CN104600179A - LED fluorescent powder layer with conformal-remote structure and preparation method - Google Patents
LED fluorescent powder layer with conformal-remote structure and preparation method Download PDFInfo
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- CN104600179A CN104600179A CN201510029185.3A CN201510029185A CN104600179A CN 104600179 A CN104600179 A CN 104600179A CN 201510029185 A CN201510029185 A CN 201510029185A CN 104600179 A CN104600179 A CN 104600179A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses an LED fluorescent powder layer with a conformal-remote structure and a preparation method. The preparation method includes steps that 1, preparing a transparent conformal layer (pre-coated layer), to be specific, using transparent colloid to form the pre-coated layer with the conformal attribute at the surface of an LED chip; 2, fluorescent powder coating, to be specific, mixing the fluorescent powder with colloid to form uniform powder syrup, and applying the powder syrup to the LED chip pre-coated with the transparent conformal layer to obtain the fluorescent powder layer. The preparation method is capable of preparing the LED fluorescent powder layer with the conformal-remote structure, because the remote structure transparent layer is capable of increasing the blue light extraction efficiency, the structure can effectively increase the light emitting efficiency of an LED apparatus and reduce the heat effect of the fluorescent powder layer; the transparent remote layer with the conformal attribute and the fluorescent powder coat structure can match with the light intensity distribution of the LED and effectively improve the light emitting quality of the white LED and the space uniformity of the light color and brightness; the technology has good application value in the pc-WLED encapsulation.
Description
Technical field
The invention belongs to field of photoelectric technology, be specifically related to a kind of integrated preparation method of LED fluorescent powder coating.
Background technology
LED is the abbreviation of light-emitting diode (light emitting diode), can be divided into organic LED (i.e. OLED) and the large class of inorganic LED (being commonly referred to as LED) two according to the difference of its luminescent material.1996, blue GaN base light-emitting diode basis successfully achieves White LED, its have low voltage drive, all solid state, low-power consumption, long-acting reliable, pollution-free, the advantage such as to change.Therefore, in recent years, the semiconductor lighting (forth generation lighting technology) based on white light LEDs obtains and develops fast.
Current modal white light LEDs implementation is fluorescent material conversion hysteria is (pc-LED), such as, at (yellow+blue) white light LEDs of blue-light LED chip surface application one deck yellow fluorescent powder.The actualizing technology of phosphor powder layer in addition, what mainly adopt is traditional dosing technology, i.e. the gluing process of fluorescent material mixing silica gel.But the fluorescent coating obtained like this due to structure uneven, poor controllability, so that the lack of homogeneity of LED bright dipping.
Overcome above-mentioned defect, just must realize the thickness of phosphor powder layer, the uniform, controllable of shape.
Summary of the invention
The present invention obtains a kind of LED fluorescent powder coating structure with conformal-remote structure by improving LED plane coating (conformal coating) technology, solves and improve some problems that existing plane coating technology exists.
Technical scheme of the present invention is: a kind of LED fluorescent powder layer and preparation method with conformal-remote structure, is characterized in that, comprise the following steps:
(1), by colloid and the solvent transparent pre-coating solution of mixed preparing according to a certain percentage;
(2), transparent to (1) pre-coating solution is coated in transparent conformal layer LED chip being formed there is conform attribute;
(3), colloid and fluorescent material are mixed according to a certain percentage acquisition powder slurry;
(4), the powder obtained in (3) slurry is coated on the LED chip of the existing transparent precoated shet of conformal in (2), form the phosphor powder layer with conformal attribute, obtain the LED fluorescent powder coating with conformal-remote structure.
In step (1), described colloid is one or more combinations in silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) or photoresists; In step (3), described colloid is one or more combinations in silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) or photoresists; Described photosensitive colloid comprises following three class negative-working photoresists: 1. emulsion+film forming formulation, i.e. photosensitive compounds+macromolecular compound type, wherein emulsion is one or more the combination in bichromate, chromate, diazonium compound or azido cpd; Film forming agent is one or more the combination in polyvinyl alcohol (PVA), gum arabic, polyimides or polyvinyl acetate emulsion; 2. the macromolecular compound type with photosensitive base, mainly contains one or more the combination in polyvinyl cinnamate, polyvinyl alcohol Chinese cassia tree fork acetic acid esters, polyethylene oxygen ethyl-cinnamic acid ester, polyvinylpyrrolidone or polyvinyl alcohol-p-azidobenzoic acid ester (PVAB); 3. one or more the combination in SBQ photoresists (polyvinyl alcohol cyclic ketal styryl pyridinium resin photoresists), SBQ-PVA+ macromolecule emulsion, SBQ-PVA+ macromolecule emulsion+acrylate or organic benzene, organic vinylpyridine salt resin photoresists system; Photosensitive colloid is the combination of a class in above-mentioned three classes or multiclass.
In step (1), when described colloid employing silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC), need first transparent silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) one or more and organic solvent in certain ratio to be mixed, adopt spraying, spin coating, printing mode obtain transparent precoated shet; Described organic solvent is the organic solvent of ethers, ester class or other alkyl; Described colloid and solvent volume ratio are 0.1%-20%; Ether organic solvent is oxolane and the derivative after modifying thereof; Based organic solvent refers to ethyl acetate, propyl acetate, butyl acetate or ethyl butyrate; Alkyl organic solvent refers to normal heptane, normal hexane, pentane, normal octane.
In step (1), when described colloid is photoresists, employing exposure, developing process obtain the conformal coating thoroughly with conformal attribute, described Exposure mode be adopt LED self luminescence from Exposure mode or adopt outer light source in conjunction with the outer Exposure mode of mask plate, described outer light source is the light source of other wavelength of ultraviolet source or photosensitive colloid sensitivity, and the developer solution of development comprises one or more the combination in deionized water, running water, weak acid, weak base or organic solvent.
In step (1), when described colloid employing silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC), the mode of employing spraying, spin coating, printing obtains the conformal precoated shet of conformal attribute.
In step (1), the conformal hyaline layer obtained can increase the extraction yield of light, and the blue light extracted is more even in space, thus can effectively increase LED component luminous efficiency and improve white light LEDs go out light quality and photochromic and spatially uniform that is brightness, and conformal hyaline layer has isolated chip and phosphor powder layer, the thermal effect of phosphor powder layer can be reduced.
In step (1), the conform hyaline layer obtained can improve the tack at fluorescent material and interface, thus follow-up phosphor powder layer can be made more can to mate the light distribution of LED, that effectively improves white light LEDs goes out light quality and photochromic and spatially uniform that is brightness.
In step (2), described pre-coating solution painting method is one or more the combination in spraying, printing or some glue.
In step (2), required drying mode can be that nature dries in the shade, natural air drying, heater plate, drying oven heat or one or more combinations of infrared heating.
In step (3), when described colloid employing silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC), need first transparent silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) one or more and organic solvent in certain ratio to be mixed, adopt spraying, spin coating, printing mode obtain transparent precoated shet; Described organic solvent is the organic solvent of ethers, ester class or other alkyl; Described colloid and solvent volume ratio are 0.1%-20%; Ether organic solvent is oxolane and the derivative after modifying thereof; Based organic solvent refers to ethyl acetate, propyl acetate, butyl acetate or ethyl butyrate; Alkyl organic solvent refers to normal heptane, normal hexane, pentane, normal octane.
In step (3), when described colloid is photoresists, employing exposure, developing process obtain the phosphor powder layer thoroughly with conform attribute, described Exposure mode be adopt LED self luminescence from Exposure mode or adopt outer light source in conjunction with the outer Exposure mode of mask plate, described outer light source is the light source of other wavelength of ultraviolet source or photosensitive colloid sensitivity, and the developer solution of development comprises one or more the combination in deionized water, running water, weak acid, weak base or organic solvent.
In step (3), when described colloid employing silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC), the coating method of employing spraying, electrostatic spraying, electrophoretic deposition, printing, spin coating obtains the phosphor powder layer with conformal attribute.
In step (3), its structure of phosphor powder layer, the shape with conformal attribute all have good uniformity consistency, and its process control is stablized, thus effectively can improve white light LEDs go out light quality, the spatially uniform of photochromic and brightness.
In step (3), fluorescent material used is yellow fluorescent material or the fluorescent material of three primary colors; Can also be included as simultaneously and improve color rendering and one or more combination in the green emitting phosphor that adds or red fluorescence powder.
In step (3), described comprises in the particle of fluorescent material one or more the combination that can contain in polymethyl methacrylate (PMMA), polystyrene (PS), titanium oxide, aluminium oxide, yittrium oxide, silica, zinc oxide, gallium nitride, silicon nitride, carborundum or zirconia, also can only have fluorescent powder grain.
In step (4), required drying mode can be that nature dries in the shade, natural air drying, infrared heating, baking oven heat or one or more combination of heater plate.
In step (4), namely the LED fluorescent powder coating of described conformal-remote structure has the remote layer coating phosphor powder layer of conformal attribute.
In step (4), described phosphor powder layer can be the phosphor powder layer with conformal attribute, also can be the phosphor powder layer of other structures.
Above-mentioned said LED is organic LED, inorganic LED or both combinations.Described LED is single LEDs chip, or the plurality of LEDs chipset of same substrate, or whole wafer.
For the phosphor slurry of heterogeneity, variable concentrations, repeat (3) (4) step, multiple or the multilayered fluorescent powder coating on the surface of LED component light direction can be realized, even also can be that the phosphor slurry of identical composition repeatedly repeats above-mentioned processing step, thus obtain the fluorescent coating of the sandwich construction of same component.
In addition, (2) (3) (4) step can be repeated, obtain the phosphor powder layer of the sandwich construction that a kind of conform hyaline layer, phosphor powder layer, conform hyaline layer alternately occur.
Use this technology can LED light direction realize on the surface one or more, cover intact and uniform phosphor powder layer pattern.
The technology of the present invention is not only suitable for the white light LED part preparation of yellow fluorescent powder+blue-light LED chip, also be suitable for the white light LEDs implementation of UV LED chip+multicolor phosphor (such as RGB three primary colors fluorescent powder), and other go out fluorescent material conversion hysteria (pc-LEDs) device of light color.
The present invention can obtain a kind of fluorescent coating with conformal-remote structure, and because conformal hyaline layer can increase blue light extraction efficiency, therefore this structure effectively can increase the luminous efficiency of LED component, and reduces the thermal effect of fluorescent coating; And conformal hyaline layer and powder slurry processes fluorescent coating structure can mate the light distribution of LED, that effectively can improve white light LEDs goes out light quality, this technology both can be applied to the encapsulation of LED core chip level, also can apply to the coating encapsulates of wafer (Wafer) level, in PC-LED encapsulation, there is good using value.
Accompanying drawing explanation
Accompanying drawing is obtain a kind of schematic diagram with conformal-remote structure fluorescent material bisque.Fig. 1 a is LED chip schematic diagram; Fig. 1 b is for coating conformal precoated shet LED chip schematic diagram; Fig. 1 c is the LED schematic diagram that coating fluorescent material obtains the conformal phosphor powder layer of conformal-remote structure, Fig. 1 d is that coating fluorescent material obtains the LED schematic diagram of the non-conformal phosphor powder layer of conformal-remote structure wherein, 1 is fluorescent powder grain, 2 is LED chip, 3 is colloid, 4 is precoated shet, and 5 is substrate.
Embodiment
Below in conjunction with accompanying drawing and case study on implementation, the invention will be further described:
Embodiment 1
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 2
Weigh 0.5ml epoxy resin 50ml ethyl acetate, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form the conformal layer of layer of transparent at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 3
Weigh 0.1ml silica gel 100ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 4
Weigh 5ml silica gel 25ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 5
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Both are mixed acquisition photoresists by the 0.26%ADC that 5%PVA, 0.68ml that weighing 0.72ml has configured have prepared;
Photoresists are coated on LED chip, use drying box heat drying, then adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, and developing time is 30s ~ 5min, then blows away loose unnecessary photoresists with deionized water rinsing or blowing, just obtains the conformal layer of layer of transparent;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 6
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Both are mixed acquisition photoresists by the 0.26%ADC that 5%PVA, 0.3ml that weighing 1.56ml has configured have prepared;
Photoresists are coated on LED chip, use drying box heat drying, then adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, and developing time is 30s ~ 5min, then blows away loose unnecessary photoresists with deionized water rinsing or blowing, just obtains the conformal layer of layer of transparent;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 7
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Both are mixed acquisition photoresists by the 0.26%ADC that 5%PVA, 1ml that weighing 0.26ml has configured have prepared;
Photoresists are coated on LED chip, use drying box heat drying, then adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, and developing time is 30s ~ 5min, then blows away loose unnecessary photoresists with deionized water rinsing or blowing, just obtains the conformal layer of layer of transparent;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 8
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.15g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.3%ADC;
Take 0.4g fluorescent material, 0.3%ADC that 5%PVA, 0.6ml that 0.8ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 9
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.1g dichromic acid by (ADC) and 20ml deionized water mixes, i.e. 0.5%ADC;
Take 0.4g fluorescent material, 0.5%ADC that 5%PVA, 0.5ml that 1ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 10
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.1g dichromic acid by (ADC) and 100ml deionized water mixes, i.e. 0.1%ADC;
Take 0.4g fluorescent material, 0.1%ADC that 5%PVA, 0.8ml that 0.4ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 11
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.1g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.2%ADC;
Take 0.36g fluorescent material, 0.2%ADC that 5%PVA, 0.6ml that 0.8ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 12
Weigh 0.5ml silica gel, 50ml oxolane, 0.25g polymethyl methacrylate, three is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 13
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g polymethyl methacrylate, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed and forms powder slurry;
Adopt dotting glue method that powder slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development adopts deionized water to be heated to 35 DEG C ~ 80 DEG C and to develop, and developing time is 30s ~ 5min, then blows away loose unnecessary powder with deionized water rinsing or blowing, forms at chip surface the conformal layer that one deck contains transparent powder;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in above-mentioned LED chip on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 14
Weigh 0.5ml silica gel, 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.2g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.2g polymethyl methacrylate, 0.72ml have configured have prepared, mix formation phosphor slurry by four;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 15
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
0.26%ADC, 0.4g polymethyl methacrylate that 5%PVA, 0.68ml that weighing 0.72ml has configured have prepared, mixes acquisition photoresists by three;
Photoresists are coated on LED chip, use drying box heat drying, then adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary photoresists with deionized water rinsing or blowing, just obtain the transparent conformal layer that one deck contains poly methyl methacrylate particle;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 16
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
Adopt mode of printing to be coated on LED chip by pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 17
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
Adopt spin coating mode to be coated on LED chip by pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 18
Weigh 0.5ml epoxy resin 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 19
Weigh 0.5ml silica gel 50ml normal heptane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, obtain the conformal phosphor powder layer with conformal-remote structure, and reclaim fluorescent material.
Embodiment 20
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, and developing time is 30s ~ 5min, then blows away loose unnecessary fluorescent material, last heat drying with deionized water rinsing or blowing;
Adopt dotting glue method that phosphor slurry is coated in LED chip on the surface again, with drying box heating (40 DEG C) dry 20min;
Then adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, then loose unnecessary fluorescent material is blown away with deionized water rinsing or blowing, heat drying, obtain the conformal phosphor powder layer with conformal-remote structure, finally reclaim fluorescent material.
Embodiment 21
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Take 0.4g fluorescent material, 0.26%ADC that 5%PVA, 0.68ml that 0.72ml has configured have prepared, three is mixed formation phosphor slurry;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, and developing time is 30s ~ 5min, then blows away loose unnecessary fluorescent material, last heat drying with deionized water rinsing or blowing;
Again LED chip is put and heat (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Then adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (40 DEG C) dry 20min;
Finally adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, developing time is 30s ~ 5min, blow away loose unnecessary fluorescent material with deionized water rinsing or blowing, heat drying, obtain the conformal phosphor powder layer with conformal-remote structure; Reclaim fluorescent material.
Embodiment 22
Weigh a certain amount of silica gel oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Weigh certain fluorescent material, silica gel, oxolane three is mixed acquisition phosphor slurry;
Adopt spraying process that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (150 DEG C) dry 2h, obtain the conformal phosphor powder layer with conformal-remote structure.
Embodiment 23
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
LED chip is put and heats (120 DEG C) on hot plate and spray pre-coating solution, form layer of transparent conformal layer at chip surface;
Take 0.2g fluorescent material, 2g joins arogel and both mixed, vacuumize removing bubble and obtain phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (150 DEG C) dry 2h, obtain the non-conformal phosphor powder layer with conformal-remote structure.
Embodiment 24
Weigh 5g polyvinyl alcohol (PVA) and the mixing of 100mL deionized water, stirring and dissolving 30min in boiling water bath, solution presents clear homogeneous shape, without tuberculosis phenomenon, static, treats bubble collapse, i.e. 5%PVA;
Weighing 0.13g dichromic acid by (ADC) and 50ml deionized water mixes, i.e. 0.26%ADC;
Both are mixed acquisition photoresists by the 0.26%ADC that 5%PVA, 0.68ml that weighing 0.72ml has configured have prepared;
Photoresists are coated on LED chip, use drying box heat drying, then adopt 1A electric current, time for exposure 0.2ms ~ 1ms from exposure; Development employing deionized water is heated to 35 DEG C ~ 80 DEG C and develops, and developing time is 30s ~ 5min, then blows away loose unnecessary photoresists with deionized water rinsing or blowing, just obtains the conformal layer of layer of transparent;
Take 0.2g fluorescent material, 2g joins arogel and both mixed, vacuumize removing bubble and obtain phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (150 DEG C) dry 2h, obtain the non-conformal phosphor powder layer with conformal-remote structure.
Embodiment 25
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
Adopt mode of printing to be coated on LED chip by pre-coating solution, form layer of transparent conformal layer at chip surface;
Take 0.2g fluorescent material, 2g joins arogel and both mixed, vacuumize removing bubble and obtain phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (150 DEG C) dry 2h, obtain the non-conformal phosphor powder layer with conformal-remote structure.
Embodiment 26
Weigh 0.5ml silica gel 50ml oxolane, the two is mixed acquisition pre-coating solution;
Adopt spin coating mode to be coated on LED chip by pre-coating solution, form layer of transparent conformal layer at chip surface;
Take 0.2g fluorescent material, 2g joins arogel and both mixed, vacuumize removing bubble and obtain phosphor slurry;
Adopt dotting glue method that phosphor slurry is coated in the LED chip of precoating on the surface, with drying box heating (150 DEG C) dry 2h, obtain the non-conformal phosphor powder layer with conformal-remote structure.
Claims (10)
1. there is LED fluorescent powder layer and the preparation method of conformal-remote structure, it is characterized in that, comprise the following steps:
(1), by colloid and the solvent transparent pre-coating solution of mixed preparing according to a certain percentage;
(2), transparent to (1) pre-coating solution is coated in transparent conformal layer LED chip being formed there is conformal attribute;
(3), colloid and the particle containing fluorescent material are mixed acquisition powder slurry according to a certain percentage;
(4), the powder obtained in (3) slurry is coated on the LED chip of the existing transparent precoated shet of conformal in (2), forms phosphor powder layer, obtain the LED fluorescent powder coating with conformal-remote structure.
2. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 1, it is characterized in that: in step (1), described colloid is one or more combinations in silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) or photosensitive colloid; In step (3), described colloid is one or more combinations in silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) or photosensitive colloid.
3. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 1, it is characterized in that: in step (4), the powder obtained in step (3) slurry is coated on the LED chip of the existing transparent precoated shet of conformal in step (2), form the phosphor powder layer with conformal attribute, obtain the LED fluorescent powder coating of the conformal with conformal-remote structure.
4. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 2, it is characterized in that: described photosensitive colloid comprises following three class negative-working photoresists: 1. emulsion+film forming formulation, i.e. photosensitive compounds+macromolecular compound type, wherein emulsion is one or more the combination in bichromate, chromate, diazonium compound or azido cpd; Film forming agent is one or more the combination in polyvinyl alcohol (PVA), gum arabic, polyimides or polyvinyl acetate emulsion; 2. the macromolecular compound type with photosensitive base, mainly contains one or more the combination in polyvinyl cinnamate, polyvinyl alcohol Chinese cassia tree fork acetic acid esters, polyethylene oxygen ethyl-cinnamic acid ester, polyvinylpyrrolidone or polyvinyl alcohol-p-azidobenzoic acid ester (PVAB); 3. one or more the combination in SBQ photoresists (polyvinyl alcohol cyclic ketal styryl pyridinium resin photoresists), SBQ-PVA+ macromolecule emulsion, SBQ-PVA+ macromolecule emulsion+acrylate or organic benzene, organic vinylpyridine salt resin photoresists system; Photosensitive colloid is the combination of a class in above-mentioned three classes or multiclass; Then the conformal coating of exposure, developing process acquisition conformal attribute is adopted.
5. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 4, it is characterized in that: described Exposure mode be adopt LED self luminescence from Exposure mode or adopt outer light source in conjunction with the outer Exposure mode of mask plate, described outer light source is the light source of other wavelength of ultraviolet source or photosensitive colloid sensitivity; The developer solution of development comprises one or more the combination in deionized water, running water, weak acid, weak base or organic solvent.
6. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 1, it is characterized in that: in step (2), described pre-coating solution painting method is spraying, electrostatic spraying, electrophoretic deposition, printing, spin coating, perfusion, dipping or one or more the combination of some glue, adopt spraying, printing, spin coating coating method can directly obtain conformal layer, also first spraying can be adopted, electrostatic spraying, electrophoretic deposition, printing, spin coating, perfusion, then dipping or some glue coating method need to adopt exposure, developing process obtains the conformal coating of conformal attribute, in step (3), described powder slurry painting method is one or more the combination in spraying, electrostatic spraying, electrophoretic deposition, printing, spin coating, perfusion, dipping or some glue.
7. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 1, it is characterized in that: in step (1), described colloid is transparent silica gel, epoxy resin, polymethyl methacrylate (PMMA), during one or more combinations of Merlon (PC), first will by transparent silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) one or more and organic solvent in certain ratio mix, then spraying is adopted, spin coating, the modes such as printing obtain the conformal precoated shet with conformal attribute.
8. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 7, is characterized in that: described organic solvent is the organic solvent of ethers, ester class or other alkyl; Described colloid and solvent volume ratio are 0.1%-20%; Ether organic solvent is oxolane and the derivative after modifying thereof; Based organic solvent refers to ethyl acetate, propyl acetate, butyl acetate or ethyl butyrate, pentyl acetate; Alkyl organic solvent refers to normal heptane, normal hexane, pentane, normal octane.
9. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 1, is characterized in that: in step (3), and fluorescent material used is yellow fluorescent material or the fluorescent material of three primary colors; Can also be included as simultaneously and improve color rendering and one or more combination in the green emitting phosphor that adds or red fluorescence powder.
10. a kind of LED fluorescent powder layer and preparation method with conformal-remote structure according to claim 1, it is characterized in that: in step (3), described comprises in the particle of fluorescent material one or more the combination that can contain in polymethyl methacrylate (PMMA), polystyrene (PS), titanium oxide, aluminium oxide, yittrium oxide, silica, zinc oxide, gallium nitride, silicon nitride, carborundum or zirconia, also can only have fluorescent powder grain.
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| CN106848041A (en) * | 2017-03-23 | 2017-06-13 | 电子科技大学 | A kind of LED light source for aquaculture |
| CN107611239A (en) * | 2017-08-16 | 2018-01-19 | 芜湖晶鑫光电照明有限公司 | A kind of coating processes of automobile lamp fluorescent material |
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