CN106304827B - High-overload-resistant electronic component encapsulating process - Google Patents
High-overload-resistant electronic component encapsulating process Download PDFInfo
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- CN106304827B CN106304827B CN201610874803.9A CN201610874803A CN106304827B CN 106304827 B CN106304827 B CN 106304827B CN 201610874803 A CN201610874803 A CN 201610874803A CN 106304827 B CN106304827 B CN 106304827B
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract
The invention discloses a high overload resistant electronic component encapsulating process, which belongs to the field of electronic component encapsulating, and comprises process preparation, process test and operation procedures, wherein the process test comprises the following steps: recording the temperature and humidity of the operation room; cleaning the test mold; uniformly coating a release agent; fully mixing the black material and the white material to form a test potting material, and injecting the test potting material into a test mold; the invention determines parameters of preheating time, stirring speed, curing temperature and the like of product encapsulation in advance through a scientific test method, improves encapsulation yield and quality, ensures that components in the electronic cabin are not influenced by conditions of external temperature, humidity, impact, vibration and the like, and realizes stable and reliable work of the encapsulated electronic cabin.
Description
Technical Field
The invention relates to the field of electronic component encapsulation, in particular to an anti-high-overload electronic component encapsulation process.
Background
Electronic components in electronic products generally adopt a potting process, and the electronic components including modules such as inductance coils, cable joints, power supplies and the like or circuit boards are potted into a whole through hard foam materials, so that the durability and reliability of the electronic products are improved. In the prior art, the traditional encapsulation process lacks early-stage process preparation and process test links, important parameters in the encapsulation process are estimated based on experience, and the encapsulation quality and the finished product rate are greatly influenced by parameter estimation based on experience because the characteristics of encapsulation materials can change along with the change of the external environment. Especially in some extreme environments, the change range of environmental factors such as temperature, humidity, impact, vibration and the like is large, and the quality of the encapsulation process directly influences the working state and the service life of the electronic components.
Disclosure of Invention
In view of the above, the invention provides a high overload resistant electronic component encapsulation process, parameters such as preheating time, stirring speed, stirring time, curing temperature and the like of product encapsulation are determined in advance through a scientific test method, encapsulation yield and quality are improved, components in an electronic cabin are not affected by conditions such as external temperature, humidity, impact, vibration and the like, the capacity of the components in the electronic cabin for resisting extreme environments is improved, and stable and reliable work of the encapsulated electronic cabin is realized.
The invention solves the problems through the following technical means:
the encapsulating process of the electronic component with high overload resistance is characterized by comprising a process test and an operation procedure,
the process test comprises the following steps:
1) cleaning a test mould in an operation room, uniformly coating a release agent on the test mould, and recording the weight of the test mould and the temperature and humidity of the operation room;
2) placing the experimental mold coated with the release agent into an oven for preheating, and recording the preheating time and the preheating temperature;
3) respectively weighing 59-61 g of white material and 59-61 g of black material, mixing the white material and the black material 1-2 min before the preheating of the experimental mold is finished, stirring at a high speed to form a test potting material, and recording the stirring time and the stirring speed when the white material and the black material are mixed;
4) injecting the test potting material into the preheated test mold, and observing and recording the milky white time of the test potting material;
5) after the test potting material is naturally foamed, putting the test potting mold into an oven for heating and curing, and observing and recording curing time and curing temperature;
6) taking the cured test encapsulation mold out of the oven, naturally cooling to room temperature, forming a test product in the encapsulation mold by the injected test encapsulation material, and taking the test product out of the test encapsulation mold;
7) counting the temperature value and the humidity value in the operating room in the steps 1) to 6) to prepare a temperature change table and a humidity change table in the operating room;
8) measuring the weight of the test article and the skinning thickness of the test article when all the change values in the temperature change table are not higher than 3 ℃ and all the change values in the humidity change table are not higher than 10%;
9) when the weight of the test product is 78-88 g and the skinning thickness of the test product is less than 0.5mm, obtaining a qualified test product;
10) recording the average temperature of the operation room, the average humidity of the operation room, the preheating time, the preheating temperature, the milk-white time, the stirring speed, the curing time and the curing temperature in the steps 1) to 6) corresponding to the preparation of the qualified test product;
the operation program comprises the following steps:
11) cleaning an electronic cabin to be encapsulated and sealed and a mould, fastening a wire harness of the electronic cabin, embedding the wire harness into a groove of the electronic cabin, and recording the weight of the electronic cabin;
12) adjusting the temperature and the humidity of the operating room by the air conditioner to be the average temperature and the average humidity of the operating room recorded in the step 10);
13) combining the electronic cabin uniformly coated with the separating agent and the mold uniformly coated with the release agent to form a potting mold, putting the potting mold into an oven, and preheating according to the preheating time and the preheating temperature recorded in the step 10);
14) respectively weighing 64-66 g of white material and 64-66 g of black material, stirring the white material and the black material according to the stirring time and the stirring speed recorded in the step 10) to form a potting material 1-2 min before the preheating of the potting mold is finished;
15) injecting the potting material into a preheated potting mold according to a specified time, and sealing an injection opening of the potting mold, wherein the specified time is less than or equal to the milky white time recorded in the step 10);
16) after the potting material is naturally foamed, putting the potting mold into the oven, and heating and curing according to the curing time and the curing temperature recorded in the step 10);
17) taking the cured encapsulation mold out of the oven, naturally cooling to room temperature, disassembling the encapsulation mold, taking out the encapsulated electronic cabin from the encapsulation mold, cleaning leftover materials of the encapsulated electronic cabin, recording the weight of the encapsulated electronic cabin, and calculating the weight increase value of the encapsulated electronic cabin;
18) and when the weight increase value of the encapsulated electronic cabin is 100-120 g, obtaining the qualified encapsulated electronic cabin.
Further, in the step 8), when all the change values in the temperature change table are higher than 3 ℃ and/or the values in the humidity change table are higher than 10%, adjusting the temperature and humidity of the operating room by the air conditioner, and performing the steps 1) to 7) again;
further, the step 9) further comprises: when the weight of the test product is less than 78g or more than 88g and/or the skinning thickness is more than or equal to 0.5mm, the values of the preheating time, the preheating temperature, the stirring time, the stirring speed, the curing time and the curing temperature are adjusted within the adjustment range, and the steps 1) to 8) are repeated according to the adjusted values until a qualified test product is produced.
Further, the temperature and humidity adjusting ranges of the operating room are respectively 21-27 ℃ and 40-70%
The adjusting ranges of the preheating time and the preheating temperature are respectively 30-90 min and 35-45 ℃;
the adjusting ranges of the stirring time and the stirring speed are 15-35 s and 2000-4000 r/min respectively;
the curing time and the curing temperature are adjusted within the ranges of 3-5 hours and 55-70 ℃.
Further, when the process test is carried out for the first time, the numerical values of the preheating time, the preheating temperature, the stirring time, the stirring speed, the curing time and the curing temperature are respectively set to be 30min, 35 ℃, 15s, 2000r/min, 3h and 55 ℃;
and when the process test is carried out again each time, increasing the values of the preheating time and the preheating temperature, or the stirring time and the stirring speed, or the curing time and the curing temperature by 20 percent based on the original values in a regulating range.
Further, the white material is composite polyether, and the black material is polyisocyanate.
Further, the method also comprises a process preparation before the process test is started, wherein the process preparation comprises the following steps:
starting a ventilation device, and recording the temperature and humidity of an operating room after the ventilation device works stably;
when the temperature of the operation room is 21-27 ℃ and the humidity is 40-70%, the process preparation is completed.
Furthermore, the separating agent is a silicon rubber separating agent which is uniformly coated on the circuit board of the electronic cabin.
The encapsulating process of the high overload resistant electronic component has the following beneficial effects:
the invention provides a high-overload-resistant electronic component encapsulating process, which improves encapsulating yield and quality by reasonably setting process preparation, process test and operation procedures, particularly defines parameters such as preheating time, stirring speed, curing temperature and the like of product encapsulation in advance by a scientific test method in a process test stage, improves encapsulating yield and quality, ensures that components in an electronic cabin are not influenced by conditions such as external temperature, humidity, impact, vibration and the like, and realizes stable and reliable work of the electronic cabin after encapsulation.
Drawings
Fig. 1 is a flow chart of a high overload resistant electronic component potting process provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, the invention provides a high overload resistant electronic component potting process, which comprises a process test and an operation procedure,
the process test comprises the following steps:
1) cleaning a test mould in an operation room, uniformly coating a release agent on the test mould, and recording the weight of the test mould and the temperature and humidity of the operation room;
2) placing the experimental mold coated with the release agent into an oven for preheating, and recording the preheating time and the preheating temperature;
3) respectively weighing 59-61 g of white material and 59-61 g of black material, mixing the white material and the black material 1-2 min before the preheating of the experimental mold is finished, stirring at a high speed to form a test potting material, and recording the stirring time and the stirring speed when the white material and the black material are mixed;
4) injecting the test potting material into the preheated test mold, and observing and recording the milky white time of the test potting material;
5) after the test potting material is naturally foamed, putting the test potting mold into an oven for heating and curing, and observing and recording curing time and curing temperature;
6) taking the cured test encapsulation mold out of the oven, naturally cooling to room temperature, forming a test product in the encapsulation mold by the injected test encapsulation material, and taking the test product out of the test encapsulation mold;
7) counting the temperature value and the humidity value in the operating room in the steps 1) to 6) to prepare a temperature change table and a humidity change table in the operating room;
8) measuring the weight of the test article and the skinning thickness of the test article when all the change values in the temperature change table are not higher than 3 ℃ and all the change values in the humidity change table are not higher than 10%;
9) when the weight of the test product is 78-88 g and the skinning thickness of the test product is less than 0.5mm, obtaining a qualified test product;
10) recording the average temperature of the operation room, the average humidity of the operation room, the preheating time, the preheating temperature, the milk-white time, the stirring speed, the curing time and the curing temperature in the steps 1) to 6) corresponding to the manufactured qualified test product.
In the actual operation process, values of humidity, temperature, test product weight, product appearance, preheating time, preheating temperature, cream time, stirring speed, curing time and curing temperature in an operation room are recorded in detail, and encapsulation parameters are determined according to recorded data. In the process test stage, the operating procedure can be performed only after all test results are approved by the craftsman for signature.
The operation program comprises the following steps:
11) cleaning an electronic cabin to be encapsulated and sealed and a mould, fastening a wire harness of the electronic cabin, embedding the wire harness into a groove of the electronic cabin, and recording the weight of the electronic cabin;
specifically, the electronic cabin to be encapsulated is a cabin-shaped structure consisting of a circuit board, a wire harness and a fixing bracket of the wire harness;
12) adjusting the temperature and the humidity of the operating room by the air conditioner to be the average temperature and the average humidity of the operating room recorded in the step 10);
13) combining the electronic cabin uniformly coated with the separating agent and the mold uniformly coated with the release agent to form a potting mold, putting the potting mold into an oven, and preheating according to the preheating time and the preheating temperature recorded in the step 10);
14) respectively weighing 64-66 g of white material and 64-66 g of black material, stirring the white material and the black material according to the stirring time and the stirring speed recorded in the step 10) to form a potting material 1-2 min before the preheating of the potting mold is finished;
15) injecting the potting material into a preheated potting mold according to a specified time, and sealing an injection opening of the potting mold, wherein the specified time is less than or equal to the milky white time recorded in the step 10);
16) after the potting material is naturally foamed, putting the potting mold into the oven, and heating and curing according to the curing time and the curing temperature recorded in the step 10);
17) taking the cured encapsulation mold out of the oven, naturally cooling to room temperature, disassembling the encapsulation mold, taking out the encapsulated electronic cabin from the encapsulation mold, cleaning leftover materials of the encapsulated electronic cabin, recording the weight of the encapsulated electronic cabin, and calculating the weight increase value of the encapsulated electronic cabin;
18) and when the weight increase value of the encapsulated electronic cabin is 100-120 g, obtaining the qualified encapsulated electronic cabin.
In the actual operation process, an operator needs to wear the anti-static work clothes and the work cap, and the wrist of the operator is connected with the release lead and the static release lead is grounded. When the quality of the encapsulated electronic cabin is detected, whether the appearance of the encapsulated electronic cabin meets the requirements of encapsulation technical conditions needs to be checked, and if the appearance of the encapsulated electronic cabin does not meet the requirements, the encapsulated electronic cabin needs to be filled and encapsulated according to an operating program. Meanwhile, whether the material is accumulated in the center hole is checked visually, and the electronic cabin is detected according to cabin encapsulation technical conditions after encapsulation.
It should be noted that, when the electronic cabin is combined with the mold, the wiring harness is arranged at the mold outlet, and the exhaust holes are arranged on the front row of the mold and are installed upwards.
Further, in the step 8), when all the variation values in the temperature variation table are higher than 3 ℃ and/or the values in the humidity variation table are higher than 10%, the temperature and the humidity of the operating room are adjusted by the air conditioner, and the steps 1) to 7) are performed again.
Further, the step 9) further comprises: when the weight of the test product is less than 78g or more than 88g and/or the skinning thickness is more than or equal to 0.5mm, the values of the preheating time, the preheating temperature, the stirring time, the stirring speed, the curing time and the curing temperature are adjusted within the adjustment range, and the steps 1) to 8) are repeated according to the adjusted values until a qualified test product is produced.
Further, the temperature and humidity adjusting ranges of the operating room are respectively 21-27 ℃ and 40-70%
The adjusting ranges of the preheating time and the preheating temperature are respectively 30-90 min and 35-45 ℃;
the adjusting ranges of the stirring time and the stirring speed are 15-35 s and 2000-4000 r/min respectively;
the curing time and the curing temperature are adjusted within the ranges of 3-5 hours and 55-70 ℃.
Further, when the process test is carried out for the first time, the numerical values of the preheating time, the preheating temperature, the stirring time, the stirring speed, the curing time and the curing temperature are respectively set to be 30min, 35 ℃, 15s, 2000r/min, 3h and 55 ℃;
and when the process test is carried out again each time, increasing the values of the preheating time and the preheating temperature, or the stirring time and the stirring speed, or the curing time and the curing temperature by 20 percent based on the original values in a regulating range.
In the actual operation process, when the process test is carried out for the first time, the preheating time and the preheating temperature are respectively set to be 30min and 35 ℃; the stirring time and the stirring speed are respectively set to be 15s and 2000 r/min; the curing time and the curing temperature were set to 3h and 55 ℃ respectively.
When the test product of the first process test is unqualified, the process test needs to be carried out again, and when the process test is carried out for the second time, the preheating time and the preheating temperature need to be increased by 20 percent based on the original values in the adjusting range. Specifically, during the second process test, the preheating time and the preheating temperature are respectively adjusted to 36min and 42 ℃, and the remaining parameters are consistent with those in the first process test.
When the test product of the second process test is unqualified, the process test needs to be carried out again, and when the process test is carried out for the third time, the stirring time and the stirring speed need to be increased by 20 percent based on the original values in the adjustment range. Specifically, during the third process test, the stirring time and the stirring rate are respectively adjusted to 18s and 2400r/min, and the remaining parameters are kept consistent with those in the second process test.
When the test product of the third process test fails, the process test needs to be carried out again, and when the process test is carried out for the fourth time, the curing time and the curing temperature need to be increased by 20 percent based on the original values in the adjusting range. Specifically, in the fourth process test, the curing time and the curing temperature are respectively adjusted to be 3.6h and 66 ℃, and the residual parameters are consistent with those in the third process test.
And analogizing in turn until the test product is qualified, and recording the corresponding operating room temperature, operating room humidity, preheating time, preheating temperature, milk-white time, stirring speed, curing time and curing temperature when the test product is qualified.
Specifically, the step 18) further includes: checking whether the encapsulated electronic cabin meets the requirements of encapsulation technical conditions, if not, repairing the surface of the encapsulated electronic cabin according to the encapsulation technical conditions, and if the weight increase value of the repaired electronic cabin is less than 100g, re-performing the repairing and encapsulation on the repaired encapsulated electronic cabin according to the steps 11) to 17).
In the actual operation process, whether the appearance of the encapsulated electronic cabin meets the requirements of encapsulation technical conditions is checked, and if the appearance of the encapsulated electronic cabin does not meet the requirements, the encapsulated electronic cabin needs to be subjected to filling and encapsulation according to an operation program.
Further, the white material is composite polyether, and the black material is polyisocyanate.
The electronic cabin to be encapsulated needs to be stored in a 30-40 ℃ heat preservation box. The white material is easy to react with water, so that the white material is required to be tightly sealed, a barrel cover is screwed after the white material is used to prevent the foaming agent from overflowing and water vapor from entering, the white material is stored in a place which is dark, dry and cool, the quality guarantee period of the white material is 6 months, the quality guarantee period of the black material is 12 months, and the white material is required to be timely sealed after each use. In actual operation, an operator should take a protective tool, and if the skin carelessly contacts black materials or white materials, the operator should timely wipe the black materials or the white materials with acetone and clean the black materials or the white materials. In the operation process, the requirements are strictly met in technical conditions for encapsulating electronic cabins and standards for inspecting and accepting encapsulated electronic cabin materials in factories.
Further, the method also comprises a process preparation before the process test is started, wherein the process preparation comprises the following steps:
starting a ventilation device, and recording the temperature and humidity of an operating room after the ventilation device works stably;
when the temperature of the operation room is 21-27 ℃ and the humidity is 40-70%, the process preparation is completed.
Specifically, a ventilation device, an anti-static facility, an electric heating blast oven, a stirrer, an electronic balance and a stopwatch are arranged on the site of the filling and sealing operation room. Wherein, the operating temperature of electric heat blast box is: the room temperature is 250 ℃, the stirrer is an infinitely variable speed stirrer, and the speed is 2000-4000 r/min. It should also be prepared in the process preparation link: 2 conductive rubber pads (0.5 m by 1 m), antistatic working clothes, acetone, a release agent and a polyethylene plastic cup.
Furthermore, the separating agent is a silicon rubber separating agent which is uniformly coated on the circuit board of the electronic cabin.
Specifically, the silicone rubber separating agent is a stress releasing material, and is uniformly coated on a circuit board of the electronic cabin, so that the potting material is separated from the potting components, the stress effect of the potting material on the components is avoided, and the later-stage component maintenance and detection are facilitated.
Example two
Based on the encapsulation process of the high overload resistant electronic component, provided by the invention, the encapsulation of the electronic cabin of the 156A type product is completed:
firstly, entering a process preparation link:
starting a ventilation device, and recording the temperature and humidity of an operating room after the ventilation device works stably;
the temperature of the operation room is ensured to be 21-27 ℃ and the humidity is ensured to be 40-70%.
And then, entering a process test link.
The encapsulating parameters of the 156A-type product electronic cabin are determined by process tests as follows:
preheating time is 36min, preheating temperature is 42 ℃, stirring time is 18s, stirring speed is 2400r/min, curing time is 3.6h and curing temperature is 66 ℃. Specifically, according to the parameters, 65g of white material and 65g of black material are respectively weighed to carry out a process test, and the final test product has a weight of 80g and meets the test requirements.
Secondly, the operation procedure is completed according to the parameters, so that the qualified 156A type product encapsulated electronic cabin can be produced. Specifically, according to the parameters, 65g of white material and 65g of black material are respectively weighed and operated, and finally the weight of the encapsulated electronic cabin is 110g, so that the qualified standard of the product is met.
The invention provides a high-overload-resistant electronic component encapsulating process, which improves encapsulating yield and quality by reasonably setting process preparation, process test and operation procedures, particularly defines parameters such as preheating time, stirring speed, curing temperature and the like of product encapsulation in advance by a scientific test method in a process test stage, improves encapsulating yield and quality, ensures that components in an electronic cabin are not influenced by conditions such as external temperature, humidity, impact, vibration and the like, and realizes stable and reliable work of the electronic cabin after encapsulation.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (5)
1. The encapsulating process of the electronic component with high overload resistance is characterized by comprising a process test and an operation procedure,
the process test comprises the following steps:
1) cleaning a test mould in an operation room, uniformly coating a release agent on the test mould, and recording the weight of the test mould and the temperature and humidity of the operation room;
2) placing the experimental mold coated with the release agent into an oven for preheating, and recording the preheating time and the preheating temperature;
3) respectively weighing 59-61 g of white material and 59-61 g of black material, mixing the white material and the black material 1-2 min before the preheating of the experimental mold is finished, stirring at a high speed to form a test potting material, and recording the stirring time and the stirring speed when the white material and the black material are mixed;
4) injecting the test potting material into the preheated test mold, and observing and recording the milky white time of the test potting material;
5) after the test potting material is naturally foamed, putting the test potting mold into an oven for heating and curing, and observing and recording curing time and curing temperature;
6) taking the cured test encapsulation mold out of the oven, naturally cooling to room temperature, forming a test product in the encapsulation mold by the injected test encapsulation material, and taking the test product out of the test encapsulation mold;
7) counting the temperature value and the humidity value in the operating room in the steps 1) to 6) to prepare a temperature change table and a humidity change table in the operating room;
8) measuring the weight of the test article and the skinning thickness of the test article when all the change values in the temperature change table are not higher than 3 ℃ and all the change values in the humidity change table are not higher than 10%;
9) when the weight of the test product is 78-88 g and the skinning thickness of the test product is less than 0.5mm, obtaining a qualified test product;
10) recording the average temperature of the operation room, the average humidity of the operation room, the preheating time, the preheating temperature, the milk-white time, the stirring speed, the curing time and the curing temperature in the steps 1) to 6) corresponding to the preparation of the qualified test product;
the operation program comprises the following steps:
11) cleaning an electronic cabin to be encapsulated and sealed and a mould, fastening a wire harness of the electronic cabin, embedding the wire harness into a groove of the electronic cabin, and recording the weight of the electronic cabin;
12) adjusting the temperature and the humidity of the operating room by the air conditioner to be the average temperature and the average humidity of the operating room recorded in the step 10);
13) combining the electronic cabin uniformly coated with the separating agent and the mold uniformly coated with the release agent to form a potting mold, putting the potting mold into an oven, and preheating according to the preheating time and the preheating temperature recorded in the step 10);
14) respectively weighing 64-66 g of white material and 64-66 g of black material, stirring the white material and the black material according to the stirring time and the stirring speed recorded in the step 10) to form a potting material 1-2 min before the preheating of the potting mold is finished;
15) injecting the potting material into a preheated potting mold according to a specified time, and sealing an injection opening of the potting mold, wherein the specified time is less than or equal to the milky white time recorded in the step 10);
16) after the potting material is naturally foamed, putting the potting mold into the oven, and heating and curing according to the curing time and the curing temperature recorded in the step 10);
17) taking the cured encapsulation mold out of the oven, naturally cooling to room temperature, disassembling the encapsulation mold, taking out the encapsulated electronic cabin from the encapsulation mold, cleaning leftover materials of the encapsulated electronic cabin, recording the weight of the encapsulated electronic cabin, and calculating the weight increase value of the encapsulated electronic cabin;
18) when the weight increase value of the encapsulated electronic cabin is 100-120 g, obtaining a qualified encapsulated electronic cabin;
in the step 8), when all the change values in the temperature change table are higher than 3 ℃ and/or the values in the humidity change table are higher than 10%, adjusting the temperature and the humidity of the operating room by the air conditioner, and performing the steps 1) to 7) again;
the step 9) further comprises: when the weight of the test product is less than 78g or more than 88g and/or the skinning thickness is more than or equal to 0.5mm, gradually adjusting the values of the preheating time, the preheating temperature, the stirring time, the stirring speed, the curing time and the curing temperature within the adjusting range, and repeating the steps 1) to 8) according to the adjusted values until a qualified test product is produced;
the temperature and humidity adjusting ranges of the operating room are respectively 21-27 ℃ and 40-70%
The adjusting ranges of the preheating time and the preheating temperature are respectively 30-90 min and 35-45 ℃;
the adjusting ranges of the stirring time and the stirring speed are 15-35 s and 2000-4000 r/min respectively;
the curing time and the curing temperature are adjusted within the ranges of 3-5 hours and 55-70 ℃.
2. The electronic component potting process of claim 1, wherein the values of the preheating time, preheating temperature, stirring time, stirring rate, aging time and aging temperature are set to 30min, 35 ℃, 15s, 2000r/min, 3h and 55 ℃ respectively at the time of the first process test.
3. The process for potting electronic components according to claim 2, wherein the white material is a composite polyether and the black material is a polyisocyanate.
4. The electronic component potting process of claim 3, further comprising a process preparation prior to the start of the process test, the process preparation comprising the steps of:
starting a ventilation device, and recording the temperature and humidity of an operating room after the ventilation device works stably;
when the temperature of the operation room is 21-27 ℃ and the humidity is 40-70%, the process preparation is completed.
5. The process for encapsulating the electronic component according to any one of claims 1 to 4, wherein the release agent is a silicone rubber release agent, and the silicone rubber release agent is uniformly coated on the circuit board of the electronic cabin.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900132A (en) * | 2006-07-13 | 2007-01-24 | 国营万峰无线电厂 | High strength hard polyurethane foam plastics and its preparing method |
| CN101550327A (en) * | 2008-04-03 | 2009-10-07 | 航天材料及工艺研究所 | High hardness high-toughness polyurethane casting compound and application thereof |
| JP2013171907A (en) * | 2012-02-20 | 2013-09-02 | Seiko Epson Corp | Electronic device encapsulation method and electronic device |
| CN104682156A (en) * | 2014-12-19 | 2015-06-03 | 北京卫星制造厂 | Potting process method of high-density electrical connector |
| CN105001821A (en) * | 2015-07-16 | 2015-10-28 | 西安电子工程研究所 | Preparation and pouring sealing methods of air vehicle high-overload anti-shock pouring sealant |
| CN204858958U (en) * | 2015-07-31 | 2015-12-09 | 广东易事特电源股份有限公司 | Lightweight photovoltaic wave filter |
-
2016
- 2016-10-08 CN CN201610874803.9A patent/CN106304827B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900132A (en) * | 2006-07-13 | 2007-01-24 | 国营万峰无线电厂 | High strength hard polyurethane foam plastics and its preparing method |
| CN101550327A (en) * | 2008-04-03 | 2009-10-07 | 航天材料及工艺研究所 | High hardness high-toughness polyurethane casting compound and application thereof |
| JP2013171907A (en) * | 2012-02-20 | 2013-09-02 | Seiko Epson Corp | Electronic device encapsulation method and electronic device |
| CN104682156A (en) * | 2014-12-19 | 2015-06-03 | 北京卫星制造厂 | Potting process method of high-density electrical connector |
| CN105001821A (en) * | 2015-07-16 | 2015-10-28 | 西安电子工程研究所 | Preparation and pouring sealing methods of air vehicle high-overload anti-shock pouring sealant |
| CN204858958U (en) * | 2015-07-31 | 2015-12-09 | 广东易事特电源股份有限公司 | Lightweight photovoltaic wave filter |
Non-Patent Citations (2)
| Title |
|---|
| 聚氨酯灌封加工工艺的应用研究;完颜裕仁;《上海涂料》;20121230;全文 * |
| 高过载电子设备的灌封工艺研究;夏奥利;《装备制造技术》;20100815;第169页第1.1、1.2、3节、第170页第3.2节及附图3 * |
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