Content of the invention
The purpose of the present invention is to overcome weak point of the prior art, there is provided a kind of raising mechanical automation level of production
A kind of electronic devices and components transmitting device and electronic devices and components automatic double surface gluer.
The purpose of the present invention is achieved through the following technical solutions:
A kind of electronic devices and components transmitting device, including:Electronic devices and components horizontal transport streamline, located at the electronics unit device
The electronic devices and components horizontal transport baffle plate of part horizontal transport streamline both sides, it is positioned over the electronic devices and components horizontal transport flowing water
Electronic devices and components fixed jig on line, electronic devices and components stop current-limiting apparatus;
The electronic devices and components horizontal transport streamline is the conveyer belt knot for forming transmission intercal in the middle of two parallel arrangeds
Structure;
The electronic devices and components stop that current-limiting apparatus include:Electronic devices and components stop current limliting power part, electronic devices and components resistance
Gear current limliting block, the electronic devices and components stop that current limliting power part drives the electronic devices and components to stop that current limliting block is vertically past
Multiple lifting, so that the electronic devices and components stop that current limliting block is arranged in the transmission intercal or departs from the transmission intercal;
The electronic devices and components fixed jig includes:Electronic devices and components are fixed base plate, electronic devices and components and fix top board, electronics
Buffer board fixed by components and parts, and the electronic devices and components are fixed top board and are fixed on the electronic devices and components fixation base plate, the electricity
Base plate fixed by sub- components and parts and the electronic devices and components to be fixed and form hollow accepting groove between top board, and the electronic devices and components are fixed
Buffer board is contained on the hollow accepting groove, and the electronic devices and components are fixed base plate and are provided with electronic devices and components fixation elasticity
Part, the electronic devices and components are fixed buffer board and are installed on the electronic devices and components admittedly by electronic devices and components fixation elastic component
Determine on base plate, the electronic devices and components are fixed buffer board and are provided with magnet, the electronic devices and components fix offer on top board with
The electronic devices and components accepting hole of the hollow accepting groove insertion, the magnet are arranged in the electronic devices and components accepting hole.
Wherein in one embodiment, the electronic devices and components stop that current limliting power part is air cylinder structure.
Wherein in one embodiment, it is spring that the electronic devices and components fix elastic component.
Wherein in one embodiment, it is rubber bar that the electronic devices and components fix elastic component.
A kind of electronic devices and components automatic double surface gluer, including:Electronic devices and components coating system and the electronic devices and components gluing system
The electronic devices and components induction system of conjunction under unified central planning;
The electronic devices and components coating system includes:Gluing bracing frame, gluing horizontally moving device, gluing vertical lifting dress
Put, electronic devices and components glue spreading apparatus;The gluing horizontally moving device is installed on the gluing bracing frame, and the gluing is vertical
Lowering or hoisting gear is installed on the gluing horizontally moving device, and it is vertical that the electronic devices and components glue spreading apparatus are installed on the gluing
On lowering or hoisting gear, the gluing horizontally moving device drives the gluing vertical lifting device to move back and forth in the horizontal direction, institute
Stating gluing vertical lifting device drives the electronic devices and components glue spreading apparatus vertically back and forth to lift;
The electronic devices and components induction system includes:Above-mentioned electronic devices and components transmitting device and the electronic devices and components
The electronic devices and components jacking apparatus that transmitting device coordinates.
The electronic devices and components automatic double surface gluer of the present invention, by arranging electronic devices and components coating system and applying with electronic devices and components
The electronic devices and components induction system that colloid system coordinates, and to electronic devices and components coating system and the knot of electronic devices and components induction system
Structure is optimized, and improves the overall mechanical automation level of production of equipment.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Plus it is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can directly on another element
Or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field for belonging to the present invention
The implication that technical staff is generally understood that is identical.The term for being used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that of the invention in limiting.Term as used herein " and/or " including one or more
The arbitrary and all of combination of related Listed Items.
As shown in Figures 1 and 2, a kind of electronic devices and components automatic double surface gluer 10, including:Electronic devices and components coating system 100 and
The electronic devices and components induction system 200 that electronic devices and components coating system 100 coordinates.
Electronic devices and components coating system 100 is used for carrying out gluing, electronic devices and components delivery system to the surface of electronic devices and components
System 200 is used for carrying out electronic devices and components transport transfer, or electronic devices and components are delivered to electronic devices and components coating system 100
Place, or electronic devices and components are transferred out from electronic devices and components coating system 100.
As shown in figure 3, electronic devices and components coating system 100 includes:Gluing bracing frame 110, gluing horizontally moving device
120th, gluing vertical lifting device 130, electronic devices and components glue spreading apparatus 140.
Gluing bracing frame 110 is used for gluing horizontally moving device 120, gluing vertical lifting device 130, electronic devices and components
Glue spreading apparatus 140 are supported, and gluing horizontally moving device 120 is used for driving gluing vertical lifting device 130 in the horizontal direction
Mobile, gluing vertical lifting device 130 is used for driving electronic devices and components glue spreading apparatus 140 vertically to move, electronics unit device
Part glue spreading apparatus 140 are used for carrying out gluing to electronic devices and components.
Gluing horizontally moving device 120 is installed on gluing bracing frame 110, and gluing vertical lifting device 130 is installed on painting
On glue horizontally moving device 120, electronic devices and components glue spreading apparatus 140 are installed on gluing vertical lifting device 130.Gluing level
Mobile device 120 drives gluing vertical lifting device 130 to move back and forth in the horizontal direction, and gluing vertical lifting device 130 drives
Electronic devices and components glue spreading apparatus 140 are vertically reciprocal to be lifted.
Gluing bracing frame 110 includes:Support baseboard 111, roof supporting 112, support riser 113, support baseboard 111 with
Be spaced between support plate 112 and by support riser 113 connect, support baseboard 111, roof supporting 112 and support riser 113 it
Between form receiving space 114, offer on roof supporting 112 vertically through groove 115, support and offer level on riser 113 and lead to
Groove 116 is crossed, gluing vertical lifting device 130 drives electronic devices and components glue spreading apparatus 140 vertically back and forth to lift and wear
Pass through groove 116 in level.
Gluing horizontally moving device 120 includes:Gluing move horizontally power part 121, gluing move horizontally power transmission shaft 122,
The gluing of two parallel interval settings moves horizontally transmission belt 123, four rolling seat 124.Roller mount 124 is fixed on roof supporting
On 112, every cementing translation dynamic transmission belt 123 is respectively arranged at the two ends with a roller mount 124, and gluing moves horizontally transmission belt
123 are set around in roller mount 124, and gluing moves horizontally one end of power transmission shaft 122 and transmission belt is moved in wherein one cementing translation
One of roller mount 124 on 123 connects, and gluing moves horizontally the other end of power transmission shaft 122 and another cementing is translated
One of roller mount 124 in dynamic transmission belt 123 connects, and gluing moves horizontally power part 121 and moves horizontally transmission with gluing
122 drive connection of axle.In the present embodiment, gluing moves horizontally power part 121 for Motor drive, further, gluing level
Mobile power part 121 is servomotor.
Gluing vertical lifting device 130 includes:Gluing vertical lifting supports transverse slat 131, gluing vertical lifting to support riser
132nd, gluing vertical lifting drive division 133.Gluing vertical lifting supports the two ends of transverse slat 131 dynamic with two cementing translations respectively
Transmission belt 123 connects, and gluing vertical lifting supports riser 132 to be fixed on gluing vertical lifting and supports on transverse slat 131, and gluing is vertical
Lifting drive division 133 is installed on gluing vertical lifting and supports on riser 132.In the present embodiment, gluing vertical lifting drive division
133 is air cylinder driven.
Electronic devices and components glue spreading apparatus 140 include:Electronic devices and components gluing substrate 141, electronic devices and components applies elastomer
142nd, electronic devices and components gluing head 143.Electronic devices and components gluing substrate 141 vertically slides located at gluing vertical lifting
On support riser 132, gluing vertical lifting drive division 133 drives the vertically reciprocal lifting of electronic devices and components gluing substrate 141,
Electronic devices and components gluing head 143 applies elastomer 142 by electronic devices and components and is installed on electronic devices and components gluing substrate 141.
In the present embodiment, it is spring that electronic devices and components apply elastomer 142.In other embodiments, electronic devices and components apply glue elasticity
Part 142 is rubber bar.
Gluing moves horizontally power part 121 and drives cementing translation dynamic by the effect that gluing moves horizontally power transmission shaft 122
Transmission belt 123 is driven around roller mount 124, due to gluing vertical lifting support transverse slat 131 two ends respectively with two gluings
Move horizontally transmission belt 123 to connect, gluing moves horizontally transmission belt 123 and then drives gluing vertical lifting to support 131 edge of transverse slat
Horizontal direction is moved, and gluing vertical lifting drive division 133 drives the vertically reciprocal liter of electronic devices and components gluing substrate 141
Drop, and then the vertically reciprocal lifting of electronic devices and components gluing head 143 is driven, finally realize electronic devices and components gluing head 143
Along level and vertical two free degree activities, so as to realize the gluing to electronic devices and components.
It is noted that applying elastomer 142 by arranging electronic devices and components, electronic devices and components apply elastomer 142 and are
Electronic devices and components gluing head 143 provides elastic buffer power, prevents electronic devices and components gluing head 143 from occurring to touch firmly with electronic devices and components
Hit, reduce the scuffing to electronic devices and components surface.
It should also be noted that gluing moves horizontally transmission belt 123 is provided with two, gluing vertical lifting supports transverse slat 131
Two ends be connected with the dynamic transmission belt 123 of two cementings translation respectively, gluing vertical lifting can be caused to support 131 stress of transverse slat
More uniform, horizontal movement is more stable, and then improves the stability to electronic devices and components gluing.
As shown in Figures 4 and 5, electronic devices and components induction system 200 includes:Electronic devices and components transmitting device 300 and electronics
The electronic devices and components jacking apparatus 400 that components and parts transmitting device 300 coordinates.It is perpendicular that electronic devices and components transmitting device 300 wears support
Level on plate 113 by groove 116 and is partially housed in receiving space 114, and electronic devices and components jacking apparatus 400 are contained in
Hold in space 114.
Electronic devices and components transmitting device 300 is used for being transmitted electronic devices and components, and electronic devices and components jacking apparatus 400 are used
In by the electronic devices and components jack-up in electronic devices and components transmitting device 300, facilitate electronic devices and components coating system 100 to electronics unit
Device carries out gluing.
Particularly, offer on roof supporting 112 vertically through groove 115, support and level is offered on riser 113 by groove
116, facilitate electronic devices and components jacking apparatus 400 by electronic devices and components jacking to glue sites are treated vertically through groove 115, level is logical
Crossing groove 116 facilitates electronic devices and components transmitting device 300 to wear and pass through, and facilitates electronic devices and components transmitting device 300 by electronics unit
Device is transported to electronic devices and components jacking apparatus 400, after the completion of gluing, is also convenient for electronic devices and components transmitting device 300 from electricity
Next station is transferred at sub- components and parts jacking apparatus 400.Electronic devices and components transmitting device 300 and electronic devices and components jacking dress
Put 400 to be partially housed in receiving space 114 so that the volume occupied by equipment entirety is less, improves integration degree.
As shown in fig. 6, electronic devices and components transmitting device 300 includes:Electronic devices and components horizontal transport streamline 310, it is located at
The electronic devices and components horizontal transport baffle plate 320 of 310 both sides of electronic devices and components horizontal transport streamline, it is positioned over electronic devices and components water
The electronic devices and components fixed jig 330, electronic devices and components that flates pass on defeated streamline 310 stops current-limiting apparatus 340.
Electronic devices and components horizontal transport streamline 310 is the conveyer belt for forming transmission intercal 311 in the middle of two parallel arrangeds
Structure.
Electronic devices and components stop that current-limiting apparatus 340 include:Electronic devices and components stop current limliting power part 341, electronic devices and components
Stop current limliting block 342.Electronic devices and components stop that current limliting power part 341 drives electronic devices and components to stop current limliting block 342 along vertical side
To reciprocal lifting, so that electronic devices and components stop that current limliting block 342 is arranged in transmission intercal 311 or departs from transmission intercal 311.
In the present embodiment, electronic devices and components stop that current limliting power part 341 is air cylinder structure.
As shown in Figures 7 and 8, electronic devices and components fixed jig 330 includes:Electronic devices and components fix base plate 331, electronics unit
Device is fixed top board 332, electronic devices and components and fixes buffer board 333.Electronic devices and components are fixed top board 332 and are fixed on electronic devices and components
On fixed base plate 331, electronic devices and components fix base plate 331 and electronic devices and components to be fixed and form hollow accepting groove between top board 332,
Electronic devices and components are fixed buffer board 333 and are contained on the hollow accepting groove.Electronic devices and components are fixed base plate 331 and are provided with electronics
Elastic component 334 fixed by components and parts, and electronic devices and components are fixed buffer board 333 and are installed on by electronic devices and components fixation elastic component 334
Electronic devices and components are fixed on base plate 331.Electronic devices and components are fixed buffer board 333 and are provided with magnet 335, and electronic devices and components fix top
The electronic devices and components accepting hole 336 with the hollow accepting groove insertion is offered on plate 332, and magnet 335 is arranged in electronics unit device
Part accepting hole 336.In the present embodiment, it is spring that electronic devices and components fix elastic component 334.In other embodiments, electronics unit
It is rubber bar that elastic component 334 fixed by device.
It is noted that the both sides of electronic devices and components horizontal transport streamline 310 are equipped with electronic devices and components horizontal transport
Baffle plate 320, electronic devices and components horizontal transport baffle plate 320 electronic devices and components fixed jig 330 is carried out spacing, prevent electronics unit device
Part fixed jig 330 is dropped in the case of vibrations, so as to improve electronic devices and components fixed jig 330 in electronics unit device
The stability that transports on part horizontal transport streamline 310.
It is noted that electronic devices and components stop that current-limiting apparatus 340 are used for electronic devices and components horizontal transport streamline 310
On electronic devices and components fixed jig 330 stopped, when electronic devices and components fixed jig 330 reach specified location when, electronics
Components and parts stop that current limliting power part 341 drives electronic devices and components to stop that current limliting block 342 stretches out, and prevent electronic devices and components fixed jig
330 move forward on electronic devices and components horizontal transport streamline 310.
It is noted that electronic devices and components fixed jig 330 is provided with electronic devices and components fixes buffer board 333, electronics unit device
Part is fixed buffer board 333 and is installed on electronic devices and components fixation base plate 331 by electronic devices and components fixation elastic component 334, enters one
Step, electronic devices and components are fixed buffer board 333 and are provided with magnet 335, electronic devices and components fix offer on top board 332 with described
The electronic devices and components accepting hole 336 of hollow accepting groove insertion, magnet 335 are arranged in electronic devices and components accepting hole 336, electronics unit device
Part is then positioned in electronic devices and components accepting hole 336, this kind of structure setting, as electronic devices and components fix the work of buffer board 333
With the vibration influence to electronic devices and components can be reduced, and prevented gluing head and electronic devices and components from hard collision occurring, improve to electricity
The yield of sub- components and parts gluing.
It should also be noted that the electronic devices and components in electronic devices and components accepting hole 336 are held by magnet 335, on the one hand may be used
Dropped with preventing electronic devices and components from vibrations occur when transport, on the other hand can improve electronic devices and components and apply
Stability when glue.
As shown in Fig. 9, Figure 10 and Figure 11, electronic devices and components jacking apparatus 400 include:Electronic devices and components jacking horizontal drive
Portion 410, the spacing pressing plate 440, fixed jig of electronic devices and components jacking bracing frame 420, fixed jig restriction 430, fixed jig
Location division 450, fixed jig jacking portion 460.In the present embodiment, electronic devices and components jacking horizontal drive portion 410 is motor silk
Bar driving structure.In other embodiments, electronic devices and components jacking horizontal drive portion 410 is air cylinder driven structure.
Electronic devices and components jacking horizontal drive portion 410 drives electronic devices and components jacking bracing frame 420 reciprocal in the horizontal direction
Mobile, the spacing pressing plate 440 of fixed jig restriction 430, fixed jig, fixed jig location division 450 and fixed jig jacking portion
460 are installed on electronic devices and components jacking bracing frame 420.
Fixed jig restriction 430 includes:Fixed jig current limliting cylinder 431, fixed jig current limliting pin 432.Fixation is controlled
Tool current limliting cylinder 431 drives the vertically reciprocal lifting of fixed jig current limliting pin 432, so that fixed jig current limliting pin
432 are arranged in transmission intercal 311 or depart from transmission intercal 311.
The spacing pressing plate 440 of fixed jig is located above electronic devices and components horizontal transport streamline 310, and electronic devices and components are fixed
Tool 330 is limited between electronic devices and components horizontal transport streamline 310 and the spacing pressing plate 440 of fixed jig.
Fixed jig location division 450 includes:Fixed jig positioning cylinder 451, fixed jig location-plate 452, be installed on solid
Determine the fixed jig locating dowel 453 on tool location-plate 452.Fixed jig positioning cylinder 451 drives fixed jig location-plate 452
Vertically reciprocal lifting.In the present embodiment, the quantity of fixed jig locating dowel 453 is two.
The location hole 337 coordinated with fixed jig locating dowel 453 is offered on electronic devices and components fixed jig 330.
Fixed jig jacking portion 460 includes:Fixed jig jacking cylinder 461, fixed jig raising plate 462.Fixed jig
Jacking cylinder 461 drives the vertically reciprocal lifting of fixed jig raising plate 462, so that fixed jig raising plate 462 is worn
It is located at transmission intercal 311 or departs from transmission intercal 311.
It is noted that fixed jig restriction 430 is used for the electronics on electronic devices and components horizontal transport streamline 310
Components and parts fixed jig 330 carries out stop current limliting, after electronic devices and components fixed jig 330 reaches specified location, in electronics unit
In the presence of device jacking apparatus 400, by electronic devices and components fixed jig 330 from electronic devices and components horizontal transport streamline 310
Upper ejection so that electronic devices and components fixed jig 330 departs from from electronic devices and components horizontal transport streamline 310, prevents electronics
There is friction with electronic devices and components horizontal transport streamline 310 and produce vibrations in components and parts fixed jig 330, improve to electronics
The stability of components and parts gluing.
It is noted that by arranging the spacing pressing plate 440 of fixed jig, will in the presence of fixed jig jacking portion 460
Electronic devices and components fixed jig 330 is ejected from electronic devices and components horizontal transport streamline 310, is limited by the spacing pressure of fixed jig
Plate 440, electronic devices and components fixed jig 330 are limited in certain position and can not continue to rise.Meanwhile, fixed jig location division
450 actions, fixed jig positioning cylinder 451 drive fixed jig location-plate 452 to decline so that fixed jig locating dowel 453 with
Location hole 337 on electronic devices and components fixed jig 330 coordinates, and further the position of electronic devices and components fixed jig 330 is entered
Row is limited, and is that subsequently the accurate gluing of electronic devices and components is laid the first stone.
Particularly, electronic devices and components horizontal transport streamline 310 is to form transmission intercal 311 in the middle of two parallel arrangeds
Conveyer structure, fixed jig raising plate 462 are passed through from transmission intercal 311, by electronic devices and components fixed jig 330 from electronics
Eject on components and parts horizontal transport streamline 310, so as to solve asking that electronic devices and components fixed jig 330 is ejected
Topic.
It should also be noted that electronic devices and components jacking horizontal drive portion 410 drives 420 edge of electronic devices and components jacking bracing frame
Horizontal direction is moved back and forth, so can to the fixed jig restriction 430 on the electronic devices and components jacking bracing frame 420,
The spacing pressing plate 440 of fixed jig, fixed jig location division 450 and fixed jig jacking portion 460 carry out horizontal position adjustment, can be with
The electronic devices and components of different model are carried out with gluing, the compatibility to electronic devices and components gluing is improved.
The electronic devices and components automatic double surface gluer 10 of the present invention, by arrange electronic devices and components coating system 100 and with electronics unit
The electronic devices and components induction system 200 that device coating system 100 coordinates, and to electronic devices and components coating system 100 and electronics unit
The structure of device induction system 200 is optimized, and improves the overall mechanical automation level of production of equipment.
The above embodiment only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that the ordinary skill people for this area
For member, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be defined by claims.