CN106423758A - Electronic component lifting device and electronic component gluing equipment - Google Patents
Electronic component lifting device and electronic component gluing equipment Download PDFInfo
- Publication number
- CN106423758A CN106423758A CN201610949020.2A CN201610949020A CN106423758A CN 106423758 A CN106423758 A CN 106423758A CN 201610949020 A CN201610949020 A CN 201610949020A CN 106423758 A CN106423758 A CN 106423758A
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- China
- Prior art keywords
- electronic devices
- components
- fixed jig
- gluing
- jacking
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses an electronic component lifting device and electronic component gluing equipment. The electronic component gluing equipment comprises an electronic component gluing system and an electronic component conveying system, wherein the electronic component conveying system is matched with the electronic component gluing system, the electronic component gluing system is used for gluing the surface of an electronic component, and the electronic component conveying system is used for conveying and transferring the electronic component or conveying the electronic component to the electronic component gluing system or transferring the electronic component from the electronic component gluing system. According to the electronic component gluing equipment, the electronic component gluing system and the electronic component conveying system which is matched with the electronic component gluing system are arranged, and the structures of the electronic component gluing system and the electronic component conveying system are optimized, so that the whole mechanical automatic production level of the equipment is increased.
Description
Technical field
The present invention relates to technical field of mechanical automation, more particularly to a kind of electronic devices and components jacking apparatus and electronics unit
Device automatic double surface gluer.
Background technology
With society, constantly development and science and technology constantly improve, and mechanization, automatization, standardized production have been increasingly becoming and have sent out
Exhibition trend, and progressively replace traditional manual labour, it is that the sustainable development of enterprise is filled with new power.Therefore, electronics produces
Product manufacturing enterprise is also required to grow with each passing hour, and by transition and upgrade, greatly develops mechanical automation equipment to replace traditional craft
Work, and then improve the productivity effect of enterprise, realize the sustainable development of enterprise.
In the real process producing, need gluing is carried out on the surface of electronic devices and components, to meet corresponding production
Technological requirement.Because electronic devices and components belong to precise part, its small volume, the research staff of enterprise easily damaged by slight impact
In equipment development, to realize the mechanical automation gluing to electronic devices and components, need especially to consider the characteristic of electronic devices and components,
How to realize being accurately positioned of electronic devices and components, how to reduce vibrations in transportation for the electronic devices and components, etc., above-mentioned all
It is the practical problem needing to solve.
Content of the invention
The purpose of the present invention is to overcome weak point of the prior art, provides a kind of raising mechanical automation level of production
A kind of electronic devices and components jacking apparatus and electronic devices and components automatic double surface gluer.
The purpose of the present invention is achieved through the following technical solutions：
A kind of electronic devices and components jacking apparatus, including：Electronic devices and components jacking horizontal drive portion, electronic devices and components jacking are propped up
Support, fixed jig restriction, the spacing pressing plate of fixed jig, fixed jig location division, fixed jig jacking portion；
Described electronic devices and components jacking horizontal drive portion drives described electronic devices and components jacking bracing frame past in the horizontal direction
Multiple movement, described fixed jig restriction, the spacing pressing plate of described fixed jig, described fixed jig location division and described fixation are controlled
Tool jacking portion is installed on described electronic devices and components jacking bracing frame；
Described fixed jig restriction includes：Fixed jig current limliting cylinder, fixed jig current limliting pin, described fixed jig
Described in current limliting air cylinder driven, fixed jig current limliting pin vertically back and forth lifts；
Described fixed jig location division includes：Fixed jig positioning cylinder, fixed jig location-plate, it is installed on described fixation
Fixed jig locating dowel on tool location-plate, described fixed jig positioning cylinder drives described fixed jig location-plate along vertically
Direction back and forth lifts；
Described fixed jig jacking portion includes：Fixed jig jacking cylinder, fixed jig raising plate, described fixed jig top
Rise fixed jig raising plate described in air cylinder driven vertically back and forth to lift.
Wherein in an embodiment, described electronic devices and components jacking horizontal drive portion is motor lead screw driving structure.
Wherein in an embodiment, described electronic devices and components jacking horizontal drive portion is air cylinder driven structure.
Wherein in an embodiment, the quantity of described fixed jig locating dowel is two.
A kind of electronic devices and components automatic double surface gluer, including：Electronic devices and components coating system and described electronic devices and components gluing system
The electronic devices and components induction system of conjunction under unified central planning；
Described electronic devices and components coating system includes：Gluing bracing frame, gluing horizontally moving device, gluing vertical lifting dress
Put, electronic devices and components glue spreading apparatus；Described gluing horizontally moving device is installed on described gluing bracing frame, and described gluing is vertical
Lowering or hoisting gear is installed on described gluing horizontally moving device, and it is vertical that described electronic devices and components glue spreading apparatus are installed on described gluing
On lowering or hoisting gear, described gluing horizontally moving device drives described gluing vertical lifting device to move back and forth in the horizontal direction, institute
Stating gluing vertical lifting device drives described electronic devices and components glue spreading apparatus vertically back and forth to lift；
Described electronic devices and components induction system includes：Electronic devices and components transmitting device and described electronic devices and components transmission dress
Put the above-mentioned electronic devices and components jacking apparatus of cooperation.
The electronic devices and components automatic double surface gluer of the present invention, is applied by setting electronic devices and components coating system and with electronic devices and components
The electronic devices and components induction system of colloid system cooperation, and the knot to electronic devices and components coating system and electronic devices and components induction system
Structure is optimized, and improves the overall mechanical automation level of production of equipment.
Brief description
Fig. 1 is the structure chart of the electronic devices and components automatic double surface gluer of one embodiment of the invention；
Fig. 2 is the structure chart at another visual angle of electronic devices and components automatic double surface gluer shown in Fig. 1；
Fig. 3 is the structure chart of the electronic devices and components coating system of electronic devices and components automatic double surface gluer shown in Fig. 1；
Fig. 4 is the structure chart of the electronic devices and components induction system of electronic devices and components automatic double surface gluer shown in Fig. 1；
Fig. 5 is the structure chart at another visual angle of electronic devices and components induction system shown in Fig. 4；
Fig. 6 is the structure chart of the electronic devices and components transmitting device of electronic devices and components induction system shown in Fig. 4；
Fig. 7 is the structure chart of the electronic devices and components fixed jig of electronic devices and components transmitting device shown in Fig. 6；
Fig. 8 is the cut-away view of the electronic devices and components fixed jig shown in Fig. 7；
Fig. 9 is the structure chart of the electronic devices and components jacking apparatus of electronic devices and components induction system shown in Fig. 4；
Figure 10 is another viewing angle constructions figure of the electronic devices and components jacking apparatus shown in Fig. 9；
Figure 11 is the structure chart at the another visual angle of electronic devices and components jacking apparatus shown in Fig. 9.
Specific embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing
Give the better embodiment of the present invention.But, the present invention can realize however it is not limited to herein in many different forms
Described embodiment.On the contrary, providing the purpose of these embodiments to be to make the disclosure is understood more
Plus it is thoroughly comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left ",
For illustrative purposes only, being not offered as is unique embodiment for " right " and similar statement.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field belonging to the present invention
The implication that technical staff is generally understood that is identical.The term being used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body is it is not intended that in limiting the present invention.Term as used herein " and/or " include one or more
The arbitrary and all of combination of related Listed Items.
As shown in Figures 1 and 2, a kind of electronic devices and components automatic double surface gluer 10, including：Electronic devices and components coating system 100 and
The electronic devices and components induction system 200 of electronic devices and components coating system 100 cooperation.
Electronic devices and components coating system 100 is used for carrying out gluing, electronic devices and components delivery system to the surface of electronic devices and components
System 200 is used for electronic devices and components are carried out with transport transfer, or electronic devices and components are delivered to electronic devices and components coating system 100
Place, or electronic devices and components are transferred out at electronic devices and components coating system 100.
As shown in figure 3, electronic devices and components coating system 100 includes：Gluing bracing frame 110, gluing horizontally moving device
120th, gluing vertical lifting device 130, electronic devices and components glue spreading apparatus 140.
Gluing bracing frame 110 is used for gluing horizontally moving device 120, gluing vertical lifting device 130, electronic devices and components
Glue spreading apparatus 140 are supported, and gluing horizontally moving device 120 is used for driving gluing vertical lifting device 130 in the horizontal direction
Mobile, gluing vertical lifting device 130 is used for driving electronic devices and components glue spreading apparatus 140 vertically to move, electronics unit device
Part glue spreading apparatus 140 are used for carrying out gluing to electronic devices and components.
Gluing horizontally moving device 120 is installed on gluing bracing frame 110, and gluing vertical lifting device 130 is installed on painting
On glue horizontally moving device 120, electronic devices and components glue spreading apparatus 140 are installed on gluing vertical lifting device 130.Gluing level
Mobile device 120 drives gluing vertical lifting device 130 to move back and forth in the horizontal direction, and gluing vertical lifting device 130 drives
Electronic devices and components glue spreading apparatus 140 vertically back and forth lift.
Gluing bracing frame 110 includes：Support baseboard 111, roof supporting 112, support riser 113, support baseboard 111 with
Be spaced between support plate 112 and pass through support riser 113 connect, support baseboard 111, roof supporting 112 and support riser 113 it
Between form receiving space 114, roof supporting 112 offers vertically through groove 115, supports and level is offered on riser 113 lead to
Cross groove 116, gluing vertical lifting device 130 drives electronic devices and components glue spreading apparatus 140 vertically back and forth to lift and wear
Pass through groove 116 in level.
Gluing horizontally moving device 120 includes：Gluing moves horizontally power part 121, gluing moves horizontally power transmission shaft 122,
Article two, the gluing of parallel interval setting moves horizontally transmission belt 123, four rolling seat 124.Roller mount 124 is fixed on roof supporting
On 112, the dynamic transmission belt 123 of every cementing translation be respectively arranged at the two ends with a roller mount 124, gluing moves horizontally transmission belt
123 are set around in roller mount 124, and gluing moves horizontally one end of power transmission shaft 122 and transmission belt is moved in wherein one cementing translation
One of roller mount 124 on 123 connects, and gluing moves horizontally the other end of power transmission shaft 122 and another cementing translates
One of roller mount 124 in dynamic transmission belt 123 connects, and gluing moves horizontally power part 121 and moves horizontally transmission with gluing
Axle 122 drive connection.In the present embodiment, gluing moves horizontally power part 121 is Motor drive, further, gluing level
Mobile power part 121 is servomotor.
Gluing vertical lifting device 130 includes：Gluing vertical lifting supports transverse slat 131, gluing vertical lifting to support riser
132nd, gluing vertical lifting drive division 133.Gluing vertical lifting supports the two ends of transverse slat 131 dynamic with two cementing translations respectively
Transmission belt 123 connects, and gluing vertical lifting supports riser 132 to be fixed on gluing vertical lifting and supports on transverse slat 131, and gluing is vertical
Lifting drive division 133 is installed on gluing vertical lifting and supports on riser 132.In the present embodiment, gluing vertical lifting drive division
133 is air cylinder driven.
Electronic devices and components glue spreading apparatus 140 include：Electronic devices and components gluing substrate 141, electronic devices and components apply elastomer
142nd, electronic devices and components gluing head 143.Electronic devices and components gluing substrate 141 vertically slides and props up located at gluing vertical lifting
On support riser 132, gluing vertical lifting drive division 133 drives electronic devices and components gluing substrate 141 vertically back and forth to lift,
Electronic devices and components gluing head 143 applies elastomer 142 by electronic devices and components and is installed on electronic devices and components gluing substrate 141.
In the present embodiment, electronic devices and components apply elastomer 142 is spring.In other embodiments, electronic devices and components apply glue elasticity
Part 142 is rubber bar.
Gluing moves horizontally power part 121 and drives cementing translation dynamic by the effect that gluing moves horizontally power transmission shaft 122
Transmission belt 123 is driven around roller mount 124, due to gluing vertical lifting support transverse slat 131 two ends respectively with two gluings
Move horizontally transmission belt 123 to connect, gluing moves horizontally transmission belt 123 and then drives gluing vertical lifting to support transverse slat 131 edge
Horizontal direction moves, and gluing vertical lifting drive division 133 drives electronic devices and components gluing substrate 141 vertically back and forth to rise
Fall, and then drive electronic devices and components gluing head 143 vertically back and forth to lift, finally realize electronic devices and components gluing head 143
Along level and vertical two degree of freedom activities, thus realizing the gluing to electronic devices and components.
It is noted that applying elastomer 142 by arranging electronic devices and components, electronic devices and components apply elastomer 142 and are
Electronic devices and components gluing head 143 provides elastic buffer power, prevents electronic devices and components gluing head 143 and electronic devices and components from occurring firmly to touch
Hit, reduce the scuffing to electronic devices and components surface.
It should also be noted that gluing moves horizontally transmission belt 123 is provided with two, gluing vertical lifting supports transverse slat 131
Transmission belt 123 dynamic with the translation of two cementings is connected, so that gluing vertical lifting supports transverse slat 131 stress respectively at two ends
More uniform, horizontal movement is more stable, and then improves the stability to electronic devices and components gluing.
As shown in Figures 4 and 5, electronic devices and components induction system 200 includes：Electronic devices and components transmitting device 300 and electronics
The electronic devices and components jacking apparatus 400 of components and parts transmitting device 300 cooperation.It is perpendicular that electronic devices and components transmitting device 300 wears support
Level on plate 113 is passed through groove 116 and is partially housed in receiving space 114, and electronic devices and components jacking apparatus 400 are contained in receipts
Hold in space 114.
Electronic devices and components transmitting device 300 is used for electronic devices and components are transmitted, and electronic devices and components jacking apparatus 400 are used
In by the electronic devices and components jack-up in electronic devices and components transmitting device 300, facilitate electronic devices and components coating system 100 to electronics unit
Device carries out gluing.
Particularly, roof supporting 112 offers vertically through groove 115, support and level is offered on riser 113 by groove
116, facilitate electronic devices and components jacking apparatus 400 by electronic devices and components jacking to treating glue sites vertically through groove 115, level is led to
Crossing groove 116 facilitates electronic devices and components transmitting device 300 to wear and pass through, and facilitates electronic devices and components transmitting device 300 that electronics is first
Device transports to electronic devices and components jacking apparatus 400, after the completion of gluing, is also convenient for electronic devices and components transmitting device 300 from electricity
It is transferred to next station at sub- components and parts jacking apparatus 400.Electronic devices and components transmitting device 300 and electronic devices and components jacking dress
Put 400 to be partially housed in receiving space 114 so that the volume occupied by equipment entirety is less, improve integration degree.
As shown in fig. 6, electronic devices and components transmitting device 300 includes：Electronic devices and components horizontal transport streamline 310, located at
The electronic devices and components horizontal transport baffle plate 320 of electronic devices and components horizontal transport streamline 310 both sides, it is positioned over electronic devices and components water
Flat pass electronic devices and components fixed jig 330 on defeated streamline 310, electronic devices and components stop current-limiting apparatus 340.
Electronic devices and components horizontal transport streamline 310 is the conveyer belt of two parallel arranged intermediate formation transmission intercals 311
Structure.
Electronic devices and components stop that current-limiting apparatus 340 include：Electronic devices and components stop current limliting power part 341, electronic devices and components
Stop current limliting block 342.Electronic devices and components stop that current limliting power part 341 drives electronic devices and components to stop current limliting block 342 along vertical side
Lift to reciprocal, so that electronic devices and components stop that current limliting block 342 is arranged in transmission intercal 311 or departs from transmission intercal 311.
In the present embodiment, electronic devices and components stop that current limliting power part 341 is air cylinder structure.
As shown in Figures 7 and 8, electronic devices and components fixed jig 330 includes：Electronic devices and components fix base plate 331, electronics unit
Top board 332 fixed by device, electronic devices and components fix buffer board 333.The fixing top board 332 of electronic devices and components is fixed on electronic devices and components
On fixing base plate 331, between the fixing base plate 331 of electronic devices and components and the fixing top board 332 of electronic devices and components, form hollow accepting groove,
The fixing buffer board 333 of electronic devices and components is contained on described hollow accepting groove.The fixing base plate 331 of electronic devices and components is provided with electronics
Elastic component 334 fixed by components and parts, and the fixing buffer board 333 of electronic devices and components is installed on by the fixing elastic component 334 of electronic devices and components
On the fixing base plate 331 of electronic devices and components.The fixing buffer board 333 of electronic devices and components is provided with Magnet 335, the fixing top of electronic devices and components
Electronic devices and components accepting hole 336 with described hollow accepting groove insertion is offered on plate 332, Magnet 335 is arranged in electronics unit device
Part accepting hole 336.In the present embodiment, the fixing elastic component 334 of electronic devices and components is spring.In other embodiments, electronics unit
The fixing elastic component 334 of device is rubber bar.
It is noted that the both sides of electronic devices and components horizontal transport streamline 310 are equipped with electronic devices and components horizontal transport
Baffle plate 320, electronic devices and components horizontal transport baffle plate 320 electronic devices and components fixed jig 330 is carried out spacing, prevent electronics unit device
Part fixed jig 330 drops in the case of vibrations, thus improve electronic devices and components fixed jig 330 in electronics unit device
The stability of transport on part horizontal transport streamline 310.
It is noted that electronic devices and components stop that current-limiting apparatus 340 are used for electronic devices and components horizontal transport streamline 310
On electronic devices and components fixed jig 330 stopped, when electronic devices and components fixed jig 330 reach specified location when, electronics
Components and parts stop that current limliting power part 341 drives electronic devices and components to stop that current limliting block 342 stretches out, and prevent electronic devices and components fixed jig
330 move forward on electronic devices and components horizontal transport streamline 310.
It is noted that electronic devices and components fixed jig 330 is provided with electronic devices and components fixes buffer board 333, electronics unit device
The fixing buffer board 333 of part is installed on the fixing base plate 331 of electronic devices and components by the fixing elastic component 334 of electronic devices and components, enters one
Step, the fixing buffer board 333 of electronic devices and components is provided with Magnet 335, the fixing top board 332 of electronic devices and components offers with described
The electronic devices and components accepting hole 336 of hollow accepting groove insertion, Magnet 335 is arranged in electronic devices and components accepting hole 336, electronics unit device
Part is then positioned in electronic devices and components accepting hole 336, this kind of structure setting, due to the work of the fixing buffer board 333 of electronic devices and components
With the vibration influence to electronic devices and components can be reduced, and prevent gluing head from electronic devices and components, hard collision occurring, improve to electricity
The yield of sub- components and parts gluing.
It should also be noted that the electronic devices and components in electronic devices and components accepting hole 336 are held by Magnet 335, on the one hand may be used
Dropped with preventing electronic devices and components from when transport, vibrations occurring, on the other hand can improve electronic devices and components and apply
Stability when glue.
As shown in Fig. 9, Figure 10 and Figure 11, electronic devices and components jacking apparatus 400 include：Electronic devices and components jacking horizontal drive
Portion 410, electronic devices and components jacking bracing frame 420, fixed jig restriction 430, the spacing pressing plate of fixed jig 440, fixed jig
Location division 450, fixed jig jacking portion 460.In the present embodiment, electronic devices and components jacking horizontal drive portion 410 is motor silk
Bar driving structure.In other embodiments, electronic devices and components jacking horizontal drive portion 410 is air cylinder driven structure.
Electronic devices and components jacking horizontal drive portion 410 drives electronic devices and components jacking bracing frame 420 reciprocal in the horizontal direction
Mobile, the spacing pressing plate of fixed jig restriction 430, fixed jig 440, fixed jig location division 450 and fixed jig jacking portion
460 are installed on electronic devices and components jacking bracing frame 420.
Fixed jig restriction 430 includes：Fixed jig current limliting cylinder 431, fixed jig current limliting pin 432.Fixation is controlled
Tool current limliting cylinder 431 drives fixed jig current limliting pin 432 vertically back and forth to lift, so that fixed jig current limliting pin
432 are arranged in transmission intercal 311 or depart from transmission intercal 311.
The spacing pressing plate of fixed jig 440 is located above electronic devices and components horizontal transport streamline 310, and electronic devices and components are fixed
Tool 330 is limited between electronic devices and components horizontal transport streamline 310 and the spacing pressing plate of fixed jig 440.
Fixed jig location division 450 includes：Fixed jig positioning cylinder 451, fixed jig location-plate 452, be installed on solid
Determine the fixed jig locating dowel 453 on tool location-plate 452.Fixed jig positioning cylinder 451 drives fixed jig location-plate 452
Vertically back and forth lift.In the present embodiment, the quantity of fixed jig locating dowel 453 is two.
Location hole 337 with fixed jig locating dowel 453 cooperation is offered on electronic devices and components fixed jig 330.
Fixed jig jacking portion 460 includes：Fixed jig jacking cylinder 461, fixed jig raising plate 462.Fixed jig
Jacking cylinder 461 drives fixed jig raising plate 462 vertically back and forth to lift, so that fixed jig raising plate 462 is worn
Located at transmission intercal 311 or depart from transmission intercal 311.
It is noted that fixed jig restriction 430 is used for the electronics on electronic devices and components horizontal transport streamline 310
Components and parts fixed jig 330 carries out stopping current limliting, after electronic devices and components fixed jig 330 reaches specified location, in electronics unit
In the presence of device jacking apparatus 400, by electronic devices and components fixed jig 330 from electronic devices and components horizontal transport streamline 310
Upper ejection, so that electronic devices and components fixed jig 330 departs from from electronic devices and components horizontal transport streamline 310, prevents electronics
Components and parts fixed jig 330 and electronic devices and components horizontal transport streamline 310 occur friction to produce vibrations, improve to electronics
The stability of components and parts gluing.
It is noted that by arranging the spacing pressing plate of fixed jig 440, will in the presence of fixed jig jacking portion 460
Electronic devices and components fixed jig 330 ejects from electronic devices and components horizontal transport streamline 310, is limited by the spacing pressure of fixed jig
Plate 440, electronic devices and components fixed jig 330 is limited in certain position and can not continue to rise.Meanwhile, fixed jig location division
450 actions, fixed jig positioning cylinder 451 drive fixed jig location-plate 452 to decline so that fixed jig locating dowel 453 with
Location hole 337 on electronic devices and components fixed jig 330 coordinates, and further the position of electronic devices and components fixed jig 330 is entered
Row limits, and lays the first stone for the follow-up accurate gluing to electronic devices and components.
Particularly, electronic devices and components horizontal transport streamline 310 is two parallel arranged intermediate formation transmission intercals 311
Conveyer structure, fixed jig raising plate 462 passes through from transmission intercal 311, by electronic devices and components fixed jig 330 from electronics
Eject on components and parts horizontal transport streamline 310, thus solving asking that electronic devices and components fixed jig 330 is ejected
Topic.
It should also be noted that electronic devices and components jacking horizontal drive portion 410 drives electronic devices and components jacking bracing frame 420 edge
Horizontal direction moves back and forth, so can to the fixed jig restriction 430 on electronic devices and components jacking bracing frame 420,
The spacing pressing plate of fixed jig 440, fixed jig location division 450 and fixed jig jacking portion 460 carry out horizontal position adjustment, permissible
Gluing is carried out to the electronic devices and components of different model, improves the compatibility to electronic devices and components gluing.
The electronic devices and components automatic double surface gluer 10 of the present invention, by arrange electronic devices and components coating system 100 and with electronics unit
The electronic devices and components induction system 200 of device coating system 100 cooperation, and to electronic devices and components coating system 100 and electronics unit
The structure of device induction system 200 is optimized, and improves the overall mechanical automation level of production of equipment.
The above embodiment only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that the ordinary skill people for this area
For member, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (5)
1. a kind of electronic devices and components jacking apparatus are it is characterised in that include：Electronic devices and components jacking horizontal drive portion, electronics unit
Device jacking bracing frame, fixed jig restriction, the spacing pressing plate of fixed jig, fixed jig location division, fixed jig jacking portion；
Described electronic devices and components jacking horizontal drive portion drives described electronic devices and components jacking bracing frame back and forth to move in the horizontal direction
Dynamic, described fixed jig restriction, the spacing pressing plate of described fixed jig, described fixed jig location division and described fixed jig top
Ascending part is installed on described electronic devices and components jacking bracing frame；
Described fixed jig restriction includes：Fixed jig current limliting cylinder, fixed jig current limliting pin, described fixed jig current limliting
Described in air cylinder driven, fixed jig current limliting pin vertically back and forth lifts；
Described fixed jig location division includes：Fixed jig positioning cylinder, fixed jig location-plate, it is installed on described fixed jig
Fixed jig locating dowel on location-plate, described fixed jig positioning cylinder drives described fixed jig location-plate vertically
Reciprocal lifting；
Described fixed jig jacking portion includes：Fixed jig jacking cylinder, fixed jig raising plate, described fixed jig jacking gas
Cylinder drives described fixed jig raising plate vertically back and forth to lift.
2. electronic devices and components jacking apparatus according to claim 1 are it is characterised in that described electronic devices and components jacking level
Drive division is motor lead screw driving structure.
3. electronic devices and components jacking apparatus according to claim 1 are it is characterised in that described electronic devices and components jacking level
Drive division is air cylinder driven structure.
4. electronic devices and components jacking apparatus according to claim 1 are it is characterised in that the number of described fixed jig locating dowel
Measure as two.
5. a kind of electronic devices and components automatic double surface gluer is it is characterised in that include：Electronic devices and components coating system and described electronics unit
The electronic devices and components induction system of device coating system cooperation；
Described electronic devices and components coating system includes：Gluing bracing frame, gluing horizontally moving device, gluing vertical lifting device,
Electronic devices and components glue spreading apparatus；Described gluing horizontally moving device is installed on described gluing bracing frame, and described gluing vertically rises
Falling unit is installed on described gluing horizontally moving device, and described electronic devices and components glue spreading apparatus are installed on described gluing and vertically rise
On falling unit, described gluing horizontally moving device drives described gluing vertical lifting device to move back and forth in the horizontal direction, described
Gluing vertical lifting device drives described electronic devices and components glue spreading apparatus vertically back and forth to lift；
Described electronic devices and components induction system includes：Electronic devices and components transmitting device is joined with described electronic devices and components transmitting device
Electronic devices and components jacking apparatus described in any one in the Claims 1-4 closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610949020.2A CN106423758A (en) | 2016-10-26 | 2016-10-26 | Electronic component lifting device and electronic component gluing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610949020.2A CN106423758A (en) | 2016-10-26 | 2016-10-26 | Electronic component lifting device and electronic component gluing equipment |
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| CN106423758A true CN106423758A (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610949020.2A Pending CN106423758A (en) | 2016-10-26 | 2016-10-26 | Electronic component lifting device and electronic component gluing equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107812668A (en) * | 2017-10-30 | 2018-03-20 | 芜湖辉灿电子科技有限公司 | The point glue equipment of mobile phone production |
| CN112170116A (en) * | 2020-11-16 | 2021-01-05 | 深圳市瑞美义科技有限公司 | Dispensing device is used in PCB board production and processing |
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| CN202006360U (en) * | 2011-01-18 | 2011-10-12 | 福群科技集团有限公司 | Automatic metal post assembly device for hard disk drive frame |
| CN203540841U (en) * | 2013-10-31 | 2014-04-16 | 刘飞 | Jacking device of dispensing machine |
| CN205392884U (en) * | 2016-02-26 | 2016-07-27 | 东莞市上合旺盈印刷有限公司 | Novel point is glued device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107812668A (en) * | 2017-10-30 | 2018-03-20 | 芜湖辉灿电子科技有限公司 | The point glue equipment of mobile phone production |
| CN112170116A (en) * | 2020-11-16 | 2021-01-05 | 深圳市瑞美义科技有限公司 | Dispensing device is used in PCB board production and processing |
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