CN104682156A - Potting process method of high-density electrical connector - Google Patents
Potting process method of high-density electrical connector Download PDFInfo
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- CN104682156A CN104682156A CN201410805479.6A CN201410805479A CN104682156A CN 104682156 A CN104682156 A CN 104682156A CN 201410805479 A CN201410805479 A CN 201410805479A CN 104682156 A CN104682156 A CN 104682156A
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- glue
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- electric connector
- terminal
- electrical connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
Abstract
The invention relates to a potting process method of a high-density electrical connector. According to the potting process, an appropriate potting adhesive is selected, and the potting process that a metal wire is in adhesive picking matching with blowing equipment to blow the adhesive is adopted; the potting process is accurately controlled, so as to pot the high-density electrical connector without cavities, and the requirement of high reliability of an installation product of the high-density electrical connector is satisfied; tests show that by using the potting process, the installation quality of the high-density electrical connector can be increased, and firm fixing of pin terminals is guaranteed; according to the potting process, the potting of the high-density electrical connector is realized without bubbles, and the insulating property between the terminals and the high reliability in installation are guaranteed; the potting quality is increased. The potting process can be applied to potting the electrical connector of which the pin spacing is less than 2 mm.
Description
Technical field
The present invention relates to a kind of pouring method of high density electrical connector, belong to electric connector encapsulation technology field.
Background technology
For the small-sized electrical connector of receiving that pin-pitch is 0.635mm, the method for crimping can only be adopted to carry out dress connection.With tape insulation body locking device in the crimp connector of routine unlike, high density crimp type electric connector due to pin-pitch close, need the embedding carrying out insulating cement after being assembled by crimp, thus crimp is fixed, make to meet insulating requirements between each crimping point simultaneously.Dosing technology is completely different from electric connector assembly technology in the past,
Owing to receiving, small-sized electrical connector hood space is little, and the density of pin is comparatively large, and glue should avoid the generation in bubble and cavity in potting process.Be mixed with bubble or cavity in the embedding colloid of solidification, not only affect product appearance quality, the more important thing is the electric property and mechanical performance that affect product.Due to the existence in bubble and cavity, be no matter the internal stress in colloid or external stress, all make it can not continuously, Transmit evenly, cause stress concentrating at bubble and cavity place, easily crack or ftracture, making embedding failed.Therefore, for receiving the embedding of small-sized electrical connector, emphasis solves its bubble-free embedding.
Summary of the invention
The object of the invention is to the above-mentioned deficiency overcoming prior art, a kind of pouring method of high density electrical connector is provided, this pouring method selects suitable casting glue, and adopt wire to choose glue to coordinate blowing apparatus to blow the dosing technology of glue, by accurately controlling dosing technology, realize high density electrical connector without empty embedding, with meet high density electrical connector dress joint product highly reliable requirement.
Above-mentioned purpose of the present invention is mainly achieved by following technical solution:
A pouring method for high density electrical connector, step is as follows:
Step (one), be installed to down on embedding clamp the butt end of base of electric connector, the docking end face of base of electric connector and the bottom surface of embedding clamp are developed, and base of electric connector is fixed by the lock-screw tightening embedding clamp two ends;
Step (two), with air pressure gun to base of electric connector preheating 5s ~ 10s, air pressure gun temperature 100 DEG C ~ 110 DEG C, is connected terminal with wire, is then loaded by terminal in the installing hole of base of electric connector insulator by row;
Step (three), on the insulator of base of electric connector, break one deck primer, terminal is fixed;
Step (four), terminal leveling, concrete grammar is: taken off from embedding clamp by base of electric connector, observe the height of docking end face upper terminal, if there is rugged terminal, again base of electric connector is installed on embedding clamp, the terminal that adjustment is uneven, makes it flush with other terminals;
Step (five), the base of electric connector after terminal leveling is fixed on embedding clamp, upward, embedding clamp lies in a horizontal plane on work top in encapsulating chamber, is arranged by the wire that each row is connected with terminal, the row of making separates with the wire of row, exposes space between row and row;
Step (six), use wire picking glue, along the horizontally-arranged direction of terminal from while move to another side, move while blow the glue on wire with de-bubble air pressure gun, glue is made evenly to insert in gap between wire and encapsulating chamber, and blow glue face with de-bubble air pressure gun, make glue face smooth, and glue face height flush with encapsulating chamber port; The blowing mouth of described de-bubble air pressure gun is elongated cylindrical, and cylindrical cross-section diameter is 2-3mm;
Step (seven), absolute ethyl alcohol is adopted to be cleaned out by the cull beyond the encapsulating chamber of wire and base of electric connector;
Step (eight), the base of electric connector of having filled with glue is at room temperature solidified 18 ~ 26 hours, taken out by base of electric connector afterwards, embedding completes.
In the pouring method of above-specified high density electric connector, in step (three), bottoming glue glue used is DG-3S glue, and the mass ratio of joining glue is A:B=1.5:1.
In the pouring method of above-specified high density electric connector, in step (six), glue used is STYCAST 2651MM, and curing agent is CATALYST 9, and both quality proportionings are: STYCAST 2651MM:CATALYST 9=100:7.
In the pouring method of above-specified high density electric connector, after glue prepares, centrifuge need be used to carry out bubble removing, centrifuge rotates 2 ~ 5 minutes with 1000 ~ 3000RPM speed.
In the pouring method of above-specified high density electric connector, in step (three), the thickness of primer is 0.5mm ~ 1mm.
In the pouring method of above-specified high density electric connector, in step (four) during the rugged terminal of adjustment, should first use air pressure gun to base of electric connector preheating, the time is 5s ~ 10s, primer and base of electric connector insulator are softened, then terminal is adjusted.
In the pouring method of above-specified high density electric connector, glue face allows lower than encapsulating chamber port 0.5mm ~ 1mm in step (six), and the height that glue exceeds encapsulating chamber port of climbing on wire is no more than 1mm.
In the pouring method of above-specified high density electric connector, the high density electrical connector pedestal of base of electric connector to be pin-pitch be 0.635mm.
The present invention compared with prior art has following beneficial effect:
(1), the present invention adopts centrifuge to glue bubble removing before embedding, can remove bubble in glue fast and effectively; STYCAST 2651MM is adopted to coordinate the epoxy pouring sealant of curing agent CATALYST 9, the viscosity of this glue is lower, between the pin of high density electrical connector, there is good mobility, adopt wire to choose glue simultaneously, blowing apparatus is used glue to be blown into the process at embedding position, effectively can fill the gap in encapsulation cavity, achieve the bubble-free embedding of high density electrical connector, improve embedding quality;
(2), the present invention is by the good casting glue of selecting liquidity, and by flow when the stirring before embedding, de-bubble, embedding and the accurate control to dosing technology, effectively reduce the bubble in casting glue, achieve the bubble-free embedding of high density electrical connector, improve embedding quality;
(3), first the present invention adopt the mode of bottoming glue, is first fixed by terminal, and is beneficial to terminal leveling, the embedding of the laggard trip link actuator of terminal leveling, ensure that the height of terminal is consistent, improve embedding quality further.
(4), the present invention adopts the de-bubble air pressure gun of particular design in the encapsulating stage, the blowing mouth of de-bubble air pressure gun is elongated cylindrical, the diameter of cylindrical cross-section circle is 2-3mm, the air pressure gun air-out of this structural design is strong, wind speed is high, with strong points, the glue in encapsulating chamber can be made to flow, and blow the bubble in breaking glue solution;
(5), test proves to use pouring method of the present invention can improve the dress connection quality of high density electrical connector, fixedly securing of guarantee pin terminals; This dosing technology achieves the bubble-free embedding of high density electrical connector, ensure that the high reliability of insulation property between terminal and dress connection; The present invention can promote the embedding being applicable to pin-pitch and being less than the electric connector of 2mm.
Accompanying drawing explanation
Fig. 1 is that in the present invention, base of electric connector loads embedding clamp schematic diagram;
Fig. 2 is that in the present invention, terminal loads base of electric connector schematic diagram;
Fig. 3 is primer embedding schematic diagram in the present invention;
Fig. 4 is embedding effect schematic diagram of the present invention;
Fig. 5 is de-bubble air pressure gun outlet structure for air schematic diagram of the present invention;
Fig. 6 is that in the present invention, sample does thermal cycle experiment temperature profile.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
The present invention, can space well between filling high density degree electrical connector pins when embedding by the good casting glue of selecting liquidity.Adopt the mode of bottoming glue, first terminal is fixed, and is beneficial to terminal leveling.The embedding of the laggard trip link actuator of terminal leveling, adopt the casting glue of iron wire picking bubble removing, then use de-bubble air pressure gun that the glue on iron wire is blown into embedding position, iron wire moves along the horizontally-arranged gap of terminal while use de-bubble air pressure gun to blow glue, this dosing technology can make that glue is successively even carries out embedding to connector cavity, make embedding without dead angle, non-embedding cavity can not be produced and affect embedding quality.
The concrete implementation step of the present invention is as follows:
(1), for base of electric connector in the present invention loads embedding clamp schematic diagram; The butt end of base of electric connector 1 is installed to down on embedding clamp 2, the docking end face of base of electric connector 1 and the bottom surface of embedding clamp 2 are developed, base of electric connector 1 is fixed by the lock-screw 3 tightening embedding clamp 2 two ends, make base of electric connector 1 non-loosening, be illustrated in figure 1 base of electric connector in the present invention and load embedding clamp schematic diagram.In the present embodiment, the pin-pitch of base of electric connector 1 is 0.635mm.
(2), with air pressure gun to base of electric connector 1 preheating 5s ~ 10s, all use air pressure gun preheating, air pressure gun temperature 100 DEG C ~ 110 DEG C before entering many every sockets of plug of counting, in the present embodiment, warm-up time is 10s, and air pressure gun temperature is 110 DEG C.Terminal 4 is connected with wire 5, then terminal 4 is loaded in the installing hole of base of electric connector 1 insulator by row, after often loading a row, loading instrument is used to withstand terminal 4 outer one by one, press terminal 4 vertically downward, make terminal 4 insert the bottom connecing device pedestal 1, be illustrated in figure 2 terminal in the present invention and load base of electric connector schematic diagram.
(3), on the insulator of base of electric connector 1, break one deck primer 7, terminal 4 is fixed, is illustrated in figure 3 primer embedding schematic diagram in the present invention.Be specially: first with wind blowing gun to base of electric connector 1 preheating, warm-up time is 10s, then a small amount of glue is stained with iron wire, along terminal 4 row direction from while move to another side, move while the glue on iron wire is blown in the base bottom surface around terminal 4 uniformly with de-bubble air pressure gun, blow a row and blow another row again, until whole pedestal 1 bottom surface covers one deck glued membrane uniformly; The thickness of primer 7 is 0.5mm ~ 1mm, is 0.5mm in the present embodiment.After having broken primer, base of electric connector 1 is put into curing oven together with embedding clamp 2, the temperature of solidification is 80 DEG C, and curing time is 30 minutes.
Primer 7 Embedding Material is DG-3S glue, join glue ratio A:B=1.5:1, dust or impurity should be prevented to be mixed into joining in glue process, after glue prepares, centrifuge need be used to carry out bubble removing, centrifuge rotates 3 minutes with 1000 ~ 3000RPM speed, the glue of cooperation must not standing time long, should be finished in 30 minutes.
(4), terminal leveling, concrete grammar is: taken off from embedding clamp 2 by base of electric connector 1, observe the height of docking end face upper terminal 4, if there is rugged terminal, again base of electric connector 1 is installed on embedding clamp 2, the terminal 4 that adjustment is uneven, makes it flush with other terminals 4.When adjusting rugged terminal 4, should first use hair-dryer to base of electric connector 1 preheating, the time is 5s ~ 10s, primer and base of electric connector 1 insulator is softened, then adjusts terminal 4.
(5), the base of electric connector 1 after terminal leveling is fixed on embedding clamp 2, upward, embedding clamp 2 lies in a horizontal plane on work top in encapsulating chamber 6, is managed by each row's wire 5 with tweezers, the row of making separates with the wire 5 of row, exposes space between row and row.
(6), with wire picking glue (adopting thin wire in the present embodiment), along the horizontally-arranged direction of terminal 4 from while move to another side, move while blow the glue on wire with de-bubble air pressure gun, glue is made evenly to insert in gap between wire 5 and encapsulating chamber 6, glue face is blown with de-bubble air pressure gun after encapsulating amount reaches requirement, make glue face smooth, and glue face height flush with encapsulating chamber 6 port; Be illustrated in figure 4 embedding effect schematic diagram of the present invention.The present invention's glue used is STYCAST2651MM, and curing agent is CATALYST 9, and both quality proportionings are: STYCAST 2651MM:CATALYST 9=100:7.After glue prepares, centrifuge need be used to carry out bubble removing, and centrifuge rotates 3 minutes with 1000 ~ 3000RPM speed, the glue of cooperation must not standing time long, should be finished in 30 minutes.
Be illustrated in figure 5 de-bubble air pressure gun outlet structure for air schematic diagram of the present invention, the blowing mouth 8 of de-bubble air pressure gun is elongated cylindrical, cylindrical cross-section diameter is 2-3mm, the air pressure gun air-out of this structural design is strong, wind speed is high, with strong points, and the glue in encapsulating chamber can be made to flow, and the bubble blown in breaking glue solution, make glue face smooth.
The forceps tips that reason line uses should be mellow and full, and corner angle abate, in order to avoid puncture or scratch wire insulation; Should avoid pullling wire during reason line too quickly, in order to avoid cause damage to wire;
Glue should be filled out and fill with whole encapsulating chamber, and wire 5 must not exist glue-free cavity between row and row;
On the wire noting in operation avoiding glue to be bonded at outside encapsulating chamber and other non-encapsulating positions;
Glue face height is with encapsulating chamber port for flushing benchmark, and glue face is smooth and transition natural; Glue face allows lower than encapsulating chamber port 0.5mm ~ 1mm; On wire 5 climb glue exceed the height of encapsulating chamber port must not more than 1mm.
(7), absolute ethyl alcohol is adopted to be cleaned out by the cull beyond the encapsulating chamber 6 of wire 5 and base of electric connector 1.
(8), by the base of electric connector 1 of having filled with glue at room temperature solidify 24 hours, taken out by base of electric connector 1 afterwards, embedding completes.
(9), according to following technical requirement, electric performance test is carried out to testpieces.
(1), to wire carry out checking, contact conducting resistance should be less than 1 Europe.
(2), with Insulation Resistance Tester (table) to measure in same wire between mutual disjunct contact, whether these contacts and all insulation resistances with it between related plug-in unit shell and between they and shielding bark graft point meet index request.Under ambient environment, insulation resistance should meet the requirement of 250V/200M Ω.
(3), with Hi-pot Tester add 250V/AC voltage between supply terminals each in wire, require within 30 seconds, do not puncture.
Carry out test respectively to testpieces to prove, adopt the wire electric performance test of dosing technology of the present invention qualified.
(10), environmental test: experimental condition is as follows:
(1), sinusoidal vibration
Frequency range 10Hz ~ 200Hz, acceleration: 147m/s2 (15g), three mutually perpendicular each directions are repeated 2 times, and sweep speed is 2oct/min.
Random vibration test condition
Random experiment is carried out in three mutually perpendicular directions, and each random experiment time is 2min.
(2), shock test
Shock Environmental Condition
(3), thermal cycling test
Thermal cycling test condition and will ask for an interview to Fig. 6, often organizing testpieces, to carry out 6.5 circulations (+125 DEG C ~-65 DEG C) is altogether a circulation.
Outward appearance, electrical property inspection are carried out to the testpieces completing environmental test:
(a), well-tended appearance.
(b), according to step (nine) electric performance test index, electric performance test is carried out to testpieces, test result is qualified.
Test proves to use pouring method of the present invention can improve the dress connection quality of high density electrical connector, ensures fixedly securing of pin terminals; This dosing technology achieves the bubble-free embedding of high density electrical connector, ensure that the high reliability of insulation property between terminal and dress connection.
The present invention can promote the embedding being applicable to pin-pitch and being less than the electric connector of 2mm.
The above; be only the embodiment of the best of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
The content be not described in detail in specification of the present invention belongs to the known technology of professional and technical personnel in the field.
Claims (8)
1. a pouring method for high density electrical connector, is characterized in that step is as follows:
Step (one), the butt end of base of electric connector (1) is installed on embedding clamp (2) down, the bottom surface of the docking end face of base of electric connector (1) and embedding clamp (2) is developed, and base of electric connector (1) is fixed by the lock-screw (3) tightening embedding clamp (2) two ends;
Step (two), with air pressure gun to base of electric connector (1) preheating 5s ~ 10s, air pressure gun temperature 100 DEG C ~ 110 DEG C, terminal (4) is connected with wire (5), then terminal (4) is loaded by row in the installing hole of base of electric connector (1) insulator;
Step (three), on the insulator of base of electric connector (1), break one deck primer (7), terminal (4) is fixed;
Step (four), terminal leveling, concrete grammar is: taken off from embedding clamp (2) by base of electric connector (1), observe the height of docking end face upper terminal (4), if there is rugged terminal, again base of electric connector (1) is installed on embedding clamp (2), the terminal (4) that adjustment is uneven, makes it flush with other terminals (4);
Step (five), the base of electric connector (1) after terminal leveling is fixed on embedding clamp (2), encapsulating chamber (6) upward, embedding clamp (2) lies in a horizontal plane on work top, the wire (5) that each row is connected with terminal (4) is arranged, the row of making separates with the wire (5) of row, exposes space between row and row;
Step (six), use wire picking glue, along the horizontally-arranged direction of terminal (4) from while move to another side, move while blow the glue on wire with de-bubble air pressure gun, glue is made evenly to insert in gap between wire (5) and encapsulating chamber (6), and blow glue face with de-bubble air pressure gun, make glue face smooth, and glue face height flush with encapsulating chamber (6) port; The blowing mouth (8) of described de-bubble air pressure gun is for elongated cylindrical, and cylindrical cross-section diameter is 2-3mm;
Step (seven), absolute ethyl alcohol is adopted to be cleaned out by the cull beyond the encapsulating chamber (6) of wire (5) and base of electric connector (1);
Step (eight), the base of electric connector (1) of having filled with glue is at room temperature solidified 18 ~ 26 hours, taken out by base of electric connector (1) afterwards, embedding completes.
2. the pouring method of a kind of high density electrical connector according to claim 1, is characterized in that: in described step (three), bottoming glue (7) glue used is DG-3S glue, and the mass ratio of joining glue is A:B=1.5:1.
3. the pouring method of a kind of high density electrical connector according to claim 1, it is characterized in that: in described step (six), glue used is STYCAST 2651MM, curing agent is CATALYST 9, and both quality proportionings are: STYCAST 2651MM:CATALYST 9=100:7.
4. the pouring method of a kind of high density electrical connector according to Claims 2 or 3, is characterized in that: after described glue prepares, and centrifuge need be used to carry out bubble removing, and centrifuge rotates 2 ~ 5 minutes with 1000 ~ 3000RPM speed.
5. the pouring method of a kind of high density electrical connector according to claim 1, is characterized in that: in described step (three), the thickness of primer (7) is 0.5mm ~ 1mm.
6. the pouring method of a kind of high density electrical connector according to claim 1, it is characterized in that: in described step (four) during adjustment rugged terminal (4), should first use air pressure gun to base of electric connector (1) preheating, time is 5s ~ 10s, primer and base of electric connector (1) insulator are softened, then terminal (4) is adjusted.
7. the pouring method of a kind of high density electrical connector according to claim 1, it is characterized in that: glue face allows lower than encapsulating chamber (6) port 0.5mm ~ 1mm in described step (six), the height that glue exceeds encapsulating chamber (6) port of climbing on wire (5) is no more than 1mm.
8. the pouring method of a kind of high density electrical connector according to claim 1, is characterized in that: described base of electric connector (1) for pin-pitch be the high density electrical connector pedestal of 0.635mm.
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| CN201410805479.6A CN104682156B (en) | 2014-12-19 | 2014-12-19 | A kind of pouring method of high density electrical connector |
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| CN105261913A (en) * | 2015-10-30 | 2016-01-20 | 北京卫星制造厂 | Tail-cover-free embedding process of electric connector and testing method |
| CN105261862A (en) * | 2015-10-15 | 2016-01-20 | 沈阳兴华航空电器有限责任公司 | Positioning device for micro rectangular electric connector potting |
| CN105281180A (en) * | 2015-11-04 | 2016-01-27 | 北京新立机械有限责任公司 | Electric connector encapsulating device and application method thereof |
| CN105514665A (en) * | 2016-01-08 | 2016-04-20 | 沈阳兴华航空电器有限责任公司 | Technological method for encapsulating micro-rectangular jack electric connector |
| CN105680274A (en) * | 2016-01-08 | 2016-06-15 | 沈阳兴华航空电器有限责任公司 | Filling and sealing technique for stranded elastic contact pin micro-rectangular electric connector |
| CN106304827A (en) * | 2016-10-08 | 2017-01-04 | 西安西光精细化工有限公司 | A kind of anti high overload electronic unit dosing technology |
| CN107785764A (en) * | 2016-08-31 | 2018-03-09 | 南京晨光集团有限责任公司 | A kind of electric connector fixing device for dosing technology |
| CN107991346A (en) * | 2017-11-27 | 2018-05-04 | 南京越博动力系统股份有限公司 | A kind of silicon gel embedding and the method for detection circuit plate |
| CN110545630A (en) * | 2019-09-06 | 2019-12-06 | 中国科学院长春光学精密机械与物理研究所 | circuit board embedment solidification equipment |
| CN111431005A (en) * | 2020-04-22 | 2020-07-17 | 上海航天电子通讯设备研究所 | Rectangular electric connector encapsulating equipment and encapsulating method |
| US11894649B2 (en) | 2020-10-30 | 2024-02-06 | Amphenol Corporation | Electrical connector and method of making the same |
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| CN106304827A (en) * | 2016-10-08 | 2017-01-04 | 西安西光精细化工有限公司 | A kind of anti high overload electronic unit dosing technology |
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| CN107991346A (en) * | 2017-11-27 | 2018-05-04 | 南京越博动力系统股份有限公司 | A kind of silicon gel embedding and the method for detection circuit plate |
| CN110545630A (en) * | 2019-09-06 | 2019-12-06 | 中国科学院长春光学精密机械与物理研究所 | circuit board embedment solidification equipment |
| CN111431005A (en) * | 2020-04-22 | 2020-07-17 | 上海航天电子通讯设备研究所 | Rectangular electric connector encapsulating equipment and encapsulating method |
| US11894649B2 (en) | 2020-10-30 | 2024-02-06 | Amphenol Corporation | Electrical connector and method of making the same |
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