CN215008255U - Chip-scale packaged light-emitting chip structure capable of reducing temperature of light-emitting surface - Google Patents
Chip-scale packaged light-emitting chip structure capable of reducing temperature of light-emitting surface Download PDFInfo
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- CN215008255U CN215008255U CN202120032920.7U CN202120032920U CN215008255U CN 215008255 U CN215008255 U CN 215008255U CN 202120032920 U CN202120032920 U CN 202120032920U CN 215008255 U CN215008255 U CN 215008255U
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Abstract
A chip-scale packaged light-emitting chip structure capable of reducing the temperature of a light-emitting surface is characterized in that a light-emitting powder layer is coated on the surfaces of a chip and a substrate by a powder coating technology, and the light-emitting powder layer is formed by fluorescent powder or any powder capable of exciting light; and curing a transparent adhesive layer with the thickness of less than 0.01mm on the surface of the light-emitting powder layer to ensure that the light-emitting powder layer is completely attached to the surfaces of the chip and the substrate, thereby completing the first packaging, wherein the transparent adhesive layer is formed by transparent glue or resin without light-emitting powder, and a coating layer which does not generate heat energy is packaged on the transparent adhesive layer, and the light-emitting chip structure of the chip-level packaging capable of reducing the temperature of the light-emitting surface is formed by a secondary packaging procedure.
Description
Technical Field
The utility model provides a can reduce the luminous chip structure of the chip level encapsulation of play plain noodles temperature, borrow this reliability that improves its security and luminous efficacy, reach the purpose that the extension is sent out the luminous chip life-span.
Background
The existing light emitting diode manufacturing and packaging process is a one-time packaging process, although a settling agent is used in the manufacturing process, the fluorescent powder suspended in the fluorescent glue used for one-time packaging cannot be completely settled on a substrate and a chip, when the light is excited, the fluorescent powder suspended in the fluorescent glue and not settled in the one-time packaging process can generate heat energy again due to the exciting light, the heat energy is accumulated in the fluorescent glue layer of the light emitting surface, and the heat cannot be effectively dissipated by a heat conducting plate or the substrate, so that the light emitting diode manufactured by the conventional process generally has the defects of a light emitting structure and overhigh temperature of the light emitting surface. The above disadvantages seriously affect the safety, luminous efficacy and lifetime of the leds in the market, and cannot meet the demands of the lighting industry and the market in the future.
In summary, it is an important subject to be solved and researched urgently to develop a light emitting chip structure capable of reducing the temperature of the light emitting surface, thereby improving the use safety and the light emitting performance.
SUMMERY OF THE UTILITY MODEL
In view of the above technical background, in order to meet the industrial requirements, a first object of the present invention is to provide a light emitting chip structure of a chip scale package that can reduce the temperature of a light emitting surface. The light emitting chip structure of the chip scale package capable of reducing the temperature of the light emitting surface of the utility model is characterized in that a light emitting powder layer is formed on the surfaces of the chip and the substrate by powder coating, and the light emitting powder layer is composed of fluorescent powder or any powder capable of exciting light; forming a solidified transparent adhesive layer with the thickness less than 0.01mm on the surface of the luminous powder layer, wherein the luminous powder layer is completely attached to the surfaces of the chip and the substrate, thereby forming a first packaging structure, the transparent adhesive layer is composed of transparent glue or resin without luminous powder, and a coating layer which does not generate heat energy is formed on the surface of the transparent adhesive layer with the thickness less than 0.01mm, thereby forming a second packaging structure.
Specifically, the heat generated by the conversion of the phosphor or any powder of the excitable light into light is conducted only by the phosphor or any powder of the excitable light on the surfaces of the chip and the substrate, and then is rapidly conducted to the substrate for heat dissipation by the way, so that the heat dissipation effect of the chip-scale packaged light emitting chip structure capable of reducing the temperature of the light emitting surface is achieved.
In a specific embodiment, the light emitting chip structure of the chip scale package capable of reducing the temperature of the light emitting surface uses a related powder coating technology to enable light emitting powder or fluorescent powder to be uniformly adsorbed or deposited on a chip, a substrate or a circuit board, after the light emitting powder or the fluorescent powder forms the light emitting powder layer on the chip, the substrate or the circuit board, a transparent glue layer with a thickness of less than 0.01mm is cured on the surface of the light emitting powder layer by using transparent glue or resin without the light emitting powder, so that the fluorescent powder in the light emitting powder layer is completely attached to the surfaces of the chip and the substrate, thereby completing the first package, and then a coating layer without generating heat energy is packaged on the surface of the transparent glue layer with the thickness of less than 0.01mm, thereby forming the light emitting chip structure of the chip scale package capable of reducing the temperature of the light emitting surface by using a secondary packaging procedure.
In a preferred embodiment, the light emitting surface of the transparent adhesive layer is five surfaces.
In an embodiment, the transparent glue without the luminescent powder is made of silica gel, epoxy resin, polyurethane, acryl resin, or any combination thereof.
In one embodiment, the thickness of the light-emitting powder layer is less than 1 mm.
In one embodiment, the thickness of the transparent adhesive layer is less than 0.01 mm.
The inventor emphasizes that the structure of the coating layer which does not generate heat energy does not contain any luminescent powder, so the coating layer which does not generate heat energy only has the functions of guiding light and atomizing light, and is the coating layer structure which does not generate heat energy due to light. Preferably, the coating that does not generate thermal energy is an optical diffusion coating.
In comparison, the current light emitting diode uses fluorescent glue or a light emitting film body mixed with fluorescent powder to perform a one-time packaging process, and the structure of the fluorescent glue layer or the light emitting film layer also contains suspended fluorescent powder, so that the suspended fluorescent powder can generate heat energy when being excited to emit light, but the heat dissipation effect of the fluorescent glue layer or the light emitting film layer is poor, and the fluorescent powder is suspended in the glue, so that the uniformity of the internal structure of the glue layer is not good, and the generated heat is accumulated in the glue layer and cannot be conducted to effectively dissipate heat; in other words, after the LED phosphor is mixed with the glue for primary packaging, the phosphor does not completely settle and a part of the phosphor is still suspended in the glue, so that heat generated by the phosphor that does not settle in the glue is not dissipated in the glue, the temperature of the light emitting surface of the light emitting diode of the conventional primary packaging is too high, and the use safety and the service life of the light emitting diode are greatly reduced.
Therefore, the utility model provides a but the luminous chip structure of chip level package of reduction play plain noodles temperature makes luminescent powder or phosphor powder paste the clothes completely on the surface of chip and base plate earlier by the secondary packaging procedure, and the heat that the phosphor powder conversion light in this luminescent powder layer produced, via only at this chip and base plate surface phosphor powder conduction heat, borrow this way to heat rapidly and dispel the heat to the base plate, so can reduce effectively the utility model provides a light emitting diode's play plain noodles temperature reaches the purpose that improves the safety in utilization and increase of service life of luminous product.
The second objective of the present invention is to provide a method for manufacturing a chip scale packaged light emitting chip structure, which can reduce the temperature of the light emitting surface. Which comprises the following steps.
The method comprises the following steps: any powder capable of exciting light is coated on the surfaces of the chip and the substrate by a powder coating technology to form a light-emitting powder layer.
Step two: and curing a transparent adhesive layer with the thickness of less than 0.01mm on the surface of the luminous powder layer to ensure that the luminous powder layer is completely attached to the surfaces of the chip and the substrate, thereby completing the first packaging, wherein the transparent adhesive layer with the thickness of less than 0.01mm is formed by transparent glue or resin without luminous powder.
Step three: and packaging a coating layer which does not generate heat energy on the surface of the transparent adhesive layer, and manufacturing the chip-scale packaged light-emitting chip structure capable of reducing the temperature of the light-emitting surface by virtue of a secondary packaging procedure.
Specifically, the heat generated by the conversion of the powder of the excitable light into the light is conducted by the powder of the excitable light only on the surfaces of the chip and the substrate, and is quickly conducted to the substrate for heat dissipation by the way, so that the heat dissipation effect of the chip-scale packaged light-emitting chip structure capable of reducing the temperature of the light-emitting surface is achieved.
In a preferred embodiment, the light emitting surface of the light emitting chip structure of the chip scale package is five surfaces.
In one embodiment, the thickness of the light-emitting powder layer is less than 1 mm.
In an embodiment, the transparent glue without the luminescent powder is made of silica gel, epoxy resin, polyurethane, acryl resin, or any combination thereof.
In an embodiment, the curing of the transparent adhesive layer with a thickness less than 0.01mm in the second step includes heat curing, ultraviolet curing or a combination thereof.
In one embodiment, the coating that does not generate heat energy in the third step is an optical diffusion coating.
The key of the preparation method is that the luminescent powder layer is firstly coated on the chip or the circuit board by a powder coating technology, then transparent glue without luminescent powder is used for curing on the surface of the luminescent powder layer to form a transparent glue layer with the thickness of less than 0.01mm, the first packaging is completed, then a coating layer which does not generate heat energy is packaged on the surface of the transparent glue layer with the thickness of less than 0.01mm, and the secondary packaging procedure is used for forming the luminescent chip structure of the chip-level package capable of reducing the temperature of the light-emitting surface. The preparation method is a secondary packaging process, and all the functional structure layers of the light-emitting chip are manufactured in sequence, so that the uniformity of all the functional structure layers is good, and particularly, the transparent adhesive layer does not contain light-emitting powder, so that the defect of generating heat due to light excitation or the defect of uneven dispersion of the internal components of the structure is avoided. The inventor emphasizes that the phosphor in the chip scale package light emitting chip structure capable of reducing the temperature of the light emitting surface provided by the utility model converts the heat generated by the light, and the heat is only conducted by the phosphor on the surface of the chip and the substrate, so that the heat is rapidly conducted to the substrate to dissipate the heat, thereby effectively reducing the temperature of the light emitting surface, and achieving the purposes of improving the use safety of the light emitting product and prolonging the service life. Compare in current know use mix fluorescent powder one dose type fluorescent glue and once the emitting diode that the packaging technology made, the utility model discloses the luminous chip of the chip level encapsulation of making reduces the temperature on play plain noodles effectively, consequently the utility model discloses the luminous chip of the chip level encapsulation that the preparation method made's use security is good, and luminous efficacy is high and long service life, obviously is superior to current know luminous product.
The third objective of the present invention is to provide a method for reducing the temperature of the light-emitting surface of the light-emitting chip, which comprises using transparent glue without light-emitting powder in the manufacturing process of the light-emitting chip to form a transparent glue layer with a thickness smaller than 0.01mm on the light-emitting surface, thereby completely attaching the fluorescent powder in the light-emitting powder layer of the light-emitting chip to the substrate of the light-emitting chip and the surface of the chip, thereby conducting the heat of the fluorescent powder to the substrate, and achieving the purpose of reducing the temperature of the light-emitting surface of the light-emitting chip.
In a preferred embodiment, the light emitting surface of the light emitting chip is five surfaces.
In an embodiment, the transparent glue without the luminescent powder is made of silica gel, epoxy resin, polyurethane, acryl resin, or any combination thereof.
In one embodiment, the thickness of the transparent adhesive layer is less than 0.01 mm.
To sum up, the utility model discloses a can reduce luminous chip structure of chip scale package of play plain noodles temperature has following unexpected efficiency and advantage at least: (1) the utility model discloses an use secondary packaging technology to make luminous chip, wherein provide and make the phosphor powder paste completely and obey at base plate and chip surface and can not produce the transparent adhesive layer that the thickness of heat energy is less than 0.01mm, simultaneously, the utility model provides a can reduce the phosphor powder in the luminous chip structure of chip level encapsulation of play plain noodles temperature and change the heat that the light produced, only conduct heat at chip and base plate surface phosphor powder through only, borrow this way to conduct heat on the base plate rapidly and dispel the heat, so can reduce the play plain noodles temperature effectively, reach the purpose that improves the safety in utilization of luminous product and increase of service life; (2) the luminous powder layer of the utility model is completely covered and adhered on the surface of the chip and the substrate, so that the luminous efficiency of the luminous powder layer can be effectively improved, and the economic benefit of the utility model is high, and the luminous powder consumption is reduced by at least 15 percent compared with the prior known luminous chip or LED; and (3) providing a method of reducing the temperature of the exit surface and extending the useful life of the light emitting device; the secondary packaging technology of the light-emitting chip comprises the steps of sequentially guiding the light-emitting powder layer and enabling the fluorescent powder in the light-emitting powder layer to completely adhere to the transparent adhesive layer with the thickness of less than 0.01mm on the surfaces of the substrate and the chip, so that the temperature of the light-emitting surface is reduced, the heat damage of a light-emitting product is reduced, and the purpose of prolonging the service life is achieved.
Drawings
Fig. 1 is a schematic diagram of the light emitting chip of the chip scale package capable of reducing the temperature of the light emitting surface.
[ description of main element symbols ]
1: light-emitting chip structure capable of reducing temperature of light-emitting surface and packaged at chip level
11: substrate
12: chip and method for manufacturing the same
13: luminous powder layer
14: transparent adhesive layer with thickness less than 0.01mm
15: coating without generating heat energy
Detailed Description
The foregoing and other features, aspects and utilities of the present invention will be apparent from the following more particular description of a preferred embodiment of the invention as illustrated in the accompanying drawings. In order that the invention may be more fully understood, specific steps and components thereof will be set forth in the following description. It is apparent that the practice of the invention is not limited to the specific details known to those skilled in the art. In other instances, well-known components or steps have not been described in detail so as not to unnecessarily obscure the present invention. The present invention is described in detail with reference to the following preferred embodiments, but in addition to the detailed description, the present invention can be widely applied to other embodiments, and the scope of the present invention is not limited to the following claims.
The first embodiment of the present invention provides a method for manufacturing a chip scale packaged light emitting chip structure capable of reducing the temperature of the light emitting surface. Which comprises the following steps.
The method comprises the following steps: any powder capable of exciting light is coated on the surfaces of the chip and the substrate by a powder coating technology to form a light-emitting powder layer.
Step two: and curing a transparent adhesive layer with the thickness of less than 0.01mm on the surface of the luminous powder layer to ensure that the luminous powder layer is completely attached to the surfaces of the chip and the substrate, thereby completing the first packaging, wherein the transparent adhesive layer is formed by transparent glue or resin without luminous powder.
Step three: and packaging a coating layer which does not generate heat energy on the front surface or five surfaces of the transparent adhesive layer with the thickness of less than 0.01mm, and forming the chip-scale packaged light-emitting chip structure capable of reducing the temperature of the light-emitting surface by means of a secondary packaging procedure.
Specifically, the heat generated by the conversion of the powder of the excitable light into the light is conducted by the powder of the excitable light only on the surfaces of the chip and the substrate, and is quickly conducted to the substrate for heat dissipation by the way, so that the heat dissipation effect of the chip-scale packaged light-emitting chip structure capable of reducing the temperature of the light-emitting surface is achieved.
In a preferred embodiment, the light emitting surface of the light emitting chip structure of the chip scale package capable of reducing the temperature of the light emitting surface is five surfaces.
In one embodiment, the thickness of the light-emitting powder layer is less than 1 mm.
In an embodiment, the transparent glue or resin without the luminescent powder is made of silica gel, epoxy resin, polyurethane, acryl resin, or any combination thereof.
In an embodiment, the curing of the transparent adhesive layer with a thickness of less than 0.01mm in the second step includes heat curing, ultraviolet curing, or a combination thereof.
In one embodiment, the coating that does not generate heat energy in the third step is an optical diffusion coating.
The key of the chip-level packaged light-emitting chip structure capable of reducing the temperature of the light-emitting surface and the preparation method is that the light-emitting powder layer is firstly coated on the chip or the substrate, then the transparent glue without the light-emitting powder is used for curing the surface of the light-emitting powder layer to form the transparent glue layer with the thickness of less than 0.01mm, the first packaging is completed, and then the coating which does not generate heat energy is packaged on the front surface or five surfaces of the transparent glue layer with the thickness of less than 0.01mm, so that the secondary packaging procedure is used for forming the chip-level packaged light-emitting chip structure capable of reducing the temperature of the light-emitting surface.
The second embodiment of the present invention provides a method for reducing the temperature of the light-emitting surface of the light-emitting chip, which comprises using transparent glue without light-emitting powder to solidify on the surface of the light-emitting powder layer to form a transparent glue layer with a thickness less than 0.01mm in the manufacturing process of the light-emitting chip, thereby completely attaching the fluorescent powder in the light-emitting powder layer to the substrate of the light-emitting chip and the surface of the chip, thereby conducting the heat of the fluorescent powder to the substrate, and achieving the purpose of reducing the temperature of the light-emitting surface of the light-emitting chip.
In a preferred embodiment, the light emitting surface of the light emitting chip is five surfaces.
In an embodiment, the transparent glue without the luminescent powder is made of silica gel, epoxy resin, polyurethane, acryl resin, or any combination thereof.
In one embodiment, the thickness of the transparent adhesive layer is less than 0.01 mm.
To sum up, the utility model discloses a can reduce luminous chip structure of chip scale package of play plain noodles temperature has following unexpected efficiency and advantage at least: (1) the utility model discloses an use secondary packaging technology to make luminous chip, wherein provide and make the phosphor powder paste completely and obey at base plate and chip surface and can not produce the transparent adhesive layer that the thickness of heat energy is less than 0.01mm, simultaneously, the utility model provides a can reduce the phosphor powder in the luminous chip structure of chip level encapsulation of play plain noodles temperature and change the heat that the light produced, only conduct heat at chip and base plate surface phosphor powder through only, borrow this way to conduct heat on the base plate rapidly and dispel the heat, so can reduce the play plain noodles temperature effectively, reach the purpose that improves the safety in utilization of luminous product and increase of service life; (2) the luminous powder layer of the utility model is completely covered and adhered on the surface of the chip and the substrate, so that the luminous efficiency of the luminous powder layer can be effectively improved, and the economic benefit of the utility model is high, and the luminous powder consumption is reduced by at least 15 percent compared with the prior known luminous chip or LED; and (3) providing a method of reducing the temperature of the exit surface and extending the useful life of the light emitting device; the secondary packaging technology of the light-emitting chip comprises the steps of sequentially guiding the light-emitting powder layer and enabling the fluorescent powder in the light-emitting powder layer to completely adhere to the transparent adhesive layer with the thickness of less than 0.01mm on the surfaces of the substrate and the chip is used for reducing the temperature of the light-emitting surface, reducing the heat damage of a light-emitting product and achieving the purpose of prolonging the service life
According to the utility model discloses a representative embodiment, the utility model provides a can reduce the luminous chip structure 1 of the chip level encapsulation of play plain noodles temperature as shown in fig. 1, its processing procedure step is: placing a chip 12 on a substrate 11, coating luminescent powder on the surfaces of the substrate 11 and the chip 12 by a powder coating technology to form a luminescent powder layer 13, then coating or gluing transparent glue without luminescent powder on the surface of the luminescent powder layer 13, forming a transparent glue layer 14 with the thickness of less than 0.01mm on the surface of the luminescent powder layer 13 by the transparent glue without luminescent powder through a curing procedure, thereby completely attaching the luminescent powder in the luminescent powder layer 13 on the surfaces of the substrate 11 and the chip 12 to complete the first packaging, then packaging a coating layer 15 without generating heat energy on the front surface of the transparent glue layer 14 with the thickness of less than 0.01mm, and manufacturing the chip-level packaged luminescent chip structure 1 capable of reducing the temperature of a light-emitting surface by a secondary packaging procedure.
The phosphor layer 13 of the above representative embodiment is completely attached to the surfaces of the chip 12 and the substrate 11, and the phosphor of the present invention is closely and uniformly attached to the substrate and the chip.
In an experimental example, according to the steps described in the above representative embodiment, 0.5 g of light emitting powder is used to prepare the chip scale packaged light emitting chip (NCC-COB13.5) capable of reducing the temperature of the light emitting surface, and the light emitting chip (No. TOYONIA) of the one-time packaging process in the market is used as an experimental control group, 22 w and 50 w are respectively used for the experiment, and the temperature of the substrate and the temperature of the light emitting surface are measured simultaneously, and the result is shown in table 1, obviously, compared with the light emitting chip of the one-time packaging process in the market, the chip scale packaged light emitting chip capable of reducing the temperature of the light emitting surface can greatly reduce the temperature of the light emitting surface to reach a difference of at least 50 ℃. Accordingly, the present invention has unexpected technical effects compared to the conventional one-time packaging technology.
TABLE 1
To sum up, the utility model discloses a can reduce luminous chip structure of chip scale package of play plain noodles temperature has following unexpected efficiency and advantage at least: (1) the utility model provides a thickness that has good structural homogeneity and can not produce heat energy is less than 0.01 mm's transparent adhesive layer, simultaneously, the utility model provides a can reduce the light-emitting surface temperature the luminous chip structure of chip level encapsulation in phosphor powder conversion light in the heat that produces, via only at this chip and substrate surface phosphor powder, via this way heat conduction to the substrate rapidly dispel the heat, so can reduce its light-emitting surface temperature effectively, reach the purpose that improves the safety in utilization of luminous product and increase of service life; (2) the luminous powder layer of the utility model is completely covered on the chip or the substrate, so the luminous efficiency of the luminous powder layer can be effectively improved, and the economic benefit of the utility model is high, and the luminous powder consumption is reduced by at least 15 percent compared with the prior known luminous chip or LED; and (3) providing a method of reducing the temperature of the exit surface and extending the useful life of the light emitting device; the light-emitting chip manufacturing technology of sequentially leading in the light-emitting powder layer and the transparent adhesive layer with the thickness less than 0.01mm is used for reducing the temperature of the light-emitting surface, reducing the heat damage of a light-emitting product and achieving the purpose of prolonging the service life.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make modifications or changes equivalent to the equivalent embodiment of the above embodiments without departing from the scope of the present invention, but all the modifications, changes and modifications of the above embodiments by the technical spirit of the present invention are within the scope of the present invention.
Claims (3)
1. A chip-scale packaged light-emitting chip structure capable of reducing the temperature of a light-emitting surface is characterized in that a light-emitting powder layer is formed by coating powder on the surfaces of a chip and a substrate, and the light-emitting powder layer is composed of fluorescent powder or powder of any excitable light; forming a solidified transparent adhesive layer with the thickness less than 0.01mm on the surface of the luminous powder layer, wherein the luminous powder layer is completely attached to the surfaces of the chip and the substrate, thereby forming a first packaging structure, the transparent adhesive layer is composed of transparent glue or resin without luminous powder, and a coating layer which does not generate heat energy is formed on the surface of the transparent adhesive layer with the thickness less than 0.01mm, thereby forming a second packaging structure.
2. The chip scale package light emitting chip structure capable of reducing the temperature of the light emitting surface according to claim 1, wherein: the light-emitting surface of the transparent adhesive layer is five surfaces.
3. The chip scale package light emitting chip structure capable of reducing the temperature of the light emitting surface according to claim 1, wherein: the thickness of the luminescent powder layer is less than 1 mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120032920.7U CN215008255U (en) | 2021-01-07 | 2021-01-07 | Chip-scale packaged light-emitting chip structure capable of reducing temperature of light-emitting surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202120032920.7U CN215008255U (en) | 2021-01-07 | 2021-01-07 | Chip-scale packaged light-emitting chip structure capable of reducing temperature of light-emitting surface |
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| CN215008255U true CN215008255U (en) | 2021-12-03 |
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| CN202120032920.7U Active CN215008255U (en) | 2021-01-07 | 2021-01-07 | Chip-scale packaged light-emitting chip structure capable of reducing temperature of light-emitting surface |
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2021
- 2021-01-07 CN CN202120032920.7U patent/CN215008255U/en active Active
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