CN101867007A - Preparation method of LED lamp fluorescent powder layer - Google Patents
Preparation method of LED lamp fluorescent powder layer Download PDFInfo
- Publication number
- CN101867007A CN101867007A CN201010168494A CN201010168494A CN101867007A CN 101867007 A CN101867007 A CN 101867007A CN 201010168494 A CN201010168494 A CN 201010168494A CN 201010168494 A CN201010168494 A CN 201010168494A CN 101867007 A CN101867007 A CN 101867007A
- Authority
- CN
- China
- Prior art keywords
- coating
- fluorescent material
- fluorescent powder
- fluorescent
- dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a preparation method of an LED lamp fluorescent powder layer, belonging to the field of photoelectric technology, in particular to a white light LED element technology for realizing fluorescent powder conversion and preparing the fluorescent powder layer in the light emergence direction and the side light emergence direction of an LED chip. The method 1 comprises the steps of: 1, preparing a dispersion-fluorescent powder slurry of fluorescent powder and binder glue water; 2, coating: coating the fluorescent powder slurry on the surface of a glass lamp casing to form a coating of the fluorescent powder dispersion; and 3, degumming: removing organic components of the binder glue water and the like in the dispersion to obtain a fluorescent powder layer with a certain thickness. The method 2 comprises the steps of: 1, preparing the dispersion-fluorescent powder slurry of the fluorescent powder and a photographic colloid; 2, coating: coating the dispersion-fluorescent powder slurry on the surface of the glass casing to form the coating of the fluorescent powder dispersion; 3, exposing and developing: obtaining a fluorescent powder and photoresists dispersion coating with required thickness; 4, removing photoresists: removing photoresists components in the fluorescent powder coating to obtain the fluorescent powder layer with determined thickness.
Description
Technical field
The present invention relates to field of photoelectric technology, be specifically related to a kind ofly on the surface of leaving chip on the led chip light direction, prepare phosphor powder layer, realize the white light LED part technology of fluorescent material conversion hysteria.
Background technology
LED is that light-emitting diode is the abbreviation of light emitting diode, chemical constitution and the attribute different according to luminescent material, can be divided into inorganic LED (LED of general meaning) and organic LED (being OLEDs), 1993, blue GaN led technology obtains to break through, and realizes inorganic LED white light emission on this basis in 1996.Owing to have low voltage drive, all solid state, low-power consumption, long-acting advantage such as reliable, white light LED part all has been subjected to the great attention of academic and industrial circle in the application study of illumination association area, is a kind of high efficiency light source that meets environmental protection and energy saving green illumination theory.Therefore, at present in worldwide, obtained promotion and development energetically, formed huge industry based on the semiconductor lighting technology of white light LEDs (the 4th generation lighting technology).Present modal white light LEDs implementation is the look conversion hysteria, promptly at blue-light LED chip surface applied one deck yellow fluorescent powder.Current domestic main employing be traditional dosing technology, i.e. the gluing process of fluorescent material epoxy glue.By a glue, the mixture layer of coating fluorescent powder and colloid on led chip.But the phosphor powder layer structure that obtains like this is inhomogeneous, thereby causes the lack of homogeneity of LED bright dipping.A kind of new fluorescent material plane coating notion and thinking (conformal coating); promptly form the uniform phosphor powder layer of a layer thickness at chip surface; compare with traditional gluing process; the light-emitting uniformity of this plane coating is better; the thickness of phosphor powder layer is controlled easily, and belongs to the production that planarization technology is fit to integrated scale.But these two kinds of technologies all are in the chip surface dusting, have hindered the heat radiation of chip surface.Therefore away from led chip surface applied fluorescent material and realize that the LED device of white light just demonstrates himself distinctive value.
Summary of the invention
Problem to be solved by this invention is: a kind ofly leave the method that chip surface prepares phosphor powder layer on the led chip light direction.Technical problem proposed by the invention is to solve like this: the phosphor powder layer preparation method of two kinds of LED lamps is provided, it is characterized in that, may further comprise the steps:
Method one:
(1) dispersion of preparation fluorescent material and binder glue: particle and binding agent glue, the deionized water that will comprise fluorescent material mix dispersion, form fluorescent material adhesive dispersions-fluorescent material powder slurry.
(2) coating: dispersion-fluorescent material powder slurry that step (1) is obtained is coated on the exiting surface on non-led chip surface, forms the coating of fluorescent powder dispersoid;
(3) remove photoresist: remove the organic components such as binder glue in the dispersion, obtain having certain thickness phosphor powder layer.
Method two is characterized in that, may further comprise the steps:
(1) dispersion of preparation fluorescent material and sensitization colloid: the particle and the sensitization colloid that will comprise fluorescent material evenly disperse, and form fluorescent material photoresists dispersion-fluorescent material powder slurry;
(2) coating: the fluorescent material powder slurry that step (1) is obtained is coated on the exiting surface on non-led chip surface, forms the coating of fluorescent powder dispersoid;
(3) exposure, development: the fluorescent material photoresists dispersion coating that obtains desired thickness;
(4) remove photoresists: remove the photoresists composition in the fluorescent coating, obtain having the phosphor powder layer of definite thickness;
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, in the step in method one (1), the preparation method of LED lamp fluorescent powder layer according to claim 1, it is characterized in that: in step (1), used binder glue comprises one or several combinations in polyvinyl alcohol, ammonium polymethacrylate, carboxymethyl cellulose ammonium, ammonium polyacrylate, polyethylene glycol oxide (PEO), water soluble acrylic resin and the epoxyethane ring-expansion polymerization thing (AR-II type glue).The binder glue of preparation can also contain one or more of ammonium salt (A40) of carbonate, phosphate or the hydroxide of calcium, magnesium, barium and carboxylic acid polyalcohol.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that in the step in method one and method two (1), used fluorescent material can be yellow fluorescent material (yellow fluorescent powder+blue led chip); Also can be the fluorescent material (three primary colors fluorescent powder+ultraviolet LED chip) of three primary colors.Can also contain in titanium oxide, aluminium oxide, yittrium oxide, silica, gallium nitride, silicon nitride, the carborundum one or more in the particle that comprises fluorescent material of indication.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, in the step (2) of method one, two, the phosphor powder layer coating method is that perfusion, spin coating, suction are coated with, extrusion, spraying, static are coated with, a kind of or several mixing wherein of electrophoretic coating, dipping.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, comprise when including low-melting glass dust in the particle of fluorescent material, claim 1 step (3) employing heating coating is to uniform temperature and keep time enough, to reach the effect of fusing glass powder with low melting point and removal binder glue.Claim 2 step (4) employing heating coating is to uniform temperature and keep time enough, to reach the effect of fusing glass powder with low melting point and removal sensitization glue.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, used photoresists comprise polyvinyl alcohol and derivative, polyvinyl cinnamate, polyethylene oxygen ethyl-cinnamic acid ester and polyvinylpyrrolidone in the step in method two (1), and emulsion is a kind of in bichromate, permanganate and the diazonium compound or their combination.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, exposure in step (3) in method two, in the developing process, adopt blue light or the luminous exposure mode certainly of ultraviolet LED chip self, perhaps adopt the outer Exposure mode of UV light.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that; step (4) in step in method one (3) and the method two obtains after the certain thickness phosphor powder layer, and the diaphragm (such as coating transparent epoxy resin, optics silica gel) that can coat layer of transparent on the phosphor powder layer surface again is to improve the physicochemical characteristic of fluorescent coating.
Technology of preparing according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, using the shape of fluorescent coating face of the LED lamp of this technology can be different shape (such as oval, circle).
Technology of preparing according to LED lamp fluorescent powder layer provided by the present invention is characterized in that, comprises other compositions of indication in the particle of fluorescent material, can be the effect (such as aluminium oxide) of playing strengthening agent.Other compositions that binder glue comprises are the effects of having played dispersant such as the ammonium salt (A40) of carboxylic acid polyalcohol, can obtain stable dispersion.
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that the led chip of indication inorganic LED also can be an organic LED (OLED).
Preparation method according to LED lamp fluorescent powder layer provided by the present invention is characterized in that fluorescent coating leaves the heat dissipation problem that the led chip surface energy solves white light LED part effectively.
Description of drawings
Fig. 1 is the technical process schematic diagram that usefulness method one is made the power type white light LED lamp fluorescent powder layer.Wherein, 1, led chip, 2, the Glass lamp surface, 3, include binder glue and fluorescent material mixture, 4, the back fluorescent powder grain removes photoresist.
Fig. 2 is a technical process schematic diagram of making the power type white light LED lamp fluorescent powder layer of method two.1, P region electrode, 2, the N region electrode, 3, led chip, 4, include photoresists and fluorescent material mixture before developing, 5, the mixture that includes photoresists and fluorescent material after developing, 6, the fluorescent powder grain layer after removing photoresist.
Embodiment
Get polyethylene glycol oxide (PEO), ammonium salt of fluorescent material, aluminium oxide, carboxylic acid polyalcohol (A40) and deionized water mix, and form the dispersion of the stable particle that comprises fluorescent material.Adopt to irritate and to be coated with method the fluorescent material adhesive dispersions is coated in glass bulb spherical shell surface, the LED glass lamp housing is put into heating furnace about 500 ℃, treat that organic principle in the binder glue removes the back fully and take out, obtain removing the phosphor powder layer of photoresists.
Get polyethylene glycol oxide (PEO), fluorescent material, aluminium oxide and glass powder with low melting point and deionized water mix, and form the dispersion (fluorescent material powder slurry) of the stable particle that comprises fluorescent material.Adopt to irritate the method that is coated with fluorescent material powder slurry is coated in the glass bulb surface, the LED glass lamp housing is put into heating furnace about 500 ℃, treat that organic principle in the binder glue removes the back fully and take out, obtain removing the phosphor powder layer of photoresists.
Water intaking soluble acrylic resin and epoxyethane ring-expansion polymerization thing (AR-II type glue), ammonium salt of fluorescent material, aluminium oxide, carboxylic acid polyalcohol (A40) and deionized water mix the dispersion that forms the stable particle that comprises fluorescent material.Adopt to irritate and to be coated with method the fluorescent material adhesive dispersions is coated in Glass lamp spherical shell surface, the LED glass lamp housing is put into heating furnace about 500 ℃, treat that organic principle in the binder glue removes the back fully and take out, obtain removing the phosphor powder layer of photoresists.
Embodiment 4
Get polyvinyl alcohol (PVA), emulsion ammonium dichromate (ADC), fluorescent material and deionized water and mix, form the PVA dispersion of the stable particle that comprises fluorescent material.Adopt filling to be coated with method fluorescent material photoresists dispersion is coated in LED glass lamp housing surface.Connect the led chip both positive and negative polarity, utilize the chip self-luminous realize photoresists from exposure process, the hot water back of developing obtains the fluorescent material photosensitive plastic coating on the lamp housing surface of led chip light direction.The LED lamp housing that will have the fluorescent material photosensitive plastic coating is put into removing of photoresist by plasma equipment, and the way that adopts oxygen plasma to bombard is removed the organic component in the photoresists, obtains removing the phosphor powder layer of photoresists.
Get polyvinyl alcohol (PVA), emulsion ammonium dichromate (ADC), fluorescent material and deionized water and mix, form the PVA dispersion of the stable particle that comprises fluorescent material.Adopt filling to be coated with method fluorescent material photoresists dispersion is coated in LED glass bulb shell surface.Adopt the UV uviol lamp to the exposure of LED glass lamp housing, hot water obtains the fluorescent material photosensitive plastic coating on LED lamp housing surface after developing.The LED lamp housing that will have the fluorescent material photosensitive plastic coating is put into removing of photoresist by plasma equipment, and the way that adopts oxygen plasma to bombard is removed the organic component in the photoresists, obtains removing the phosphor powder layer of photoresists.
Get polyvinyl alcohol (PVA), emulsion ammonium dichromate (ADC), fluorescent material and deionized water and mix, form the PVA dispersion of the stable particle that comprises fluorescent material.Adopt filling to be coated with method fluorescent material photoresists dispersion is coated in LED glass lamp housing surface.Adopt the UV uviol lamp to the exposure of LED glass lamp housing, hot water obtains the fluorescent material photosensitive plastic coating on LED lamp housing surface after developing.The LED lamp housing that will have the fluorescent material photosensitive plastic coating is put into firing equipment, and 300～500 ℃ are heated the photoresists organic components of a period of time in burning coating, obtain removing the phosphor powder layer of photoresists.
Embodiment 7
Get polyvinyl alcohol (PVA), emulsion ammonium dichromate (ADC), fluorescent material, nanometer titanium dioxide titanium valve and deionized water and mix, form the PVA dispersion of the stable particle that comprises fluorescent material.Adopt filling to be coated with method fluorescent material photoresists dispersion is coated in LED Glass lamp spherical shell surface.Adopt the UV uviol lamp to the exposure of LED glass lamp housing, hot water obtains the fluorescent material photosensitive plastic coating on LED lamp housing surface after developing.The LED lamp housing that will have the fluorescent material photosensitive plastic coating is put into removing of photoresist by plasma equipment, and the way that adopts oxygen plasma to bombard is got rid of the organic component in the photoresists, obtains removing the phosphor powder layer of photoresists.
Embodiment 8
Get polyvinyl alcohol (PVA), emulsion diazo resin (Diazo), fluorescent material and deionized water and mix, form stable fluorescence powder PVA dispersion.Adopt filling to be coated with method fluorescent material photoresists dispersion is coated in LED glass lamp housing surface.Adopt the UV uviol lamp to the exposure of LED glass lamp housing, hot water obtains the fluorescent material photosensitive plastic coating on the lamp housing surface after developing.The LED lamp housing that will have the fluorescent material photosensitive plastic coating is put into removing of photoresist by plasma equipment, and the way that adopts oxygen plasma to bombard is got rid of the organic component in the photoresists, obtains removing the phosphor powder layer of photoresists.
Embodiment 9
Get polyvinyl alcohol (PVA), emulsion diazo resin (Diazo), fluorescent material, glass powder with low melting point and deionized water and mix, form the stable PVA dispersion that comprises fluorescent powder grain.Adopt filling to be coated with method fluorescent material photoresists dispersion is coated in LED glass lamp housing surface.Adopt the UV uviol lamp to the exposure of LED glass lamp housing, hot water obtains the fluorescent material photosensitive plastic coating on bulb shell surface after developing.The LED glass lamp housing is put into heating furnace, after the heating a few minutes more than the glass powder with low melting point sintering temperature, treat that other organic substances are removed the back taking-up in glass powder with low melting point fusing and the fluorescent coating, the glass powder with low melting point that cooling is solidified again is bonded in fluorescent material on the surface of lamp housing.
Claims (10)
1. the preparation method of two kinds of LED lamp fluorescent powder layers, method one is characterized in that, may further comprise the steps:
(1) dispersion of preparation fluorescent material and binder glue: the particle that will comprise fluorescent material mixes with binding agent, deionized water, evenly dispersion, and aqueous dispersion-fluorescent material powder of formation fluorescent material binding agent is starched.
(2) coating: dispersion-fluorescent material powder slurry that step (1) is obtained is coated on the exiting surface on non-led chip surface, forms the coating of fluorescent powder dispersoid;
(3) remove photoresist: remove the organic components such as binder glue in the fluorescent powder dispersoid coating, obtain having certain thickness phosphor powder layer.
2. method two is characterized in that, may further comprise the steps:
(1) dispersion of preparation fluorescent material and sensitization colloid: the particle that will comprise fluorescent material mixes with the sensitization colloid, evenly dispersion, and formation fluorescent material photoresists dispersion-fluorescent material powder is starched;
(2) coating: the fluorescent material powder slurry that step (1) is obtained is coated on the exiting surface on non-led chip surface, forms the coating of fluorescent powder dispersoid;
(3) exposure, development: the fluorescent material photoresists dispersion coating that obtains desired thickness;
(4) remove photoresists: remove the photoresists composition in the fluorescent coating, obtain having the phosphor powder layer of definite thickness.
3. the preparation method of LED lamp fluorescent powder layer according to claim 1 is characterized in that: in step
(1) in, used binder glue comprises one or several combinations in polyvinyl alcohol, ammonium polymethacrylate, carboxymethyl cellulose ammonium, ammonium polyacrylate, polyethylene glycol oxide (PEO), water soluble acrylic resin and the epoxyethane ring-expansion polymerization thing (AR-II type glue), and the binder glue of preparation can also contain the one or more combination of the ammonium salt (A40) of carbonate, phosphate or the hydroxide of calcium, magnesium, barium and carboxylic acid polyalcohol.
4. according to the preparation method of claim 1,2 described LED lamp fluorescent powder layers, it is characterized in that: used fluorescent material can be yellow fluorescent material (yellow fluorescent powder+blue led chip); Also can be the fluorescent material (three primary colors fluorescent powder+ultraviolet LED chip) of three primary colors, can also contain in titanium oxide, aluminium oxide, yittrium oxide, silica, gallium nitride, silicon nitride, the carborundum one or more in the particle that comprises fluorescent material of indication.
5. according to the preparation method of claim 1,2 described LED lamp fluorescent powder layers, it is characterized in that the coating method of fluorescent material powder slurry can be that perfusion, spin coating, suction are coated with, extrusion, spraying, static are coated with, a kind of or several combinations wherein of electrophoretic deposition, infusion process.
6. according to the preparation method of claim 1,2 described LED lamp fluorescent powder layers, it is characterized in that, comprise when including low-melting glass dust in the particle of fluorescent material, claim 1 step (3) employing heating coating is to uniform temperature and keep time enough, to reach the effect of organic component in fusing glass powder with low melting point and the removal binder glue, claim 2 step (4) employing heating coating is to uniform temperature and keep time enough, to reach the effect of fusing glass powder with low melting point and removal photoresists organic component.
7. the preparation method of LED lamp fluorescent powder layer according to claim 2, it is characterized in that, the sensitization colloid of indication comprises polyvinyl alcohol and derivative, polyvinyl cinnamate, polyethylene oxygen ethyl-cinnamic acid ester and polyvinylpyrrolidone in step (1), and emulsion is a kind of in bichromate, permanganate and the diazonium compound or their combination.
8. the preparation method of LED lamp fluorescent powder layer according to claim 2 is characterized in that, in exposure, the developing process, can adopt the luminous exposure mode certainly of blue light or ultraviolet LED chip self in step (3), perhaps adopts the outer Exposure mode of UV light.
9. according to the preparation method of claim 1,2 described LED lamp fluorescent powder layers, it is characterized in that, in step (4) is removed photoresists composition process in the fluorescent coating, can adopt heated oxide to remove photoresist, one or several combinations in plasma bombardment removes photoresist, oxygen plasma removes photoresist, laser the removes photoresist method.
10. according to the preparation method of claim 1,2 described LED lamp fluorescent powder layers, it is characterized in that described fluorescent coating can be that the inner surface at the led chip light direction also can be the outer surface of led chip light direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010168494A CN101867007A (en) | 2010-05-11 | 2010-05-11 | Preparation method of LED lamp fluorescent powder layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010168494A CN101867007A (en) | 2010-05-11 | 2010-05-11 | Preparation method of LED lamp fluorescent powder layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101867007A true CN101867007A (en) | 2010-10-20 |
Family
ID=42958640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010168494A Pending CN101867007A (en) | 2010-05-11 | 2010-05-11 | Preparation method of LED lamp fluorescent powder layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101867007A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012083776A1 (en) * | 2010-12-23 | 2012-06-28 | Byd Company Limited | Photoresist composition, led device and method of preparing the same |
| CN102709445A (en) * | 2012-06-02 | 2012-10-03 | 王双喜 | Light-emitting diode (LED) packaging structure with fluorescent glass layer |
| CN102867731A (en) * | 2012-08-16 | 2013-01-09 | 厦门通士达照明有限公司 | Incandescent lamp color energy-saving lamp with high color rendering index and manufacturing method of incandescent lamp color energy-saving lamp |
| CN103090307A (en) * | 2013-01-28 | 2013-05-08 | 南通恺誉照明科技有限公司 | Glass lampshade provided with fluorescent powder coating and manufacturing method thereof |
| CN103131310A (en) * | 2013-02-22 | 2013-06-05 | 上海祥羚光电科技发展有限公司 | Rich-blue-reduced luminescent paint used in secondary packaging |
| WO2013127226A1 (en) * | 2012-03-01 | 2013-09-06 | 广东顺祥节能照明科技有限公司 | Machine-sprayed electrodeless-lamp water powder and preparation and spraying methods thereof |
| CN103367597A (en) * | 2012-03-29 | 2013-10-23 | 常熟卓辉光电科技有限公司 | LED light source |
| CN103500786A (en) * | 2013-09-29 | 2014-01-08 | 杭州杭科光电股份有限公司 | Full-angle luminous LED (light-emitting diode) light source and preparation method thereof |
| CN104073135A (en) * | 2014-07-14 | 2014-10-01 | 邓勇 | Water-based coating material for glass pipe fluorescent lamp, as well as preparation method and coating method of water-based coating material |
| CN104617208A (en) * | 2015-01-21 | 2015-05-13 | 电子科技大学 | Preparation method of fluorescent powder layer for LED packaging |
| CN106505131A (en) * | 2016-12-30 | 2017-03-15 | 张建伟 | One kind is integrally formed LED and its packaging technology |
| CN108008570A (en) * | 2016-10-27 | 2018-05-08 | 船井电机株式会社 | Display device |
| US10209430B2 (en) | 2014-12-26 | 2019-02-19 | Shanghai Tianma Micro-electronics Co., Ltd. | LED light source, backlight module and liquid crystal display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1706023A (en) * | 2002-10-14 | 2005-12-07 | 皇家飞利浦电子股份有限公司 | Luminous body for generating white light |
| CN101093869A (en) * | 2007-07-26 | 2007-12-26 | 电子科技大学 | Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue |
| CN101093778A (en) * | 2006-06-23 | 2007-12-26 | 林瑞进 | Sturucture of fluorescent lamp |
| CN101186818A (en) * | 2007-12-17 | 2008-05-28 | 天津理工大学 | Blue-purple light or blue light excitation fluorophor, preparation method thereof, and packaged white light diode |
| CN101550334A (en) * | 2009-05-12 | 2009-10-07 | 奇瑞汽车股份有限公司 | Fluorescent powder coating method of white light-emitting diode |
| CN101694273A (en) * | 2009-10-12 | 2010-04-14 | 陈炜旻 | Light-emitting diode (LED) of heat-radiating ring-groove |
-
2010
- 2010-05-11 CN CN201010168494A patent/CN101867007A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1706023A (en) * | 2002-10-14 | 2005-12-07 | 皇家飞利浦电子股份有限公司 | Luminous body for generating white light |
| CN101093778A (en) * | 2006-06-23 | 2007-12-26 | 林瑞进 | Sturucture of fluorescent lamp |
| CN101093869A (en) * | 2007-07-26 | 2007-12-26 | 电子科技大学 | Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue |
| CN101186818A (en) * | 2007-12-17 | 2008-05-28 | 天津理工大学 | Blue-purple light or blue light excitation fluorophor, preparation method thereof, and packaged white light diode |
| CN101550334A (en) * | 2009-05-12 | 2009-10-07 | 奇瑞汽车股份有限公司 | Fluorescent powder coating method of white light-emitting diode |
| CN101694273A (en) * | 2009-10-12 | 2010-04-14 | 陈炜旻 | Light-emitting diode (LED) of heat-radiating ring-groove |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012083776A1 (en) * | 2010-12-23 | 2012-06-28 | Byd Company Limited | Photoresist composition, led device and method of preparing the same |
| CN102540721A (en) * | 2010-12-23 | 2012-07-04 | 比亚迪股份有限公司 | Photoresist composition and method for preparing fluorescent layer on surface of light emitting diode (LED) |
| WO2013127226A1 (en) * | 2012-03-01 | 2013-09-06 | 广东顺祥节能照明科技有限公司 | Machine-sprayed electrodeless-lamp water powder and preparation and spraying methods thereof |
| CN103367597A (en) * | 2012-03-29 | 2013-10-23 | 常熟卓辉光电科技有限公司 | LED light source |
| CN102709445A (en) * | 2012-06-02 | 2012-10-03 | 王双喜 | Light-emitting diode (LED) packaging structure with fluorescent glass layer |
| CN102867731A (en) * | 2012-08-16 | 2013-01-09 | 厦门通士达照明有限公司 | Incandescent lamp color energy-saving lamp with high color rendering index and manufacturing method of incandescent lamp color energy-saving lamp |
| CN103090307A (en) * | 2013-01-28 | 2013-05-08 | 南通恺誉照明科技有限公司 | Glass lampshade provided with fluorescent powder coating and manufacturing method thereof |
| CN103131310A (en) * | 2013-02-22 | 2013-06-05 | 上海祥羚光电科技发展有限公司 | Rich-blue-reduced luminescent paint used in secondary packaging |
| CN103500786A (en) * | 2013-09-29 | 2014-01-08 | 杭州杭科光电股份有限公司 | Full-angle luminous LED (light-emitting diode) light source and preparation method thereof |
| CN103500786B (en) * | 2013-09-29 | 2016-06-08 | 杭州杭科光电股份有限公司 | The LED/light source of a kind of full angle luminescence and its preparation method |
| CN104073135A (en) * | 2014-07-14 | 2014-10-01 | 邓勇 | Water-based coating material for glass pipe fluorescent lamp, as well as preparation method and coating method of water-based coating material |
| CN104073135B (en) * | 2014-07-14 | 2016-06-01 | 邓勇 | Glass tubing fluorescent lamp water-based coating material and its preparation method and coating method |
| US10209430B2 (en) | 2014-12-26 | 2019-02-19 | Shanghai Tianma Micro-electronics Co., Ltd. | LED light source, backlight module and liquid crystal display device |
| CN104617208A (en) * | 2015-01-21 | 2015-05-13 | 电子科技大学 | Preparation method of fluorescent powder layer for LED packaging |
| CN104617208B (en) * | 2015-01-21 | 2018-01-23 | 电子科技大学 | A kind of preparation method of phosphor powder layer for LED encapsulation |
| CN108008570A (en) * | 2016-10-27 | 2018-05-08 | 船井电机株式会社 | Display device |
| CN106505131A (en) * | 2016-12-30 | 2017-03-15 | 张建伟 | One kind is integrally formed LED and its packaging technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101867007A (en) | Preparation method of LED lamp fluorescent powder layer | |
| TWI654078B (en) | Ceramic phosphor plate and lighting device including the same | |
| CN110128019B (en) | Preparation method and application of yellow fluorescent glass ceramic | |
| TWM407494U (en) | LED package structure | |
| CN102723425B (en) | Integrated preparation method for LED fluorescent powder coating | |
| TWI717329B (en) | Lighting apparatus | |
| CN102237475A (en) | LED wafer level fluorescent powder coating technology based on organic colloid | |
| CN101887941A (en) | Preparation method of LED phosphor layer | |
| TW201628231A (en) | LED apparatus employing neodymium-fluorine materials | |
| CN107804974B (en) | Preparation method of remote fluorescent sheet based on low-melting-point lead-free glass powder | |
| TWI360568B (en) | ||
| CN104409607A (en) | High color rendering index 360 DEG light emitting LED filament lamp | |
| CN207009474U (en) | A kind of quantum dot LED structure of multilayer encapsulation | |
| CN205282499U (en) | Pottery fluorescence base plate and illuminator | |
| CN102629650A (en) | Preparation method of light emitting diode (LED) fluorescent powder layer | |
| CN105047795A (en) | Preparation methods for fluorescent substrate and light-emitting device | |
| CN104986956A (en) | Oxide glass with rare earth ion single-doped white up-conversion luminescence and preparation method thereof | |
| CN107763568A (en) | A kind of preparation method on LED remote excitation phosphor powder layers | |
| CN106098909B (en) | A kind of preparation method of LED illumination composite construction fluorescent glass piece | |
| CN101877376B (en) | Organic luminescent material-clad light-emitting diode and manufacturing method thereof | |
| Peng et al. | Luminous efficacy enhancement of phosphor-in-glass based white light-emitting diodes through patterned structure | |
| TW201310710A (en) | Light emitting device | |
| CN215008255U (en) | Chip-scale packaged light-emitting chip structure capable of reducing temperature of light-emitting surface | |
| CN103113025B (en) | Devitrified glass of a kind of europium doping White LED fluoride and preparation method thereof | |
| TWI473305B (en) | Light emitting diode structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20101020 |