CN106507657B - A kind of electronic component transmitting device and electronic component automatic double surface gluer - Google Patents
A kind of electronic component transmitting device and electronic component automatic double surface gluer Download PDFInfo
- Publication number
- CN106507657B CN106507657B CN201610948959.7A CN201610948959A CN106507657B CN 106507657 B CN106507657 B CN 106507657B CN 201610948959 A CN201610948959 A CN 201610948959A CN 106507657 B CN106507657 B CN 106507657B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- gluing
- fixed
- coating system
- fixed fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
Abstract
The present invention discloses a kind of electronic component transmitting device and electronic component automatic double surface gluer.Electronic component automatic double surface gluer includes: electronic component coating system, the electronic component transportation system with the cooperation of electronic component coating system.Electronic component coating system is used to carry out gluing to the surface of electronic component, electronic component transportation system is for carrying out transport transfer to electronic component, or electronic component is delivered at electronic component coating system, or electronic component is transferred out from electronic component coating system.Electronic component automatic double surface gluer of the invention, electronic component transportation system by setting electronic component coating system and with the cooperation of electronic component coating system, and the structure of electronic component coating system and electronic component transportation system is optimized, improve the mechanical automation production level of equipment entirety.
Description
Technical field
The present invention relates to technical field of mechanical automation, more particularly to a kind of electronic component transmitting device and electronics member
Device automatic double surface gluer.
Background technique
It is constantly progressive as society continues to develop with science and technology, mechanization, automation, standardized production have been increasingly becoming hair
Exhibition trend, and traditional hand labour is gradually replaced, new power is filled with for the sustainable development of enterprise.Therefore, electronics produces
Product manufacturing enterprise is also required to grow with each passing hour, and by transition and upgrade, greatly develops mechanical automation equipment to replace traditional craft
Labour, and then the productivity effect of enterprise is improved, realize the sustainable development of enterprise.
It in the real process of production, needs to carry out gluing on the surface of electronic component, to meet corresponding production
Technique requirement.It is small in size since electronic component belongs to precise part, the research staff of enterprise easily damaged by slight impact
In equipment development, to realize to the mechanical automation gluing of electronic component, the characteristic special consideration should be given to electronic component is needed,
How to realize the accurate positionin of electronic component, how to reduce the vibration, etc. of electronic component during transportation, it is above-mentioned all
It is the practical problem for needing to solve.
Summary of the invention
The purpose of the present invention is overcoming shortcoming in the prior art, a kind of raising mechanical automation production level is provided
A kind of electronic component transmitting device and electronic component automatic double surface gluer.
The purpose of the present invention is achieved through the following technical solutions:
A kind of electronic component transmitting device, comprising: electronic component horizontal transport assembly line is set to the electronics member device
The electronic component horizontal transport baffle of part horizontal transport assembly line two sides is placed in the electronic component horizontal transport flowing water
Electronic component fixed fixture, electronic component on line stop current-limiting apparatus；
The electronic component horizontal transport assembly line is the conveyer belt knot that transmission intercal is formed among two parallel arrangeds
Structure；
The electronic component stops current-limiting apparatus to include: that electronic component stops current limliting power part, electronic component resistance
Limiting block is kept off, the electronic component stops current limliting power part that the electronic component is driven to stop limiting block past along the vertical direction
Multiple lifting, so that the electronic component stops limiting block to be arranged in the transmission intercal or be detached from the transmission intercal；
The electronic component fixed fixture includes: the fixed bottom plate of electronic component, electronic component fixed top plate, electronics
Component fixes buffer board, and the fixed top plate of the electronic component is fixed on the fixed bottom plate of the electronic component, the electricity
Hollow container is formed between the fixed bottom plate of sub- component and the fixed top plate of the electronic component, the electronic component is fixed
Buffer board is contained on the hollow container, and the fixed bottom plate of the electronic component is equipped with the fixed elasticity of electronic component
Part, the fixed buffer board of the electronic component are installed on the electronic component by the fixed elastic component of the electronic component and consolidate
Determine on bottom plate, the fixed buffer board of the electronic component is equipped with magnet, offered on the fixed top plate of the electronic component with
The electronic component accepting hole of the hollow container perforation, the magnet are arranged in the electronic component accepting hole.
The electronic component stops current limliting power part to be air cylinder structure in one of the embodiments,.
The fixed elastic component of the electronic component is spring in one of the embodiments,.
The fixed elastic component of the electronic component is rubber bar in one of the embodiments,.
A kind of electronic component automatic double surface gluer, comprising: electronic component coating system and electronic component gluing system
The electronic component transportation system of conjunction under unified central planning；
The electronic component coating system includes: gluing support frame, gluing horizontally moving device, gluing vertical lifting dress
It sets, electronic component glue stations；The gluing horizontally moving device is installed on the gluing support frame, and the gluing is vertical
Lifting device is installed on the gluing horizontally moving device, and it is vertical that the electronic component glue stations is installed on the gluing
On lifting device, the gluing horizontally moving device drives the gluing vertical lifting device to move back and forth in the horizontal direction, institute
Stating gluing vertical lifting device drives the electronic component glue stations back and forth to go up and down along the vertical direction；
The electronic component transportation system includes: above-mentioned electronic component transmitting device and the electronic component
The electronic component jacking apparatus of transmitting device cooperation.
Electronic component automatic double surface gluer of the invention is applied by setting electronic component coating system and with electronic component
The electronic component transportation system of colloid system cooperation, and to the knot of electronic component coating system and electronic component transportation system
Structure optimizes, and improves the mechanical automation production level of equipment entirety.
Detailed description of the invention
Fig. 1 is the structure chart of the electronic component automatic double surface gluer of one embodiment of the invention；
Fig. 2 is the structure chart at another visual angle of electronic component automatic double surface gluer shown in FIG. 1；
Fig. 3 is the structure chart of the electronic component coating system of electronic component automatic double surface gluer shown in FIG. 1；
Fig. 4 is the structure chart of the electronic component transportation system of electronic component automatic double surface gluer shown in FIG. 1；
Fig. 5 is the structure chart at another visual angle of electronic component transportation system shown in Fig. 4；
Fig. 6 is the structure chart of the electronic component transmitting device of electronic component transportation system shown in Fig. 4；
Fig. 7 is the structure chart of the electronic component fixed fixture of electronic component transmitting device shown in fig. 6；
Fig. 8 is the internal structure chart of electronic component fixed fixture shown in Fig. 7；
Fig. 9 is the structure chart of the electronic component jacking apparatus of electronic component transportation system shown in Fig. 4；
Figure 10 is another viewing angle constructions figure of electronic component jacking apparatus shown in Fig. 9；
Figure 11 is the structure chart at the another visual angle of electronic component jacking apparatus shown in Fig. 9.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
As shown in Figures 1 and 2, a kind of electronic component automatic double surface gluer 10, comprising: electronic component coating system 100, with
The electronic component transportation system 200 that electronic component coating system 100 cooperates.
Electronic component coating system 100 is used to carry out gluing, electronic component delivery system to the surface of electronic component
System 200 is used to carry out transport transfer to electronic component, or electronic component is delivered to electronic component coating system 100
Place, or electronic component is transferred out from electronic component coating system 100.
As shown in figure 3, electronic component coating system 100 includes: gluing support frame 110, gluing horizontally moving device
120, gluing vertical lifting device 130, electronic component glue stations 140.
Gluing support frame 110 is used for gluing horizontally moving device 120, gluing vertical lifting device 130, electronic component
Glue stations 140 is supported, and gluing horizontally moving device 120 is for driving gluing vertical lifting device 130 in the horizontal direction
Mobile, gluing vertical lifting device 130 is for driving electronic component glue stations 140 to move along the vertical direction, electronics member device
Part glue stations 140 is used to carry out gluing to electronic component.
Gluing horizontally moving device 120 is installed on gluing support frame 110, and gluing vertical lifting device 130 is installed on painting
On glue horizontally moving device 120, electronic component glue stations 140 is installed on gluing vertical lifting device 130.Gluing is horizontal
Mobile device 120 drives gluing vertical lifting device 130 to move back and forth in the horizontal direction, and gluing vertical lifting device 130 drives
The reciprocal lifting along the vertical direction of electronic component glue stations 140.
Gluing support frame 110 includes: support baseboard 111, roof supporting 112, support riser 113, support baseboard 111 and branch
Between support plate 112 be spaced and by support riser 113 connect, support baseboard 111, roof supporting 112 and support riser 113 it
Between form accommodating space 114, offer on roof supporting 112 vertically through slot 115, support offered on riser 113 it is horizontal logical
Slot 116 is crossed, gluing vertical lifting device 130 drives electronic component glue stations 140 back and forth to go up and down and wear along the vertical direction
Pass through slot 116 in level.
Gluing horizontally moving device 120 include: gluing moves horizontally power part 121, gluing moves horizontally transmission shaft 122,
The gluing of two parallel intervals setting moves horizontally transmission belt 123, four rolling seat 124.Roller mount 124 is fixed on roof supporting
On 112, the both ends that every cementing translates dynamic transmission belt 123 are respectively provided with a roller mount 124, and gluing moves horizontally transmission belt
123 are set around in roller mount 124, and gluing moves horizontally one end of transmission shaft 122 and a wherein cementing translates dynamic transmission belt
One of roller mount 124 on 123 connects, and gluing moves horizontally the other end of transmission shaft 122 and another cementing translates
One of roller mount 124 in dynamic transmission belt 123 connects, and gluing moves horizontally power part 121 and gluing moves horizontally transmission
Axis 122 is drivingly connected.In the present embodiment, it is motor driven that gluing, which moves horizontally power part 121, and further, gluing is horizontal
Mobile power part 121 is servo motor.
Gluing vertical lifting device 130 includes: gluing vertical lifting support transverse slat 131, gluing vertical lifting support riser
132, gluing vertical lifting driving portion 133.Gluing vertical lifting supports the both ends of transverse slat 131 dynamic with two cementing translations respectively
Transmission belt 123 connects, and gluing vertical lifting support riser 132 is fixed on gluing vertical lifting support transverse slat 131, and gluing is vertical
Lifting driving portion 133 is installed on gluing vertical lifting support riser 132.In the present embodiment, gluing vertical lifting driving portion
133 drive for cylinder.
Electronic component glue stations 140 includes: electronic component gluing substrate 141, electronic component painting elastomer
142, electronic component gluing head 143.Electronic component gluing substrate 141 slides along the vertical direction is set to gluing vertical lifting branch
It supportting on riser 132, gluing vertical lifting driving portion 133 drives the reciprocal lifting along the vertical direction of electronic component gluing substrate 141,
Electronic component gluing head 143 applies elastomer 142 by electronic component and is installed on electronic component gluing substrate 141.
In the present embodiment, it is spring that electronic component, which applies elastomer 142,.In other embodiments, electronic component applies glue elasticity
Part 142 is rubber bar.
Gluing moves horizontally power part 121 and drives cementing translation dynamic by the effect that gluing moves horizontally transmission shaft 122
Transmission belt 123 is driven around roller mount 124, due to gluing vertical lifting support transverse slat 131 both ends respectively with two gluings
The connection of transmission belt 123 is moved horizontally, gluing moves horizontally transmission belt 123 and then drives gluing vertical lifting support 131 edge of transverse slat
Horizontal direction is mobile, and gluing vertical lifting driving portion 133 drives electronic component gluing substrate 141 is reciprocal along the vertical direction to rise
Drop, and then the reciprocal lifting along the vertical direction of electronic component gluing head 143 is driven, it is final to realize electronic component gluing head 143
Along horizontal and vertical two freedom degree activities, to realize the gluing to electronic component.
It is noted that applying elastomer 142 by setting electronic component, electronic component applies elastomer 142 and is
Electronic component gluing head 143 provides elastic buffer power, prevents electronic component gluing head 143 from occurring to touch firmly with electronic component
It hits, reduces the scuffing to electronic component surface.
It should also be noted that gluing, which moves horizontally transmission belt 123, is provided with two, gluing vertical lifting supports transverse slat 131
Both ends dynamic transmission belts 123 is translated with two cementings respectively connect, gluing vertical lifting support 131 stress of transverse slat can be made
More uniform, horizontal movement is more stable, and then improves the stability to electronic component gluing.
As shown in Figures 4 and 5, electronic component transportation system 200 includes: electronic component transmitting device 300 and electronics
The electronic component jacking apparatus 400 that component transmitting device 300 cooperates.It is perpendicular that electronic component transmitting device 300 wears support
Level on plate 113 passes through slot 116 and is partially housed in accommodating space 114, and electronic component jacking apparatus 400 is contained in
Hold in space 114.
Electronic component transmitting device 300 for transmitting to electronic component, use by electronic component jacking apparatus 400
It is jacked up in by the electronic component in electronic component transmitting device 300, facilitates electronic component coating system 100 to electronics member
Device carries out gluing.
Particularly, it is offered on roof supporting 112 vertically through slot 115, supports and offer level on riser 113 and pass through slot
116, facilitate electronic component jacking apparatus 400 to jack electronic component to glue sites vertically through slot 115, level is logical
It crosses slot 116 to facilitate electronic component transmitting device 300 to wear and pass through, facilitates electronic component transmitting device 300 by electronics member
Device is transported to electronic component jacking apparatus 400, after the completion of gluing, also facilitates electronic component transmitting device 300 from electricity
Next station is transferred at sub- component jacking apparatus 400.Electronic component transmitting device 300 and electronic component jacking dress
It sets 400 to be partially housed in accommodating space 114, so that volume occupied by equipment entirety is smaller, improves integration degree.
As shown in fig. 6, electronic component transmitting device 300 includes: electronic component horizontal transport assembly line 310, is set to
The electronic component horizontal transport baffle 320 of 310 two sides of electronic component horizontal transport assembly line is placed in electronic component water
Flat pass electronic component fixed fixture 330 on defeated assembly line 310, electronic component stops current-limiting apparatus 340.
Electronic component horizontal transport assembly line 310 is the conveyer belt that transmission intercal 311 is formed among two parallel arrangeds
Structure.
Electronic component stops current-limiting apparatus 340 to include: that electronic component stops current limliting power part 341, electronic component
Stop limiting block 342.Electronic component stops current limliting power part 341 that electronic component is driven to stop limiting block 342 along vertical side
To reciprocal lifting, so that electronic component stops limiting block 342 to be arranged in transmission intercal 311 or be detached from transmission intercal 311.
In the present embodiment, electronic component stops current limliting power part 341 to be air cylinder structure.
As shown in Figures 7 and 8, electronic component fixed fixture 330 includes: the fixed bottom plate 331 of electronic component, electronics member
Device fixes the fixed buffer board 333 of top plate 332, electronic component.The fixed top plate 332 of electronic component is fixed on electronic component
On fixed bottom plate 331, hollow container is formed between the fixed bottom plate 331 of electronic component and the fixed top plate 332 of electronic component,
The fixed buffer board 333 of electronic component is contained on the hollow container.The fixed bottom plate 331 of electronic component is equipped with electronics
Component fixes elastic component 334, and the fixed buffer board 333 of electronic component is installed on by the fixed elastic component 334 of electronic component
On the fixed bottom plate 331 of electronic component.The fixed buffer board 333 of electronic component is equipped with magnet 335, the fixed top of electronic component
The electronic component accepting hole 336 with the hollow container perforation is offered on plate 332, magnet 335 is arranged in electronics member device
Part accepting hole 336.In the present embodiment, the fixed elastic component 334 of electronic component is spring.In other embodiments, electronics member
The fixed elastic component 334 of device is rubber bar.
It is noted that the two sides of electronic component horizontal transport assembly line 310 are equipped with electronic component horizontal transport
Baffle 320, electronic component horizontal transport baffle 320 limit electronic component fixed fixture 330, prevent electronics member device
Part fixed fixture 330 is fallen in the case of vibrations, to improve electronic component fixed fixture 330 in electronics member device
The stability transported on part horizontal transport assembly line 310.
It is noted that electronic component stops current-limiting apparatus 340 to be used for electronic component horizontal transport assembly line 310
On electronic component fixed fixture 330 stopped, when electronic component fixed fixture 330 reach designated position when, electronics
Component stops current limliting power part 341 to drive electronic component that limiting block 342 is stopped to be stretched out, and prevents electronic component fixed fixture
330 move forward on electronic component horizontal transport assembly line 310.
It is noted that electronic component fixed fixture 330 is equipped with the fixed buffer board 333 of electronic component, electronics member device
The fixed buffer board 333 of part is installed on the fixed bottom plate 331 of electronic component by the fixed elastic component 334 of electronic component, into one
Step, the fixed buffer board 333 of electronic component is equipped with magnet 335, offered on the fixed top plate 332 of electronic component with it is described
The electronic component accepting hole 336 of hollow container perforation, magnet 335 are arranged in electronic component accepting hole 336, electronics member device
Part is then placed in electronic component accepting hole 336, such structure setting, due to the work of the fixed buffer board 333 of electronic component
With can reduce the vibration influence to electronic component, prevent gluing head and electronic component from hard collision occurs, improve to electricity
The yield of sub- component gluing.
It should also be noted that the electronic component in electronic component accepting hole 336 is sucked magnet 335, on the one hand may be used
It is fallen with preventing electronic component from occurring shaking when transport, electronic component on the other hand can be improved and applying
Stability when glue.
As shown in Fig. 9, Figure 10 and Figure 11, electronic component jacking apparatus 400 includes: electronic component jacking horizontal drive
Portion 410, electronic component jacking support frame 420, fixed fixture restriction 430, fixed fixture limit pressing plate 440, fixed fixture
Positioning region 450, fixed fixture jacking portion 460.In the present embodiment, electronic component jacking horizontal drive portion 410 is motor silk
Bar driving structure.In other embodiments, electronic component jacking horizontal drive portion 410 is cylinder driving structure.
Electronic component jacks horizontal drive portion 410 and drives electronic component jacking support frame 420 reciprocal in the horizontal direction
It is mobile, fixed fixture restriction 430, fixed fixture limit pressing plate 440, fixed fixture positioning region 450 and fixed fixture jacking portion
460 are installed on electronic component jacking support frame 420.
Fixed fixture restriction 430 includes: fixed fixture current limliting cylinder 431, fixed fixture current limliting bar 432.Fixation is controlled
Have current limliting cylinder 431 and drive the reciprocal lifting along the vertical direction of fixed fixture current limliting bar 432, so that fixed fixture current limliting bar
432 are arranged in transmission intercal 311 or are detached from transmission intercal 311.
Fixed fixture limit pressing plate 440 is located at 310 top of electronic component horizontal transport assembly line, and electronic component is fixed
Jig 330 is limited between electronic component horizontal transport assembly line 310 and fixed fixture limit pressing plate 440.
Fixed fixture positioning region 450 includes: fixed fixture positioning cylinder 451, fixed fixture positioning plate 452, is installed on admittedly
Determine the fixed fixture positioning column 453 on jig positioning plate 452.Fixed fixture positioning cylinder 451 drives fixed fixture positioning plate 452
Reciprocal lifting along the vertical direction.In the present embodiment, the quantity of fixed fixture positioning column 453 is two.
The location hole 337 cooperated with fixed fixture positioning column 453 is offered in electronic component fixed fixture 330.
Fixed fixture jacking portion 460 includes: fixed fixture jacking cylinder 461, fixed fixture raising plate 462.Fixed fixture
Jacking cylinder 461 drives the reciprocal lifting along the vertical direction of fixed fixture raising plate 462, so that fixed fixture raising plate 462 is worn
Set on transmission intercal 311 or it is detached from transmission intercal 311.
It is noted that fixed fixture restriction 430 is used for the electronics on electronic component horizontal transport assembly line 310
Component fixed fixture 330 carries out blocking current limliting, after electronic component fixed fixture 330 reaches designated position, in electronics member
Under the action of device jacking apparatus 400, by electronic component fixed fixture 330 from electronic component horizontal transport assembly line 310
Upper ejection prevents electronics so that electronic component fixed fixture 330 is detached from from electronic component horizontal transport assembly line 310
Component fixed fixture 330 and electronic component horizontal transport assembly line 310 occur friction and generate vibration, improve to electronics
The stability of component gluing.
It is noted that pressing plate 440 is limited by setting fixed fixture, it will under the action of fixed fixture jacking portion 460
Electronic component fixed fixture 330 is ejected from electronic component horizontal transport assembly line 310, is limited by fixed fixture limit pressure
Plate 440, electronic component fixed fixture 330 are limited in certain position and cannot continue to rise.Meanwhile fixed fixture positioning region
450 movement, fixed fixture positioning cylinder 451 drive fixed fixture positioning plate 452 decline so that fixed fixture positioning column 453 with
Location hole 337 in electronic component fixed fixture 330 cooperates, further to the position of electronic component fixed fixture 330 into
Row limits, and lays the foundation for the subsequent accurate gluing to electronic component.
Particularly, electronic component horizontal transport assembly line 310 is that transmission intercal 311 is formed among two parallel arrangeds
Conveyer structure, fixed fixture raising plate 462 are passed through from transmission intercal 311, by electronic component fixed fixture 330 from electronics
It ejects on component horizontal transport assembly line 310, is asked to solve by what electronic component fixed fixture 330 ejected
Topic.
It should also be noted that electronic component jacking horizontal drive portion 410 drives electronic component to jack 420 edge of support frame
Horizontal direction move back and forth, and then can be set to electronic component jacking support frame 420 on fixed fixture restriction 430,
Fixed fixture limits pressing plate 440, fixed fixture positioning region 450 and fixed fixture jacking portion 460 carry out horizontal position adjustment, can be with
Gluing is carried out to the electronic component of different model, improves the compatibility to electronic component gluing.
Electronic component automatic double surface gluer 10 of the invention, by setting electronic component coating system 100 and with electronics member
The electronic component transportation system 200 that device coating system 100 cooperates, and to electronic component coating system 100 and electronics member
The structure of device transportation system 200 optimizes, and improves the mechanical automation production level of equipment entirety.
Only several embodiments of the present invention are expressed for embodiment described above, and the description thereof is more specific and detailed, but
It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to of the invention
Protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (5)
1. a kind of electronic component transmitting device characterized by comprising electronic component horizontal transport assembly line is set to institute
It states the electronic component horizontal transport baffle of electronic component horizontal transport assembly line two sides, be placed in the electronic component water
Flat pass electronic component fixed fixture on defeated assembly line, electronic component stops current-limiting apparatus；The electronic component is horizontal
Transmitting assembly line is the conveyer structure that transmission intercal is formed among two parallel arrangeds；The electronic component stops current limliting dress
Setting includes: that electronic component stops current limliting power part, electronic component to stop limiting block, and the electronic component stops current limliting dynamic
Power portion drives the electronic component that limiting block is stopped back and forth to go up and down along the vertical direction, so that the electronic component stops limit
Stream block is arranged in the transmission intercal or is detached from the transmission intercal；The electronic component fixed fixture includes: electronics member
Device fixes the fixed top plate of bottom plate, electronic component, the fixed buffer board of electronic component, and the fixed top plate of the electronic component is solid
Due on the fixed bottom plate of the electronic component, the fixed bottom plate of the electronic component and the fixed top plate of the electronic component it
Between form hollow container, the fixed buffer board of the electronic component is contained on the hollow container, the electronics member device
The fixed bottom plate of part is equipped with the fixed elastic component of electronic component, and the fixed buffer board of the electronic component passes through the electronics member device
The fixed elastic component of part is installed on the fixed bottom plate of the electronic component, and the fixed buffer board of the electronic component is equipped with magnetic
Iron, the electronic component fixes the electronic component accepting hole offered on top plate with the hollow container perforation, described
Magnet is arranged in the electronic component accepting hole, and the electronic component is placed in the electronic component accepting hole.
2. electronic component transmitting device according to claim 1, which is characterized in that the electronic component stops current limliting
Power part is air cylinder structure.
3. electronic component transmitting device according to claim 1, which is characterized in that the fixed elasticity of the electronic component
Part is spring.
4. electronic component transmitting device according to claim 1, which is characterized in that the fixed elasticity of the electronic component
Part is rubber bar.
5. a kind of electronic component automatic double surface gluer characterized by comprising electronic component coating system and electronics member
The electronic component transportation system of device coating system cooperation；The electronic component coating system includes: gluing support frame, applies
Glue horizontally moving device, gluing vertical lifting device, electronic component glue stations；The gluing horizontally moving device is installed on
On the gluing support frame, the gluing vertical lifting device is installed on the gluing horizontally moving device, the electronics member
Device glue stations is installed on the gluing vertical lifting device, and the gluing horizontally moving device drives the gluing vertical
Lifting device moves back and forth in the horizontal direction, and the gluing vertical lifting device drives the electronic component glue stations along perpendicular
Histogram is gone up and down to reciprocal；The electronic component transportation system includes: the member of electronics described in any one of Claims 1-4
Device transmission device, the electronic component jacking apparatus with electronic component transmitting device cooperation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610948959.7A CN106507657B (en) | 2016-10-26 | 2016-10-26 | A kind of electronic component transmitting device and electronic component automatic double surface gluer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610948959.7A CN106507657B (en) | 2016-10-26 | 2016-10-26 | A kind of electronic component transmitting device and electronic component automatic double surface gluer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106507657A CN106507657A (en) | 2017-03-15 |
| CN106507657B true CN106507657B (en) | 2019-02-26 |
Family
ID=58322160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610948959.7A Expired - Fee Related CN106507657B (en) | 2016-10-26 | 2016-10-26 | A kind of electronic component transmitting device and electronic component automatic double surface gluer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106507657B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11396392B2 (en) * | 2017-11-17 | 2022-07-26 | Tzu-Chung CHEN | Parallel method for packaging electronic component and coating adhesive on carrier tape and mechanism for same |
| CN112871591B (en) * | 2021-04-30 | 2021-08-10 | 山东云豪卫生用品股份有限公司 | Panty-shape diapers production is with spouting mucilage binding fast and is put |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001053430A (en) * | 1999-08-12 | 2001-02-23 | Daishinku Corp | Bonding material coating jig for electronic part element |
| JP2011029568A (en) * | 2009-07-27 | 2011-02-10 | Taisei:Kk | Holding fixture and holding method for mounting thin-plate printed wiring board |
| CN202006360U (en) * | 2011-01-18 | 2011-10-12 | 福群科技集团有限公司 | Automatic metal post assembly device for hard disk drive frame |
| CN203076789U (en) * | 2013-02-06 | 2013-07-24 | 东莞富强电子有限公司 | Automatic spot welding equipment |
| CN203955452U (en) * | 2014-07-01 | 2014-11-26 | 东莞市纳声电子设备科技有限公司 | Adhesive dispensing robot |
| CN205213260U (en) * | 2015-12-09 | 2016-05-04 | 深圳市汇众森科技有限公司 | Electronic component's equipment tool |
| CN205392884U (en) * | 2016-02-26 | 2016-07-27 | 东莞市上合旺盈印刷有限公司 | Novel point is glued device |
-
2016
- 2016-10-26 CN CN201610948959.7A patent/CN106507657B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001053430A (en) * | 1999-08-12 | 2001-02-23 | Daishinku Corp | Bonding material coating jig for electronic part element |
| JP2011029568A (en) * | 2009-07-27 | 2011-02-10 | Taisei:Kk | Holding fixture and holding method for mounting thin-plate printed wiring board |
| CN202006360U (en) * | 2011-01-18 | 2011-10-12 | 福群科技集团有限公司 | Automatic metal post assembly device for hard disk drive frame |
| CN203076789U (en) * | 2013-02-06 | 2013-07-24 | 东莞富强电子有限公司 | Automatic spot welding equipment |
| CN203955452U (en) * | 2014-07-01 | 2014-11-26 | 东莞市纳声电子设备科技有限公司 | Adhesive dispensing robot |
| CN205213260U (en) * | 2015-12-09 | 2016-05-04 | 深圳市汇众森科技有限公司 | Electronic component's equipment tool |
| CN205392884U (en) * | 2016-02-26 | 2016-07-27 | 东莞市上合旺盈印刷有限公司 | Novel point is glued device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106507657A (en) | 2017-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106516557B (en) | A kind of electronic component transport system and electronic component automatic double surface gluer | |
| US20170157724A1 (en) | Device for automatically mounting screw and automatically mounting system | |
| CN103722376B (en) | Remote controller mounting equipment | |
| CN106563613B (en) | A kind of electronic component coating system and electronic component automatic double surface gluer | |
| CN106973518A (en) | A kind of efficient automatic chip mounting equipment | |
| CN106507657B (en) | A kind of electronic component transmitting device and electronic component automatic double surface gluer | |
| CN103771113A (en) | Material conveying device | |
| CN102683233B (en) | Die bonder | |
| CN204322045U (en) | A kind of tool for mechanical machining holder | |
| CN206697730U (en) | Charger part plug assembly | |
| CN109865644B (en) | Material carrying mechanism for dispensing irregular products | |
| CN205343057U (en) | A platform structure for positioning | |
| CN106548962A (en) | A kind of electronic devices and components automatic double surface gluer | |
| CN106423758A (en) | Electronic component lifting device and electronic component gluing equipment | |
| CN204713986U (en) | Elevator structure | |
| CN203725333U (en) | Single-pinhole glue dispensing device | |
| CN205522959U (en) | Alignment platform | |
| CN203509544U (en) | Assembling device of screws, spring washers and flat washers | |
| CN103086194A (en) | Multi-axis flying pork winding machine | |
| CN207472528U (en) | A kind of directional drop tester | |
| CN102992642A (en) | Substrate supply device | |
| CN205166587U (en) | Glass finishing impression equipment | |
| CN204031619U (en) | A kind of placement head | |
| CN204974339U (en) | Glue dispensing machine | |
| CN204642945U (en) | A kind of rail transport mechanism of valve holder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191204 Address after: Room c506a-19, University Business Park, No. 99, University Road, Xuzhou hi tech Industrial Development Zone, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Tiancheng Intelligent Technology Co., Ltd Address before: 516003 Huizhou, Zhejiang Province, the city of civilization on the 1st Road, No. three, CITIC City times, unit 11, layer 04, No. 1, No. Patentee before: Zheng Jianling |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200902 Address after: Dongfeng Road, WeiMiao Town, Pei County, Xuzhou City, Jiangsu Province, 221000 Patentee after: Jiangsu Zhida Electronic Materials Co., Ltd Address before: Room c506a-19, University Business Park, No. 99, University Road, Xuzhou hi tech Industrial Development Zone, Xuzhou City, Jiangsu Province Patentee before: Xuzhou Tiancheng Intelligent Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190226 Termination date: 20201026 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |