en) | 2015-07-31 | 2015-07-31 | Coloring method in LED lamp encapsulating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510459998.6A CN105024000A (en) | 2015-07-31 | 2015-07-31 | Coloring method in LED lamp encapsulating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105024000A true CN105024000A (en) | 2015-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510459998.6A Pending CN105024000A (en) | 2015-07-31 | 2015-07-31 | Coloring method in LED lamp encapsulating process |
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| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4292794B2 (en) * | 2002-12-04 | 2009-07-08 | 日亜化学工業株式会社 | Light emitting device, method for manufacturing light emitting device, and method for adjusting chromaticity of light emitting device |
| CN102751396A (en) * | 2011-04-22 | 2012-10-24 | 展晶科技(深圳)有限公司 | Method for manufacturing LED (light emitting diode) packaging structures |
| CN104409611A (en) * | 2014-11-20 | 2015-03-11 | 无锡科思电子科技有限公司 | Adhesive sealing method in LED (light-emitting diode) encapsulating process |
-
2015
- 2015-07-31 CN CN201510459998.6A patent/CN105024000A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4292794B2 (en) * | 2002-12-04 | 2009-07-08 | 日亜化学工業株式会社 | Light emitting device, method for manufacturing light emitting device, and method for adjusting chromaticity of light emitting device |
| CN102751396A (en) * | 2011-04-22 | 2012-10-24 | 展晶科技(深圳)有限公司 | Method for manufacturing LED (light emitting diode) packaging structures |
| CN104409611A (en) * | 2014-11-20 | 2015-03-11 | 无锡科思电子科技有限公司 | Adhesive sealing method in LED (light-emitting diode) encapsulating process |
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Application publication date: 20151104 |
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