CN102992642A - Substrate supply device - Google Patents

Substrate supply device Download PDF

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Publication number
CN102992642A
CN102992642A CN2012103278310A CN201210327831A CN102992642A CN 102992642 A CN102992642 A CN 102992642A CN 2012103278310 A CN2012103278310 A CN 2012103278310A CN 201210327831 A CN201210327831 A CN 201210327831A CN 102992642 A CN102992642 A CN 102992642A
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CN
China
Prior art keywords
chain
wales
substrate
main platform
arm
Prior art date
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Granted
Application number
CN2012103278310A
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Chinese (zh)
Other versions
CN102992642B (en
Inventor
西尾勤
魏志丹
横山雅树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chugai Ro Co Ltd
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Chugai Ro Co Ltd
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Filing date
Publication date
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Publication of CN102992642A publication Critical patent/CN102992642A/en
Application granted granted Critical
Publication of CN102992642B publication Critical patent/CN102992642B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention discloses a substrate supply device (1) capable of realizing the replacement of substrates within a short time, which comprises a plurality of arm parts (4) capable of integrally rotating and moving up and down and symmetrically arranged relative to a rotation shaft; a plurality of small platforms (6) respectively supported with a clearance between each of the arm parts (4) and used for holding the substrate; and a main platform (7) used for loading the small platforms (6) by means of the rotation and the lifting of the arm parts (4). The main platform (7) is provided with a platform holding mechanism used for positioning and holding the small platforms (6).

Description

The substrate feedway
Technical field
The present invention relates to a kind of for substrate being supplied to substrate processing device and with its substrate feedway of therefrom discharging.
Background technology
In the manufacturing of panel display board etc., has the operation of using the die coating machine that glass substrate is applied.In order to form filming of even thickness at substrate, substrate need to be located exactly maintenance and die head is moved, keep evenly with the gap with substrate and die head.Therefore, as Japanese Patent Laid-Open 2002-200450 communique was disclosed, normal operation was fixed with device be used to the guide rail that die head is moved at the platform that substrate is kept.
In addition, in order to dispose and discharge (replacing) substrate at this platform, for example, as Japanese patent laid-open 5-45641 communique is disclosed, be provided with to utilize from the outstanding pin of platform substrate is lifted, and the arm of robot is stretched into the structure that substrate is taken out.But, if the shortening coating cycle, and after being coated with coating, with pin substrate is lifted immediately, then because the substrate deflection, and make coating flow under the state of sunk part dryly, therefore, can make thickness become inhomogeneous.Therefore, because the coating cycle of shortening substrate can be sacrificed the homogeneity of thickness, therefore, can't improve manufacturing capacity.
In Japanese Patent Laid-Open 2002-102771 communique, disclose and a kind ofly at very large platform the station of two mounting substrates has been set, and the metallic paint machine is configured to can be at the mobile device of two stations.In this device, as long as on a side station during coated substrate, the substrate of changing the opposing party's station get final product, therefore, and the processing power height.But, the robot that two stations is changed substrates need to be arranged respectively, thereby exist device to maximize and make cost uprise such problem.In addition, because the amount of movement of die head is very large, therefore, also produce easily error.
Summary of the invention
In view of the above problems, technical problem of the present invention is to provide a kind of substrate feedway that can change at short notice substrate.
For solving the problems of the technologies described above, substrate feedway of the present invention comprises: a plurality of arms, these arms are arranged to and can be rotated integratedly and lifting, and arrange symmetrically around the shaft; A plurality of chain-waless, these chain-waless be supported to respectively and above-mentioned arm between have play, and above-mentioned chain-wales can keep substrate; And main platform, this main platform utilizes the rotation of above-mentioned arm and lifting to load above-mentioned chain-wales, and is included in the interior platform maintaining body that above-mentioned chain-wales is positioned and keeps of scope of above-mentioned play.
Pass through said structure, owing to can be under remaining in the state of chain-wales substrate be supplied to coating unit or processing unit (plant) and substrate discharged from said apparatus, therefore, applying (processing) afterwards, can in non-deflecting situation, substrate be discharged, and supply with next piece substrate.Therefore, in the situation of the time before after not shortening coating (processing), extremely substrate being lifted, shorten the coating cycle.In addition, by between chain-wales and arm, play being set, thereby can finely tune position and the posture of chain-wales on main platform, and can determine exactly to apply or add position and the posture of substrate in man-hour.In addition, substrate feedway of the present invention needs only the robot of a treatment substrate, does not also need to increase the movable range of coating unit or processing unit (plant), therefore, can provide at an easy rate.
In addition, in substrate feedway of the present invention, above-mentioned chain-wales is built-in with from the teeth outwards outstanding supporting pin so that aforesaid substrate is lifted, the aforesaid substrate feedway also comprises driving mechanism, when in above-mentioned arm one remains on above-mentioned chain-wales on the above-mentioned main platform, the downside of the above-mentioned chain-wales that this actuator configuration supports at other above-mentioned arm, above-mentioned driving mechanism has the drive pin with above-mentioned supporting pin jack-up, and above-mentioned drive pin and above-mentioned supporting pin constitute by magnetic force and attract each other.
By said structure, owing to can supporting pin be retreated reliably by retreating of magnetic force and drive pin, therefore, do not need to dispose the member to the supporting pin application of force in chain-wales inside, thereby simple in structure, it is large that the thickness of chain-wales can not become yet.
In addition, in substrate feedway of the present invention, above-mentioned platform maintaining body also can have the air cushion that above-mentioned chain-wales is supported by air pressure.
By said structure, the part that supports owing to the weight to chain-wales is non-contacting, therefore, can prevent from changing because wearing and tearing make the height that substrate is kept.
In addition, in substrate feedway of the present invention, above-mentioned main platform also can support the device of processing aforesaid substrate.
By said structure because the position relationship between main platform and processing unit (plant) can not change, therefore, by with substrate orientation on chain-wales, and chain-wales is positioned on the main platform, thereby can keeps position relationship between substrate and processing unit (plant).
As mentioned above, the rotation (convolution) by arm is configured in a plurality of chain-waless on the main platform, therefore, can carry out simultaneously substrate towards the configuration of chain-wales with to the processing of substrate.In addition, by between chain-wales and arm, play being set, can on main platform, finely tune chain-wales, therefore, can keep substrate accurately man-hour adding.
Description of drawings
Fig. 1 is the stereographic map of substrate coating apparatus that comprises the substrate feedway of an embodiment of the present invention.
Fig. 2 is the side-view of the substrate coating apparatus of Fig. 1.
Fig. 3 is the local amplification view of the substrate coating apparatus of Fig. 1.
(nomenclature)
1 substrate feedway
2 rotary driving parts
3 turntables
4 arms
5 glass substrates
6 chain-waless
7 main platforms
8 pin driving mechanisms
9 locating devices
10 cylinders
11 grooves
12 air cushions
13 die heads
14 frameworks of advancing
15 guide rails
16 supporting pins
17 guide cylinders
18 slide blocks
19 magneticmetal sheets
20 cylinders
21 frameworks
22 drive pins
23 permanent magnets
24 mechanical manipulators
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.In Fig. 1 and Fig. 2, show the substrate coating apparatus of the substrate feedway 1 that comprises an embodiment of the present invention.Substrate feedway 1 comprises: turntable 3, this turntable 3 can be by rotary driving part 2 around vertical axle rotation and be supported to can VTOL (vertical take off and landing); Two pairs of arms 4, these arms 4 be arranged to two a pair of, and extend from turntable 3 towards radial outside; Two chain-waless 6, these two chain-waless 6 are supported in respectively each on the arm 4, and can keep glass substrate 5 by absorption; Main platform 7, this main platform 7 can keep a side chain-wales 6; And pin driving mechanism 8, this pin driving mechanism 8 is used for the chain-wales 6 of glass substrate 5 from the opposing party lifted.
Arm 4 to the mode that is mutually symmetrical with the rotating shaft around rotary driving part 2, that is to say the angle configurations with 180 °.Main platform 7 and pin driving mechanism 8 are configured on the axisymmetric position of rotary driving part, when a side chain-wales 6 remains on the main platform 7, the pin driving mechanism 8 just be positioned at the opposing party chain-wales 6 under.
Main platform 7 and pin driving mechanism 8 have respectively a plurality of locating devices 9, and the side butt of these locating devices 9 and chain-wales 6 is determined with level attitude and direction to chain-wales 6.Locating device 9 all is the actuators that can regulate the butt position of itself and chain-wales 6 butts, itself and the moving ground of cylinder 10 associations of being located at main platform 7, pin driving mechanism 8 and turntable 3, its with the play scope of arm 4 in level attitude and the direction (platform maintaining body) of definite chain-wales 6.
Chain-wales 6 has the groove 11 that can take in arm 4 in the bottom surface, but the width of the Width arm 4 of groove 11 is large, and is supported in the mode with play.Therefore, chain-wales 6 can move horizontally and horizontally rotate in the scope at this play on the arm 4.
Rotary driving part 2 Rotate 180 ° under making turntable 3 and arm 4 rise to when rotation not have the state of height (position shown in the two dot chain line of Fig. 2) of obstacle, and chain-wales 6 is configured in main platform 7 above after, turntable 3 and arm 4 are descended, chain-wales 6 is positioned on the main platform 7, arm 4 further drop to and groove 11 between produce the position in gap.
Main platform 7 has and utilizes air pressure to come the air cushion 12 that chain-wales 6 is supported with contactless state.Air cushion 12 is retained can be respectively regulate height by regulating air pressure, and the upper surface that is adjusted to chain-wales 6 is level at specified altitude, and chain-wales 6 is in the state that the air pressure that only depends on air cushion 12 just can keep.
Air cushion 12 and locating device 9 can be set different holding positions according to chain-wales 6.By this, even if having small skew or shape difference at each chain-wales 6, also the glass substrate 5 that is adsorbed in chain-wales 6 can be remained on the constant position and direction with respect to main platform 7.
In addition, in the present embodiment, owing to just utilize air cushion 12 to accept the weight of chain-wales 6 in non-contacting mode by air pressure, therefore, chain-wales 6 and air cushion 12 can not be worn, need only the height of setting an air cushion 12 according to chain-wales 6, then can all glass substrate 5 be remained on the same position exactly at every turn.In addition, also can come moment to position by locating device 9 and cylinder 10 with very little power.
Main platform 7 has the guide rail 15 that the framework 14 of advancing of opposite house type guides, and maintains the die head 13 that glass substrate 5 is applied at the framework 14 of advancing of this type.That is to say that 7 pairs on main platform is by making die head 13 move the processing unit (plant) of coated glass substrates 5 to support, and make die head 13 with respect to main platform 7 parallel strictly.Therefore, die head 13 can form filming of homogeneous film thickness to correctly locating the glass substrate 5 that remains on the main platform 7.
In addition, Fig. 3 represents the internal structure of chain-wales 6.Chain-wales 6 is driven by pin driving mechanism 8, and it is built-in with the supporting pin 16 that glass substrate 5 is lifted from chain-wales 6.Supporting pin 16 outstanding being arranged at can be on the slide block 18 of the guide cylinder 17 interior slips of imbedding chain-wales 6.Slide block 18 is equipped with magneticmetal sheet 19 at downside.
Pin driving mechanism 8 has outstanding being arranged on by cylinder 20 and is held in drive pin 22 on can the framework 21 of lifting, at the front end of drive pin 22 permanent magnet 23 that magneticmetal sheet 19 is adsorbed is installed.
Framework 21 by making pin driving mechanism 8 rises, slide block 18 jack-up of utilizing drive pin 22 to support supporting pin 16, thus glass substrate 5 is lifted from chain-wales 6.In addition, as shown in Figure 1, mechanical manipulator 24 is inserted the downside of glass substrates 5, and take off glass substrate 5 from chain-wales 6.
In addition, mechanical manipulator 24 is positioned in new glass substrate 5 on the supporting pin 16.After extracting mechanical manipulator 24, by pin driving mechanism 8 drive pin 22 is descended, supporting pin 16 is housed in the inside of chain-wales 6, glass substrate 5 is positioned on the chain-wales 6.
At this moment, control exactly the position of mechanical manipulator 24 mounting glass substrates 5 by the locating mechanism (not shown) etc. that utilizes image processing techniques and be built in chain-wales 6, remain on the chain-wales 6 thereby can make glass substrate 5 locate exactly and adsorb.Because glass substrate 5 is at every turn all identical with the relative position of chain-wales 6, therefore on main platform 7, as long as chain-wales 6 is positioned, just can make main platform 7 also at every turn identical with the relative position of glass substrate 5.
Like this, in the present embodiment, the chain-wales 6 that will keep the glass substrate 5 before applying by die head 13 is supplied to the main platform 7 that applies for to glass substrate 5, and the chain-wales 6 that will keep the glass substrate 5 after applying is taken out of from main platform 7.
To be formed with the glass substrate 5 of filming under the state that is kept by chain-wales 6, because arm 4 Rotate 180s ° move to pin driving mechanism 8 tops, in order exchanging with new glass substrate 5, by supporting pin 16 it to be lifted from chain-wales 6 afterwards.That is to say that the glass substrate 5 after the coating is in the state that is kept by chain-wales 6 in the process of arm 4 rotations, after having applied coating, just glass substrate 5 can not lifted.Therefore, coating remains under the smooth state of chain-wales 6 dry at glass substrate 5.Then, deflection occurs even if glass substrate 5 is lifted by pin driving mechanism 8, because coating drying, therefore, can not occur that coating flows to sunk part and the situation that makes membrane thickness unevenness.
Therefore, not only can increase from forming the filming to the time that is supported till pin 16 lifts of glass substrate 5, and can increase the piece number of coated glass substrate 5.
Therefore, in the present invention and since be with the play of arm 4 in chain-wales 6 location, so arm 4 can not separate fully with chain-wales 6, therefore, do not need for the special organization of arm 4 being located or guaranteed the maintenance of 4 pairs of chain-waless 6 of arm with respect to chain-wales 6.
In addition, in the present embodiment, owing to constitute supporting pin 16 jack-up in the thickness that utilizes drive pin 22 will remain on chain-wales 6, therefore, also can make the thickness of stroke ratio chain-wales 6 of cylinder 20 of pin driving mechanism 8 little, thereby can shorten the required time of drive pin 22 liftings, and can increase output.
In addition, because the permanent magnet 23 of drive pin 22 is adsorbed on the magneticmetal sheet 19 that moves with supporting pin 16 one, therefore, the decline of drive pin 22 is except gravity, and also effect has supporting pin 16 is drawn in power in the chain-wales 6.By this, even if do not arrange supporting pin 16 towards the spring of accommodating the direction application of force etc., also can realize reliably accommodating of supporting pin 16.Therefore, to supporting pin 16 keep simple in structure, and can make chain-wales 6 slimmings.

Claims (4)

1. a substrate feedway is characterized in that, comprising:
A plurality of arms, these arms are arranged to and can be rotated integratedly and lifting, and arrange symmetrically around the shaft;
A plurality of chain-waless, these chain-waless be supported to respectively and described arm between have play, and described chain-wales can keep substrate; And
Main platform, this main platform utilize the rotation of described arm and lifting to load described chain-wales, and are included in the interior platform maintaining body that described chain-wales is positioned and keeps of scope of described play.
2. substrate feedway as claimed in claim 1 is characterized in that,
Described chain-wales is built-in with from the teeth outwards outstanding supporting pin so that described substrate is lifted,
Described substrate feedway also comprises driving mechanism, when in described arm one remains on described chain-wales on the described main platform, the downside of the described chain-wales that this actuator configuration supports at other described arm, described driving mechanism has the drive pin with described supporting pin jack-up
Described drive pin and described supporting pin constitute by magnetic force and attract each other.
3. substrate feedway as claimed in claim 1 is characterized in that, described platform maintaining body has the air cushion that described chain-wales is supported by air pressure.
4. substrate feedway as claimed in claim 1 is characterized in that, described main platform supports the device of processing described substrate.
CN201210327831.0A 2011-09-09 2012-09-06 Substrate supply device Active CN102992642B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011197396A JP5243585B2 (en) 2011-09-09 2011-09-09 Substrate supply device
JP2011-197396 2011-09-09

Publications (2)

Publication Number Publication Date
CN102992642A true CN102992642A (en) 2013-03-27
CN102992642B CN102992642B (en) 2015-01-14

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JP (1) JP5243585B2 (en)
KR (1) KR101318600B1 (en)
CN (1) CN102992642B (en)
TW (1) TWI421968B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112191427A (en) * 2020-09-27 2021-01-08 铜陵市肆得科技有限责任公司 Spraying equipment is used in processing of metal stamping workpiece

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102278083B1 (en) * 2019-05-23 2021-07-16 세메스 주식회사 Unit for supporting substrate and Apparatus for treating substrate with the unit
KR102303595B1 (en) * 2019-06-12 2021-09-23 세메스 주식회사 Supporting Unit And Apparatus For Treating Substrate
JP2023002003A (en) * 2021-06-22 2023-01-10 東京エレクトロン株式会社 Mounting table and substrate processing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068620A (en) * 2001-08-28 2003-03-07 Sendai Nikon:Kk Aligner
JP2007042799A (en) * 2005-08-02 2007-02-15 Hitachi High-Technologies Corp Vacuum carrier and charged particle ray inspection device equipped therewith
JP2007142292A (en) * 2005-11-22 2007-06-07 Advanced Mask Inspection Technology Kk Substrate inspection apparatus
JP2010182919A (en) * 2009-02-06 2010-08-19 Tokyo Electron Ltd Substrate processing system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4419303B2 (en) * 2000-09-27 2010-02-24 東レ株式会社 Coating apparatus and coating method, and color filter manufacturing apparatus and manufacturing method
JP2007172292A (en) * 2005-12-22 2007-07-05 Hitachi Ltd Information processor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068620A (en) * 2001-08-28 2003-03-07 Sendai Nikon:Kk Aligner
JP2007042799A (en) * 2005-08-02 2007-02-15 Hitachi High-Technologies Corp Vacuum carrier and charged particle ray inspection device equipped therewith
JP2007142292A (en) * 2005-11-22 2007-06-07 Advanced Mask Inspection Technology Kk Substrate inspection apparatus
JP2010182919A (en) * 2009-02-06 2010-08-19 Tokyo Electron Ltd Substrate processing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112191427A (en) * 2020-09-27 2021-01-08 铜陵市肆得科技有限责任公司 Spraying equipment is used in processing of metal stamping workpiece

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TW201312689A (en) 2013-03-16
KR101318600B1 (en) 2013-10-15
JP5243585B2 (en) 2013-07-24
JP2013058690A (en) 2013-03-28
KR20130028634A (en) 2013-03-19
TWI421968B (en) 2014-01-01
CN102992642B (en) 2015-01-14

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