CN107876320A - fluorescent powder coating device and coating method - Google Patents

fluorescent powder coating device and coating method Download PDF

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Publication number
CN107876320A
CN107876320A CN201610886781.8A CN201610886781A CN107876320A CN 107876320 A CN107876320 A CN 107876320A CN 201610886781 A CN201610886781 A CN 201610886781A CN 107876320 A CN107876320 A CN 107876320A
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CN
China
Prior art keywords
powder coating
groove
kickboard
limitation
fluorescent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610886781.8A
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Chinese (zh)
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CN107876320B (en
Inventor
李崇华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Duolis Technology Co ltd
Original Assignee
Shanghai Hanbang Pujing Energy Conservation Tech Co ltd
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Publication of CN107876320A publication Critical patent/CN107876320A/en
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Publication of CN107876320B publication Critical patent/CN107876320B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • B05C9/027Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means using applicator shoes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/065Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects having colour interferences or colour shifts or opalescent looking, flip-flop, two tones
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/10Organic solvent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2451/00Type of carrier, type of coating (Multilayers)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention discloses a fluorescent material coating device, which can quickly and simply form fluorescent powder on a substrate and can be applied to mass production. The phosphor coating device of the present invention comprises: a tank body having a tank wall, a liquid injection inlet, and a liquid discharge outlet; the clapboard is positioned in the groove body and divides the groove body into a first groove and a second groove; wherein the height of the partition board is lower than that of the tank wall; and a fluorescent powder injection device.

Description

Fluorescent powder coating device and coating method
Technical field
The present invention relates to a kind of apparatus for coating and coating method, more particularly to one kind can be in even spread phosphor on substrate The device and coating method of material.
Background technology
In recent years, because light emitting diode (LED) has, luminous efficiency is high, power consumption is few, service life is long and component size The advantages that small, it is widely used in various light-emitting devices, and substitutes several lighting apparatus.
White light LEDs currently used for illumination have coordinates feux rouges, green glow and blue light using ultraviolet light-emitting diodes chip Three-color phosphor, by red bluish-green trichromatic light mixing mechanism, white light can be mixed into.
But fluorescent material can be dispersed in resin by conventionally manufactured white light LEDs method.Then, fluorescent material will be dispersed with Resin is mixed with curing agent, and the colloid for being dispersed with fluorescent material is covered in LED chip with point gum machine, drying and encapsulation work Skill, a LED element can be made.According to the LED element obtained by the above method, because the external form and size of fluorescent material are irregular, Therefore phosphor powder layer is easily because of fluorescent material material property disunity, and the problems such as cause colour temperature inaccurate with mixed light inequality.
And material and operating condition are limited to, is only capable of at present artificial in the method for substrate with water surface epistasis coating fluorescent material Operation, and can not rapid, high volume production, it is necessary to skilled has training operator's operation.
Therefore, need badly at present and develop a kind of fluorescent-powder coating method, it can produce coating uniform rapid, high volume Substrate, with applied in LED luminous lighting equipment.
The content of the invention
The main object of the present invention is providing a kind of fluorescent material apparatus for coating, and it can be quickly and easily by fluorescent material shape Into on substrate, and can be applied to largely produce.
Another object of the present invention is providing a kind of fluorescent material coating method, and it can be quickly and easily by fluorescent material shape Into on substrate, and can be applied to largely produce.
The fluorescent powder coating device of the present invention, comprising:One has a cell wall, a fluid injection entrance, and the groove of discharge opeing outlet Body;One dividing plate, one first groove and the second groove are separated into the cell body, and by the cell body;Wherein the divider height, which is less than, is somebody's turn to do Cell wall height;An and fluorescent material injecting device.
The fluorescent-powder coating method of the present invention, is comprised the steps of:One substrate and a fluorescent powder coating device are provided, its In the fluorescent powder coating device include:One has a cell wall, a fluid injection entrance, and the cell body of discharge opeing outlet;One dividing plate, is located at In the cell body, and the cell body is separated into one first groove and the second groove;Wherein the divider height is less than cell wall height;And one Limitation kickboard with hollow space;And the substrate is placed in second groove;Then sequentially by water from fluid injection entrance inject this One groove and second groove;In the hollow space for the limitation kickboard that fluorescent material injection is floated on into the first tank liquor face;It is higher than in liquid level During the divider height, mobile limitation kickboard to second groove;And liquid level is reduced from discharge opeing outfall drain, so that the limitation is floated Fluorescent powder coating in plate is in the substrate surface.
The fluorescent powder coating device of the present invention, selectively also comprising a limitation kickboard with hollow space.This has The limitation kickboard of hollow space, the water surface can be floated on by the buoyancy of itself when water injects cell body.The limitation kickboard of the present invention Shape need to be with accommodating and limit and inject the fluorescent material scope for floating on the water surface of cell body with a hollow space.The present invention's The shape of kickboard is limited preferably with the framework shape with hollow space.
The fluorescent powder coating device of the present invention, selectively also comprising a limitation kickboard shifter, to be moved in technique Float on the limitation kickboard of the water surface.The limitation kickboard shifter of the present invention can be the mechanism of any movement or promotion limitation kickboard, A preferably mechanical arm, a gripper, a bracket, a bar, or its combination.
The fluorescent powder coating device of the present invention, selectively also includes a baseplate carrier, to fix the substrate.The present invention's Baseplate carrier is preferably placed in second groove.The baseplate carrier of the present invention can be portable or fixed, to coordinate process requirements.
The fluorescent powder coating device of the present invention, selectively also includes a microprocessor control system, to use program certainly Dynamicization controls moving for the valve of each fluid injection entrance, the valve of discharge opeing outlet, fluorescent material injecting device, and limitation kickboard shifter Make.
The fluorescent powder coating device of the present invention, auxiliary injection ports selectively are provided with cell body, aid in outlet, or its Combination, to adjust or accelerate coating speed.
In fluorescent material coating method of the invention and it is coated with the substrate of fluorescent material, substrate is unrestricted, preferably may be used For any LED chip or LED element semi-finished product, the blue light epi-wafer formed with epitaxial layer of a more preferably sapphire substrate, one or Flip LED chip.
Using the substrate for being coated with fluorescent material made by the fluorescent material coating method of the present invention, due to fluorescent material Particle diameter and property are homogeneous, and can form uniform fluorescent material film in substrate surface.Meanwhile by fluorescent material film Packed layer, except that can protect fluorescence, how material film will not be peeled off from substrate easily, can also lift the refraction of institute's formation substrate Rate.
The cell body number or dividing plate number of fluorescent powder coating device of the present invention can increase because of needs, and its configuration can also Array is adjusted or lined up according to the demand of production technology, to increase coating efficiency and yield.
Brief description of the drawings
Fig. 1 is the side view of fluorescent material apparatus for coating of the present invention.
Fig. 2 is the top view of fluorescent material apparatus for coating of the present invention.
Fig. 3 A-3C use schematic diagram for fluorescent material apparatus for coating of the present invention.
【Description of reference numerals】
100 fluorescent material apparatus for coating
110 cell bodies
111 first grooves
112 cell walls
113 second grooves
114 main inlets
115 auxiliary injection ports
116 main outlets
117 auxiliary outlets
120 dividing plates
130 fluorescent material injecting devices
140 microscope carriers
142 substrates
150 limitation kickboards
152 limitation kickboard shifters
160 hollow spaces
Embodiment
Illustrate embodiments of the present invention following with particular specific embodiment, those skilled in the art can be by this explanation Book disclosure of that understands advantage of the present invention and other effects easily.The present invention also can be by other different specific implementations Example is implemented or applied, and the various details in this specification can also be directed to different viewpoints and application, without departing substantially from this hair Bright spirit is lower to carry out various modifications and change.
It refer to Fig. 1 and Fig. 2.Fig. 1 is the side view of fluorescent material apparatus for coating of the present invention.Fig. 2 is phosphor of the present invention Expect the top view of apparatus for coating.Fluorescent material apparatus for coating 100 of the present invention, which includes one, has a main inlet 114, a main discharge Mouth 116, and the hollow cell body 110 that cell wall 112 is circular.The center of cell body 110 is provided with a dividing plate 120, and dividing plate separates cell body Into the first groove 111 and the second groove 113.And the height of cell wall 112 is substantially higher than the height of demarcation strip 120, to facilitate technique to carry out. Apparatus of the present invention 100 additionally comprise a fluorescent material injecting device 130, in manufacturing process, to inject fluorescence according to scheduled volume in order Powder.
Fluorescent powder coating device 100 of the present invention, on cell wall 112 and more several auxiliary injection ports 115 and more can be provided with Several auxiliary outlets 117, during fluorescent powder coating, to accelerate water filling or draining to accelerate the speed of processing in passing.This Invention fluorescent powder coating, which is installed on fluorescent powder coating, which still needs, will be used cooperatively a limitation kickboard 150 with hollow space, and it is One has the framework of closed housing, can bubble through the water column.
Fluorescent-powder coating method (refer to Fig. 3 A-3C) of the present invention, first by the base of required coating fluorescent material when implementing The microscope carrier 140 that plate 142 is placed in the second groove 113, and limitation kickboard 150 is inserted in the first groove 111.Used in the present embodiment Substrate 142 be a flip LED chip.Water is then injected into the first groove 111 and the second groove 113 through main inlet 114.Now, Limitation kickboard 150 can float on the water surface of the first groove 111 because of water injection, and raise and raise with the water surface.To accelerate process speed, and can So that water optionally is injected into two cell body (111,113) through auxiliary injection ports 115.Treat that water enters the first groove 111 not up to separation During 120 height of plate, it can be mixed so that the fluorescent material to be coated with is slowly added dropwise into fluorescent material in water surface by fluorescent material injecting device 130 Solution is closed to inject the hollow space 160 of limitation kickboard 150 in the first groove 111.Fluorescent material floats on limitation kickboard after injection The water surface of hollow space 160 in 150, it will not largely be spread in the outer water surface of limitation kickboard.
The fluorescent material in fluorescent material injecting device 130 used in the present embodiment is a fluorescent material solution, takes fluorescent material to do For a fluorescent material, it for 500nm and material is SiO that the ball-type carrier of wherein fluorescent material, which uses particle diameter,2Nanosphere, and fluorescent powder Then use particle diameter about 30nm Y2O3:La3+、YAG:La3+And CdSe:ZnS mixture, and fluorescent powder passes through silane point Sub (APTMS) bond is in ball-type carrier surface.Fluorescent material is mixed in the ethanol with polymolecularity, a fluorescent material is obtained and mixes Close solution.
Persistently inject water afterwards so that the liquid level of the first groove 111 and the second groove 113 continue to increase to higher than dividing plate 120. this Shi Yinwei the first grooves 111 and the water surface of the second groove 113 are higher than dividing plate 120 with height, it is possible to utilize a limitation kickboard shifter 152 movements are surrounded by the limitation kickboard 150 of fluorescent material.By limitation kickboard 150 from the water surface movable of the first groove 111 to the second groove 113 The water surface.And the fluorescent material that kickboard 150 encases is limited, also just as the movement of limitation kickboard 150 smoothly moves to the water of the second groove 113 Face.Limitation kickboard shifter 152 used in the present embodiment, can be gripper or mechanical arm.
After the second groove 113 is moved into the limitation kickboard 150 of fluorescent material, then the water of the second groove 113 is independently discharged Mouth 116 is discharged, to reduce the water surface of the second groove 113.When the water surface is reduced, the rough alignment institute of hollow space of kickboard 150 will be limited The substrate 142 to be coated with., can be with stably equably by fluorescent powder coating in the upper surface of substrate 142 when the water surface reduces And side surface.
Then, substrate 142 is placed in equipment for drying (not shown), the ethanol of tool polymolecularity is removed with evaporation (not shown).It is to be dried completely after, then can obtain the surface of a substrate 142 has the substrate of fluorescent powder film.
The substrate for being coated with fluorescent material can use silicon alkoxide (such as:TEOS the aqueous solution) is molten as collosol and gel precursor Liquid, and by by YAG and La3+Salt be dissolved in acid solution that a nitric acid is formulated it is well mixed after, with rotary coating Mixed solution is coated on fluorescent powder film 21 by method, and forms a packed layer 22, and it is then to contain YAG: La that packed layer, which is made,3+'s SiO2Material layer.After standing, the substrate 20 with fluorescent powder film 21 and packed layer 22 is heat-treated, then carries out at annealing Reason, then complete the substrate for being coated with fluorescent material of the present embodiment.
This case will not be such that fluorescent material expands in large quantities because smoothly moving the fluorescent material bubbled through the water column using kickboard is limited Dissipate, save material.And by water surface fluctuation control flow speed, cost is cheap and speed improvement, technique are simple, can be largely fast Fast ground is by fluorescent powder coating in substrate.Fluorescent material smoothly declines by the limitation and the water surface of limitation kickboard, can be equably It is coated on substrate surface.

Claims (10)

1. a kind of fluorescent powder coating device, comprising:
One has a cell wall, a fluid injection entrance, and the cell body of discharge opeing outlet;
One dividing plate, the first groove and the second groove are separated into the cell body, and by the cell body;
Wherein the divider height is less than cell wall height;And
One fluorescent material injecting device.
2. the fluorescent powder coating device as described in claim 1, also comprising a limitation kickboard with hollow space.
3. the fluorescent powder coating device as described in claim 1, also comprising a limitation kickboard shifter.
4. the fluorescent powder coating device as described in claim 1, wherein the fluid injection entrance height export higher than the discharge opeing.
5. the fluorescent powder coating device as described in claim 1, it also includes a baseplate carrier.
6. the fluorescent powder coating device as described in claim 1, wherein the limitation kickboard shifter are a mechanical arm, a machinery Pawl, a bracket, a bar, or its combination.
7. the fluorescent powder coating device as described in claim 1, the wherein cell wall of the cell body are provided with an auxiliary injection ports, auxiliary Outlet, or its combination.
8. a kind of fluorescent-powder coating method, is comprised the steps of:
(a) provide a substrate and a fluorescent powder coating device, wherein the fluorescent powder coating device include:
One has a cell wall, a fluid injection entrance, and the cell body of discharge opeing outlet;
One dividing plate, one first groove and the second groove are separated into the cell body, and by the cell body;
Wherein the divider height is less than cell wall height;And
One has the limitation kickboard of hollow space;And
The substrate is placed in second groove;
(b) water is injected into first groove and second groove from fluid injection entrance;
(c) in the hollow space for the limitation kickboard that fluorescent material injection is floated on into the first tank liquor face;
(d) when liquid level is higher than the divider height, mobile limitation kickboard to second groove;And
(e) liquid level is reduced from discharge opeing outfall drain, so that the fluorescent powder coating in the limitation kickboard is in the substrate surface.
9. the microscope carrier that the fluorescent-powder coating method as described in claim 8, the wherein substrate are placed in second groove.
10. the fluorescent-powder coating method as described in claim 8, wherein the limitation kickboard shifter are a mechanical arm, a machine Machinery claw, a bracket, a bar, or its combination.
CN201610886781.8A 2016-09-30 2016-10-11 Fluorescent powder coating device and coating method Active CN107876320B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105131800A TWI613011B (en) 2016-09-30 2016-09-30 Device for coating phosphors and coating method
TW105131800 2016-09-30

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CN107876320B CN107876320B (en) 2020-11-06

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113257976A (en) * 2020-02-10 2021-08-13 台湾爱司帝科技股份有限公司 Light emitting diode chip packaging structure and manufacturing method thereof
CN113257981A (en) * 2020-02-10 2021-08-13 台湾爱司帝科技股份有限公司 Light emitting diode chip packaging structure and manufacturing method thereof

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JPH11251463A (en) * 1998-03-06 1999-09-17 Matsushita Electron Corp Semiconductor storage device and its manufacture
CN101093869A (en) * 2007-07-26 2007-12-26 电子科技大学 Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue
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CN102107178A (en) * 2009-12-28 2011-06-29 李威汉 Fluorescent material coating method and substrate prepared by same
CN102694091A (en) * 2012-06-13 2012-09-26 佛山市国星光电股份有限公司 Method for exposing electrodes in wafer level packaging and mask plate
CN102945915A (en) * 2012-10-22 2013-02-27 厦门多彩光电子科技有限公司 Coating technique of LED fluorescent powder

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JPS61178070A (en) * 1985-01-31 1986-08-09 Japan Radio Co Ltd Formation of fluorescent film
JPS61216767A (en) * 1985-03-22 1986-09-26 Shimadzu Corp Method for coating fine powder
JPH11251463A (en) * 1998-03-06 1999-09-17 Matsushita Electron Corp Semiconductor storage device and its manufacture
CN101093869A (en) * 2007-07-26 2007-12-26 电子科技大学 Technique for coating layer of power type white light LED plane based on water-soluble sensitization glue
CN201389516Y (en) * 2009-04-28 2010-01-27 上海宝绿包装材料科技有限公司 Coating circulation material trough
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Publication number Priority date Publication date Assignee Title
CN113257976A (en) * 2020-02-10 2021-08-13 台湾爱司帝科技股份有限公司 Light emitting diode chip packaging structure and manufacturing method thereof
CN113257981A (en) * 2020-02-10 2021-08-13 台湾爱司帝科技股份有限公司 Light emitting diode chip packaging structure and manufacturing method thereof
CN113257976B (en) * 2020-02-10 2022-06-24 台湾爱司帝科技股份有限公司 Light emitting diode chip packaging structure and manufacturing method thereof
US11456398B2 (en) * 2020-02-10 2022-09-27 Asti Global Inc., Taiwan Method of manufacturing LED chip package structure

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Publication number Publication date
TW201811443A (en) 2018-04-01
TWI613011B (en) 2018-02-01
CN206293459U (en) 2017-06-30
CN107876320B (en) 2020-11-06

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