TWM612607U - Scribing apparatus - Google Patents

Abstract

The scribing device of the embodiment of the present invention may include: an operating table for supporting the substrate; a substrate aligning unit for aligning the substrates loaded on the operating table; and the dicing unit having a device for loading on the operating table A scribing wheel with a scribing line is formed on the substrate. The substrate aligning unit may include: an operating table tilting unit to tilt the operating table in such a way that one end of the operating table is tilted downward; and a stop module, which is opposite to one end of the operating table Next, the substrate moves along the operating table tilted under the action of the operating table tilt unit to contact the stop module and align, so that the initial working position of the scribing wheel to contact the substrate and the position to be formed on the substrate The starting points of the scribing lines coincide.

Description

Dicing device

The invention relates to a scribing device for forming a scribing line on a substrate for cutting the substrate.

Generally, liquid crystal display panels, organic electroluminescence display panels, inorganic electroluminescence display panels, transmissive projector substrates, and reflective projector substrates are used in flat panel displays. The flat panel display uses a unit glass panel (unit substrate) cut from a brittle mother glass panel (substrate) such as glass to a predetermined size.

The substrate cutting process includes a dicing process. In the scribing process, the scribing wheel is moved while pressing along a virtual predetermined line on the substrate to form a scribing line.

On the other hand, before the step of forming the scribing line on the substrate, a step of aligning the substrate is required. In the prior art, in order to arrange the substrates, it is necessary to move the substrates horizontally after holding or adsorbing the substrates. In particular, a structure is required to rotate the substrate around the vertical axis with respect to the operating table after the substrate is gripped or sucked. This structure is designed to align only one type of substrate, so there is a problem that it is difficult to align multiple substrates of different sizes.

The purpose of the present invention is to provide the following scribing device, that is, even if multiple substrates of different sizes are loaded on the operating table, the initial working position of the scribing wheel can be adjusted to the preset starting point of the scribing line on the corresponding substrate. Consistent.

The scribing device of the embodiment of the present invention for achieving the above-mentioned objects may include: an operation table for supporting the substrate; a substrate aligning unit for aligning the substrates loaded on the operation table; and a dicing unit having a scribing wheel scribe lines formed on the substrate mounted on the console, the substrate may comprise the entire column of cells: console tilting unit, so that one end of the operating table allows the operator station is inclined downward inclined manner; and a stopper mold group, adjacent one end of the operating table, the substrate table is tilted along the tilting operation action of the operation unit in a station to move into contact with the stopper mold set and aligned so that the scribing wheel to be in contact with the substrate and an initial operative position The starting points of the scribe lines to be formed on the substrate coincide.

The stop module may include: a stop member that is in contact with one end of the substrate; and a moving mechanism that moves the stop member along a direction in which the substrate is transferred or a direction orthogonal to the direction in which the substrate is transferred.

The substrate aligning unit may include: an operating table tilting unit for tilting the operating table; and a first stop module and a second stop module, which are arranged on both sides with a corner of the operating table as a center.

The first stop module and the second stop module may respectively include: a stop member that is in contact with one end of the substrate; and a moving mechanism to make the stop member follow the direction of the substrate transfer or be in line with the direction of the substrate transfer. Move in the direction of the intersection.

The substrate transport unit can load the substrate on the above-mentioned operation table in a state where the operation table is inclined.

According to the scribing device of the embodiment of the present invention, even if multiple substrates with different sizes are loaded on the operating table, the initial working position of the scribing wheel can be consistent with the preset scribing line starting point on the corresponding substrate.

Hereinafter, the dicing device according to the embodiment of the present invention will be described with reference to the drawings.

1 to 3, the transfer direction of the substrate S where the scribe line is to be formed is defined as the Y-axis direction. In addition, the direction perpendicular to the direction in which the substrate S is transferred (the Y-axis direction) is defined as the X-axis direction. In addition, the direction perpendicular to the X-Y plane on which the substrate is placed is defined as the Z-axis direction. In addition, the term “scribing line” refers to grooves and/or slits formed on the surface of the substrate S to extend in a predetermined direction.

As shown in FIGS. 1 to 3, the scribing device of the embodiment of the present invention may include a base B, a console 10, a scribing unit 20, a substrate handling unit 30, a substrate transfer unit 40, a substrate aligning unit 50, and a control unit (Not shown).

The base B is used to support various structural components constituting the dicing device.

The control unit is used to control the actions of the structural components of the dicing device.

The console 10 is used to support the substrate S.

A plurality of holes 101 are formed in the console 10. The multiple holes 101 of the console 10 are connected to the air supply 11. The gas supplied from the gas supplier 11 is sprayed toward the plurality of holes 101, whereby the substrate S can float on the operating table 10.

In addition, the plurality of holes 101 of the console 10 are connected to a negative pressure source 12 such as a vacuum generator. A negative pressure can be formed in the plurality of holes 101 under the action of the negative pressure source 12. Therefore, the substrate S can be attached and fixed to the console 10.

During the movement of the substrate S on the operating table 10, the substrate S may float up from the operating table 10. In the process of forming the scribing line on the substrate S, the substrate S may be attached to the operation table 10.

The scribing unit 20 forms scribing lines on the first surface (the upper surface of the substrate S in FIG. 2) and the second surface (the lower surface of the substrate S in FIG. 2) of the substrate S. However, the present invention is not limited to this. For example, the scribing unit 20 may form a scribing line on only one of the first surface and the second surface of the substrate S.

The scribing unit 20 may include: a first support 21, a first scribing head 22, a second support 23, and a second scribing head 24.

The first bracket 21 extends in the X-axis direction.

The first dicing head 22 is provided on the first holder 21 so as to be movable in the X-axis direction.

The second bracket 23 extends in the X-axis direction in parallel with the first bracket 21 below the first bracket 21.

The second dicing head 24 is provided on the second holder 23 so as to be movable in the X-axis direction.

A space for the substrate S to pass through may be formed between the first bracket 21 and the second bracket 23. The first bracket 21 and the second bracket 23 can be fabricated and assembled as separate parts, or can be fabricated as a whole.

A linear moving mechanism may be provided between the first dicing head 22 and the first support 21. The linear moving mechanism is connected with the first scribing head 22 to move the first scribing head 22 in the X-axis direction. For example, the linear moving mechanism may be configured as an actuator using pneumatic or hydraulic pressure, a linear motor working under electromagnetic interaction, or a ball screw mechanism.

A linear moving mechanism can be provided between the second dicing head 24 and the second bracket 23. The linear moving mechanism is connected with the second scribing head 24 to move the second scribing head 24 in the X-axis direction. For example, the linear movement mechanism may be configured as a pneumatic or hydraulic actuator, a linear motor working through electromagnetic interaction, or a ball screw mechanism.

The first dicing head 22 and the second dicing head 24 may be arranged to face each other in the Z-axis direction.

The first scribing head 22 is provided with a wheel frame 25, and the wheel frame 25 can be used to support the scribing wheel 251. The second scribing head 24 is provided with a wheel frame 25, and the wheel frame 25 can be used to support the scribing wheel 251. The scribing wheel 251 attached to the first scribing head 22 and the scribing wheel 251 attached to the second scribing head 24 may be arranged to face each other in the Z-axis direction.

A pair of dicing wheels 251 can apply pressure to the first surface and the second surface of the substrate S, respectively. In a state where the pair of scribing wheels 251 respectively apply pressure to the first surface and the second surface of the substrate S, the first scribing head 22 and the second scribing head 24 can move relative to the substrate S in the X-axis direction. As a result, scribing lines can be formed in the X-axis direction on the first surface and the second surface of the substrate S.

On the other hand, the first dicing head 22 can move in the Z-axis direction relative to the first support 21. The second dicing head 24 can move in the Z-axis direction relative to the second bracket 23.

To this end, a head moving module 28 can be provided between the first dicing head 22 and the first bracket 21. The head moving module 28 is used to connect with the first scribing head 22 to move the first scribing head 22 along the Z-axis direction. In addition, a head moving module 29 can be provided between the second dicing head 24 and the second bracket 23. The head moving module 29 is used to connect with the second scribing head 24 to move the second scribing head 24 along the Z-axis direction. For example, the head moving modules 28 and 29 may be provided in linear moving mechanisms such as pneumatic or hydraulic actuators, linear motors working under electromagnetic interaction, or ball screw mechanisms.

The first scribing head 22 and the second scribing head 24 can move in the Z-axis direction relative to the first support 21 and the second support 23, respectively, so that the pair of scribing wheels 251 can apply pressure to the substrate S or move away from the substrate S. In addition, the pressure applied by the pair of scribing wheels 251 to the substrate S can be adjusted by adjusting the degree of movement of the first scribing head 22 and the second scribing head 24 in the Z-axis direction. In addition, since the first scribing head 22 and the second scribing head 24 move in the Z-axis direction, the cutting depth (penetration depth) of the pair of scribing wheels 251 with respect to the substrate S can be adjusted.

The substrate transport unit 30 is used to load the substrate S on the console 10. In addition, the substrate transport unit 30 is used to transfer the substrate S on the operation table 10 to the dicing unit 20.

The substrate transport unit 30 may include a pickup module 31, a supporting frame 32, a pickup moving module 33, and a pickup lifting module 34.

The pickup module 31 is used to support the substrate S.

The supporting frame 32 is used to support the pickup module 31. The pickup module 31 can be installed in the support frame 32 in a movable manner in the Y-axis direction.

The pickup moving module 33 is used to move the pickup module 31 in the X-axis direction and the Y-axis direction. As the pickup moving module 33, a linear moving mechanism such as a pneumatic or hydraulic actuator, a linear motor operating under electromagnetic interaction, or a ball screw mechanism can be used. Under the action of the pickup moving module 33, the pickup module 31 can be moved along the X-axis direction and the Y-axis direction, and the substrate S can be moved along the X-axis direction and the Y-axis direction.

The pickup lift module 34 is used to move the pickup module 31 along the Z-axis direction. As the pickup lifting module 34, a linear moving mechanism such as a pneumatic or hydraulic actuator, a linear motor working under electromagnetic interaction, or a ball screw mechanism can be used. The pickup module 31 can be moved in the Z-axis direction under the action of the pickup lifting module 34, and the substrate S can be loaded on the operating table 10 or lifted from the operating table 10 at the same time.

The substrate transfer unit 40 is used to transfer the substrate S from the dicing unit 20 to a subsequent process.

The substrate transfer unit 40 may include: a support plate 41, a transfer belt 42, and a moving device 43.

The support plate 41 is arranged adjacent to the dicing unit 20. The support plate 41 is used to float the substrate or adsorb the substrate.

The transfer belt 42 is arranged adjacent to the support plate 41.

The moving device 43 reciprocates the support plate 41 and the transfer belt 42 in the Y-axis direction. The moving device 43 is used to reciprocate the support plate 41 and the transfer belt 42 in the Y-axis direction along the guide rail 44 extending in the Y-axis direction. As the moving device 43, a linear moving mechanism such as an actuator using air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism can be used.

The support plate 41 and the transfer belt 42 can be moved together in a direction (Y-axis direction) parallel to the direction in which the substrate S is transferred under the action of the moving device 43.

In the process of respectively forming scribing lines on the first surface and the second surface of the substrate S under the action of the dicing unit 20, the support plate 41 can move toward the operating table 10 to be adjacent to the operating table 10. In addition, the first dicing head 22 and the second dicing head 24 may be located between the operating table 10 and the support plate 41. In the process of respectively forming scribing lines on the first surface and the second surface of the substrate S under the action of the scribing unit 20, the operation table 10 is adjacent to the support plate 41. Therefore, both the console 10 and the support plate 41 can stably support the substrate S.

There may be a plurality of transfer belts 42, and the plurality of transfer belts 42 may be spaced apart from each other in the X-axis direction. Each transfer belt 42 is supported by a plurality of pulleys 421, and at least one of the plurality of pulleys 421 may be a driving pulley that provides a driving force for rotating the transfer belt 42.

The support plate 41 may be configured to float the substrate S or adsorb the substrate S. For example, a plurality of grooves connected to an air supply source and a vacuum source may be formed on the surface of the support plate 41. In the case where gas is supplied from the gas supply source to the plurality of grooves of the support plate 41, the substrate S can float from the support plate 41. In addition, when gas is sucked in through the multiple grooves of the support plate 41 under the action of the negative pressure formed by the vacuum source, the substrate S can be adsorbed to the support plate 41.

In the process of transferring the substrate S to the support plate 41, gas is supplied to the groove of the support plate 41, so that the substrate S can be moved without friction with the support plate 41.

In addition, in the process of forming dicing lines on the first surface and the second surface of the substrate S, respectively, the substrate S is sucked and fixed to the support plate 41.

In addition, after scribing lines are formed on the first surface and the second surface of the substrate S, the support plate 41 can be moved away from the operation table 10 in a state where the substrate S is adsorbed on the console 10 and the support plate 41. mobile. Thus, the substrate S can be divided along the scribing line.

On the other hand, while the substrate S is moved from the support plate 41 to the subsequent process by the transfer belt 42, gas is supplied to the groove of the support plate 41, so that the substrate S can move without friction with the support plate 41.

The substrate aligning unit 50 may include a console tilt module 51, a first stop module 52, and a second stop module 53.

The console tilt module 51 can be installed at the lower part of the console 10. The console tilt module 51 is used to tilt the console 10 in the X-axis direction or the Y-axis direction. The console tilt module 51 can tilt the console 10 so that one end of the console 10 facing the Y-axis direction is tilted downward. In addition, the console tilt module 51 can tilt the console 10 so that one end of the console 10 facing the X-axis direction is tilted downward.

As an example, as shown in FIGS. 2 and 3, the operating platform tilt module 51 may be constituted by an actuator whose one end is hingedly connected to the operating platform 10 and the other end is hingedly connected to the base B. The actuator can be composed of a hydraulic cylinder or a pneumatic cylinder. In the case where the console tilt module 51 is composed of an actuator, a plurality of console tilt modules 51 may be provided at the lower part of the console 10. A part of the console 10 is lifted by a part of the console tilt module 51 among the plurality of console tilt modules 51 so that the console 10 can be tilted. In addition, the degree to which part of the console tilt module 51 lifts a part of the console 10 is different from the degree to which the rest of the console 10 is lifted by the rest of the console tilt module 51, so that the console 10 can be tilted.

As another example, although not shown, the console tilt module 51 may be a multi-axis robot connected to the console 10. The multi-axis robot constituting the console tilt module 51 works with multiple axes as a reference, so that the console 10 can be tilted.

As another example, although not shown, the console tilt module 51 may include an actuator and a hinge member. The actuator and the hinge component can support the operation table 10 by being connected to the operation table 10. The actuator provides driving force for rotating the operating table 10. The hinge member functions to provide a hinge shaft for rotating the console 10. Therefore, the operating table 10 can be rotated around the hinge axis of the hinge member under the action of the driving force of the actuator, and thus, the operating table 10 can be tilted.

The first stop module 52 and the second stop module 53 can be arranged on both sides with a corner of the console 10 as a center.

The first stop module 52 is used for aligning the substrate S along the X-axis direction. The first stop module 52 may be adjacently arranged at one end of the console 10 in the Y-axis direction. The number of the first stop module 52 may be more than two. The first stop module 52 may include: a first stop member 521, a first X-axis moving mechanism 522, and a first Y-axis moving mechanism 523.

The first stopper member 521 is in contact with one end of the substrate S facing the Y-axis direction. The operation table 10 is tilted under the action of the operation table tilt module 51. If the end of the operation table 10 adjacent to the first stop member 521 is inclined downward, the substrate S on the operation table 10 will be tilted due to its own weight. The console 10 moves. Thereby, one end of the substrate S facing the Y-axis direction is in contact with the first stopper member 521. Therefore, the end of the substrate S facing the Y-axis direction is aligned along the direction in which the plurality of first stopper members 521 are arranged.

The first stopper member 521 is a member that directly contacts the substrate S. Therefore, it is preferable that the first stopper member 521 is formed of an elastic material to be able to prevent the substrate S from being damaged. For example, the first stop member 521 may have the form of a rotatable roller or a ball. In this case, one end of the substrate S may be in contact with the outer peripheral surface of the first stop member 521.

The first X-axis moving mechanism 522 is used to move the first stop member 521 in the X-axis direction. As the first X-axis moving mechanism 522, a linear moving mechanism such as an actuator using air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism can be used. The first stopper member 521 moves in the X-axis direction by the action of the first X-axis moving mechanism 522, whereby the position of the first stopper member 521 in the X-axis direction is adjusted. The position of the first stop member 521 facing the X-axis direction can be adjusted so that the part of the first stop member 521 that should be in contact with the substrate S corresponds to that.

When the substrate S is cut into a plurality of unit substrates, the portion where the substrate S contacts the first stopper member 521 is preferably an area between the plurality of unit substrates. Wherein, the area between the multiple unit substrates may be an invalid area that is not used for products and needs to be removed and discarded. This ineffective area is a part of the substrate and will not affect the quality of the product even if it is in contact with external components. Therefore, preferably, the first stopper member 521 is in contact with the ineffective area of the substrate S. Therefore, in order to enable the first stop member 521 to contact the ineffective area of the substrate S, the position of the first stop member 521 in the X-axis direction can be adjusted under the action of the first X-axis moving mechanism 522.

The first Y-axis moving mechanism 523 is used to move the first stop member 521 in the Y-axis direction. As the first Y-axis moving mechanism 523, a linear moving mechanism such as an actuator using air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism can be used. The first stop member 521 moves in the Y-axis direction under the action of the first Y-axis moving mechanism 523, and thereby the position of the first stop member 521 in the Y-axis direction is adjusted. The respective positions of the plurality of first stop members 521 toward the Y-axis direction are adjusted, so that the arrangement direction of the plurality of first stop members 521 is adjusted. The arrangement direction of the plurality of first stopper members 521 is adjusted, so that the end of the substrate S facing the Y-axis direction is in contact with the plurality of first stopper members 521 and the alignment direction is adjusted. The direction in which one end of the substrate S facing the Y-axis direction is in contact with the plurality of first stopper members 521 and aligned may be the X-axis direction, or may be a direction inclined by a predetermined angle with respect to the X-axis (or Y-axis). In this way, under the action of the first Y-axis moving mechanism 523, the position of the first stop member 521 in the Y-axis direction is adjusted, so that the direction in which the end of the substrate S facing the Y-axis direction is aligned is determined. Therefore, after holding the substrate S, there is no need for an additional structure to rotate the substrate S around the Z axis, and the substrate S can be aligned at a predetermined angle with respect to the X axis (Y axis).

The second stop module 53 is used for aligning the substrate S along the Y-axis direction. The second stop module 53 may be adjacently arranged at one end of the console 10 in the X-axis direction. The number of the second stop module 53 may be more than two. The second stop module 53 may include: a second stop member 531, a second X-axis moving mechanism 532, and a second Y-axis moving mechanism 533.

The second stopper 531 is in contact with one end of the substrate S facing the X-axis direction. The operation table 10 is tilted under the action of the operation table tilt module 51. If the end of the operation table 10 adjacent to the second stopper 531 is inclined downward, the substrate S on the operation table 10 will be tilted due to its own weight. The console 10 moves. Thereby, one end of the substrate S facing the X-axis direction is in contact with the second stopper member 531. Therefore, one end of the substrate S facing the X-axis direction is aligned along the direction in which the plurality of second stopper members 531 are arranged.

The second stopper member 531 is a member that directly contacts the substrate S. Therefore, it is preferable that the second stopper member 531 is formed of an elastic material to be able to prevent the substrate S from being damaged. For example, the second stopper 531 may have a rotatable roller or ball shape. In this case, one end of the substrate S may be in contact with the outer peripheral surface of the second stopper 531.

The second X-axis moving mechanism 532 is used to move the second stopper 531 in the X-axis direction. As the second X-axis moving mechanism 532, a linear moving mechanism such as an actuator using air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism can be used. The second stopper 531 moves in the X-axis direction under the action of the second X-axis moving mechanism 532, whereby the position of the second stopper 531 in the X-axis direction is adjusted. The respective positions of the plurality of second stop members 531 toward the X-axis direction are adjusted, so that the arrangement direction of the plurality of second stop members 531 is adjusted. The arrangement direction of the plurality of second stopper members 531 is adjusted, so that the one end of the substrate S facing the X-axis direction is in contact with the plurality of second stopper members 531 and the alignment direction is adjusted. The direction in which one end of the substrate S facing the X-axis direction is in contact with the plurality of second stopper members 531 and aligned may be the Y-axis direction, or may be a direction inclined by a predetermined angle with respect to the Y-axis (or X-axis). In this way, under the action of the second X-axis moving mechanism 532, the position of the second stopper 531 in the X-axis direction is adjusted, so that the direction in which the end of the substrate S facing the X-axis direction is aligned is determined. Therefore, after holding the substrate S, there is no need for an additional structure to rotate the substrate S around the Z axis, and the substrate S can be aligned at a predetermined angle with respect to the Y axis (X axis).

The second Y-axis moving mechanism 533 is used to move the second stopper 531 in the Y-axis direction. As the second Y-axis moving mechanism 533, a linear moving mechanism such as an actuator using air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism can be used. Under the action of the second Y-axis moving mechanism 533, the second stop member 531 moves in the Y-axis direction, whereby the position of the second stop member 531 in the Y-axis direction is adjusted. The position of the second stopper 531 facing the Y-axis direction can be adjusted so that the part of the second stopper 531 that should contact the substrate S corresponds to the part of the second stopper 531 that should contact the substrate S.

In the case where the substrate S is cut into a plurality of unit substrates, the portion where the substrate S contacts the second stopper member 531 is preferably an area between the plurality of unit substrates. Wherein, the area between the multiple unit substrates may be an invalid area that is not used for products and needs to be removed and discarded. This ineffective area is a part of the substrate and will not affect the quality of the product even if it is in contact with external components. Therefore, preferably, the second stopper 531 is in contact with the ineffective area of the substrate S. Therefore, in order to enable the second stopper 531 to contact the ineffective area of the substrate S, the position of the second stopper 531 in the Y-axis direction can be adjusted under the action of the second Y-axis moving mechanism 533.

Hereinafter, referring to FIGS. 4 and 12, the working process of the dicing device according to the embodiment of the present invention will be described.

First, as shown in FIGS. 4 and 5, the substrate S is loaded on the console 10 by the substrate transport unit 30. In this case, air is supplied to the plurality of holes 101 of the console 10 to float the substrate S from the console 10.

In this state, as shown in FIGS. 6 and 7, the console 10 is tilted under the action of the console tilt module 51. Thus, when the end adjacent to the first stopper member 521 of the operation table 10 is inclined downward, the substrate S on the operation table 10 moves along the inclined operation table 10 due to its own weight. Therefore, one end of the substrate S facing the Y-axis direction is in contact with the plurality of first stopper members 521 and is aligned in the direction in which the plurality of first stopper members 521 are arranged.

In addition, as shown in FIG. 8, the console 10 is restored to the initial horizontal state (a state parallel to the X-Y plane) under the action of the console tilt module 51.

Then, as shown in FIGS. 9 and 10, the console 10 is tilted under the action of the console tilt module 51. Thus, when the end adjacent to the second stopper 531 of the operation table 10 is inclined downward, the substrate S on the operation table 10 moves along the inclined operation table 10 due to its own weight. Therefore, one end of the substrate S facing the X-axis direction is in contact with the plurality of second stopper members 531 and is aligned in the direction in which the plurality of second stopper members 531 are arranged.

According to the dicing device of the embodiment of the present invention, the substrate S can be aligned on the operation table 10 by tilting the operation table 10. Therefore, it is possible to effectively align the substrates S without using an optical device with a complicated structure or control method.

In addition, according to the dicing device of the embodiment of the present invention, the substrate S can be aligned on the operation table 10 by tilting the operation table 10. Therefore, after holding the substrate S, there is no need for an additional structure to rotate the substrate S around the Z axis, and the substrate S can be aligned at a predetermined angle with respect to the Y axis (X axis).

Therefore, as shown in FIG. 11, even if multiple types of substrates S1, S2 with different sizes are loaded on the console 10, the initial working positions W on the substrates S1, S2 that need to be in contact with the scribing wheel 251 can be made to be the same as those formed on the corresponding substrates. The preset starting points P1 and P2 of the scribing line on S1 and S2 are consistent.

On the other hand, when the process of aligning the substrate S is completed, after the substrate S is transferred to the dicing unit 20 by the substrate conveying unit 30, a scribing line is formed on the substrate S.

As an example, when the dicing unit 20 forms a scribing line on the substrate S, the air supply to the plurality of holes 101 of the console 10 is interrupted. Therefore, the scribing unit 20 can form a scribing line on the substrate S in a state where the substrate S is stably attached to the upper surface of the operation table 10.

As another example, in the process of forming the scribing line on the substrate S by the dicing unit 20, the substrate S may be adsorbed on the operating table 10. Therefore, the scribing unit 20 can form a scribing line on the substrate S in a state where the substrate S is stably sucked on the upper surface of the operation table 10.

As another example, as shown in FIG. 12, the substrate transport unit 30 may support the substrate S during the process of forming the scribe line on the substrate S by the dicing unit 20. Therefore, in a state where the substrate S is stably supported by the substrate conveying unit 30, the scribing unit 20 can form a scribing line on the substrate S.

As described above, during the process in which the dicing unit 20 forms the scribing line on the substrate S, the substrate S can be stably supported. Therefore, the scribing line can be formed on the substrate S more precisely. Therefore, the quality and reliability of the unit substrate cut along the dicing line can be improved.

On the other hand, as shown in FIGS. 13 to 16, in a state where the operation table 10 is tilted by the operation table tilt module 51, the substrate transport unit 30 can load the substrate S on the operation table 10.

In the above case, while the substrate S is loaded on the operating table 10, the substrate S moves along the inclined operating table 10 so as to come into contact with the first stopper member 521 and be aligned. Therefore, the process of loading the substrate S and the process of aligning the substrate S can be quickly performed.

In addition, as shown in FIG. 14, in the process of loading the substrate S on the console 10, the lower surface of the substrate S is sequentially adjacent to the upper surface of the console 10. That is, the area of the lower surface of the substrate S adjacent to the upper surface of the operation table 10 sequentially increases. Therefore, static electricity existing between the upper surface of the console 10 and the lower surface of the substrate S can be discharged to the side of the substrate S (the side of the substrate S adjacent to the first stopper 521 ). Therefore, it is possible to prevent the problem that the flatness of the substrate S is decreased due to static electricity between the substrate S and the console 10 or that the substrate S is not smoothly loaded on the console 10.

On the other hand, in the embodiment of the present invention, the process of aligning the substrate S after contacting the first stopper 521 and then contacting the second stopper 531 to perform alignment is described. However, the present invention is not limited to this. For example, the substrate S may be in contact with the second stopper 531 to be aligned, and then in contact with the first stopper 521 to be aligned.

In addition, FIGS. 13 to 16 show the following process, that is, in a state where the end of the operation table 10 adjacent to the first stopper 521 is inclined downward, the substrate S is loaded on the operation table 10 and follows the operation table 10 moves so as to come into contact with the first stopper 521 to make alignment. However, the present invention is not limited to this. For example, in a state where the end adjacent to the second stopper 531 of the operation table 10 is inclined downward, the substrate S is loaded on the operation table 10 and moves along the operation table 10 so as to be able to stop with the second stop. The parts 531 are in contact and aligned.

Although the preferred embodiments of the present invention have been described exemplarily, the scope of the present invention is not limited to the specific embodiments described above, and appropriate changes can be made within the scope described in the scope of the present invention.

10: console 101: Hole 11: Air supply 12: Negative pressure source 20: Dicing unit 21: The first bracket 22: The first scribing head 23: second bracket 24: second scribing head 25: Wheel frame 251: Scribing Wheel 28: Head movement module 29: Head movement module 30: Board handling unit 31: Picker module 32: support frame 33: Picker mobile module 34: Picker lift module 40: Substrate transfer unit 41: Support plate 42: transfer belt 421: Pulley 43: mobile device 44: Rail 50: Substrate array unit 51: Console tilt module 52: The first stop module 521: The first stop component 522: The first X-axis moving mechanism 523: The first Y-axis moving mechanism 53: The second stop module 531: second stop component 532: Second X-axis moving mechanism 533: Second Y-axis moving mechanism B: Pedestal P1, P2: starting point S, S1, S2: substrate W: initial working position

Fig. 1 is a plan view schematically showing a dicing device according to an embodiment of the present invention. Fig. 2 is a side view schematically showing the dicing device according to the embodiment of the present invention. Fig. 3 is a side view schematically showing the dicing device according to the embodiment of the present invention. 4 to 7 are diagrams sequentially showing the process of aligning the substrate with respect to the X axis in the dicing device according to the embodiment of the present invention. 8 to 10 are diagrams sequentially showing the process of aligning the substrates with respect to the Y axis in the dicing device according to the embodiment of the present invention. FIG. 11 is a diagram schematically showing a state after the substrates are aligned on the workbench in the dicing device according to the embodiment of the present invention. Fig. 12 is a diagram schematically showing a process of forming a scribing line on a substrate in the scribing device of the embodiment of the present invention. 13 to 16 are diagrams showing another example of the process of loading the substrate on the console in the dicing device according to the embodiment of the present invention.

10: console

20: Dicing unit

21: The first bracket

22: The first scribing head

23: second bracket

24: second scribing head

25: Wheel frame

251: Scribing Wheel

28: Head movement module

29: Head movement module

30: Board handling unit

31: Picker module

32: support frame

33: Picker mobile module

34: Picker lift module

40: Substrate transfer unit

41: Support plate

42: transfer belt

421: Pulley

43: mobile device

44: Rail

50: Substrate array unit

51: Console tilt module

52: The first stop module

521: The first stop component

522: The first X-axis moving mechanism

523: The first Y-axis moving mechanism

53: The second stop module

531: second stop component

532: Second X-axis moving mechanism

533: Second Y-axis moving mechanism

B: Pedestal

S: substrate

Claims (5)

A dicing device includes: an operation table for supporting a substrate; a substrate aligning unit for aligning the substrates loaded on the operation table; and a scribing unit for loading the substrate on the operation table A scribing wheel on which a scribing line is formed, the substrate aligning unit includes: an operating table tilting unit to tilt the operating table in such a way that one end of the operating table is tilted downward; and a stop module, which is connected to the operating table One end is adjacent, and the substrate moves along the operating platform tilted under the action of the operating platform tilting unit, and is in contact with the stop module to be aligned, so that the scribing wheel is in contact with the substrate. The position coincides with the starting point of the scribe line to be formed on the substrate. The dicing device according to claim 1, wherein the stop module includes: a stop member that is in contact with one end of the substrate; and a moving mechanism that causes the stop member to move along the direction in which the substrate is transferred or in conjunction with the transfer The direction of the substrate moves in a direction orthogonal to the direction. The dicing device according to claim 1, wherein the substrate aligning unit includes: an operating table tilting unit for tilting the operating table; and a first stop module and a second stop module to use the operating table One of the corners is centered on both sides. The dicing device according to claim 3, wherein the first stop module and the second stop module respectively include: a stop member that is in contact with one end of the substrate; and The moving mechanism moves the stopper along the direction in which the substrate is transferred or a direction orthogonal to the direction in which the substrate is transferred. The dicing device according to any one of claims 1 to 4, further including a substrate transport unit that loads the substrate on the operation table in a state where the operation table is inclined.

Images