JP2011029568A - Holding fixture and holding method for mounting thin-plate printed wiring board - Google Patents
Holding fixture and holding method for mounting thin-plate printed wiring board Download PDFInfo
- Publication number
- JP2011029568A JP2011029568A JP2009188729A JP2009188729A JP2011029568A JP 2011029568 A JP2011029568 A JP 2011029568A JP 2009188729 A JP2009188729 A JP 2009188729A JP 2009188729 A JP2009188729 A JP 2009188729A JP 2011029568 A JP2011029568 A JP 2011029568A
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- Prior art keywords
- wiring board
- printed wiring
- thin
- plate
- thin printed
- Prior art date
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- 238000000034 method Methods 0.000 title abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 238000004140 cleaning Methods 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- -1 amide imide Chemical class 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本発明は、薄板プリント配線基板に電子部品を実装する作業工程の際、薄板プリント配線基板を保持するための、薄板プリント配線基板保持冶具及び薄板プリント配線基板の保持方法に関する。 The present invention relates to a thin printed wiring board holding jig and a thin printed wiring board holding method for holding a thin printed wiring board during an operation process of mounting electronic components on the thin printed wiring board.
薄板プリント基板の表面実装工程及びリフロー工程において、プレート状の冶具の表面に薄板プリント配線基板を固定するための、繰り返し着脱可能な接着剤層を形成した冶具により、薄板プリント配線基板を保持搬送する方法が多く利用されている。(例えば、特許文献1参照。)。 In the surface mounting process and the reflow process of the thin printed circuit board, the thin printed circuit board is held and conveyed by a jig in which a repeatedly removable adhesive layer is formed to fix the thin printed wiring board on the surface of the plate-shaped jig. Many methods are used. (For example, refer to Patent Document 1).
しかし、前記の従来技術では、表面実装工程及びリフロー工程の際、または薄板プリント配線基板着脱の際に汚れが接着剤に付着して接着力が弱まるため、使用する度に洗浄しなければならない。その繰り返し行われる洗浄により、形成された接着剤が磨り減ってしまう現象が生じ、使用回数が数百回程度で使用不可能となることが懸念されている。 However, in the above prior art, dirt adheres to the adhesive during the surface mounting process and the reflow process, or when the thin printed circuit board is attached / detached, and the adhesive strength is weakened. The repeated cleaning causes a phenomenon that the formed adhesive is worn away, and there is a concern that the adhesive may become unusable after being used several hundred times.
また、前記の従来技術は、フレキシブル基板等の薄板プリント配線基板での使用に適した技術分野であるが、高温下(250度から260度)での連続使用時に接着剤層の粘着性が劣化し、正確な位置出しの繰り返し精度に疑問がのこる。
本発明は、前途の課題を踏まえ、簡易に繰り返し薄板プリント配線基板の着脱が可能で、電子部品の表面実装工程及びリフロー工程において、使用可能回数を増大させ、正確な位置出しの繰り返し精度を確保する。また、電子部品の実装工程の効率化及び生産性の向上を目的とした、薄板プリント配線基板を保持搬送するための薄板プリント配線基板実装用保持冶具及び薄板プリント配線基板保持方法を課題とする。 The present invention can easily and repeatedly attach and detach a thin printed circuit board in light of the problems ahead, increase the number of times it can be used in the surface mounting process and reflow process of electronic components, and ensure accurate positioning repeatability. To do. Another object of the present invention is to provide a thin printed wiring board mounting holding jig and a thin printed wiring board holding method for holding and transporting a thin printed wiring board for the purpose of improving the efficiency of the electronic component mounting process and improving the productivity.
本考案の実装用薄板プリント配線基板保持冶具は、薄板プリント配線基板と薄板プリント配線基板を磁石の磁力で圧着させる薄形磁性体金属板を、凹設した納置面で保持するプレート状の冶具である。冶具の裏面に自動工具交換機能を備えた工作機械等を用い、小型永久磁石を適数埋設するためのザグリ加工を凹設し、冶具の表面に薄板プリント配線基板及び薄形磁性体金属板の外形及び形状に沿って前記工作機械等を用い、薄板プリント配線基板及び薄形磁性体金属板を納置するための溝を凹設する。また、その溝及び薄板プリント配線基板を納置する溝の下部の冶具に、薄板プリント配線基板を薄板プリント配線基板実装用保持冶具から抜脱するための穴を貫設する。これにより、冶具から薄板プリント配線基板の着脱が可能となる。 The thin printed wiring board holding jig for mounting according to the present invention is a plate-shaped jig for holding a thin magnetic metal plate, which presses the thin printed wiring board and the thin printed wiring board by the magnetic force of a magnet, with a recessed storage surface. It is. Using a machine tool equipped with an automatic tool change function on the back of the jig, a counterbore for embedding an appropriate number of small permanent magnets is recessed, and a thin printed circuit board and a thin magnetic metal plate are placed on the surface of the jig. Using the machine tool or the like along the outer shape and shape, a groove for receiving the thin printed wiring board and the thin magnetic metal plate is provided. Further, a hole for removing the thin printed circuit board from the holding jig for mounting the thin printed circuit board is provided in the jig below the groove and the groove in which the thin printed circuit board is placed. Thereby, the thin printed wiring board can be attached and detached from the jig.
また、プレート状の冶具としては、アミドイミド樹脂やエボキシ樹脂、ガラス繊維等を含んだ耐熱半導電樹脂板、チタン合金、アルミニウム合金、ステンレス材等が用いられる。 As the plate-shaped jig, a heat-resistant semiconductive resin plate containing an amide imide resin, an ethoxy resin, glass fiber or the like, a titanium alloy, an aluminum alloy, a stainless steel material, or the like is used.
本発明の薄板プリント配線基板保持方法は、工作機械等を用いプレート状の冶具の裏面にザグリ加工を適数凹設し円柱形等の小型永久磁石を、耐熱性の接着剤、圧入、カシメ等の方法で埋設し、プレート状の冶具の表面に薄板プリント配線基板及び薄形磁性体金属板の外形及び形状に沿って、工作機械等を用いて溝を凹設し、先に薄板プリント配線基板、次に薄形磁性体金属板を納置したとき、適数の小型永久磁石の磁力が薄形磁性体金属板を強く吸引し、薄板プリント配線基板を保持する。 The thin printed wiring board holding method of the present invention uses a machine tool or the like to insert a small number of counterbores on the back surface of a plate-shaped jig and form a cylindrical permanent magnet, etc., heat-resistant adhesive, press-fit, caulking, etc. Embedded in the method, along the outer shape and shape of the thin printed wiring board and thin magnetic metal plate on the surface of the plate-shaped jig, using a machine tool or the like to recess the groove, first thin printed wiring board Next, when the thin magnetic metal plate is placed, the magnetic force of an appropriate number of small permanent magnets strongly attracts the thin magnetic metal plate and holds the thin printed wiring board.
本発明により、接着剤等を使用する方法図2とは異なり、高温化においての繰り返しの使用でも、汚れの付着、機能の劣化、洗浄工程時の接着剤等の剥離、等の形態の変化も避けることができる。 According to the present invention, unlike the method of using an adhesive or the like, even in repeated use at a high temperature, changes in form such as adhesion of dirt, deterioration of function, peeling of the adhesive or the like during the cleaning process, etc. Can be avoided.
本発明の薄板プリント配線基板実装用保持冶具は、図1に示すように、プレート状の冶具1の裏面に適数の円柱形等の小型永久磁石3を埋設するためのザグリ加工2を凹設し、耐熱性の接着剤、圧入、カシメ等により小型永久磁石3を埋設する、プレート状の冶具1の表面には薄板プリント配線基板7を納置するためのザグリ加工4を凹設し、薄形磁性体金属板8を納置するためのザグリ加工6を凹設する形態から成る。薄形磁性体金属板8にはクリームハンダや電子部品実装時の逃げ穴9が加工してある、プレート状の冶具1は耐熱性である、アミドイミド樹脂やエボキシ樹脂、ガラス繊維等を含んだ半導電積層板(例えば、ニッカン工業株式会社製ニカプレート)やチタン合金、アルミニウム合金、ステンレス材等の板状である。 As shown in FIG. 1, the holding jig for mounting a thin printed wiring board according to the present invention is provided with a
プレート状の冶具1の裏面に適数の円柱形等の小型永久磁石3を埋設するためのザグリ加工を施し凹部2を形設する、プレート状の冶具1の表面に薄板プリント配線基板7を納置するためのザグリ加工を施し凹部4を形設する、また薄形磁性体金属板8を納置するためのザグリ加工を施し凹部6を形設する。さらに、ザグリ加工を施したプレート状の冶具1及び薄板プリント配線基板7を納置した下部に基板抜脱用押し穴5を貫設する。 The thin plate printed
薄板プリント配線基板実装用保持冶具を用いた薄板プリント配線基板の保持方法は、図2に示すように、裏面に適数の円柱形等の小型永久磁石3を埋設したプレート状の冶具1の表面に、薄板プリント配線基板7を納置するための凹部4と薄形磁性体金属板8を納置するための凹部6にそれぞれ薄板プリント配線基板7、薄形磁性体金属板8の順で納置することにより適数の小型永久磁石3の磁力が薄形磁性体金属板8を強く吸引し、薄板プリント配線基板7を保持固定する。 As shown in FIG. 2, the method of holding a thin printed wiring board using a holding jig for mounting a thin printed wiring board is the surface of a plate-
本発明は、需要層が広く、品質の長期安定も可能なため利用可能性を有する。 The present invention has applicability because the demand layer is wide and the quality can be stable for a long time.
1 プレート状の冶具
2 円柱形等の小型永久磁石納置用凹部
3 円柱形等の小型永久磁石
4 薄板プリント配線基板納置用凹部
5 基板抜脱用押し穴
6 薄形磁性体金属板納置用凹部
7 薄板プリント配線基板
8 薄形磁性体金属板
9 クリームハンダ、電子部品実装時等の逃げ穴
20 接着剤等DESCRIPTION OF
Claims (6)
Priority Applications (1)
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JP2009188729A JP2011029568A (en) | 2009-07-27 | 2009-07-27 | Holding fixture and holding method for mounting thin-plate printed wiring board |
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JP2009188729A JP2011029568A (en) | 2009-07-27 | 2009-07-27 | Holding fixture and holding method for mounting thin-plate printed wiring board |
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JP2011029568A true JP2011029568A (en) | 2011-02-10 |
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JP2009188729A Pending JP2011029568A (en) | 2009-07-27 | 2009-07-27 | Holding fixture and holding method for mounting thin-plate printed wiring board |
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KR101577026B1 (en) * | 2014-01-23 | 2015-12-11 | 아메스산업(주) | Assembly and transfer apparatus of substrate zig for solder reflow |
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2009
- 2009-07-27 JP JP2009188729A patent/JP2011029568A/en active Pending
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KR101555228B1 (en) | 2014-01-06 | 2015-09-24 | (주)세웅 | Smt pcb cover and zig unit having the same |
KR20150087938A (en) * | 2014-01-23 | 2015-07-31 | 아메스산업(주) | Separation and transfer apparatus of soldered assembly substrate |
KR101577026B1 (en) * | 2014-01-23 | 2015-12-11 | 아메스산업(주) | Assembly and transfer apparatus of substrate zig for solder reflow |
KR101577027B1 (en) * | 2014-01-23 | 2015-12-21 | 아메스산업(주) | Separation and transfer apparatus of soldered assembly substrate |
KR101538099B1 (en) * | 2014-12-05 | 2015-07-21 | 추평호 | Career jig for carrying PCB |
CN105864246A (en) * | 2015-01-20 | 2016-08-17 | 东莞新科技术研究开发有限公司 | Processing method for aluminum jig |
JP2017059799A (en) * | 2015-09-19 | 2017-03-23 | 新電元工業株式会社 | Manufacturing method for electrical apparatus, manufacturing jig and removal jig |
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CN106507657A (en) * | 2016-10-26 | 2017-03-15 | 郑建灵 | A kind of electronic devices and components transmitting device and electronic devices and components automatic double surface gluer |
CN106507657B (en) * | 2016-10-26 | 2019-02-26 | 郑建灵 | A kind of electronic component transmitting device and electronic component automatic double surface gluer |
CN110729201A (en) * | 2019-10-18 | 2020-01-24 | 东莞记忆存储科技有限公司 | SMT (surface Mount technology) solder paste printing method based on thin package substrate |
CN110729201B (en) * | 2019-10-18 | 2021-08-17 | 东莞记忆存储科技有限公司 | SMT (surface Mount technology) solder paste printing method based on thin package substrate |
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