CN202058783U - LED encapsulated reflecting cup - Google Patents

LED encapsulated reflecting cup Download PDF

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Publication number
CN202058783U
CN202058783U CN2011201521169U CN201120152116U CN202058783U CN 202058783 U CN202058783 U CN 202058783U CN 2011201521169 U CN2011201521169 U CN 2011201521169U CN 201120152116 U CN201120152116 U CN 201120152116U CN 202058783 U CN202058783 U CN 202058783U
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CN
China
Prior art keywords
reflector
taper hole
reflecting cup
led
phosphor powder
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011201521169U
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Chinese (zh)
Inventor
罗小兵
郑怀
余珊
陈明祥
刘胜
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Huazhong University of Science and Technology
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Huazhong University of Science and Technology
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Priority to CN2011201521169U priority Critical patent/CN202058783U/en
Application granted granted Critical
Publication of CN202058783U publication Critical patent/CN202058783U/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Abstract

The utility model discloses an LED encapsulated reflecting cup, wherein the structure of the reflecting cup is a taper hole shape or a taper hole combination of two layers of different taper angles, the inner wall surface of the single layer taper hole shaped reflecting cup and the horizontal plane form an included angle alpha, the upper and lower taper hole wall surfaces of the double layer taper hole structure and the horizontal plane form included angles beta 1 and beta 2, and the shape of the taper hole can be a taper shaped structure, such as circular truncated cone, four-prismoid, and five-prismoid, etc. A phosphor powder layer with uniform thickness is formed in a reflecting cup with a special taper angle, so as to achieve the purpose of shape protection coating; or a glue material without containing phosphor powder is firstly added into the reflecting cup with different taper angles or with a double layer taper hole structure, then a phosphor powder glue is also added into the reflecting cup, so as to form remote coating; and the in the process of remote coating, the geometry shape of the phosphor powder layer can be accurately controlled through the reflecting cup. The technical scheme of the LED encapsulated reflecting cup has the advantages of being simple, being low in cost, and efficiently controlling the geometry shape of the LED phosphor powder.

Description

A kind of LED encapsulation reflector
Technical field
The utility model belongs to the LED encapsulation technology, relates to a kind of reflector in the LED encapsulation, is applied to especially that fluorescent material conformal in the LED encapsulation applies and away from the control of the phosphor powder layer pattern that applies.
Background technology
LED (Light Emitting Diode) is a kind of light emitting semiconductor device of making based on P-N junction electroluminescence principle, have advantages such as electro-optical efficiency height, long service life, environmental protection and energy saving, volume be little, be described as the 21 century green illumination light source, if can be applied to the traditional lighting field and will obtain very obvious energy-saving effect, this is significant now what be becoming tight global energy day.Along with the breakthrough that with the nitride is the third generation semi-conducting material technology of representative, semiconductor lighting industry based on high-power and high-luminance light-emitting diode (LED) is risen rapidly in the whole world, just becoming semi-conductor photoelectronic industry new growth engines, and causing a revolution in the traditional lighting field.LED has begun to be used widely in a lot of fields because its unique advantages, is thought the main developing direction of following lighting technology to have huge market potential by industry.
Large power white light LED is normally mixed by two wavelength light (blue light+sodium yellow) or three-wavelength light (blue light+green light+red light).The white light LEDs that extensively adopts is to form by blue led chip (GaN) and yellow fluorescent powder (YAG or TAG) at present.How much patterns of fluorescent material have a strong impact on the important optical properties such as light extraction efficiency, colour temperature, spatial color uniformity of LED in LED encapsulation; The phosphor powder layer pattern of realizing ideal in the LED encapsulation process is most important.
The most frequently used fluorescent material coating method of LED encapsulation is by point gum machine the phosphor gel in the syringe to be coated in around the led chip, and fluorescent material presents ball crown type, usually can occur yellow hot spot in the use of reality.In order to improve the spatial color inhomogeneities that the fluorescent material spot printing brings and to improve the light extraction efficiency of LED, the conformal of fluorescent material applies and is comparatively desirable coating method among the LED away from coating.Realize that at present the conformal paint-on technique is generally comparatively complicated, there are problems such as environmental protection in some technology, and cost is higher, so it is extremely important in the LED encapsulation to seek the coating method that a kind of technology is simple, low-cost, fluorescent material is evenly distributed.Both at home and abroad, confirm effectively to improve the light extraction efficiency of LED by optical analog, and proposed multiple desirable fluorescent material geometry away from applying to the studying of fluorescent material among the LED away from coating; But these work all only be by the means of simulation or before encapsulation the phosphor powder layer by the Mold Making design geometries, the mature technology that applicable industry LED encapsulation also do not occur at present, so seek a kind of simply, LED fluorescent material is most important equally for the LED encapsulation away from paint-on technique cheaply.
Summary of the invention
The purpose of this utility model is to provide a kind of LED encapsulation reflector, and it can be used for the LED encapsulation, in the even coating of fluorescent powder silica gel with in away from coating the pattern of silica gel is controlled effectively.
A kind of LED encapsulation reflector that the utility model provides, it is characterized in that, reflector is individual layer taper hole shape or two-layer ladder taper hole shape, and individual layer taper hole shape reflector wall becomes angle α with horizontal plane, and two-layer ladder taper hole structure taper hole wall up and down becomes angle to be respectively β with horizontal plane 1, β 2α, β 1, β 2Span be 0 °～90 °.
The utility model utilizes this reflector to add simple mode such as syringe point glue or spraying by point gum machine and just can realize with the identical equally distributed effect of fluorescent material of other complicated conformal paint-on techniques by the cone angle of reflector and the design and the processing of shape; This reflector also can be used to away from applying, and forms how much patterns of fluorescent material of favorable optical performance.Because only the structure to the reflector among the LED designs, the coating method of fluorescent material is identical with the extensive LED fluorescent material spot printing that adopts in the industry at present, so can be applied to large-scale LED encapsulation in the industry soon, important optical properties such as the light extraction efficiency of lifting led light source, colour temperature, spatial color uniformity.
Description of drawings
Fig. 1 is the structural representation of reflector, and wherein Fig. 1 (a) is an individual layer taper hole shape structure, and Fig. 1 (b) is two-layer ladder taper hole shape structure;
Fig. 2 is phosphor gel contact angle schematic diagram on flat board
Fig. 3 is the first embodiment schematic diagram;
Fig. 4-8 is the process schematic diagram of second embodiment;
Fig. 9-10 is the process schematic diagram of the 3rd embodiment.
Symbol description among the figure
1LED reflector 2LED chip 3 solder layers
4 gold thread 5LED supports 6 fill the syringe of phosphor gel
7 fluorescent material glue-lines 8 fill the syringe 9 glue material layers of glue material
Embodiment
Shown in Fig. 1 (a) and (b), the structure of reflector is individual layer taper hole shape or two-layer ladder taper hole shape, and individual layer taper hole shape reflector wall becomes angle α with horizontal plane, and two-layer ladder taper hole structure taper hole wall up and down becomes angle to be respectively β with horizontal plane 1, β 2Wherein the shape of taper hole can be pyramidal structures such as round platform, truncated rectangular pyramids, five terrace with edges.
Employed reflector material can make metal, plastic material or other material.
The cone angle of the reflector that is adopted (is α, β 1, β 2) scope be 0 °～90 °.
The internal face of reflector is a reflector layer, and the material of reflector layer can be silver or other reflectorized material.
Reflector can be by punching press, the line cutting, and casting waits other machining mode to realize.
The method of reflector control phosphor powder layer geometry in the LED encapsulation is:
Conformal applies: fluorescent material is added in the glue material, and mix, regulate the ratio between fluorescent material and the glue material, matched proportion density is the phosphor gel of 0.01g/ml～5.0g/ml, after finishing fixed L ED chip and circuit be connected operation, add in reflector with alternate manners such as spot printing or sprayings and to be pre-mixed even phosphor gel, the concentration of fluorescent material is in the concentration range of above-mentioned configuration; In order to reach the effect that conformal applies, the cone angle of the reflector of employing must equate that wherein contact angle depends on the material that glue material and reflector internal face adopt with phosphor gel contact angle on the reflector inwall.The concrete phosphor gel contact angle method on the reflector inwall of obtaining is, phosphor gel is dropped on the flat board of reflector inner-wall material, measure tangentially and the angle between the flat board by high-power microscope at drop outer surface and board joint synapsis liquid level, this angle is phosphor gel contact angle on the reflector inwall, angle θ as shown in Figure 2.After phosphor gel splashes in the reflector, in reflector, will form the uniform phosphor powder layer of thickness, reach the effect that conformal applies, wherein the degree of depth that the thickness of phosphor powder layer can be from tens microns (as 70 μ m) to reflector in the reflector is different for the phosphor powder layer thickness of different optical performance requirement; Can control the phosphor powder layer that the amount that splashes into the phosphor gel in the reflector in the syringe realizes concrete thickness again by calculating the phosphor gel volume of the phosphor powder layer thickness that expection reaches in the reflector in advance; Install the encapsulation that lens and injecting glue operation are finished LED additional by follow-up.
Away from coating: fluorescent material is added in the glue material, and mix, regulate fluorescent material and glue material amount, matched proportion density is the phosphor gel of 0.01g/ml～5.0g/ml, after finishing fixed L ED chip and circuit is connected operation, in reflector, add the glue material earlier, in the individual layer taper hole reflector, the thickness of glue material layer can be from tens microns to reflector the degree of depth, control the thickness of glue material layer by the amount of the glue material that adds; In the reflector of two-layer ladder taper hole structure, the amount of glue material is less than the volume of the lower cone hole of reflector, realizes the thickness of concrete glue material layer by the glue material amount of control adding reflector cup.Add phosphor gel again, the concentration of the fluorescent material in the phosphor gel is in the concentration range of above-mentioned configuration; The thickness of phosphor powder layer can be from tens microns (as 70 μ m) to reflector the degree of depth, different for the phosphor powder layer thickness of different optical performance requirement, the amount that adds by the control phosphor gel realizes the phosphor powder layer of concrete thickness.But the amount of the phosphor gel in the adding reflector should be controlled in the following scope: require fluorescent material glue-line upper bound face to be lower than the reflector end face in the individual layer taper hole reflector, the amount that adds phosphor gel in the reflector of two-layer ladder taper hole structure makes taper hole on the interface is arranged on the phosphor powder layer, but fluorescent material glue-line upper bound face is lower than the end face of reflector epicone pore structure.Wherein the cone angle of reflector is determined according to the shape of the fluorescent material glue-line of the contact angle of glue material on reflector and requirement realization.In the reflector of individual layer taper hole shape structure, be convex when requiring upper and lower interface away from fluorescent material in applying, the cone angle of reflector is less than the contact angle of glue material on the reflector inwall, and cone angle is more less than contact angle, and the curvature at convex interface is big more; Upper and lower interface away from fluorescent material in applying is smooth when requiring, and the cone angle of reflector equals the contact angle of glue material and reflector inwall; When requiring the upper and lower interface away from fluorescent material in applying is spill, and the cone angle of reflector is greater than the contact angle of glue material and reflector inwall, and cone angle gets over greater than contact angle, and the curvature at spill interface is big more.In the reflector of two-layer ladder taper hole shape structure, be convex when requiring following interface away from fluorescent material in applying, the cone angle of the lower cone hole of reflector is less than the contact angle of glue material and reflector inwall; Following interface away from fluorescent material in applying is smooth when requiring, and the cone angle of the lower cone hole of reflector equals the contact angle of glue material and reflector inwall; When requiring the following interface away from fluorescent material in applying is spill, and the cone angle of the lower cone hole of reflector is greater than the contact angle of glue material and reflector inwall; When requiring the last interface away from fluorescent material in applying is convex, and the cone angle of the last taper hole of reflector is less than the contact angle of glue material and reflector inwall; Last interface away from fluorescent material in applying is smooth when requiring, and the cone angle of the last taper hole of reflector equals the contact angle of glue material and reflector inwall; When requiring the last interface away from fluorescent material in applying is spill, and the cone angle of the last taper hole of reflector is greater than the contact angle of glue material and reflector inwall.The concave, convex phosphor powder layer interface curvature that requirement reaches in the above-mentioned two-layer ladder taper hole reflector is big more, and the cone angle of reflector and the difference between the contact angle should be big more.Phosphor gel will will form in the reflector away from coating, realize protruding, recessed or smooth fluorescent material glue-line by the cone angle of above-mentioned control reflector; Install the encapsulation that lens and injecting glue operation are finished LED additional by follow-up.
Being used for the encapsulated LED chip and can being quaternary materials such as binary material such as GaN or A1GaNP forms and other chip.
Fluorescent material in the phosphor gel can be the fluorescent material that all LED encapsulation such as YAG and TAG are adopted.
It can be that glue materials such as silica gel, epoxy resin and liquid glass are formed that the configuration phosphor gel is used the glue material.
The concentration of fluorescent material can be 0.01g/ml～5.0g/ml in the phosphor gel.
Glue material and phosphor gel are transferred to approach in the reflector and can be dripped by syringe and be coated with spraying.
This method goes for LED packing forms such as stent-type, chip on board, array and system in package.
Below by by embodiment the utility model being described in further detail, but following examples only are illustrative, and protection range of the present utility model is not subjected to the restriction of these embodiment.
Embodiment 1
Referring to Fig. 3, design and processing have the reflector 1 of cone angle, reflector be shaped as round platform, the reflector material is a metallic copper, in reflector internal face sputtering silver, forms reflective surface, reflector internal face and horizontal plane angle are 30 °; Led chip 2 is fixed on the center of reflector bottom by scolder 3, and gold thread 4 links to each other led chip with led support 5, form the circuit of connection.By point gum machine the phosphor gel in the syringe 6 is splashed in the reflector, the glue material in the phosphor gel is a silica gel, and fluorescent material is YAG fluorescent material, and the amount that adds the phosphor gel of reflector is 1/2 of a reflector volume.Phosphor gel 7 reaches poised state in reflector after, put into baking box and solidify, the conformal of finishing fluorescent material applies operation.Above-mentioned experimentation carries out repeatedly, adopts the phosphor gel of variable concentrations in each experimentation, and fluorescent material concentration is respectively 0.01g/ml, 0.2g/ml, 1.0g/ml, 2.0g/ml, 5.0g/ml; Each time experiment reaches identical phosphor powder layer pattern, as shown in Figure 2, forms the phosphor powder layer (as shown in Figure 3) that is evenly distributed on interface on the led chip in reflector.
Embodiment 2
Referring to Fig. 4-8, design and processing have the reflector 1 of cone angle, reflector be shaped as truncated rectangular pyramids, the material of reflector is a metallic copper, in the internal face sputtering silver of reflector, forms reflective surface, wall of cup and horizontal direction angle are respectively α in the reflector 1=10 °, α 2=30 °, α 3=60 °,
α 4=0 °, α 5=90 °; Led chip 2 is fixed on the center of reflector bottom by scolder 3, and gold thread 4 links to each other led chip with led support 5, form the circuit of connection.By point gum machine the glue material that does not contain fluorescent material in the syringe 8 is splashed in the reflector, the glue material is a silica gel, and the amount of glue material is 1/3 of a reflector volume, glue material 9 reaches poised state in reflector after, puts into baking box and solidifies; By point gum machine the phosphor gel in the syringe 6 is splashed in the reflector of solidification of silicon glue-line 7, the glue material that adopts in the phosphor gel is a silica gel, and the amount of phosphor gel is 1/2 of a reflector volume, puts into baking box after reaching balance, finishes away from the operation that applies.In the reflector of above-mentioned different cone angle, above-mentioned experimentation carries out repeatedly, adopts the phosphor gel of variable concentrations in each experimentation, and fluorescent material concentration is respectively 0.01g/ml, 0.2g/ml, 1.0g/ml, 2.0g/ml, 5.0g/ml; By above-mentioned experimentation in reflector, realize fluorescent material away from coating, and the phosphor gel of different fluorescent material concentration forms identical phosphor powder layer pattern in reflector, shown in Fig. 4-8.In the reflector of different cone angle, the pattern difference of phosphor powder layer: when cone angle is α 1In the time of=10 °, in reflector, form the phosphor powder layer (as Fig. 4) of upper and lower surface, work as α away from led chip, projection 2In the time of=30 °, form the smooth phosphor powder layer (as Fig. 5) of upper and lower surface, work as α 3In the time of=60 °, form the phosphor powder layer (as Fig. 6) of upper and lower surface, work as α near led chip, depression 4=0 ° does not promptly have reflector to carry out the LED encapsulation, and the convex curvature that forms the phosphor powder layer upper and lower surface compares α 1Big (as Fig. 7) in the time of=10 °; The same α that works as 5In the time of=90 °, can form the phosphor powder layer of upper and lower surface depression in reflector, concave curvature compares α 3Big (as the Fig. 8) that forms in the time of=60 °.
Embodiment 3
Referring to Fig. 9-10, design and processing have the reflector 1 of cone angle, and reflector is made up of two taper hole structures of different cone angle up and down, and the shape of reflector is a round platform, and the material of reflector is a metallic copper, in the internal face sputtering silver of reflector, and the formation reflective surface.Interior wall of cup of the upper and lower taper hole of reflector and horizontal direction angle are β among Fig. 9 1=60 °, β 2=30 °, interior wall of cup of the upper and lower taper hole of reflector and horizontal direction angle β among Figure 10 1=20 °, β 2=10 °; Led chip 2 is fixed on the center of reflector bottom by scolder 3, and gold thread 4 links to each other led chip with led support 5, form the circuit of connection.By point gum machine the glue material that does not contain fluorescent material in the syringe 8 is splashed in the reflector, glue material material is a silica gel, and the amount of glue material is 1/2 of a reflector lower cone hole volume, glue material 9 reaches poised state in reflector after, puts into baking box and solidifies; Phosphor gel in the syringe 6 is splashed in the reflector of solidification of silicon glue-line 7 by point gum machine again, the glue material that adopts in the phosphor gel is a silica gel, the amount of control phosphor gel, make half position of the supreme taper hole degree of depth in interface on the phosphor powder layer, put into baking box after reaching balance, finish in two-layer ladder taper hole away from coating.In the reflector of two kinds of above-mentioned different cone angle, above-mentioned experimentation carries out repeatedly, and the fluorescent material concentration of use is respectively 0.01g/ml, 0.2g/ml, 1.0g/ml, 2.0g/ml, 5.0g/ml; In above-mentioned reflector, realize fluorescent material away from coating, and different fluorescent material concentration phosphor gel reaches identical phosphor powder layer pattern at reflector, shown in Fig. 9-10.As shown in Figure 9, at β 1And β 2Be respectively and form in the reflector of 60 ° and 30 ° that to go up the interface be spill, the smooth phosphor powder layer in following interface; As shown in figure 10, at β 1And β 2Be respectively in the reflector of 20 ° and 10 ° and form the phosphor powder layer that upper and lower interface is convex.
The above is preferred embodiment of the present utility model, but the utility model should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of finishing under the spirit disclosed in the utility model or revise, all fall into the scope of the utility model protection.

Claims (3)

1. a LED encapsulates reflector, it is characterized in that, LED encapsulation reflector is individual layer taper hole shape or two-layer ladder taper hole shape, and individual layer taper hole shape reflector wall becomes angle α with horizontal plane, and two-layer ladder taper hole structure taper hole wall up and down becomes angle to be respectively β with horizontal plane 1, β 2, α, β 1, β 2Span be 0 ° ~ 90 °.
2. LED encapsulation reflector according to claim 1 is characterized in that described taper hole shape is round platform, truncated rectangular pyramids or five terrace with edges.
3. LED encapsulation reflector according to claim 1 is characterized in that its employed material is metal, plastic material or other material.
CN2011201521169U 2011-05-13 2011-05-13 LED encapsulated reflecting cup Expired - Fee Related CN202058783U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102227011A (en) * 2011-05-13 2011-10-26 华中科技大学 Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same
CN103165793A (en) * 2011-12-15 2013-06-19 新世纪光电股份有限公司 Reflection element and light emitting diode packaging device
CN110265530A (en) * 2014-01-29 2019-09-20 亮锐控股有限公司 The superficial reflex device cup for phosphor-converted LED filled with sealant
WO2021004090A1 (en) * 2019-07-11 2021-01-14 成都辰显光电有限公司 Color conversion assembly, display panel and manufacturing method
CN113825943A (en) * 2019-03-11 2021-12-21 亮锐有限责任公司 Light extraction bridge in a cup

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102227011A (en) * 2011-05-13 2011-10-26 华中科技大学 Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same
CN103165793A (en) * 2011-12-15 2013-06-19 新世纪光电股份有限公司 Reflection element and light emitting diode packaging device
CN110265530A (en) * 2014-01-29 2019-09-20 亮锐控股有限公司 The superficial reflex device cup for phosphor-converted LED filled with sealant
CN113825943A (en) * 2019-03-11 2021-12-21 亮锐有限责任公司 Light extraction bridge in a cup
WO2021004090A1 (en) * 2019-07-11 2021-01-14 成都辰显光电有限公司 Color conversion assembly, display panel and manufacturing method

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