JP2011029568A - Holding fixture and holding method for mounting thin-plate printed wiring board - Google Patents

Holding fixture and holding method for mounting thin-plate printed wiring board Download PDF

Info

Publication number
JP2011029568A
JP2011029568A JP2009188729A JP2009188729A JP2011029568A JP 2011029568 A JP2011029568 A JP 2011029568A JP 2009188729 A JP2009188729 A JP 2009188729A JP 2009188729 A JP2009188729 A JP 2009188729A JP 2011029568 A JP2011029568 A JP 2011029568A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
thin
plate
thin printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009188729A
Other languages
Japanese (ja)
Inventor
Toru Oki
徹 大木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cotta Co Ltd
Original Assignee
Taisei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taisei Co Ltd filed Critical Taisei Co Ltd
Priority to JP2009188729A priority Critical patent/JP2011029568A/en
Publication of JP2011029568A publication Critical patent/JP2011029568A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fixture that facilitates attachment and detachment of a thin-plate printed wiring board and is used for a component mounting process and a reflow process, the fixture improving productivity by solving problems of form deterioration, use frequency limitation etc., of an adhesive in a cleaning process. <P>SOLUTION: A holding fixture for mounting a thin-plate printed wiring board 7 is configured to embed a proper number of compact permanent magnets 3 having a columnar shape etc., in a plate-shaped fixture 1, placing the thin-plate printed wiring board 7 on a surface in contained manner, and placing a thin magnetic body metal plate 8 thereupon in a contained manner to hold the thin-plate printed wiring board 7 using magnetic force of the permanent magnets. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、薄板プリント配線基板に電子部品を実装する作業工程の際、薄板プリント配線基板を保持するための、薄板プリント配線基板保持冶具及び薄板プリント配線基板の保持方法に関する。  The present invention relates to a thin printed wiring board holding jig and a thin printed wiring board holding method for holding a thin printed wiring board during an operation process of mounting electronic components on the thin printed wiring board.

薄板プリント基板の表面実装工程及びリフロー工程において、プレート状の冶具の表面に薄板プリント配線基板を固定するための、繰り返し着脱可能な接着剤層を形成した冶具により、薄板プリント配線基板を保持搬送する方法が多く利用されている。(例えば、特許文献1参照。)。  In the surface mounting process and the reflow process of the thin printed circuit board, the thin printed circuit board is held and conveyed by a jig in which a repeatedly removable adhesive layer is formed to fix the thin printed wiring board on the surface of the plate-shaped jig. Many methods are used. (For example, refer to Patent Document 1).

しかし、前記の従来技術では、表面実装工程及びリフロー工程の際、または薄板プリント配線基板着脱の際に汚れが接着剤に付着して接着力が弱まるため、使用する度に洗浄しなければならない。その繰り返し行われる洗浄により、形成された接着剤が磨り減ってしまう現象が生じ、使用回数が数百回程度で使用不可能となることが懸念されている。  However, in the above prior art, dirt adheres to the adhesive during the surface mounting process and the reflow process, or when the thin printed circuit board is attached / detached, and the adhesive strength is weakened. The repeated cleaning causes a phenomenon that the formed adhesive is worn away, and there is a concern that the adhesive may become unusable after being used several hundred times.

また、前記の従来技術は、フレキシブル基板等の薄板プリント配線基板での使用に適した技術分野であるが、高温下(250度から260度)での連続使用時に接着剤層の粘着性が劣化し、正確な位置出しの繰り返し精度に疑問がのこる。
特開2001−144430号公報
In addition, the above-mentioned conventional technology is a technical field suitable for use on a thin printed wiring board such as a flexible substrate, but the adhesive layer has poor adhesiveness during continuous use at high temperatures (250 to 260 degrees). However, there are doubts about the repeatability of accurate positioning.
JP 2001-144430 A

本発明は、前途の課題を踏まえ、簡易に繰り返し薄板プリント配線基板の着脱が可能で、電子部品の表面実装工程及びリフロー工程において、使用可能回数を増大させ、正確な位置出しの繰り返し精度を確保する。また、電子部品の実装工程の効率化及び生産性の向上を目的とした、薄板プリント配線基板を保持搬送するための薄板プリント配線基板実装用保持冶具及び薄板プリント配線基板保持方法を課題とする。  The present invention can easily and repeatedly attach and detach a thin printed circuit board in light of the problems ahead, increase the number of times it can be used in the surface mounting process and reflow process of electronic components, and ensure accurate positioning repeatability. To do. Another object of the present invention is to provide a thin printed wiring board mounting holding jig and a thin printed wiring board holding method for holding and transporting a thin printed wiring board for the purpose of improving the efficiency of the electronic component mounting process and improving the productivity.

本考案の実装用薄板プリント配線基板保持冶具は、薄板プリント配線基板と薄板プリント配線基板を磁石の磁力で圧着させる薄形磁性体金属板を、凹設した納置面で保持するプレート状の冶具である。冶具の裏面に自動工具交換機能を備えた工作機械等を用い、小型永久磁石を適数埋設するためのザグリ加工を凹設し、冶具の表面に薄板プリント配線基板及び薄形磁性体金属板の外形及び形状に沿って前記工作機械等を用い、薄板プリント配線基板及び薄形磁性体金属板を納置するための溝を凹設する。また、その溝及び薄板プリント配線基板を納置する溝の下部の冶具に、薄板プリント配線基板を薄板プリント配線基板実装用保持冶具から抜脱するための穴を貫設する。これにより、冶具から薄板プリント配線基板の着脱が可能となる。  The thin printed wiring board holding jig for mounting according to the present invention is a plate-shaped jig for holding a thin magnetic metal plate, which presses the thin printed wiring board and the thin printed wiring board by the magnetic force of a magnet, with a recessed storage surface. It is. Using a machine tool equipped with an automatic tool change function on the back of the jig, a counterbore for embedding an appropriate number of small permanent magnets is recessed, and a thin printed circuit board and a thin magnetic metal plate are placed on the surface of the jig. Using the machine tool or the like along the outer shape and shape, a groove for receiving the thin printed wiring board and the thin magnetic metal plate is provided. Further, a hole for removing the thin printed circuit board from the holding jig for mounting the thin printed circuit board is provided in the jig below the groove and the groove in which the thin printed circuit board is placed. Thereby, the thin printed wiring board can be attached and detached from the jig.

また、プレート状の冶具としては、アミドイミド樹脂やエボキシ樹脂、ガラス繊維等を含んだ耐熱半導電樹脂板、チタン合金、アルミニウム合金、ステンレス材等が用いられる。  As the plate-shaped jig, a heat-resistant semiconductive resin plate containing an amide imide resin, an ethoxy resin, glass fiber or the like, a titanium alloy, an aluminum alloy, a stainless steel material, or the like is used.

本発明の薄板プリント配線基板保持方法は、工作機械等を用いプレート状の冶具の裏面にザグリ加工を適数凹設し円柱形等の小型永久磁石を、耐熱性の接着剤、圧入、カシメ等の方法で埋設し、プレート状の冶具の表面に薄板プリント配線基板及び薄形磁性体金属板の外形及び形状に沿って、工作機械等を用いて溝を凹設し、先に薄板プリント配線基板、次に薄形磁性体金属板を納置したとき、適数の小型永久磁石の磁力が薄形磁性体金属板を強く吸引し、薄板プリント配線基板を保持する。  The thin printed wiring board holding method of the present invention uses a machine tool or the like to insert a small number of counterbores on the back surface of a plate-shaped jig and form a cylindrical permanent magnet, etc., heat-resistant adhesive, press-fit, caulking, etc. Embedded in the method, along the outer shape and shape of the thin printed wiring board and thin magnetic metal plate on the surface of the plate-shaped jig, using a machine tool or the like to recess the groove, first thin printed wiring board Next, when the thin magnetic metal plate is placed, the magnetic force of an appropriate number of small permanent magnets strongly attracts the thin magnetic metal plate and holds the thin printed wiring board.

本発明により、接着剤等を使用する方法図2とは異なり、高温化においての繰り返しの使用でも、汚れの付着、機能の劣化、洗浄工程時の接着剤等の剥離、等の形態の変化も避けることができる。  According to the present invention, unlike the method of using an adhesive or the like, even in repeated use at a high temperature, changes in form such as adhesion of dirt, deterioration of function, peeling of the adhesive or the like during the cleaning process, etc. Can be avoided.

本発明の薄板プリント配線基板実装用保持冶具は、図1に示すように、プレート状の冶具1の裏面に適数の円柱形等の小型永久磁石3を埋設するためのザグリ加工2を凹設し、耐熱性の接着剤、圧入、カシメ等により小型永久磁石3を埋設する、プレート状の冶具1の表面には薄板プリント配線基板7を納置するためのザグリ加工4を凹設し、薄形磁性体金属板8を納置するためのザグリ加工6を凹設する形態から成る。薄形磁性体金属板8にはクリームハンダや電子部品実装時の逃げ穴9が加工してある、プレート状の冶具1は耐熱性である、アミドイミド樹脂やエボキシ樹脂、ガラス繊維等を含んだ半導電積層板(例えば、ニッカン工業株式会社製ニカプレート)やチタン合金、アルミニウム合金、ステンレス材等の板状である。  As shown in FIG. 1, the holding jig for mounting a thin printed wiring board according to the present invention is provided with a counterbore process 2 for embedding an appropriate number of cylindrical permanent magnets 3 such as a cylindrical shape on the back surface of a plate-like jig 1. Then, a small permanent magnet 3 is embedded by heat-resistant adhesive, press-fitting, caulking, or the like, and a counterbore process 4 for placing the thin printed wiring board 7 is recessed on the surface of the plate-shaped jig 1, and the thin The counterbore processing 6 for placing the shape magnetic metal plate 8 is recessed. The thin magnetic metal plate 8 has a clearance hole 9 for mounting cream solder or electronic parts. The plate-like jig 1 is heat resistant, and includes a half containing an amide imide resin, an ethoxy resin, glass fiber, or the like. It has a plate shape such as a conductive laminated plate (for example, Nika plate manufactured by Nikkan Kogyo Co., Ltd.), a titanium alloy, an aluminum alloy, and a stainless material.

プレート状の冶具1の裏面に適数の円柱形等の小型永久磁石3を埋設するためのザグリ加工を施し凹部2を形設する、プレート状の冶具1の表面に薄板プリント配線基板7を納置するためのザグリ加工を施し凹部4を形設する、また薄形磁性体金属板8を納置するためのザグリ加工を施し凹部6を形設する。さらに、ザグリ加工を施したプレート状の冶具1及び薄板プリント配線基板7を納置した下部に基板抜脱用押し穴5を貫設する。  The thin plate printed wiring board 7 is placed on the surface of the plate-shaped jig 1, which is subjected to counterboring for embedding an appropriate number of small-sized permanent magnets 3 such as cylindrical shapes on the back surface of the plate-shaped jig 1 to form the recesses 2. A concave portion 4 is formed by performing a counterboring process for placement, and a concave portion 6 is formed by performing a counterboring process for placing the thin magnetic metal plate 8. Further, a board removal push hole 5 is provided in the lower part where the plate-shaped jig 1 and the thin printed wiring board 7 subjected to counterboring are placed.

薄板プリント配線基板実装用保持冶具を用いた薄板プリント配線基板の保持方法は、図2に示すように、裏面に適数の円柱形等の小型永久磁石3を埋設したプレート状の冶具1の表面に、薄板プリント配線基板7を納置するための凹部4と薄形磁性体金属板8を納置するための凹部6にそれぞれ薄板プリント配線基板7、薄形磁性体金属板8の順で納置することにより適数の小型永久磁石3の磁力が薄形磁性体金属板8を強く吸引し、薄板プリント配線基板7を保持固定する。  As shown in FIG. 2, the method of holding a thin printed wiring board using a holding jig for mounting a thin printed wiring board is the surface of a plate-like jig 1 in which an appropriate number of small permanent magnets 3 such as cylindrical shapes are embedded on the back surface. The thin printed wiring board 7 and the thin magnetic metal plate 8 are placed in this order in the concave portion 4 for placing the thin printed wiring board 7 and the concave portion 6 for placing the thin magnetic metal plate 8, respectively. As a result, the magnetic force of the appropriate number of small permanent magnets 3 attracts the thin magnetic metal plate 8 strongly, and holds and fixes the thin printed wiring board 7.

本発明は、需要層が広く、品質の長期安定も可能なため利用可能性を有する。  The present invention has applicability because the demand layer is wide and the quality can be stable for a long time.

本考案の薄板プリント配線基板実装用保持冶具の構成図(例として薄板プリント配線基板3面付け)である。1 is a configuration diagram of a holding jig for mounting a thin printed wiring board according to the present invention (for example, a three-sided thin printed wiring board). 本考案の薄板プリント配線基板実装用保持冶具の断面図である。It is sectional drawing of the holding jig for thin board printed wiring board mounting of this invention. 従来の接着剤層を形成したプリント基板実装用保持冶具の断面図である。It is sectional drawing of the holding jig for mounting a printed circuit board in which the conventional adhesive bond layer was formed.

1 プレート状の冶具
2 円柱形等の小型永久磁石納置用凹部
3 円柱形等の小型永久磁石
4 薄板プリント配線基板納置用凹部
5 基板抜脱用押し穴
6 薄形磁性体金属板納置用凹部
7 薄板プリント配線基板
8 薄形磁性体金属板
9 クリームハンダ、電子部品実装時等の逃げ穴
20 接着剤等
DESCRIPTION OF SYMBOLS 1 Plate-shaped jig 2 Cylindrical etc. small permanent magnet storage recessed part 3 Cylindrical etc. small permanent magnet 4 Thin plate printed wiring board storage recessed part 5 Substrate removal push hole 6 Thin magnetic metal plate storage Concave part 7 Thin printed circuit board 8 Thin magnetic metal plate 9 Escape hole 20 for mounting solder paste, electronic parts, etc. Adhesive etc.

Claims (6)

プレート状の冶具の裏面から円柱形等の小型永久磁石を適数埋設し、表面に薄板プリント配線基板を納置し、その薄板プリント配線基板を全て覆い隠す、薄形磁性体金属板を納置して、永久磁石の磁力を利用し、薄板プリント配線基板を基板納置面で保持する為の冶具であって、前記基板納置面が、薄板プリント配線基板実装用保持冶具。  Place a small number of small permanent magnets such as cylinders from the back of a plate-shaped jig, place a thin printed wiring board on the surface, and cover the entire thin printed wiring board, and place a thin magnetic metal plate A jig for holding the thin printed wiring board on the board placement surface using the magnetic force of the permanent magnet, wherein the board placement surface is a holding jig for mounting the thin printed wiring board. プレート状の冶具は、アミドイミド樹脂やエボキシ樹脂、ガラス繊維等を含んだ半導電樹脂板である請求項1に記載の薄板プリント配線基板実装用保持冶具。  2. The holding jig for mounting a thin printed circuit board according to claim 1, wherein the plate-shaped jig is a semiconductive resin plate containing an amide-imide resin, an epoxy resin, glass fiber, or the like. プレート状の冶具は、チタン合金である請求項1に記載の薄板プリント配線基板実装用保持冶具。  The holding jig for mounting a thin printed wiring board according to claim 1, wherein the plate-shaped jig is a titanium alloy. プレート状の冶具は、アルミニウム合金である請求項1に記載の薄板プリント配線基板実装用保持冶具。  The holding jig for mounting a thin printed wiring board according to claim 1, wherein the plate-shaped jig is an aluminum alloy. プレート状の冶具は、ステンレス材である請求項1に記載の薄板プリント配線基板実装用保持冶具。  2. The holding jig for mounting a thin printed circuit board according to claim 1, wherein the plate-shaped jig is a stainless material. 前記プレート状の冶具の裏面に、円柱形等の小型永久磁石を適数埋設し、表面に薄板プリント配線基板と、薄板プリント配線基板押え用の薄形磁性体金属板を納置するための、凹部を形設した請求項1乃至5のいずれかに記載の薄板プリント配線基板実装用保持冶具。  An appropriate number of small permanent magnets such as cylinders are embedded on the back surface of the plate-shaped jig, and a thin printed wiring board and a thin magnetic metal plate for holding the thin printed wiring board are placed on the surface. The holding jig for mounting a thin printed circuit board according to any one of claims 1 to 5, wherein a recess is formed.
JP2009188729A 2009-07-27 2009-07-27 Holding fixture and holding method for mounting thin-plate printed wiring board Pending JP2011029568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009188729A JP2011029568A (en) 2009-07-27 2009-07-27 Holding fixture and holding method for mounting thin-plate printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009188729A JP2011029568A (en) 2009-07-27 2009-07-27 Holding fixture and holding method for mounting thin-plate printed wiring board

Publications (1)

Publication Number Publication Date
JP2011029568A true JP2011029568A (en) 2011-02-10

Family

ID=43637939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009188729A Pending JP2011029568A (en) 2009-07-27 2009-07-27 Holding fixture and holding method for mounting thin-plate printed wiring board

Country Status (1)

Country Link
JP (1) JP2011029568A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101538099B1 (en) * 2014-12-05 2015-07-21 추평호 Career jig for carrying PCB
KR20150087938A (en) * 2014-01-23 2015-07-31 아메스산업(주) Separation and transfer apparatus of soldered assembly substrate
KR101555228B1 (en) 2014-01-06 2015-09-24 (주)세웅 Smt pcb cover and zig unit having the same
KR101577026B1 (en) * 2014-01-23 2015-12-11 아메스산업(주) Assembly and transfer apparatus of substrate zig for solder reflow
CN105834648A (en) * 2016-05-18 2016-08-10 天津力神电池股份有限公司 Welding locating device for safety protection components of lithium ion battery
CN105864246A (en) * 2015-01-20 2016-08-17 东莞新科技术研究开发有限公司 Processing method for aluminum jig
CN106180956A (en) * 2016-08-25 2016-12-07 南京中电熊猫照明有限公司 FPC lamp bar Multifunctional reflux tool
CN106507657A (en) * 2016-10-26 2017-03-15 郑建灵 A kind of electronic devices and components transmitting device and electronic devices and components automatic double surface gluer
JP2017059799A (en) * 2015-09-19 2017-03-23 新電元工業株式会社 Manufacturing method for electrical apparatus, manufacturing jig and removal jig
CN110729201A (en) * 2019-10-18 2020-01-24 东莞记忆存储科技有限公司 SMT (surface Mount technology) solder paste printing method based on thin package substrate

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101555228B1 (en) 2014-01-06 2015-09-24 (주)세웅 Smt pcb cover and zig unit having the same
KR20150087938A (en) * 2014-01-23 2015-07-31 아메스산업(주) Separation and transfer apparatus of soldered assembly substrate
KR101577026B1 (en) * 2014-01-23 2015-12-11 아메스산업(주) Assembly and transfer apparatus of substrate zig for solder reflow
KR101577027B1 (en) * 2014-01-23 2015-12-21 아메스산업(주) Separation and transfer apparatus of soldered assembly substrate
KR101538099B1 (en) * 2014-12-05 2015-07-21 추평호 Career jig for carrying PCB
CN105864246A (en) * 2015-01-20 2016-08-17 东莞新科技术研究开发有限公司 Processing method for aluminum jig
JP2017059799A (en) * 2015-09-19 2017-03-23 新電元工業株式会社 Manufacturing method for electrical apparatus, manufacturing jig and removal jig
CN105834648A (en) * 2016-05-18 2016-08-10 天津力神电池股份有限公司 Welding locating device for safety protection components of lithium ion battery
CN106180956A (en) * 2016-08-25 2016-12-07 南京中电熊猫照明有限公司 FPC lamp bar Multifunctional reflux tool
CN106180956B (en) * 2016-08-25 2019-08-23 南京中电熊猫照明有限公司 FPC lamp bar Multifunctional reflux jig
CN106507657A (en) * 2016-10-26 2017-03-15 郑建灵 A kind of electronic devices and components transmitting device and electronic devices and components automatic double surface gluer
CN106507657B (en) * 2016-10-26 2019-02-26 郑建灵 A kind of electronic component transmitting device and electronic component automatic double surface gluer
CN110729201A (en) * 2019-10-18 2020-01-24 东莞记忆存储科技有限公司 SMT (surface Mount technology) solder paste printing method based on thin package substrate
CN110729201B (en) * 2019-10-18 2021-08-17 东莞记忆存储科技有限公司 SMT (surface Mount technology) solder paste printing method based on thin package substrate

Similar Documents

Publication Publication Date Title
JP2011029568A (en) Holding fixture and holding method for mounting thin-plate printed wiring board
JP2010098320A (en) Surface mounting process for flexible printed circuit board, and magnetic tool and steel mesh used in the same
US20120261870A1 (en) Printed circuit board, a supporting jig and a positioning method
JP2008274373A (en) Mask for vapor deposition
KR101555228B1 (en) Smt pcb cover and zig unit having the same
JP2011060829A (en) Conveying carrier for flexible printed board, and printing apparatus for flexible printed board using the same
JP2010272650A (en) Substrate holding and carrying jig, substrate pressing member, pressing member removal jig, metal mask plate, carrying method of printed wiring substrate, method of manufacturing wiring substrate with electronic component, substrate carrying device
CN103889162A (en) Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture
KR101442706B1 (en) Taping jig for finishing PCB and taping method for PCB using the same
JP4815329B2 (en) Mask holding device and mask attaching / detaching method
TW201244566A (en) Unit circuit board replacing method of composite substrate and composite substrate
TW200746961A (en) Solder substrate processing jig, and bonding method of solder powder to electronic circuit board
JP4862584B2 (en) Conveying jig for flexible wiring board and electronic component mounting method using the same
TW200742513A (en) Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
TWI439979B (en) Electronic paper structure and method for faricating electronic paper
JP4724926B2 (en) Film forming jig, magnet used therefor, film forming apparatus and film forming method
JP2007165408A (en) Method and apparatus for positioning flexible printed wiring board onto component mounting carrier tool
JP2010171353A (en) Holding jig for mounting printed circuit board and method of holding printed circuit board
JP2005183424A (en) Thin substrate fixing jig
JP3151419U (en) Rotating board holding jig fixing auxiliary tool for printed board holding and conveying jig
JP2004359270A (en) Fixture for holding and carrying
JP2006203094A (en) Fixing tool for electronic component
JP2004349570A (en) Adhesion palette for conveying substrate
LU93430B1 (en) Magnetic jig applied to manufacturing of fpc
JP5611665B2 (en) Substrate transfer jig