CN101093869A - Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue - Google Patents
Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue Download PDFInfo
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Abstract
Plane coat technique includes following steps: (1) preparing organic colloid; (2) preparing solution of photosensitizer; (3) mixing organic colloid with photosensitizer according to proportion, adding a small quantity of dispersant or defoaming agent dispersed to organic colloid evenly to form sensitization system accorded with requirement; (4) preparing suspension of sensitization colloid of containing phosphor powder; mixing phosphor powder with sensitization liquid prepared in step (3) according to proportion, mixing them evenly so as to prepare slurry of phosphor powder; (5) coating the slurry obtained in step (4) on surface of LED chip so as to form coat layer of phosphor powder; dry in the shade or air-dry in darkroom; (6) exposure and develop obtains layer of phosphor powder with plane structure; (7) solidifying layer of phosphor powder with plane structure obtained in step (6) to make physicochemical characteristics stable.
Description
Technical field
The present invention relates to field of photoelectric technology, be specifically related to a kind of power type white light LED plane coating process based on water soluble photosensitive.
Background technology
LED is the abbreviation of light emitting diode.1993, obtaining technological break-through on the blue GaN light-emitting diode, and realized white light LEDs, the development of forward the 4th generation lighting source in recent years in 1996---the direction based on the semiconductor illuminating light source of white light LEDs develops.White light LEDs has advantages such as low voltage drive, low-power consumption, highly reliable, long-life, is a kind of environmental protection, energy-conservation green illumination light source of meeting.Therefore, its appearance causes that national governments and company of many businessmans give very big enthusiasm and great attention.
Up till now for this reason, known have four approach and can realize white light LEDs, one of them important channel is at the suitable yellow fluorescent powder (YAG:Ce of surface-coated one layer thickness of blue-light LED chip
3+), yellow fluorescent powder changes gold-tinted into after absorbing the part blue light that sends from the blue led chip, and the gold-tinted of generation and remaining blue light form white light by the stack of colour mixture principle.Yet under existing process conditions, the main employing mixed fluorescent powder grain with transparent colloid (as epoxy glue, silica gel etc.), apply the mixed layer of fluorescent material and colloid by technologies such as embedding, sprayings, the phosphor powder layer that obtains is in uneven thickness, thereby make the homogeneity of LED bright dipping poor, and the colloid of mixed fluorescent powder has certain decay, and is also influential to the life-span of white light LEDs product.And the fluorescent material thickness between device is not reproducible, and this has limited rate of finished products greatly and industrialization is produced in batches.
Summary of the invention
Technical problem to be solved by this invention is how a kind of power type white light LED plane coating process based on water soluble photosensitive is provided, this technology is mixed fluorescent material with suitable aqueous sensitizing glue, by change to relevant parameters such as gluing, exposure, developments, thereby shape, thickness to phosphor powder layer are controlled, obtain the phosphor powder layer that thickness, uniformity and relevant physicochemical characteristic are all satisfied the demand, improve the relevant physicochemical characteristic of phosphor powder layer, improve the overall performance of LED device, satisfy the needs that industrialization is produced in batches.
Technical problem proposed by the invention is to solve like this: a kind of power type white light LED plane coating process based on water soluble photosensitive is provided, it is characterized in that, may further comprise the steps:
1. prepare organic colloid: the mass ratio in organic principle and deionized water is 2～22: 100 a ratios preparation organic colloid, and static to bubble collapse, described organic principle is polyvinyl alcohol (PVA);
2. prepare sensitising agent solution: the mass ratio in ammonium dichromate or diazonium compound and deionized water is 0.02～12: 100 a ratios preparation sensitising agent;
3. be mixed into photosensitive system: with organic colloid and sensitising agent is 2～20: 1 mixed by volume, add defoamer then, wherein the volume ratio of defoamer and mixed liquor is 1: 2～20, and this defoamer is to have diluted 5～30 times silicone defoaming agent or silicon oil foam killer;
4. preparation contains the photoresists suspension of fluorescent material: with 3. gained photosensitive system and function organic principle and fluorescent material mixing of step, described photosensitive system and function organic principle are to carry out proportioning at 2～100: 1 by volume, and the amount of fluorescent material is in adding with the ratio of photosensitive system 0.1～1g/ml;
5. apply: with step 4. the photoresists suspension of gained be coated on the led chip surface, form fluorescent coating, and in the darkroom, dry in the shade naturally or air-dry;
6. exposure imaging: completing steps led chip is 5. connected with the mains, allow chip self is luminous to expose to the photographic composition in the bisque, the control that electric current and the control of conduction time by chip is exposure light flux realizes different depth of exposures, in being 50～90 ℃ developer solution, temperature develops then, developing time is 1～10min, obtains having the phosphor powder layer of planar structure;
7. cured: the 6. resulting phosphor powder layer of step is cured (as hot curing, secondary light is solidified), makes the physicochemical characteristic of bisque stable.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 1. in preparation during organic colloid, in adding absolute ethyl alcohol, glacial acetic acid and the dispersant one or more, wherein the absolute ethyl alcohol addition accounts for 5～25% of cumulative volume, the glacial acetic acid addition accounts for 1～5% of cumulative volume, the addition of dispersant is to account for 0.001～1% of gross mass, described dispersant is for containing sulfonic organic compound, absolute ethyl alcohol reduces the bubble that produces in the course of dissolution, and glacial acetic acid quickens the dissolving of organic gel; Dispersant can make sensitising agent be dispersed in the organic colloid.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 4. in, described function organic principle is adhesive or uvioresistant or antioxidant, can be in silica gel, epoxy resin, polyvinyl acetate and the acrylate polymer one or more.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 4. in, be adhesive if select silica gel, then need add emulsifying agent and carry out emulsification, this emulsifying agent is an O/W type emulsifying agent; If select epoxy resin, need to add curing agent, the weight ratio of epoxy resin and curing agent is 10: 1～5, described curing agent is macromolecule curing agent such as phenolic resin or amino resins.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 4. in, add the specific function organic principle and form powder slurry and phosphor powder layer with stable inside and outside phase structure.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 4. in, fluorescent material can at first mix with the function organic principle, again with step 3. gained sensitization liquid mix, obtain sensitizing powder slurry; Also can allow earlier function organic principle and step 3. gained sensitization liquid mix, add fluorescent material again and mix.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 5. in, the phosphor powder layer painting method adopts rotation gluing method, spraying process, drip a kind of in glue method and the print process.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 6. in the exposure, can adopt chip from the exposure mode; Also can adopt the outer Exposure mode of UV light in conjunction with mask plate.
According to the power type white light LED plane coating process based on water soluble photosensitive provided by the present invention, it is characterized in that, step 7. in, curing mode is that re-expose or UV solidify or hot curing again.
The power type white light LED plane coating process that provides of the present invention based on water soluble photosensitive, with organic colloid (as PVA, polyvinyl alcohol) and sensitising agent (as ADC, ammonium dichromate, diazonium compound) photosensitive system formed is the carrier of fluorescent material, after photosensitive system, function organic compound (as adhesive, uvioresistant, antioxidant) and fluorescent material mix, formation contains the photoresists suspension (being the powder slurry) of fluorescent material, in order to obtain steady suspension more, can introduce relevant dispersant, defoamer.After gluing, exposure, development, forming with the organic colloid on the led chip surface is that foreign minister, function organic compound are the planar structure fluorescent coating of interior phase, improve the optical homogeneity and the thermal stability of device, thereby improve the overall performance of power type white light LED device.
Description of drawings
Fig. 1 (Fig. 1 a～Fig. 1 d) is the technical process schematic diagram of making power type white light LED phosphor powder layer of the present invention, wherein Fig. 1 a is the structural representation of selected led chip, Fig. 1 b is the schematic diagram that is coated with the led chip of fluorescent material powder slurry, Fig. 1 c is the bisque pattern schematic diagram that obtains behind the exposure imaging, and Fig. 1 d is the schematic diagram that solidifies behind the phosphor powder layer;
Fig. 2 is the phosphor powder layer schematic diagram with inside and outside phase structure of this programme preparation.
Wherein, 1, substrate, 2, the P region electrode, 3, the N region electrode, 4, led chip, 5, interior phase function organic principle, 6, foreign minister's photosensitive system, 7, the phosphor powder layer after developing, 8, the phosphor powder layer that solidifies of back.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
Fig. 1 (1a～1d) be to use the present invention to make the schematic diagram of power type white light LED phosphor powder layer process,
Fig. 1 a is the structural representation (1 of used led chip, substrate, 2, the P region electrode, 3, the N region electrode, 4, led chip), Fig. 1 b is the schematic diagram that is coated with the led chip of fluorescent material powder slurry, 5 is interior phase function organic principle, 6 is foreign minister's photosensitive system, fluorescent material is scattered among the interior foreign minister, function organic compound and photosensitive system mix, and after adding an amount of fluorescent material and mixing, form the photoresists suspension (being the powder slurry) that contains fluorescent material, adopt rotation gluing method then, spraying process, drip modes such as glue method or print process, above-mentioned powder slurry is coated in the led chip surface, among Fig. 2 b, employing be to drip the phosphor powder layer that the glue method forms, after phosphor powder layer applies, should in the darkroom, dry in the shade naturally or air-dry.
Fig. 1 c is the phosphor powder layer schematic diagram that obtains behind the chip exposure imaging.Exposure mode can adopt led chip from exposure or UV light in conjunction with the outer exposure of mask plate, by the control of depth of exposure, realize having the phosphor powder layer of definite thickness and pattern.
Fig. 1 d is the phosphor powder layer schematic diagram that solidify the back.The mode that solidify the back can be secondary exposure certainly, also can be that UV solidifies again, can also be hot curing, to realize the more stable physicochemical characteristic of phosphor powder layer.
Fig. 2 is the phosphor powder layer schematic diagram with inside and outside phase structure of this programme preparation, and wherein 5 is interior phase function organic principles, the 6th, and foreign minister's photosensitive system.
Foreign minister's photosensitive system is made up of organic colloid (film forming agent) and sensitising agent (sensitizer), and all is water miscible, organic colloid such as PVA, sensitising agent such as ADC or diazonium compound; Interior phase function organic principle is selected silica gel, epoxy resin, polyvinyl acetate (PVAc), acrylate polymer etc. for use, with adhesion characteristic, uvioresistant, the anti-oxidation characteristics that improves bisque.Add fluorescent material and after even the mixing, form the photoresists suspension (being the powder slurry) that contains fluorescent material, need sometimes by adding defoamer, dispersant, to improve the stability of suspension.Roughly step is as follows for it:
The first, match well by certain mass and be shaped on the machine colloid, leave standstill, can increase the stability of organic colloid like this to bubble collapse.In case of necessity, add dispersant;
The second, press certain mass than preparation sensitising agent solution;
Three, organic colloid is mixed by a certain percentage with sensitising agent, form photosensitive system, can add appropriate amount of defoamer, sensitising agent is dispersed in the organic colloid;
Four, get an amount of function organic principle, take by weighing the fluorescent material of respective quality, and get the sensitization liquid of corresponding proportion, three's mixing and stirring obtains containing the photoresists suspension (be powder slurry) of fluorescent material.When mixing, add an amount of emulsifying agent (as the silica gel situation) or curing agent (as the epoxy resin situation), make the powder slurry form stable inside and outside phase structure.
Five, utilize above-mentioned sensitization rubber powder slurry, adopt rotation gluing method, spraying process, drip modes such as glue method or print process, on the led chip surface, apply one deck powder slurry, and in the darkroom, dry in the shade naturally or air-dry;
Six, the 5th photoresists bisque that obtain of step is carried out exposure imaging, Exposure mode can adopt led chip from the outer exposure in conjunction with mask plate of exposure or UV light.
The phosphor powder layer with planar structure that seven, will obtain carries out the back cured, and shown in Fig. 1 d, the mode of back cured can be secondary exposure certainly, also can be that UV solidifies again, can also be hot curing.To realize the more stable physicochemical characteristic of phosphor powder layer.
Below be specific embodiments of the invention:
Embodiment one
The dodecyl sodium sulfate of weighing 3.5g polyvinyl alcohol (PVA) and 43.8mg mixes with the 25ml deionized water, adds 2.5ml absolute ethyl alcohol and 0.5ml glacial acetic acid again, the about 10min of stirring and dissolving in boiling water bath, and solution presents transparent homogeneous shape, no tuberculosis phenomenon.Leave standstill, treat bubble collapse;
Weighing 315.8mg ammonium dichromate (ADC) mixes with the 6ml deionized water, places in the darkroom;
PVA solution is mixed with ADC solution, and add after silicone defoaming agent 6ml after 20 times of the dilutions stirs, in the darkroom, place;
Equal-volume measure silica gel A and silica gel B altogether 310ul mix, weighing 800mg yellow fluorescent powder after mixing silica gel and mixing, mixes with the photographic emulsion that mixes that 3.1ml went up in the step again, obtains containing the photoresists suspension (being that powder is starched) of fluorescent material;
Sensitizing powder slurry point glue on chip front surface, is spared glue at sol evenning machine, and the rotating speed of sol evenning machine is about 1400r, and the even glue time is 10s, and the even good chip about 10min in the darkroom of glue is dried in the shade;
The electric current of regulating constant-current source is 10mA, the chip both positive and negative polarity is connected on the electrode of constant current, and energized, the time for exposure is 1～5s;
Develop in 85 ℃ water-bath, the time is about 3～5min;
With high-pressure mercury lamp (300W, ultraviolet source 365nm), post-exposure 5min.
Embodiment two
Weighing 3.763g polyvinyl alcohol (PVA) mixes with the 50ml deionized water, the about 15min of stirring and dissolving in boiling water bath, and solution presents transparent homogeneous shape, no tuberculosis phenomenon.Leave standstill, treat bubble collapse;
Weighing 315.8mg ammonium dichromate (ADC) mixes with the 6ml deionized water, places in the darkroom;
PVA solution is mixed with ADC solution, after stirring, in the darkroom, place;
Equal-volume is measured silica gel A and silica gel B 310ul mixing altogether, weighing 800mg yellow fluorescent powder, after mixing silica gel and mixing, mix with the photographic emulsion that mixes that 3.1ml went up in the step again, obtain containing the photoresists suspension (being the powder slurry) of fluorescent material, in vacuum drying chamber, remove the bubble in the powder slurry;
Sensitizing powder slurry point glue on chip front surface, is applied evenly, the chip about 30min in the darkroom that coats is dried in the shade naturally;
The electric current of regulating constant-current source is 10mA, the chip both positive and negative polarity is connected on the electrode of constant current, and energized, the time for exposure is 1～5s;
Develop in 85 ℃ water-bath, the time is about 3～5min;
With high-pressure mercury lamp (300W, ultraviolet source 365nm), post-exposure 5min.
Claims (7)
1, a kind of power type white light LED plane coating process based on water soluble photosensitive is characterized in that, may further comprise the steps:
1. prepare organic colloid: the mass ratio in organic principle and deionized water is 2～22: 100 a ratios preparation organic colloid, and static to bubble collapse, described organic principle is a polyvinyl alcohol;
2. prepare sensitising agent solution: the mass ratio in ammonium dichromate or diazonium compound and deionized water is 0.02～12: 100 a ratios preparation sensitising agent;
3. be mixed into photosensitive system: with organic colloid and sensitising agent is 2～20: 1 mixed by volume, add defoamer then, wherein the volume ratio of defoamer and mixed liquor is 1: 2～20, and this defoamer is to have diluted 5～30 times silicone defoaming agent or silicon oil foam killer;
4. preparation contains the photoresists suspension of fluorescent material: with 3. gained photosensitive system and function organic principle and fluorescent material mixing of step, described photosensitive system and function organic principle are to carry out proportioning at 2～100: 1 by volume, and the amount of fluorescent material is in adding with the ratio of photosensitive system 0.1～1g/ml;
5. apply: with step 4. the photoresists suspension of gained be coated on the led chip surface, form fluorescent coating, and in the darkroom, dry in the shade naturally or air-dry;
6. exposure imaging: completing steps led chip is 5. connected with the mains, allow chip self is luminous to expose to the photographic composition in the bisque, develop in temperature is 50～90 ℃ developer solution then, developing time is 1～10min, obtains having the phosphor powder layer of planar structure;
7. cured: the 6. resulting phosphor powder layer of step is cured, makes the physicochemical characteristic of bisque stable.
2, the power type white light LED plane coating process based on water soluble photosensitive according to claim 1, it is characterized in that, step 1. in preparation during organic colloid, in adding absolute ethyl alcohol, glacial acetic acid and the dispersant one or more, wherein the absolute ethyl alcohol addition accounts for 5～25% of cumulative volume, the glacial acetic acid addition accounts for 1～5% of cumulative volume, and the addition of dispersant is to account for 0.001～1% of gross mass, and described dispersant is for containing sulfonic organic compound.
3, the power type white light LED plane coating process based on water soluble photosensitive according to claim 1, it is characterized in that, step 4. in, described function organic principle is one or more in silica gel, epoxy resin, polyvinyl acetate and the acrylate polymer.
4, the power type white light LED plane coating process based on water soluble photosensitive according to claim 1, it is characterized in that, step 4. in, the function organic principle is an adhesive if select silica gel, then need add emulsifying agent and carry out emulsification, this emulsifying agent is an O/W type emulsifying agent; If select epoxy resin, need to add curing agent, the weight ratio of epoxy resin and curing agent is 10: 1～5, described curing agent is macromolecule curing agent such as phenolic resin or amino resins.
5, the power type white light LED plane coating process based on water soluble photosensitive according to claim 1 is characterized in that, step 5. in, the phosphor powder layer painting method adopts rotation gluing method, spraying process, drip a kind of in glue method and the print process.
6, the power type white light LED plane coating process based on water soluble photosensitive according to claim 1 is characterized in that, step 6. in, Exposure mode adopts chip from the mode of exposure or adopt the outer Exposure mode of UV light in conjunction with mask plate.
7, the power type white light LED plane coating process based on water soluble photosensitive according to claim 1 is characterized in that, step 7. in, curing mode is that re-expose or UV solidify or hot curing again.
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