CN106356439A - LED (Light Emitting Diode) packaging structure with adjustable color temperature - Google Patents
LED (Light Emitting Diode) packaging structure with adjustable color temperature Download PDFInfo
- Publication number
- CN106356439A CN106356439A CN201611027386.0A CN201611027386A CN106356439A CN 106356439 A CN106356439 A CN 106356439A CN 201611027386 A CN201611027386 A CN 201611027386A CN 106356439 A CN106356439 A CN 106356439A
- Authority
- CN
- China
- Prior art keywords
- led chip
- led
- light
- fluorescence coating
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Abstract
The invention discloses an LED (Light Emitting Diode) packaging structure with adjustable color temperature. The LED packaging structure comprises a packaging substrate and LED chips arranged on the packaging substrate, wherein the LED chips include a first LED chip and a second LED chip; a first fluorescent layer is covered on an upper end face of the first LED chip; a second fluorescent layer is covered on the packaging substrate and the second LED chip; the first fluorescent layer and the second fluorescent layer are in different color temperature; the light emitted by the first LED chip and the second LED chip only once passes by the fluorescent layer and then the white light is emitted, so that the problems of polarized light and reduced light quality can be solved; and the first LED chip and the second LED chip are uniformly staggered and arrayed on the packaging substrate, and the side walls of the bottoms of the first LED chip and the second LED chip are both wrapped with the second fluorescent layer, so that the decreasing of light quality caused by blue light leakage of the first LED chip and the second LED chip can be avoided, the uniform light can be acquired, and the light spot effect caused by adopting only one LED chip can be eliminated.
Description
Technical field
The invention belongs to led encapsulation field, especially relate to a kind of led encapsulating structure of adjustable color temperature.
Background technology
The method manufacturing the led chip of white light is: is directly covered with one on the blue light led disk of pre-fabricated electrode pad
Layer fluorescent film, the cleaved rear white light led chip monomer forming a grain, existing problems are: the bottom sides of white light led chip
Have blue leakage, cause light quality defect.When application led chip manufacturing becomes LED light source, in order to realize the colour temperature of LED light source
Adjustable, conventional technological means will be previously covered by packaging type led chip unit and bare led that the first fluorescence coating is formed
Chip unit arranges on base plate for packaging, be additionally provided with the second fluorescence coating cover above-mentioned packaging type led chip unit and one naked
Formula led chip unit.Using achieving photochromic concordance, uniform light and adjustable color in the LED light source of this kind of encapsulating structure,
But packaging type led chip unit complex manufacturing technology, and the light that sends of chip top and side is white light so that packaging type
After the white light that led chip unit is sent again passes by the fluorescent material in the middle of the second fluorescence coating, one kind can be sent partially yellow or partially green
Colour mixture light), reduce light quality, cause discomfort to user.
Content of the invention
The present invention provide adjustable color temperature led encapsulating structure energy effectively solving light secondary after fluorescence coating polarisation and
The technical problem of light quality decline, the technical solution used in the present invention is:
A kind of led encapsulating structure of adjustable color temperature, including base plate for packaging and be arranged at led chip on base plate for packaging,
Described led chip includes a led chip and the 2nd led chip, and the upper surface of a described led chip is coated with the first fluorescence
Layer, is additionally provided with and covers the second fluorescence coating on base plate for packaging and the 2nd led chip, wherein said first fluorescence coating and second glimmering
The colour temperature of photosphere is different.
Further, a described led chip and the 2nd led chip are uniformly staggered on the package substrate.
Further, the distance between a described led chip and the 2nd led chip are not more than a led chip or the
The twice of two led chip sizes.
Further, height on base plate for packaging for described second fluorescence coating is not less than a led chip in encapsulation
Height on substrate.
Further, described first fluorescence coating and the second fluorescence coating thickness on base plate for packaging maintains an equal level.
Further, described second fluorescence coating is not higher than the first fluorescence coating on base plate for packaging in the thickness on base plate for packaging
Thickness.
A led chip of the present invention passes through to the light sending of upper surface and projects after the first fluorescence coating and send white
Light, led chip sides are surrounded the second fluorescence coating, and the light that led chip sides send can after the second fluorescence coating
Obtain the white light of different-colour, the light that the 2nd led chip sends is through projecting after the second fluorescence coating and send white light；Avoid institute
State a led chip and the 2nd led chip secondary through fluorescence coating, solve the problems, such as the light quality decline leading to because of polarisation；
The side of the first led chip and the 2nd led chip bottom is all wrapped up by the second fluorescence coating, and the of a described led chip circumference
Two fluorescence coatings play the effect of protection the first led chip, it is to avoid the side of a led chip and the 2nd led chip bottom produces
The problem of light leakage；First led chip and the 2nd led chip interlock evenly distributed, and the light sending mixes and obtains uniformly
Light, eliminate on base plate for packaging light point effect during a kind of only led chip.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description are only this
Some bright embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also root
Obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the basic arrangement schematic diagram of the led encapsulating structure of adjustable color temperature of the present invention；
Fig. 2 is the structural representation of the cob of the led encapsulating structure using adjustable color temperature of the present invention；
Fig. 3 is the structural representation of the smd of the led encapsulating structure using adjustable color temperature of the present invention.
Specific embodiment
Purpose, technical scheme and advantage for making the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
And accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.
The specific embodiment of the present invention is described below in conjunction with the accompanying drawings.
As shown in figure 1, the led encapsulating structure of adjustable color temperature of the present invention includes base plate for packaging 1 and is arranged on encapsulation base
Led chip 2 on plate 1.Described led chip 2 includes a led chip 21 and the 2nd led chip 22, a led chip 21 He
2nd led chip 22 is uniformly staggered on base plate for packaging 1, between a described led chip 21 and the 2nd led chip 22
Distance the no more than the first led chip 21 or the twice of the 2nd led chip 22 size, the photochromic consistent and even light mixing sending, obtains
Obtain uniform white light.
The upper surface of a described led chip 21 is coated with the first fluorescence coating 3, on described led chip 22 and base plate for packaging 1
It is coated with described second fluorescence coating 4, wherein said first fluorescence coating 3 is different with the colour temperature of the second fluorescence coating 4, described second fluorescence
Layer 4 height on base plate for packaging 1 are not less than height on base plate for packaging 1 for the led chip 21.Preferably, described
One fluorescence coating 3 and the second fluorescence coating 4 thickness on base plate for packaging 1 maintains an equal level.
The material of described first fluorescence coating 3 and the second fluorescence coating 4 is mixed by transparent silica gel and fluorescent material, and described first
Fluorescence coating 3 is different with concentration in transparent silica gel for the fluorescent material in the second fluorescence coating 4, and the first fluorescence coating 3 and second of gained is glimmering
The colour temperature of photosphere 4 is different.
The upper surface of the first led chip 21 is only coated with the first fluorescence coating 3, the light warp that a led chip 21 sends upwards
White light is projected, the light that a led chip 21 side sends projects white light, institute after the second fluorescence coating 4 after crossing the first fluorescence coating 3
State that the white light that a led chip 21 projects upwards is different with the colour temperature of the white light emitted by side, the white light mixing of two kinds of colour temperatures
The white light of another kind of colour temperature can be obtained, eliminate light point effect during a kind of only led chip, there is more excellent illumination effect
Really.
Second fluorescence coating 4 is only coated with the 2nd led chip 22, the light that the 2nd led chip 22 sends is glimmering through second
White light is projected, it is to avoid the light that a led chip 21 and the 2nd led chip 22 send is because secondary through fluorescence coating after photosphere 4
Colour cast simultaneously leads to light quality decline.
Embodiment 1
As shown in Fig. 2 embodiment 1 is the adjustable color temperature cob using led encapsulating structure of the present invention, including cob substrate
5th, it is arranged on a led chip 21 and the 2nd led chip 22 on cob substrate 5, a described led chip 21 upper surface covers
There is the first fluorescence coating 3 (not shown), described second fluorescence coating 4 covers on cob substrate 5 and the 2nd led chip 22, wherein
Described first fluorescence coating 3 and the second fluorescence coating 4 thickness on cob substrate 5 maintains an equal level, and described first fluorescence coating 3 and second is glimmering
Photosphere 4 is different fluorescent materials, has different colour temperatures.When a led chip 21 and the 2nd led chip 22 are lighted, the
The light that one led chip 21 sends upwards is changed into white light after the first fluorescence coating 3 and projects, a led chip 21 bottom sides
Light and the 2nd led chip 22 project after being changed into having the white light of different-colour after the second fluorescence coating 4, form two kinds and have
The white light of different-colour.
A described led chip 21 and the 2nd led chip 22 are uniformly alternately arranged on cob substrate 5, and described first
The distance between led chip 21 and the 2nd led chip 22 are the twice of led chip 2, apart from little, make a described led chip 21
The light mixed light that projects with the 2nd led chip 22 simultaneously produces uniform light, by controlling a led chip 21 and the 2nd led core
Piece 22 has each independent drive signal, can each self-regulation drive signal intensity adjusting a described led chip 21 He
The colour temperature export ratio of the 2nd led chip 22, thus obtain the cob of adjustable color temperature.
Embodiment 2
As shown in figure 3, embodiment 2 is the adjustable color temperature smd using led encapsulating structure of the present invention, including led support
6, the led chip 21 on setting and led support 6 and the 2nd led chip 22, a described led chip 21 is coated with the
One fluorescence coating 3, is additionally provided with the second fluorescence coating 4 for covering the 2nd led chip 22 and filling led support 6 groove, wherein said
First fluorescence coating 3 is different with the thickness of the second fluorescence coating 4, and described first fluorescence coating 3 and the second fluorescence coating 4 are on led support 6
Highly fair.
In the present embodiment, a led chip 21 and the 2nd led chip 22 are connected into different driving circuit on led support 6 respectively,
First led chip 21 and the 2nd led chip 22 are inputted with different drive signals, obtains photochromic adjustable smd.
It should be noted that described embodiment is only a part of embodiment of the present invention, rather than whole enforcement
Example.Based on the embodiment in the present invention, those of ordinary skill in the art are obtained under the premise of not paying creative work
Every other embodiment, broadly falls into the scope of protection of the invention.
Claims (5)
1. the led encapsulating structure of a kind of adjustable color temperature, including base plate for packaging and be arranged at led chip on base plate for packaging, its
It is characterised by, described led chip includes a led chip and the 2nd led chip, the upper surface of a described led chip covers
There is the first fluorescence coating, be additionally provided with the second fluorescence coating covering on base plate for packaging and the 2nd led chip, wherein said first fluorescence
Layer is different with the colour temperature of the second fluorescence coating.
2. according to claim 1 the led encapsulating structure of adjustable color temperature it is characterised in that a described led chip and second
Led chip is uniformly staggered on the package substrate.
3. according to claim 2 described adjustable color temperature led encapsulating structure it is characterised in that a described led chip and
The distance between 2nd led chip is not more than the twice of a led chip or the 2nd led chip size.
4. according to claim 1 the led encapsulating structure of described adjustable color temperature it is characterised in that described second fluorescence coating exists
Height on base plate for packaging is not less than height on base plate for packaging for the led chip.
5. according to claim 1 the led encapsulating structure of adjustable color temperature it is characterised in that described first fluorescence coating and second
Thickness on base plate for packaging for the fluorescence coating maintains an equal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611027386.0A CN106356439A (en) | 2016-11-21 | 2016-11-21 | LED (Light Emitting Diode) packaging structure with adjustable color temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611027386.0A CN106356439A (en) | 2016-11-21 | 2016-11-21 | LED (Light Emitting Diode) packaging structure with adjustable color temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106356439A true CN106356439A (en) | 2017-01-25 |
Family
ID=57863276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611027386.0A Pending CN106356439A (en) | 2016-11-21 | 2016-11-21 | LED (Light Emitting Diode) packaging structure with adjustable color temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106356439A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108644630A (en) * | 2018-06-13 | 2018-10-12 | 宁波升谱光电股份有限公司 | A kind of patch type light modulation toning LED light and preparation method thereof |
| JP2020027814A (en) * | 2018-08-09 | 2020-02-20 | シチズン時計株式会社 | Led light-emitting device |
| WO2020118777A1 (en) * | 2018-12-10 | 2020-06-18 | 广东晶科电子股份有限公司 | Light emitting diode tube and manufacturing method therefor |
| CN111490038A (en) * | 2019-01-25 | 2020-08-04 | 蚌埠三颐半导体有限公司 | L ED package preparation method and L ED package |
| EP3905345B1 (en) * | 2018-12-27 | 2024-01-24 | Denka Company Limited | Light-emitting substrate, and lighting device |
| CN108644630B (en) * | 2018-06-13 | 2024-04-26 | 宁波升谱光电股份有限公司 | SMD dimming and color mixing LED lamp and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203351659U (en) * | 2013-07-31 | 2013-12-18 | 广州硅能照明有限公司 | Adjustable color temperature COB light source module |
| CN104851953A (en) * | 2014-02-13 | 2015-08-19 | 扬州艾笛森光电有限公司 | Dimmable LED packaging structure |
| CN105261613A (en) * | 2015-10-29 | 2016-01-20 | 广州硅能照明有限公司 | LED light source assembly and packaging method thereof |
| CN105336836A (en) * | 2015-10-29 | 2016-02-17 | 横店集团得邦照明股份有限公司 | Light color-variable LED structure |
| CN105977245A (en) * | 2016-07-18 | 2016-09-28 | 中山市立体光电科技有限公司 | Color-temperature-adjustable COB packaging structure and packaging method thereof |
-
2016
- 2016-11-21 CN CN201611027386.0A patent/CN106356439A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203351659U (en) * | 2013-07-31 | 2013-12-18 | 广州硅能照明有限公司 | Adjustable color temperature COB light source module |
| CN104851953A (en) * | 2014-02-13 | 2015-08-19 | 扬州艾笛森光电有限公司 | Dimmable LED packaging structure |
| CN105261613A (en) * | 2015-10-29 | 2016-01-20 | 广州硅能照明有限公司 | LED light source assembly and packaging method thereof |
| CN105336836A (en) * | 2015-10-29 | 2016-02-17 | 横店集团得邦照明股份有限公司 | Light color-variable LED structure |
| CN105977245A (en) * | 2016-07-18 | 2016-09-28 | 中山市立体光电科技有限公司 | Color-temperature-adjustable COB packaging structure and packaging method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108644630A (en) * | 2018-06-13 | 2018-10-12 | 宁波升谱光电股份有限公司 | A kind of patch type light modulation toning LED light and preparation method thereof |
| CN108644630B (en) * | 2018-06-13 | 2024-04-26 | 宁波升谱光电股份有限公司 | SMD dimming and color mixing LED lamp and preparation method thereof |
| JP2020027814A (en) * | 2018-08-09 | 2020-02-20 | シチズン時計株式会社 | Led light-emitting device |
| JP7178820B2 (en) | 2018-08-09 | 2022-11-28 | シチズン時計株式会社 | LED light emitting device |
| WO2020118777A1 (en) * | 2018-12-10 | 2020-06-18 | 广东晶科电子股份有限公司 | Light emitting diode tube and manufacturing method therefor |
| EP3905345B1 (en) * | 2018-12-27 | 2024-01-24 | Denka Company Limited | Light-emitting substrate, and lighting device |
| JP7430650B2 (en) | 2018-12-27 | 2024-02-13 | デンカ株式会社 | Phosphor substrates, light emitting substrates and lighting devices |
| CN111490038A (en) * | 2019-01-25 | 2020-08-04 | 蚌埠三颐半导体有限公司 | L ED package preparation method and L ED package |
| CN111490038B (en) * | 2019-01-25 | 2022-04-05 | 蚌埠三颐半导体有限公司 | Preparation method of LED package and LED package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5086641B2 (en) | LIGHT EMITTING DEVICE, BACKLIGHT AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME | |
| KR100946015B1 (en) | White led device and light source module for lcd backlight using the same | |
| JP5240603B2 (en) | White light source module, backlight unit and LCD display | |
| CN101939859B (en) | Light emitting apparatus and display apparatus having the same | |
| CN106356439A (en) | LED (Light Emitting Diode) packaging structure with adjustable color temperature | |
| CN203519974U (en) | Light-emitting assembly of backlight module and liquid crystal display device | |
| US7994530B2 (en) | Light emitting diode module | |
| CN102073090A (en) | Light guide plate and backlight module | |
| CN107180902A (en) | LED lamp bead and LED/light source | |
| CN105977245A (en) | Color-temperature-adjustable COB packaging structure and packaging method thereof | |
| CN106501994A (en) | A kind of quantum dot light emitting device, backlight module and display device | |
| TW201320406A (en) | Improved white LED packaging structure for improving light mixing effect | |
| CN105304793A (en) | Insulated liquid packaged LED and preparation method thereof | |
| TW201143160A (en) | Light-emitting device | |
| CN107369742A (en) | A kind of high S/P values white light LEDs of high color rendering index (CRI) and its preparation method and application | |
| CN103797596B (en) | Light emitting module | |
| CN206805067U (en) | Backlight module and display device | |
| CN101840987A (en) | White-light emitting device and the white light source module of using this white-light emitting device | |
| US7598663B2 (en) | Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component | |
| CN203733842U (en) | LED capable of improving light-emitting rate | |
| CN102709280A (en) | Chip on board (COB) integrated light source module | |
| CN101877375A (en) | White LED with high color rendering property | |
| CN101740679B (en) | Fluorescent powder packaging of light-emitting diode | |
| CN213583778U (en) | COB packaging structure and LED lamp | |
| CN208753314U (en) | A kind of encapsulating structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170125 |
|
| WD01 | Invention patent application deemed withdrawn after publication |