CN102992642B - Substrate supply device - Google Patents
Substrate supply device Download PDFInfo
- Publication number
- CN102992642B CN102992642B CN201210327831.0A CN201210327831A CN102992642B CN 102992642 B CN102992642 B CN 102992642B CN 201210327831 A CN201210327831 A CN 201210327831A CN 102992642 B CN102992642 B CN 102992642B
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- CN
- China
- Prior art keywords
- wales
- chain
- substrate
- arm
- main platform
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The invention discloses a substrate supply device (1) capable of realizing the replacement of substrates within a short time, which comprises a plurality of arm parts (4) capable of integrally rotating and moving up and down and symmetrically arranged relative to a rotation shaft; a plurality of small platforms (6) respectively supported with a clearance between each of the arm parts (4) and used for holding the substrate; and a main platform (7) used for loading the small platforms (6) by means of the rotation and the lifting of the arm parts (4). The main platform (7) is provided with a platform holding mechanism used for positioning and holding the small platforms (6).
Description
Technical field
The substrate feeding device that the present invention relates to a kind of device for substrate being supplied to substrate processing and it is therefrom discharged.
Background technology
In the manufacture etc. of panel display board, there is the operation using die coating machine to apply glass substrate.In order to form the uniform film of thickness on substrate, needing substrate to locate exactly and keep and die head is moved, so that the gap of substrate and die head is kept even.Therefore, disclosed in Japanese Patent Laid-Open 2002-200450 publication, be generally used in device platform that substrate is kept being fixed with the guide rail for making die head movement.
In addition, in order to configuration and discharge (replacing) substrate on this platform, such as, disclosed in Japanese Patent Laid-Open 5-45641 publication, be provided with and utilize the pin from platform is outstanding to be lifted by substrate, and the arm of robot is stretched into the structure of being taken out by substrate.But, if shortening coating cycle, and with pin, substrate is lifted immediately after being coated with coating, then due to substrate flexure, and makes coating dry under the state flowing to sunk part, therefore, thickness can be made to become uneven.Therefore, because the coating cycle shortening substrate can sacrifice the homogeneity of thickness, therefore, manufacturing capacity cannot be improved.
In Japanese Patent Laid-Open 2002-102771 publication, disclose a kind of station that two mounting substrates are set on very large platform, and be configured to by metallic paint machine can the device of movement on two stations.In this device, as long as on the station of a side during coated substrate, change the substrate of the station of the opposing party, therefore, processing power is high.But, need the robot respectively two stations being changed to substrate, thus there is larger-scale unit and make cost uprise such problem.In addition, because the amount of movement of die head is very large, therefore, also easily error is produced.
Summary of the invention
In view of the above problems, technical problem of the present invention is to provide a kind of substrate feeding device changing substrate at short notice.
For solving the problems of the technologies described above, substrate feeding device of the present invention comprises: multiple arm, and these arms are arranged to rotate integratedly and to be elevated, and arrange symmetrically around the shaft; Multiple chain-wales, these chain-waless are supported to there is play respectively between above-mentioned arm, and above-mentioned chain-wales can keep substrate; And main platform, this main platform utilizes the rotation of above-mentioned arm and lifting to load above-mentioned chain-wales, and positions and the platform maintaining body kept above-mentioned chain-wales in the scope being included in above-mentioned play.
Pass through said structure, owing to substrate being supplied to coating unit or processing unit (plant) under the state being held in chain-wales and substrate be discharged from said apparatus, therefore, after coating (processing), in non-deflecting situation, substrate can be discharged, and supply next block substrate.Therefore, when the time before not shortening coating (processing) and extremely being lifted by substrate afterwards, the coating cycle can be shortened.In addition, by arranging play between chain-wales and arm, thus can finely tune the position of chain-wales on main platform and posture, and the position and the posture that apply or add substrate in man-hour can be determined exactly.In addition, as long as the robot of a substrate feeding device of the present invention treatment substrate, do not need the movable range increasing coating unit or processing unit (plant) yet, therefore, can provide at an easy rate.
In addition, in substrate feeding device of the present invention, above-mentioned chain-wales is built-in with outstanding with the supporting pin lifted by aforesaid substrate from the teeth outwards, aforesaid substrate feedway also comprises driving mechanism, one in above-mentioned arm when remaining on above-mentioned chain-wales on above-mentioned main platform, the downside of the above-mentioned chain-wales that this actuator configuration supports at other above-mentioned arm, above-mentioned driving mechanism has the drive pin of above-mentioned supporting pin jack-up, and above-mentioned drive pin and above-mentioned supporting pin are configured to be attracted each other by magnetic force.
By said structure, because the retrogressing by magnetic force and drive pin makes supporting pin reliably retreat accordingly, therefore, do not need to configure the component to supporting pin force in chain-wales inside, thus structure is simple, the thickness of chain-wales also can not become large.
In addition, in substrate feeding device of the present invention, above-mentioned platform maintaining body also can have the air cushion supported above-mentioned chain-wales by air pressure.
By said structure, because the part supported the weight of chain-wales is non-contacting, therefore, can prevent from making the height to substrate keeps change because of wearing and tearing.
In addition, in substrate feeding device of the present invention, above-mentioned main platform also can support the device of processing aforesaid substrate.
By said structure, because the position relationship between main platform and processing unit (plant) can not change, therefore, by by substrate orientation on chain-wales, and chain-wales to be positioned on main platform, thus the position relationship between substrate and processing unit (plant) can be kept.
As mentioned above, by the rotation (convolution) of arm, multiple chain-wales is configured on main platform, therefore, the configuration of substrate towards chain-wales and the processing to substrate can be carried out simultaneously.In addition, by arranging play between chain-wales and arm, can finely tune chain-wales on main platform, therefore, can keep substrate accurately man-hour adding.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the substrate coating apparatus of the substrate feeding device comprising an embodiment of the present invention.
Fig. 2 is the side-view of the substrate coating apparatus of Fig. 1.
Fig. 3 is the enlarged partial sectional view of the substrate coating apparatus of Fig. 1.
(nomenclature)
1 substrate feeding device
2 rotary driving parts
3 turntables
4 arms
5 glass substrates
6 chain-waless
7 main platforms
8 pin driving mechanisms
9 locating devices
10 cylinders
11 grooves
12 air cushions
13 die heads
14 advance framework
15 guide rails
16 supporting pins
17 guide cylinders
18 slide blocks
19 magneticmetal sheets
20 cylinders
21 frameworks
22 drive pins
23 permanent magnets
24 mechanical manipulators
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.In Fig. 1 and Fig. 2, show the substrate coating apparatus of the substrate feeding device 1 comprising an embodiment of the present invention.Substrate feeding device 1 comprises: turntable 3, and this turntable 3 rotates around vertical axle by rotary driving part 2 and is supported to energy VTOL (vertical take off and landing); Two pairs of arms 4, these arms 4 are arranged to two a pair, and extend from turntable 3 towards radial outside; Two chain-waless 6, these two chain-waless 6 are supported on each pair of arm 4 respectively, and keep glass substrate 5 by absorption; Main platform 7, this main platform 7 can keep the chain-wales 6 of a side; And pin driving mechanism 8, this pin driving mechanism 8 is for lifting the chain-wales 6 of glass substrate 5 from the opposing party.
Arm 4 in the mode be mutually symmetrical around the rotating shaft of rotary driving part 2, that is with the angle configurations of 180 °.Main platform 7 and pin driving mechanism 8 are configured on the axisymmetric position of rotary driving part, and when the chain-wales 6 of a side remains on main platform 7, pin driving mechanism 8 is just positioned at immediately below the chain-wales 6 of the opposing party.
Main platform 7 and pin driving mechanism 8 have multiple locating device 9 respectively, and these locating devices 9 abut with the side of chain-wales 6, to determine the level attitude of chain-wales 6 and direction.Locating device 9 is all actuators that the abutted position that can abut with chain-wales 6 it regulates, its be located at main platform 7, sell the cylinder 10 of driving mechanism 8 and turntable 3 and collaborate, within the scope of the play of itself and arm 4, determine level attitude and direction (the platform maintaining body) of chain-wales 6.
Chain-wales 6 has the groove 11 can receiving arm 4 in bottom surface, but the width of groove 11 is larger than the width of arm 4, and is supported in the mode with play.Therefore, chain-wales 6 can move horizontally and horizontally rotate on arm 4 in the scope of this play.
180 ° are rotated under rotary driving part 2 does not have the height (position shown in the two dot chain line of Fig. 2) of obstacle state when making turntable 3 and arm 4 rises to rotation, and after chain-wales 6 being configured in above main platform 7, turntable 3 and arm 4 are declined, be positioned in by chain-wales 6 on main platform 7, arm 4 drops to the position producing gap between groove 11 further.
Main platform 7 has the air cushion 12 utilizing air pressure to support chain-wales 6 with contactless state.Air cushion 12 is retained and can regulates height respectively by adjustment air pressure, and the upper surface being adjusted to chain-wales 6 is level on specified altitude, and chain-wales 6 is in the state only leaning on the air pressure of air cushion 12 just can keep.
Air cushion 12 and locating device 9 can set different holding positions according to chain-wales 6.By this, even if there is small skew or shape difference on each chain-wales 6, also the glass substrate 5 being adsorbed in chain-wales 6 can be remained on constant position and direction relative to main platform 7.
In addition, in the present embodiment, the weight of chain-wales 6 is accepted in a non-contact manner by air pressure owing to just utilizing air cushion 12, therefore, chain-wales 6 and air cushion 12 can not be worn, as long as set the height of an air cushion 12 according to chain-wales 6, then can all glass substrate 5 be remained in same position exactly at every turn.In addition, also can come by very little power to be positioned by locating device 9 and cylinder 10 instantaneously.
Main platform 7 has the guide rail 15 guided the framework 14 of advancing of gate, and the framework 14 of advancing of this gate maintains the die head 13 applied glass substrate 5.That is, main platform 7 supports the processing unit (plant) by making die head 13 move coated glass substrates 5, and die head 13 is strictly moved in parallel relative to main platform 7.Therefore, die head 13 can to correctly locating the film that the glass substrate 5 remained on main platform 7 forms homogeneous film thickness.
In addition, Fig. 3 represents the internal structure of chain-wales 6.Chain-wales 6 is driven by pin driving mechanism 8, and it is built-in with the supporting pin 16 lifted from chain-wales 6 by glass substrate 5.Supporting pin 16 is provided projectingly on the slide block 18 that can slide in the guide cylinder 17 imbedding chain-wales 6.Slide block 18 is provided with magneticmetal sheet 19 in downside.
Pin driving mechanism 8 has projecting being held in the drive pin 22 on the framework 21 that can be elevated by cylinder 20, is provided with the permanent magnet 23 adsorbed magneticmetal sheet 19 in the front end of drive pin 22.
By making the framework 21 of pin driving mechanism 8 rise, utilizing slide block 18 jack-up that drive pin 22 will support supporting pin 16, thus glass substrate 5 is lifted from chain-wales 6.In addition, as shown in Figure 1, mechanical manipulator 24 is inserted the downside of glass substrate 5, and take off glass substrate 5 from chain-wales 6.
In addition, new glass substrate 5 is positioned on supporting pin 16 by mechanical manipulator 24.After extracting mechanical manipulator 24, by pin driving mechanism 8, drive pin 22 is declined, supporting pin 16 is housed in the inside of chain-wales 6, glass substrate 5 is positioned on chain-wales 6.
Now, control by the locating mechanism (not shown) etc. utilizing image processing techniques and be built in chain-wales 6 position that mechanical manipulator 24 loads glass substrate 5 exactly, thus glass substrate 5 can be made to locate exactly and adsorb to remain on chain-wales 6.Because glass substrate 5 is each all identical with the relative position of chain-wales 6, therefore on main platform 7, as long as position chain-wales 6, main platform 7 just can be made also at every turn identical with the relative position of glass substrate 5.
Like this, in the present embodiment, the chain-wales 6 kept the glass substrate 5 before being applied by die head 13 is supplied to the main platform 7 for applying glass substrate 5, and the chain-wales 6 kept the glass substrate 5 after coating is taken out of from main platform 7.
The glass substrate 5 being formed with film, under the state kept by chain-wales 6, be rotated 180 ° because of arm 4 and moves to above pin driving mechanism 8, afterwards in order to exchange with new glass substrate 5, it be lifted from chain-wales 6 by supporting pin 16.That is, be in the state kept by chain-wales 6 in the process that the glass substrate 5 after coating rotates at arm 4, after being coated with coating, glass substrate 5 would not be lifted.Therefore, dry under the smooth state that coating is held in chain-wales 6 at glass substrate 5.Then, even if glass substrate 5 is lifted by pin driving mechanism 8 and occurs flexure, due to coating drying, therefore, paint-flow is there will not be to make the situation of membrane thickness unevenness to sunk part.
Therefore, not only can increase the time of film to being lifted by supporting pin 16 from forming glass substrate 5, and the block number of coated glass substrate 5 can be increased.
Therefore, in the present invention, due to be with the play of arm 4 in chain-wales 6 is located, therefore arm 4 can not separate completely with chain-wales 6, therefore, there is no need for the special organization of the maintenance locating arm 4 relative to chain-wales 6 or guarantee arm 4 pairs of chain-waless 6.
In addition, in the present embodiment, owing to being configured to supporting pin 16 jack-up utilizing drive pin 22 to remain in the thickness of chain-wales 6, therefore, also the thickness of the stroke ratio chain-wales 6 of the cylinder 20 of pin driving mechanism 8 can be made little, thus drive pin 22 can be shortened be elevated the required time, and can increase yield.
In addition, because the permanent magnet 23 of drive pin 22 is adsorbed on on the magneticmetal sheet 19 of supporting pin 16 one movement, therefore, the decline of drive pin 22 in addition to gravity, also acts on the power having and to be drawn in by supporting pin 16 in chain-wales 6.By this, even if do not arrange the spring etc. of supporting pin 16 towards collecting direction force, the collecting of supporting pin 16 can also reliably be realized.Therefore, the structure kept supporting pin 16 is simple, and can make chain-wales 6 slimming.
Claims (4)
1. a substrate feeding device, is characterized in that, comprising:
Multiple arm, these arms are arranged to rotate integratedly and to be elevated, and arrange symmetrically around the shaft;
Multiple chain-wales, these chain-waless are supported to there is play respectively between described arm, and described chain-wales can keep substrate; And
Main platform, this main platform utilizes the rotation of described arm and lifting to load described chain-wales, and positions and the platform maintaining body kept described chain-wales in the scope being included in described play.
2. substrate feeding device as claimed in claim 1, is characterized in that,
Described chain-wales is built-in with outstanding with the supporting pin lifted by described substrate from the teeth outwards,
Described substrate feeding device also comprises driving mechanism, one in described arm when remaining on described chain-wales on described main platform, the downside of the described chain-wales that this actuator configuration arm described in other supports, described driving mechanism has the drive pin of described supporting pin jack-up
Described drive pin and described supporting pin are attracted each other by magnetic force.
3. substrate feeding device as claimed in claim 1, it is characterized in that, described platform maintaining body has the air cushion supported described chain-wales by air pressure.
4. substrate feeding device as claimed in claim 1, is characterized in that, the device of described main platform to the described substrate of processing supports.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-197396 | 2011-09-09 | ||
| JP2011197396A JP5243585B2 (en) | 2011-09-09 | 2011-09-09 | Substrate supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102992642A CN102992642A (en) | 2013-03-27 |
| CN102992642B true CN102992642B (en) | 2015-01-14 |
Family
ID=47921832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210327831.0A Active CN102992642B (en) | 2011-09-09 | 2012-09-06 | Substrate supply device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5243585B2 (en) |
| KR (1) | KR101318600B1 (en) |
| CN (1) | CN102992642B (en) |
| TW (1) | TWI421968B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102278083B1 (en) * | 2019-05-23 | 2021-07-16 | 세메스 주식회사 | Unit for supporting substrate and Apparatus for treating substrate with the unit |
| KR102303595B1 (en) * | 2019-06-12 | 2021-09-23 | 세메스 주식회사 | Supporting Unit And Apparatus For Treating Substrate |
| CN112191427A (en) * | 2020-09-27 | 2021-01-08 | 铜陵市肆得科技有限责任公司 | Spraying equipment is used in processing of metal stamping workpiece |
| JP2023002003A (en) * | 2021-06-22 | 2023-01-10 | 東京エレクトロン株式会社 | Mounting table and substrate processing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003068620A (en) * | 2001-08-28 | 2003-03-07 | Sendai Nikon:Kk | Aligner |
| JP2007042799A (en) * | 2005-08-02 | 2007-02-15 | Hitachi High-Technologies Corp | Vacuum carrier and charged particle ray inspection device equipped therewith |
| JP2007142292A (en) * | 2005-11-22 | 2007-06-07 | Advanced Mask Inspection Technology Kk | Substrate inspection apparatus |
| JP2010182919A (en) * | 2009-02-06 | 2010-08-19 | Tokyo Electron Ltd | Substrate processing system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4419303B2 (en) * | 2000-09-27 | 2010-02-24 | 東レ株式会社 | Coating apparatus and coating method, and color filter manufacturing apparatus and manufacturing method |
| JP2007172292A (en) * | 2005-12-22 | 2007-07-05 | Hitachi Ltd | Information processor |
-
2011
- 2011-09-09 JP JP2011197396A patent/JP5243585B2/en active Active
-
2012
- 2012-06-15 TW TW101121540A patent/TWI421968B/en active
- 2012-06-15 KR KR1020120064233A patent/KR101318600B1/en active IP Right Grant
- 2012-09-06 CN CN201210327831.0A patent/CN102992642B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003068620A (en) * | 2001-08-28 | 2003-03-07 | Sendai Nikon:Kk | Aligner |
| JP2007042799A (en) * | 2005-08-02 | 2007-02-15 | Hitachi High-Technologies Corp | Vacuum carrier and charged particle ray inspection device equipped therewith |
| JP2007142292A (en) * | 2005-11-22 | 2007-06-07 | Advanced Mask Inspection Technology Kk | Substrate inspection apparatus |
| JP2010182919A (en) * | 2009-02-06 | 2010-08-19 | Tokyo Electron Ltd | Substrate processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102992642A (en) | 2013-03-27 |
| TWI421968B (en) | 2014-01-01 |
| KR20130028634A (en) | 2013-03-19 |
| JP2013058690A (en) | 2013-03-28 |
| JP5243585B2 (en) | 2013-07-24 |
| TW201312689A (en) | 2013-03-16 |
| KR101318600B1 (en) | 2013-10-15 |
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