CN206628500U - A kind of White-light LED package structure - Google Patents

Abstract

It the utility model is related to LED encapsulation technologies field, provide a kind of White-light LED package structure, at least two LED chips are affixed on substrate, and by bonding line by its serial or parallel connection on substrate surface, it is set to be connected into circuit, the wavelength of light all differs caused by each LED chip, and at least two different wavelength period of the wavelength that the original beam that is collectively forming of LED chip has again from any of which LED chip produces light, at least two LED chips and multiple bonding lines are packaged together by fluorescent colloid again, now, after at least two have the LED chip mixing of different wave length, caused white-light spectrum is basically identical after being encapsulated with phase co-wavelength LED chip, realize white light uniformity.

Description

A kind of White-light LED package structure

Technical field

It the utility model is related to LED encapsulation technologies field, more particularly to a kind of White-light LED package structure.

Background technology

The implementation of white light mainly has at present：Simultaneously chip using feux rouges, blue light and green luminescence (referred to as：The colors of RGB tri- Chip), blue chip collocation yellow fluorescent powder, blue chip collocation green emitting phosphor and red fluorescence powder, the pole of ultra-violet light-emitting two Pipe (also known as UV LED) collocation RGB fluorescent material, and it is more special when using ZnSe materials give out white light.For example, blue chip Wavelength is typically in 440-470nm, when the blue chip of different wave length is packaged together, will cause because blue light wavelength is inconsistent and Aberration be present in the white light for causing to project.

Utility model content

The purpose of this utility model is to provide a kind of White-light LED package structure, it is intended to solves different ripples in the prior art The problem of long LED chip can produce white light aberration when being packaged together.

In order to solve the above technical problems, the technical solution of the utility model is：A kind of White-light LED package structure is provided, wrapped Include the substrate for being connected into circuit, the fluorescent colloid located at the substrate surface, there is different wave length to be placed in the fluorescent colloid N number of LED chip, and be placed in the fluorescent colloid and for by each LED chip serial or parallel connection in the substrate It is more with bonding line, wherein, N >=2, each LED chip is collectively forming through white light beam after the fluorescent colloid Original beam.

Further, the White-light LED package structure also includes supporting plate, the supporting plate thereon plate face open up it is accommodating Groove, the substrate are layed in the storage tank groove bottom wall, and the fluorescent colloid is adapted with the storage tank.

Further, the groove sidewall of the storage tank is in horn-like, and its notch opens upward setting.

Further, the White-light LED package structure also includes reflector layer, and the reflector layer is affixed on the groove of the storage tank Side wall.

Further, the White-light LED package structure also includes die bond layer, and a surface is affixed on the base in the die bond layer Plate plate face, any LED chip are affixed on another surface of the die bond layer.

Further, the die bond layer is formed using after substrate described in die bond glue bond and any LED wafer Die bond layer.

Further, the fluorescent colloid is to be filled in described house after uniformly being mixed using organic packages glue and fluorescent material Groove and the fluorescent colloid formed.

Further, the substrate includes being connected into the positive electrode substrate of cathode circuit and is connected into the negative electrode substrate of cathode traces, The White-light LED package structure also includes the insulation board for being spaced the positive electrode substrate and the negative electrode substrate, the insulation board patch In the groove bottom wall of the storage tank, and two sides respectively with the edges of boards of the positive electrode substrate and the edges of boards pair of the negative electrode substrate Connect.

Further, the insulation board is using coating or the insulation board using bonding pressing and forming.

The utility model has the technical effect that relative to prior art：At least two LED chips are affixed on substrate, and passed through Bonding line by its serial or parallel connection on substrate surface, making it be connected into circuit, the wavelength of light neither phase caused by each LED chip Together, and the original beam that is collectively forming of at least two LED chips has the wavelength for producing light from any of which LED chip different again Wavelength period, then at least two LED chips and multiple bonding lines are packaged together by fluorescent colloid, now, by extremely After few two have the LED chip mixing of different wave length, caused white-light spectrum basic one after being encapsulated with phase co-wavelength LED chip Cause, that is, realize white light uniformity.

Brief description of the drawings

Fig. 1 is the front view for the White-light LED package structure that the utility model embodiment provides；

Fig. 2 is the sectional view of E-E along Fig. 1；

Fig. 3 is the blue light design sketch that the utility model embodiment provides；

Fig. 4 is the quality white light figure that the utility model embodiment provides；

Fig. 5 is that the mixed blue light wavelength that the utility model embodiment provides contrasts with the white LED spectrum of identical blue light wavelength Figure.

Label involved by above-mentioned accompanying drawing is detailed as follows：

Positive electrode substrate	10	Negative electrode substrate	20
				Fluorescent colloid	30	LED chip	40
Bonding line	50	First LED chip	40a
				Second LED chip	40b	Supporting plate	60
Storage tank	61	Die bond layer	70
				Insulation board	80	Chipset	40c
Substrate	90

Embodiment

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining The utility model, it is not used to limit the utility model.

It should be noted that when element is referred to as on " being fixed on " or " being arranged at " another element, it can directly exist On another element or it may be indirectly secured to or be arranged on another element by third member.When an element quilt Another element referred to as " is connected to ", it can be directly to another element or it may be indirect by third member It is connected on another element.

It should also be noted that, the orientation term such as left and right, upper and lower in the present embodiment, be only each other relative concept or Using the normal operating condition of product as reference, and should not be regarded as restrictive.

Below please refer to Fig. 1 to Fig. 5, the utility model provides a kind of White-light LED package structure, including is connected into circuit Substrate 90, the fluorescent colloid 30 located at the plate face of substrate 90, there is different wave length to be placed in N number of LED core in fluorescent colloid 30 Piece 40, and be placed in fluorescent colloid 30 and for by each serial or parallel connection of LED chip 40 in more bonding lines 50 of substrate 90, Wherein, N >=2, each LED chip 40 are collectively forming in the original beam through white light beam after fluorescent colloid 30.

At least two LED chips 40 are affixed on substrate 90, and by bonding line 50 by its serial or parallel connection in the plate of substrate 90 On face, it is set to be connected into circuit, the wavelength of light all differs caused by each LED chip 40, and at least two LED chips, 40 common shape Into original beam there is the different wavelength period of wavelength that light is produced from any LED chip 40 again, then pass through fluorescent colloid 30 will At least two LED chips 40 and multiple bonding lines 50 are packaged together, and now, have different wave length by least two After LED chip 40 mixes, caused white-light spectrum is basically identical after being encapsulated with phase co-wavelength LED chip 40, that is, realizes white light one Cause property.

Certainly, the LED chip 40 with identical wavelength period may be provided with multiple.

In the present embodiment, N=2, you can be divided into the first LED chip 40a and the second LED chip 40b, the first LED core Piece 40a is the first blue chip that can produce blue light afterwards, and wavelength value is A, and the second LED chip 40b is that can produce blue light afterwards Second blue chip, and wavelength value is B, A ≠ B, 440nm≤A≤470nm, 440nm≤B≤470nm, the two is all attached at base Plate 90, and the first LED chip 40a is electrically connected at substrate 90 by two bonding lines 50, the second LED chip 40b is also same Sample is electrically connected at substrate 90 by two bonding lines 50, and the first LED chip 40a and the second LED chip 40b are in parallel, And the first LED chip 40a and the second LED chip 40b can be independently controlled by whole optical circuit, adjusted.

First LED chip 40a and the second LED chip 40b are collectively forming chipset 40c.

In the present embodiment, as shown in figure 5,40d represent be two blue chips with phase co-wavelength combination.

Such as Fig. 3 blue light design sketch, i.e. the first LED chip 40a, the second LED chip 40b and the two be combined into chipset The blue spectrum comparison diagram that 40c three projects without fluorescent glue, as can be seen from Figure, in any wavelength value, chipset The energy value of 40c generation blue light produces the energy value of blue light between the first LED chip 40a and the second LED chip 40b produces indigo plant Between the energy value of light, but three's difference is still larger.

Such as Fig. 4 quality white light figure, i.e. the first LED chip 40a, the second LED chip 40b and the two be combined into chipset The white-light spectrum comparison diagram that 40c three projects through fluorescent glue, three produce quality white light and are closer to.

It is such as the white LED spectrum comparison diagram of Fig. 5 mixed blue light wavelength and identical blue light wavelength, i.e., identical from two wavelength LED chip 40 (combination is represented by 40d) and the different chipset 40c of two wavelength produce white-light spectrum comparison diagram, two Quality white light is essentially identical caused by person.

To sum up analyze, the quality white light that multiple LED chips 40 with different wave length produce by corresponding fluorescent glue The quality white light produced with single wavelength LED chip 40 or multiple LED chips 40 with phase co-wavelength by fluorescent glue Unanimously, white light LEDs implementation method is increased.

Further, White-light LED package structure also includes supporting plate 60, and plate face opens up storage tank to supporting plate 60 thereon 61, substrate 90 is layed in the groove bottom wall of storage tank 61, and fluorescent colloid 30 is adapted with storage tank 61.So, envelope is provided for white light LEDs Fill environment.Supporting plate 60 is using isolation material.

Further, the groove sidewall of storage tank 61 is in horn-like, and its notch opens upward setting.So, it is easy to More light beams project.

Further, White-light LED package structure also includes reflector layer (not shown), and reflector layer is affixed on storage tank 61 Groove sidewall.So, the brightness of white light LEDs is improved.

Further, White-light LED package structure also includes die bond layer 70, and a surface is affixed on the plate of substrate 90 in die bond layer 70 Face, any LED chip 40 are affixed on another surface of die bond layer 70.To fixed LED chip 40.

Further, die bond layer 70 is using the die bond formed after crystal-bonding adhesive adhesive base plate 90 and any LED chip 40 Layer 70.

Further, fluorescent colloid 30 be using being filled in storage tank 61 after organic packages glue and fluorescent material uniformly mixing and The fluorescent colloid 30 of formation.Wherein, fluorescent material can be green powder, rouge and powder, bloom, orange powder, according to the colour temperature demand for projecting white light Difference, the color of fluorescent material, or the proportioning of fluorescent material and organic packages glue can be adjusted.

In the present embodiment, while white light LEDs brightness is ensured, the use of the wavelength of LED chip 40 can be widened, is reduced The use species of fluorescent material, so as to improve the utilization rate of the production yield of white light LEDs and LED chip 40, improves because of LED chip 40 wave bands are different, fluorescent material it is identical and caused by aberration problem, finally while brightness, color is met, can effectively drop Low cost.

Further, substrate 90 includes being connected into the positive electrode substrate 10 of cathode circuit and is connected into the negative electrode substrate of cathode traces 20, White-light LED package structure also includes the insulation board 80 of interval positive electrode substrate 10 and negative electrode substrate 20, and insulation board 80 is affixed on accommodating The groove bottom wall of groove 61, and two sides are docked with the edges of boards of positive electrode substrate 10 and the edges of boards of negative electrode substrate 20 respectively.So, effectively keep away Exempt from positive electrode substrate 10 to be electrically connected with negative electrode substrate 20, cause each short circuit of LED chip 40 to burn out.

In the present embodiment, N number of LED chip 40 is all fixedly arranged on the plate face of negative electrode substrate 20, it is of course also possible to be fixedly arranged on positive pole The plate face of substrate 10.

In the present embodiment, the plate face area of negative electrode substrate 20 is more than the plate face area of positive electrode substrate 10.

Further, insulation board 80 is using coating or the insulation board 80 using bonding pressing and forming.

Preferred embodiment of the present utility model is these are only, it is all in this practicality not to limit the utility model All any modification, equivalent and improvement made within new spirit and principle etc., should be included in guarantor of the present utility model Within the scope of shield.

Claims (9)

1. a kind of White-light LED package structure, it is characterised in that including being connected into the substrate of circuit, located at the glimmering of the substrate surface Optical cement body, there is different wave length to be placed in N number of LED chip in the fluorescent colloid, and be placed in the fluorescent colloid simultaneously For by each LED chip serial or parallel connection in the more with bonding line of the substrate, wherein, N >=2, each LED chip is total to With formation in the original beam through white light beam after the fluorescent colloid.

2. White-light LED package structure as claimed in claim 1, it is characterised in that the White-light LED package structure also includes branch Frame plate, plate face opens up storage tank to the supporting plate thereon, and the substrate is layed in the storage tank groove bottom wall, the fluorescent glue Body is adapted with the storage tank.

3. White-light LED package structure as claimed in claim 2, it is characterised in that the groove sidewall of the storage tank in horn-like, And its notch opens upward setting.

4. White-light LED package structure as claimed in claim 2 or claim 3, it is characterised in that the White-light LED package structure also wraps Reflector layer is included, the reflector layer is affixed on the groove sidewall of the storage tank.

5. White-light LED package structure as claimed any one in claims 1 to 3, it is characterised in that the white-light LED encapsulation Structure also includes die bond layer, and a surface is affixed on the substrate surface in the die bond layer, and any LED chip is affixed on described solid Another surface of crystal layer.

6. White-light LED package structure as claimed in claim 5, it is characterised in that the die bond layer is to use die bond glue sticking The die bond layer formed after the substrate and any LED wafer.

7. White-light LED package structure as claimed in claim 2 or claim 3, it is characterised in that the fluorescent colloid is to use organic envelope The fluorescent colloid that dress glue and fluorescent material are filled in the storage tank and formed after uniformly mixing.

8. White-light LED package structure as claimed in claim 2 or claim 3, it is characterised in that the substrate includes being connected into cathode circuit Positive electrode substrate and be connected into the negative electrode substrates of cathode traces, the White-light LED package structure also includes being spaced the positive electrode substrate With the insulation board of the negative electrode substrate, the insulation board is affixed on the groove bottom wall of the storage tank, and two sides respectively with it is described just The edges of boards of the edges of boards of electrode substrate and the negative electrode substrate dock.

9. White-light LED package structure as claimed in claim 8, it is characterised in that the insulation board is using coating or used It is bonded the insulation board of pressing and forming.