CN106098913B - A method of white light LEDs trial is improved than testing efficiency - Google Patents
A method of white light LEDs trial is improved than testing efficiency Download PDFInfo
- Publication number
- CN106098913B CN106098913B CN201610495801.9A CN201610495801A CN106098913B CN 106098913 B CN106098913 B CN 106098913B CN 201610495801 A CN201610495801 A CN 201610495801A CN 106098913 B CN106098913 B CN 106098913B
- Authority
- CN
- China
- Prior art keywords
- led chip
- bracket
- white light
- light leds
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
A kind of method the invention discloses raising white light LEDs trial than testing efficiency, comprising steps of LED chip is fixed in the bowl of cantilever tip with glue；The welding lead between LED chip and bracket, is electrically connected LED chip with bracket；Configured fluorescent glue is coated in LED chip；The positive pin and negative pin of bracket are fixed with insulant, and the positive pin and negative pin are cut from bracket；Photochromic test is carried out to obtained LED semi-finished product.After coating fluorescent glue, the positive pin and negative pin of bracket are fixed by insulant, then directly carry out photochromic test, whether suitable test the proportion of fluorescent powder and glue in fluorescent glue, eliminate subsequent sealing process, time and cost are saved, the production efficiency of white light LEDs product is improved.
Description
Technical field
The present invention relates to LED to manufacture a kind of side of field more particularly to raising white light LEDs trial than testing efficiency
Method.
Background technique
Existing plug-in unit white light LEDs product generallys use the method system being coated in yellow fluorescent powder on blue-light LED chip
It forms, first mixes yellow fluorescent powder and silica gel, through dispenser point in LED chip, due to fluorescent powder grain
Deposition, in powder technical process, the ratio regular meeting of silica gel and yellow fluorescent powder is constantly occurring variation, same dispensing
Biggish color difference can be generated by measuring the white light LED part pointed out, and seriously affect the quality of product.Therefore, it need to produce in batches every time
Before, or during batch production, the ratio of fluorescent powder and silica gel is tested, satisfactory ratio (proportion) is obtained
Later, it could be produced in batches in this ratio.
It is usually that fraction material is taken to be produced when testing ratio (that is, trial is than test) of fluorescent powder and silica gel,
After covering whole technological process of productions (die bond-> bonding wire -- > point powder --- > sealing --- -- > cutting), that is, it produces few
After the LED finished product of part, photochromic test is just carried out, the parameters requirement whether up to specification of LED finished product is tested, is only surveying
After examination is qualified, the ratio that this could be used to use is produced in batches.Such a trial than test process, cost when
Between production efficiency that is very long, influencing producing line, and Material Cost is also higher.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of raising white light LEDs trials than testing
The method of efficiency can effectively improve the production efficiency of white light LEDs product.
Technical scheme is as follows:
A method of white light LEDs trial is improved than testing efficiency, and described method includes following steps:
A, LED chip is fixed in the bowl of cantilever tip with glue；
B, the welding lead between LED chip and bracket, is electrically connected LED chip with bracket；
C, configured fluorescent glue is coated in LED chip；
D, the positive pin and negative pin of bracket are fixed with insulant, and by the positive pin and negative pin from
It is cut in bracket；
E, photochromic test is carried out to the LED semi-finished product that step D is obtained.
The raising white light LEDs trial is than in the method for testing efficiency, the step A-E is used for white light LEDs production line
Initial workpiece test.
The raising white light LEDs trial is than further including step C1, solidification after the step C in the method for testing efficiency
The fluorescent glue.
The raising white light LEDs trial is than after the step E, further comprising the steps of: in the method for testing efficiency
F, after the LED semi-finished product detection that step D is obtained is qualified, starts to produce in batches, repeat step A-C；
G, after LED chip and electrode being sealed and solidified with covering silica gel, the encapsulation of LED chip is completed.
The raising white light LEDs trial is than in the method for testing efficiency, the insulant has been insulation and fixed function
Epoxy resin.
The raising white light LEDs trial is than in the method for testing efficiency, the insulant is insulating cement.
The utility model has the advantages that provided in the present invention it is a kind of raising white light LEDs trial than testing efficiency method, comprising steps of with
LED chip is fixed in the bowl of cantilever tip by glue；The welding lead between LED chip and bracket makes LED chip and branch
Frame electrical connection；Configured fluorescent glue is coated in LED chip；The positive pin and negative pin of bracket are consolidated with insulant
It is fixed, and the positive pin and negative pin are cut from bracket；Photochromic test is carried out to obtained LED semi-finished product.It is applying
After covering fluorescent glue, the positive pin and negative pin of bracket are fixed by insulant, then directly carry out photochromic test, tested
Whether the proportion of fluorescent powder and glue is suitable in fluorescent glue, eliminates subsequent sealing process, saves time and cost, improves
The production efficiency of white light LEDs products.
Detailed description of the invention
Fig. 1 is method flow diagram of the raising white light LEDs trial of the present invention than the method for testing efficiency.
Fig. 2 is raising white light LEDs trial of the present invention than in the method for testing efficiency, the structure chart of bracket.
Fig. 3 is raising white light LEDs trial of the present invention than in the method for testing efficiency, the structure chart of the bowl of bracket.
Fig. 4 is raising white light LEDs trial of the present invention than in the method for testing efficiency, the structure chart of LED semi-finished product.
Fig. 5 is raising white light LEDs trial of the present invention than in the method for testing efficiency, the structure chart of LED finished product.
Specific embodiment
The present invention provide it is a kind of raising white light LEDs trial than testing efficiency method, to make the purpose of the present invention, technical side
Case and effect are clearer, clear, and the present invention is described in more detail below.It should be appreciated that specific reality described herein
It applies example to be only used to explain the present invention, be not intended to limit the present invention.
Referring to Figure 1, Fig. 1 is flow chart of the raising white light LEDs trial of the present invention than the method for testing efficiency.Such as figure
Shown in 1, the raising white light LEDs trial includes: than the method for testing efficiency
S10, die bond: LED chip 20 is fixed in the bowl 110 on 10 top of bracket with glue, as shown in Figures 2 and 3.
S20, bonding wire: the welding lead 30 between LED chip 20 and bracket 10 is electrically connected LED chip 20 with bracket 10.
Preferably, the conducting wire 30 is gold thread.
S30, point powder: configured fluorescent glue is coated in LED chip.Specifically, fluorescent powder and silica gel (can also be adopted
With epoxy glue) it is configured and is mixed by predetermined ratio, fluorescent glue is obtained, it will be in the bowl 110 of fluorescent glue injection bracket.
After step S30, further includes step S31, baking: solidifying the fluorescent glue by toasting.
It is S40, with insulant 40 that the positive pin 120 of bracket 10 and negative pin 130 is fixed, and by the positive pin
120 and negative pin 130 cut from bracket 10, separate positive pin 120 and negative pin 130, be unlikely to short circuit, obtain
Semi-finished product it is as shown in Figure 4.The positive and negative anodes that bracket is secured by insulant 40 allow semi-finished product shown in Fig. 4 direct
Photochromic test is carried out, without carrying out sealing to LED chip, a large amount of time and glue is saved, improves production efficiency, save
Production cost is saved.In the present embodiment, the insulant 40 has been the epoxy resin of insulation and fixed function, using the shape of drop glue
Formula fixes positive and negative anodes, and process simple effects are good, and the epoxy resin speed is baked 10 ~ 15min and can be dried, and spends the time seldom.Into
One step, the epoxy resin is insulating cement.Certainly, in other embodiments, the insulant 40 can also be the non-of insulation
Metal (non-conductive class) fixture, grips positive and negative anodes by fixture, effect of the invention also may be implemented.
S50, photochromic test is carried out to the LED semi-finished product that step S40 is obtained.Specifically, due in step s 40 to bracket
10 have carried out cutting, obtain semi-finished product shown in Fig. 4, that is, obtain positive pin 120 and the separated LED of negative pin 130 half at
Product.Due to being used only as testing, without entering the cutting process of producing line, the artificial cutting of tester is actually also saved
The time of cutting process, improve production efficiency.Photochromic test is carried out to LED semi-finished product, tests every optics of LED semi-finished product
Parameter (such as brightness, wavelength or chromaticity coordinates) and electrical parameter (the forward test items such as voltage, open circuit, short circuit), according to survey
Test result judges whether qualification, if test passes, illustrates that the predetermined ratio of fluorescent powder and silica gel meets the requirements, and trial is than test
It completes.The step S10-S50 is for the initial workpiece test and/or sampling observation test on white light LEDs production line, in other words, process
After above-mentioned steps, the predetermined ratio of satisfactory fluorescent powder and silica gel has been obtained, has completed initial workpiece test, producing line can carry out
Batch production, the more traditional process of this process save sealing process, greatly improve production efficiency.
Further, it after the step S50, further comprises the steps of:
After the LED semi-finished product detection that S60, step S40 are obtained is qualified, starts to produce in batches, repeat step S10-S30.
S70, sealing: after LED chip and electrode are sealed and solidified with covering silica gel, the encapsulation of LED chip is completed.It is described
Step S70 is specifically included:
S710, viscose glue: after having configured glue, vacuumizing, to 110 viscose glue of bowl.Utilize viscose glue, it would be possible to easy when encapsulating
Bubble removes in advance in the cup of generation.
S720, spray release agent: release agent is sprayed on the mould item for the colloid shape for being used to produce LED.
S730, encapsulating: the resin glue after deaeration is completed is fed into the die cavity of mould item.
S740, it inserts bracket: bracket being inserted into the die cavity, short roasting pre-hardening.
S750, from mould: it is long roasting to harden resin glue, and from mould.
S760, cutting is carried out to bracket, obtains final finished product, as shown in Figure 5.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (3)
1. a kind of improve method of the white light LEDs trial than testing efficiency, which is characterized in that described method includes following steps:
A, LED chip is fixed in the bowl of cantilever tip with glue；
B, the welding lead between LED chip and bracket, is electrically connected LED chip with bracket；
C, configured fluorescent glue is coated in LED chip；
D, the positive pin and negative pin of bracket are fixed with insulant, and by the positive pin and negative pin from bracket
In cut, the fixed positive and negative anodes in the form of dripping glue；
E, photochromic test is carried out to the LED semi-finished product that step D is obtained；
The step A-E is for the initial workpiece test on white light LEDs production line；
It further include step C1, the solidification fluorescent glue after the step C；
After the step E, further comprise the steps of:
F, after the LED semi-finished product detection that step D is obtained is qualified, starts to produce in batches, repeat step A-C；
G, after LED chip and electrode being sealed and solidified with covering silica gel, the encapsulation of LED chip is completed；
The LED semi-finished product directly carry out photochromic test, eliminate the sealing process of LED chip, improve production efficiency.
2. improving method of the white light LEDs trial than testing efficiency according to claim 1, which is characterized in that the insulant
For the epoxy resin for playing insulation and fixed function.
3. improving method of the white light LEDs trial than testing efficiency according to claim 1, which is characterized in that the insulant
For insulating cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610495801.9A CN106098913B (en) | 2016-06-29 | 2016-06-29 | A method of white light LEDs trial is improved than testing efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610495801.9A CN106098913B (en) | 2016-06-29 | 2016-06-29 | A method of white light LEDs trial is improved than testing efficiency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106098913A CN106098913A (en) | 2016-11-09 |
| CN106098913B true CN106098913B (en) | 2019-04-02 |
Family
ID=57214595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610495801.9A Active CN106098913B (en) | 2016-06-29 | 2016-06-29 | A method of white light LEDs trial is improved than testing efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106098913B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768503A (en) * | 2017-10-25 | 2018-03-06 | 江苏稳润光电科技有限公司 | A kind of Lamp white lights product encapsulating structure |
| CN107944208B (en) * | 2017-11-10 | 2020-06-19 | 江苏稳润光电有限公司 | Method for calculating white light led fluorescent glue ratio |
| CN112924840B (en) * | 2021-02-26 | 2023-09-12 | 航天科工防御技术研究试验中心 | LED failure positioning method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101237017A (en) * | 2008-02-29 | 2008-08-06 | 晶能光电（江西）有限公司 | LED supporter processing method for LED nude core test |
| CN103441206A (en) * | 2013-08-22 | 2013-12-11 | 中山市光圣半导体科技有限责任公司 | Method for improving color consistency of white-light LED devices |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4923728B2 (en) * | 2006-05-24 | 2012-04-25 | 三菱化学株式会社 | Phosphor-containing composition, light emitting device, lighting device, and image display device |
-
2016
- 2016-06-29 CN CN201610495801.9A patent/CN106098913B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101237017A (en) * | 2008-02-29 | 2008-08-06 | 晶能光电（江西）有限公司 | LED supporter processing method for LED nude core test |
| CN103441206A (en) * | 2013-08-22 | 2013-12-11 | 中山市光圣半导体科技有限责任公司 | Method for improving color consistency of white-light LED devices |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106098913A (en) | 2016-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106098913B (en) | A method of white light LEDs trial is improved than testing efficiency | |
| CN101752468B (en) | Suspending manufacture process of light emitting diode (LED) fluorescent powder | |
| CN103066185A (en) | Manufacturing method for printing chip on board (COB) | |
| US20020075022A1 (en) | Wafer interposer for testing and assembly into a conventional package | |
| CN104682156B (en) | A kind of pouring method of high density electrical connector | |
| CN104517805B (en) | Glue removing method for quad flat non-leaded package chip | |
| CN107146789B (en) | LED encapsulation method and LED display | |
| CN103682030B (en) | LED, LED matrix and LED manufacture crafts | |
| CN101237017B (en) | LED supporter processing method for LED nude core test, LED supporter unit and supporter | |
| CN102931320A (en) | White light light-emitting diode (LED) approximate shape-preserving packaging structure and preparation method thereof | |
| CN106571419B (en) | A kind of production method of flash lamp | |
| CN106252486A (en) | A kind of manufacture method of Surface-mount LED lamp | |
| CN102431950A (en) | Double-layer MEMS (micro-electro-mechanical systems) device stacked package and production method thereof | |
| CN106374025A (en) | Cylindrical CSP light source and manufacturing device and manufacturing method thereof | |
| CN103400931B (en) | Manufacturing method of direct-plug-in type LED (light emitting diode) lamp and high-cup three-in-one direct-plug-in type full color lamp | |
| CN103928589A (en) | LED white light packaging and light distributing method | |
| CN105489741A (en) | Compression moulding packaging technology for LED flip-chip | |
| CN107481944A (en) | A kind of semiconductor devices hybrid package method | |
| CN109387762A (en) | A kind of adopting surface mounted LED row survey device | |
| CN108155106A (en) | A kind of length climbs the preparation process of electric light electric coupler | |
| CN103354267A (en) | Packaging method for white LED (Light-Emitting Diode) light source | |
| CN106601714A (en) | Insulation package structure in movable ejector pin and process method thereof | |
| CN207690790U (en) | A kind of lead frame for QFN encapsulation | |
| CN206774543U (en) | LED module BGA package fixed structure | |
| CN102064165B (en) | Novel LED (Light Emitting Diode) device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |