CN107876320B - Fluorescent powder coating device and coating method - Google Patents

Fluorescent powder coating device and coating method Download PDF

Info

Publication number
CN107876320B
CN107876320B CN201610886781.8A CN201610886781A CN107876320B CN 107876320 B CN107876320 B CN 107876320B CN 201610886781 A CN201610886781 A CN 201610886781A CN 107876320 B CN107876320 B CN 107876320B
Authority
CN
China
Prior art keywords
groove
substrate
floating plate
fluorescent powder
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610886781.8A
Other languages
Chinese (zh)
Other versions
CN107876320A (en
Inventor
李崇华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Duolis Technology Co ltd
Original Assignee
Jiangsu Zhongxi Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Zhongxi Semiconductor Co ltd filed Critical Jiangsu Zhongxi Semiconductor Co ltd
Publication of CN107876320A publication Critical patent/CN107876320A/en
Application granted granted Critical
Publication of CN107876320B publication Critical patent/CN107876320B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • B05C9/027—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means using applicator shoes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/065—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects having colour interferences or colour shifts or opalescent looking, flip-flop, two tones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/10—Organic solvent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2451/00—Type of carrier, type of coating (Multilayers)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention discloses a fluorescent material coating device, which can quickly and simply form fluorescent powder on a substrate and can be applied to mass production. The phosphor coating device of the present invention comprises: a tank body having a tank wall, a liquid injection inlet, and a liquid discharge outlet; the clapboard is positioned in the groove body and divides the groove body into a first groove and a second groove; wherein the height of the partition board is lower than that of the tank wall; and a fluorescent powder injection device.

Description

Fluorescent powder coating device and coating method
Technical Field
The present invention relates to a coating apparatus and a coating method, and more particularly, to an apparatus and a coating method capable of uniformly coating a fluorescent material on a substrate.
Background
In recent years, Light Emitting Diodes (LEDs) have been widely used in various light emitting devices to replace various lighting devices due to their advantages of high light emitting efficiency, low power consumption, long service life, and small element size.
The existing white light LED for illumination uses an ultraviolet light emitting diode chip to cooperate with red, green, and blue light three-color phosphors, and can be mixed into white light by a light mixing mechanism of three primary colors of red, blue, and green.
However, the conventional method for manufacturing the white LED can uniformly disperse the phosphor in the resin. And then, mixing the resin dispersed with the fluorescent powder with a curing agent, covering the colloid dispersed with the fluorescent powder on the LED chip by a dispenser, and drying and packaging to obtain the LED element. The LED element prepared by the method has the problems of inaccurate color temperature, uneven mixed light and the like of the fluorescent powder layer due to non-uniform material quality of the fluorescent powder because of irregular appearance and size of the fluorescent powder.
The method of coating phosphor on the substrate with the floating film on the water surface is limited by the materials and the operation conditions, and at present, the method can only be operated manually, needs skilled and trained operators to operate, and cannot be used for rapid mass production.
Therefore, there is a need to develop a phosphor coating method that can rapidly and massively produce a substrate with uniform coating for application in LED lighting devices.
Disclosure of Invention
The present invention is directed to a phosphor coating apparatus that can rapidly and easily form phosphor on a substrate and can be applied to mass production.
Another object of the present invention is to provide a phosphor coating method, which can rapidly and easily form phosphor on a substrate and can be applied to mass production.
The phosphor coating device of the present invention comprises: a tank body having a tank wall, a liquid injection inlet, and a liquid discharge outlet; the clapboard is positioned in the groove body and divides the groove body into a first groove and a second groove; wherein the height of the partition board is lower than that of the tank wall; and a fluorescent powder injection device.
The fluorescent powder coating method comprises the following steps: providing a substrate and a phosphor coating device, wherein the phosphor coating device comprises: a tank body having a tank wall, a liquid injection inlet, and a liquid discharge outlet; the clapboard is positioned in the groove body and divides the groove body into a first groove and a second groove; wherein the height of the partition board is lower than that of the tank wall; and a restriction floating plate having a hollow space; and the substrate is placed in the second groove; then, sequentially injecting water into the first tank and the second tank from a liquid injection inlet; injecting fluorescent powder into a hollow space of a limiting floating plate floating on the liquid level of the first groove; when the liquid level is higher than the height of the partition plate, moving the limiting floating plate to the second groove; and draining water from the drainage outlet to reduce the liquid level so as to coat the fluorescent powder in the limiting floating plate on the surface of the substrate.
The fluorescent powder coating device optionally further comprises a limit floating plate with a hollow space. The limit floating plate with the hollow space can float on the water surface by means of the buoyancy of the limit floating plate when water is injected into the tank body. The shape of the limiting floating plate of the invention needs to be a hollow space for accommodating and limiting the range of the fluorescent powder which is injected into the tank body and floats on the water surface. The shape of the floating restriction plate of the present invention is preferably a frame shape having a hollow space.
The fluorescent powder coating device optionally further comprises a floating plate limiting shifter for moving the floating plate floating on the water surface in the process. The float plate restraining mover of the present invention may be any mechanism for moving or pushing the float plate, preferably a robot arm, a robot claw, a carriage, a lever, or a combination thereof.
The fluorescent powder coating device optionally further comprises a substrate carrying platform for fixing the substrate. The substrate carrier of the present invention is preferably disposed in the second groove. The substrate carrying platform can be movable or fixed to match with the process requirements.
The fluorescent powder coating device optionally further comprises a microprocessor control system, and the microprocessor control system is used for automatically controlling the valves of the liquid injection inlets, the valves of the liquid discharge outlets, the fluorescent powder injection device and the limiting floating plate shifter by using programs.
The fluorescent powder coating device of the invention can be selectively provided with an auxiliary injection port, an auxiliary discharge port or a combination thereof on the groove body so as to adjust or accelerate the coating speed.
In the fluorescent material coating method and the substrate coated with the fluorescent material of the present invention, the substrate is not limited, and preferably may be any LED chip or LED element semi-finished product, and more preferably a sapphire substrate, a blue light epitaxial chip formed with an epitaxial layer, or a flip-chip LED chip.
The fluorescent material coated substrate manufactured by the fluorescent material coating method of the invention can form a uniform fluorescent material film on the surface of the substrate because the fluorescent material has uniform particle size and property. Meanwhile, the filling layer on the fluorescent material film can protect the fluorescent nano material film from being easily stripped from the substrate and can improve the refractive index of the formed substrate.
The number of the grooves or the number of the partition plates of the fluorescent powder coating device can be increased according to the needs, and the configuration of the fluorescent powder coating device can be adjusted or arranged in an array according to the needs of the production process so as to increase the coating efficiency and the yield.
Drawings
Fig. 1 is a side view of a fluorescent material coating apparatus of the present invention.
Fig. 2 is a top view of the fluorescent material coating apparatus of the present invention.
FIGS. 3A-3C are schematic views illustrating the application of the fluorescent material coating apparatus of the present invention.
[ description of reference ]
100 fluorescent material coating device
110 trough body
111 first groove
112 groove wall
113 second groove
114 primary injection port
115 auxiliary injection port
116 main discharge port
117 auxiliary drain
120 baffle
130 fluorescent powder injection device
140 stage
142 base plate
150 limit floating plate
152 limit float plate mover
160 hollow space
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and the advantages and other effects of the present invention will be readily apparent to those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 and fig. 2. Fig. 1 is a side view of a fluorescent material coating apparatus of the present invention. Fig. 2 is a top view of the fluorescent material coating apparatus of the present invention. The fluorescent material coating apparatus 100 of the present invention includes a hollow trough body 110 having a main injection port 114, a main discharge port 116, and a trough wall 112. A partition plate 120 is disposed in the center of the tank body 110, and divides the tank body into a first tank 111 and a second tank 113. And the height of the slot wall 112 is substantially higher than the height of the partition plate 120 to facilitate the process. The apparatus 100 further comprises a phosphor powder injector 130 for sequentially injecting phosphor powder according to a predetermined amount during the manufacturing process.
The phosphor coating device 100 of the present invention may have a plurality of auxiliary injection ports 115 and a plurality of auxiliary discharge ports 117 on the wall 112 to accelerate water injection or water discharge during the phosphor coating process to increase the processing speed. The phosphor coating device of the present invention further requires a restriction floating plate 150 having a hollow space, which is a frame body having a closed outer frame and can float on the water surface, to be used in cooperation with phosphor coating.
In the phosphor coating method of the present invention (please refer to fig. 3A-3C), the substrate 142 to be coated with phosphor is placed on a stage 140 in the second groove 113, and the floating limiting plate 150 is placed in the first groove 111. The substrate 142 used in the present embodiment is a flip-chip LED chip. Water is then injected into the first and second tanks 111 and 113 through the main injection port 114. At this time, the floating restriction plate 150 floats on the water surface of the first tank 111 due to the water injection, and rises as the water surface rises. To speed up the process, water may optionally be injected into the two tanks (111, 113) through the secondary injection port 115. When the water enters the first trough 111 and does not reach the height of the partition plate 120, the phosphor powder to be coated can be slowly dropped on the water surface by the phosphor powder injector 130 to inject the phosphor powder mixed solution into the hollow space 160 of the first trough 111 for limiting the floating plate 150. After being injected, the fluorescent powder floats on the water surface of the hollow space 160 in the limiting floating plate 150 and cannot be diffused on the water surface outside the limiting floating plate in a large amount.
The fluorescent powder in the fluorescent powder injector 130 used in this embodiment is a fluorescent powder solution, and the fluorescent powder is taken as a fluorescent material, wherein the spherical carrier of the fluorescent powder adopts a material of SiO with a particle size of 500nm2The nano-sphere is adopted as the fluorescent powder, and Y with the particle size of about 30nm is adopted as the fluorescent powder2O3：La3+、YAG：La3+And CdSe: ZnS, and the phosphor is bonded on the surface of the spherical carrier through silane molecules (APTMS). And mixing the fluorescent powder in ethanol with high dispersibility to obtain a fluorescent powder mixed solution.
Then, the water is continuously injected to continuously increase the liquid level of the first and second tanks 111 and 113 to be higher than the partition 120. at this time, since the water level of the first and second tanks 111 and 113 is the same as the water level of the partition 120, the restriction floating plate 150 filled with the phosphor is moved by a restriction floating plate mover 152. The floating restriction plate 150 is moved from the water surface of the first tank 111 to the water surface of the second tank 113. The phosphor powder enclosed by the floating restriction plate 150 is smoothly moved to the water surface of the second tank 113 along with the movement of the floating restriction plate 150. The floating plate mover 152 used in this embodiment may be a gripper or a robot arm.
After the floating restriction plate 150 with the phosphors is moved into the second tank 113, the water in the second tank 113 is discharged from the main discharge port 116 to lower the water level in the second tank 113. When the water level is lowered, the hollow space of the floating plate 150 is limited to be approximately aligned with the substrate 142 to be coated. When the water level is lowered, the phosphor can be uniformly and stably coated on the upper surface and the side surface of the substrate 142.
Next, the substrate 142 is placed in a drying processing apparatus (not shown) to evaporate and remove the ethanol (not shown) having high dispersibility. After drying, a substrate 142 with a phosphor film on the surface thereof can be obtained.
The phosphor-coated substrate can be prepared by using an aqueous solution of a silicon alkoxide (e.g., TEOS) as a sol-gel precursor solution and by using YAG and La3+After the salt is dissolved in the acid solution prepared by nitric acid, the mixed solution is coated on the fluorescent powder film 21 by the rotary coating method to form a filling layer 22, and the filling layer is prepared by the YAG: La3+SiO of (2)2A layer of material. After standing still, the substrate 20 having the phosphor thin film 21 and the filling layer 22 is subjected to a heat treatment, and then an annealing treatment is performed, thereby completing the substrate coated with the phosphor material of the present embodiment.
In the scheme, the fluorescent powder floating on the water surface is stably moved by the floating plate, so that the fluorescent powder is not diffused in a large amount, and the material is saved. The flow speed is controlled by the water surface lifting, the cost is low, the speed is improved, the process is simple, and a large amount of fluorescent powder can be rapidly coated on the substrate. The phosphor powder can be uniformly coated on the surface of the substrate by the restriction of the floating plate and the smooth descending of the water surface.

Claims (3)

1. Fluorescent powder coating method，Comprises the following steps：
(a) Providing a substrate and a phosphor coating device, wherein the phosphor coating device comprises：
A tank body having a tank wall, a liquid injection inlet, and a liquid discharge outlet;
the clapboard is positioned in the groove body and divides the groove body into a first groove and a second groove;
wherein the height of the partition board is lower than that of the tank wall;
a fluorescent powder injection device;
a restriction floating plate having a hollow space;
a floating plate limiting shifter for moving the floating plate; and
a microprocessor control system for controlling the valve of the liquid injection inlet, the valve of the liquid discharge outlet, the fluorescent powder injection device and the limiting floating plate mover; and is
The substrate is arranged in the second groove;
(b) injecting water into the first tank and the second tank from the liquid injection inlet;
(c) injecting fluorescent powder into the hollow space of the limiting floating plate floating on the liquid level of the first groove;
(d) when the liquid level is higher than the height of the clapboard，The limiting floating plate shifter moves the limiting floating plate to the second groove; and
(e) the liquid level is reduced by draining water from the liquid outlet，So that the phosphor powder in the limiting floating plate is coated on the surface of the substrate.
2. The method of claim 1, wherein the phosphor is applied to a substrate，Wherein the substrate is arranged on a carrying platform in the second groove.
3. The method of claim 1, wherein the phosphor is applied to a substrate，Wherein the limiting floating plate shifter is a mechanical arm，One machineMechanical claw，A bracket，A rod，Or a combination thereof.
CN201610886781.8A 2016-09-30 2016-10-11 Fluorescent powder coating device and coating method Active CN107876320B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105131800A TWI613011B (en) 2016-09-30 2016-09-30 Device for coating phosphors and coating method
TW105131800 2016-09-30

Publications (2)

Publication Number Publication Date
CN107876320A CN107876320A (en) 2018-04-06
CN107876320B true CN107876320B (en) 2020-11-06

Family

ID=59094576

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201621112305.2U Active CN206293459U (en) 2016-09-30 2016-10-11 Fluorescent powder coating device
CN201610886781.8A Active CN107876320B (en) 2016-09-30 2016-10-11 Fluorescent powder coating device and coating method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201621112305.2U Active CN206293459U (en) 2016-09-30 2016-10-11 Fluorescent powder coating device

Country Status (2)

Country Link
CN (2) CN206293459U (en)
TW (1) TWI613011B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766234B (en) * 2020-02-10 2022-06-01 台灣愛司帝科技股份有限公司 Led chip package structure and method of manufacturing the same
TWI710129B (en) * 2020-02-10 2020-11-11 台灣愛司帝科技股份有限公司 Led chip package structure and method of manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61178070A (en) * 1985-01-31 1986-08-09 Japan Radio Co Ltd Formation of fluorescent film
JPS61216767A (en) * 1985-03-22 1986-09-26 Shimadzu Corp Method for coating fine powder
CN101093869A (en) * 2007-07-26 2007-12-26 电子科技大学 Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue
CN201389516Y (en) * 2009-04-28 2010-01-27 上海宝绿包装材料科技有限公司 Coating circulation material trough
CN102107178A (en) * 2009-12-28 2011-06-29 李威汉 Fluorescent material coating method and substrate prepared by same
CN102694091A (en) * 2012-06-13 2012-09-26 佛山市国星光电股份有限公司 Method for exposing electrodes in wafer level packaging and mask plate
CN102945915A (en) * 2012-10-22 2013-02-27 厦门多彩光电子科技有限公司 Coating technique of LED fluorescent powder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251463A (en) * 1998-03-06 1999-09-17 Matsushita Electron Corp Semiconductor storage device and its manufacture
CN101623682B (en) * 2008-07-09 2011-05-25 北京石油化工学院 Device for preparing membrane by liquid level sedimentation method
TWI398306B (en) * 2009-12-24 2013-06-11 Wei Han Lee Method for coating fluorescence material
CN102148304B (en) * 2010-02-09 2013-07-03 和椿科技股份有限公司 Film making system and film making method
CN101884969B (en) * 2010-06-25 2012-07-04 北京航空航天大学 Device for preparing thin film by liquid level drawdown method
TWI484664B (en) * 2012-09-11 2015-05-11 Brightek Optoelectronic Co Ltd Method for spreading fluorescent particles

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61178070A (en) * 1985-01-31 1986-08-09 Japan Radio Co Ltd Formation of fluorescent film
JPS61216767A (en) * 1985-03-22 1986-09-26 Shimadzu Corp Method for coating fine powder
CN101093869A (en) * 2007-07-26 2007-12-26 电子科技大学 Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue
CN201389516Y (en) * 2009-04-28 2010-01-27 上海宝绿包装材料科技有限公司 Coating circulation material trough
CN102107178A (en) * 2009-12-28 2011-06-29 李威汉 Fluorescent material coating method and substrate prepared by same
CN102694091A (en) * 2012-06-13 2012-09-26 佛山市国星光电股份有限公司 Method for exposing electrodes in wafer level packaging and mask plate
CN102945915A (en) * 2012-10-22 2013-02-27 厦门多彩光电子科技有限公司 Coating technique of LED fluorescent powder

Also Published As

Publication number Publication date
TWI613011B (en) 2018-02-01
CN206293459U (en) 2017-06-30
CN107876320A (en) 2018-04-06
TW201811443A (en) 2018-04-01

Similar Documents

Publication Publication Date Title
US20150111313A1 (en) Method for manufacturing led, apparatus for manufacturing led, and led
TWI542038B (en) Method and apparatus for producing optodevice
CN107876320B (en) Fluorescent powder coating device and coating method
US8940561B2 (en) Systems and methods for application of optical materials to optical elements
US20120025214A1 (en) Led packaging structure and packaging method
CN105449078A (en) White light LED and preparation method thereof
TWI528601B (en) Package method and package structure
CN107861181A (en) A kind of quantum dot color filter and preparation method thereof
KR20190039772A (en) Method for manufacturing light emitting device, light emitting device and hybrid light emitting device
CN102237475A (en) LED wafer level fluorescent powder coating technology based on organic colloid
CN107546314A (en) A kind of packaging technology of LED fluorescent powder sedimentation
CN108020881A (en) It is a kind of to contain light guide plate encapsulating structure of quantum dot micro structure array and preparation method thereof for surface
US11417795B2 (en) Die-bonding method and spraying device for LED
JP5510312B2 (en) Method for manufacturing light emitting device
JP2012186319A (en) Light-emitting device manufacturing method
CN108258108B (en) High-contrast LED support, manufacturing method thereof, LED device and LED display screen
CN206820020U (en) A kind of LED component
TW201530820A (en) Light emitting diode package structure and method thereof
JP2008019380A (en) Luminous particles, luminescent device and manufacturing method of the same
TWM539391U (en) Device for coating phosphors
CN105322071B (en) A kind of chip-scale white light LEDs and preparation method thereof
CN104752588A (en) Fluorescent glue coating method for flip chip
CN112099266B (en) Color film, preparation method thereof, processing device and display device
CN102751428A (en) Optical transformational structure, manufacture method of optical transformational structure, and light-emitting diode apparatus comprising optical transformational structure
KR101647737B1 (en) phosphor structure and method of manufacturing the same and method of manufacturing LED using the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20191024

Address after: 214063 811, 8th floor, 599-1 (Building 1), Jianshe West Road, Wuxi City, Jiangsu Province

Applicant after: Jiangsu Zhongxi Semiconductor Co.,Ltd.

Address before: 201315, Shanghai, Cambridge Town, Pudong New Area, Shanghai South Road, No. 1, building 58, room 4, 2568

Applicant before: SHANGHAI HANBANG PUJING ENERGY CONSERVATION TECH CO.,LTD.

GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230323

Address after: Room 3, No. 336 Kanghui Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province, 215314

Patentee after: Suzhou Duolis Technology Co.,Ltd.

Address before: 214063 811, 8th Floor, 599-1 (Building 1), Jianzhu West Road, Wuxi City, Jiangsu Province

Patentee before: Jiangsu Zhongxi Semiconductor Co.,Ltd.