CN110729201A - SMT (surface Mount technology) solder paste printing method based on thin package substrate - Google Patents
SMT (surface Mount technology) solder paste printing method based on thin package substrate Download PDFInfo
- Publication number
- CN110729201A CN110729201A CN201910992958.6A CN201910992958A CN110729201A CN 110729201 A CN110729201 A CN 110729201A CN 201910992958 A CN201910992958 A CN 201910992958A CN 110729201 A CN110729201 A CN 110729201A
- Authority
- CN
- China
- Prior art keywords
- thin
- paste printing
- solder paste
- area
- package substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
The invention discloses an SMT (surface mount technology) solder paste printing method based on a thin package substrate, which comprises the following steps: dividing a thin packaging substrate into a functional area and a non-functional area according to the layout of the thin packaging substrate before solder paste printing is carried out; thinning the non-functional area of the thin packaging substrate to form a thinned area; designing a corresponding magnetic steel sheet matched with the layout of the thinning area; fixing the magnetic steel sheet in the corresponding thinning area to enable the printing surface formed by the thin packaging substrate to be a flat surface; and (4) carrying out solder paste printing through a common printing steel mesh. The invention solves the problem that the thin packaging substrate is easy to form badly in the solder paste printing process, and improves the printing yield of the thin printing substrate.
Description
Technical Field
The invention relates to the technical field of substrate printing, in particular to an SMT (surface mount technology) solder paste printing method based on a thin packaging substrate.
Background
Smt (surface Mounted technology) surface mount technology is currently the most popular technology and process in the electronic assembly industry. The main process comprises the following steps: printing (or dispensing), pasting, curing, reflow soldering, cleaning, detecting and repairing. The printing is used for printing the soldering paste or the patch glue on the welding disc of the PCB in an leaking mode, and preparation is made for welding of components. The equipment used is a printer (solder paste printer) located at the forefront of the SMT production line.
In the conventional SMT solder paste printing process, for a substrate with a thickness greater than 0.15mm, as shown in fig. 1, because the package substrate (11) has small deformation and warpage, a solder paste (14) printing process can be completed by direct printing without using a carrier and using a common printing steel mesh (13). However, for the substrate with a thickness less than 0.15mm, as shown in fig. 2, the prior art uses a magnetic carrier (21) to load the package substrate (11), covers a magnetic steel sheet (22) to fix the substrate, exposes the area near the substrate pad (12), performs a back half-etching on the printing steel mesh (23) according to the distribution area of the magnetic steel sheet (22), and uses the magnetic carrier (21) with the half-etched printing steel mesh (23) matching with the magnetic steel sheet to complete the solder paste printing process. The convex steps are formed on the substrate covered with the magnetic steel sheet due to the fact that the convex steps are formed on the half-etched steel mesh, the convex steps and the concave steps are matched in motion in the solder paste printing process, and poor printing forming is easily caused due to poor matching relation.
Disclosure of Invention
Accordingly, it is desirable to provide an SMT solder paste printing method that can solve the problem of poor solder paste formation during solder paste printing for thin package substrates.
In order to solve the above problems, the present invention proposes the following technical solutions:
a thin package substrate based SMT solder paste printing method, the method comprising:
dividing a thin packaging substrate into a functional area and a non-functional area according to the layout of the thin packaging substrate before solder paste printing is carried out;
thinning the non-functional area of the thin packaging substrate to form a thinned area;
designing a corresponding magnetic steel sheet matched with the layout of the thinning area;
fixing the magnetic steel sheet in the corresponding thinning area to enable the printing surface formed by the thin packaging substrate to be a flat surface;
and (4) carrying out solder paste printing through a common printing steel mesh.
In one embodiment, the step of thinning the nonfunctional area of the thin package substrate to form a thinned area further includes:
and performing laser thinning in the non-functional area by using a laser device to form a thinned area.
In one embodiment, the thickness of the magnetic steel sheet is the same as the thickness to be thinned.
In one embodiment, the thickness of the thin package substrate is 0.15 mm.
In one embodiment, the thickness of the magnetic steel sheet is 0.07 mm.
In one embodiment, the non-functional region of the thin package substrate includes: the board edge, the cutting path and the Block connection area.
In one embodiment, the functional region of the thin package substrate includes: SMD, DM, and WB regions.
In one embodiment, before the step of fixing the magnetic steel sheets in the corresponding thinned regions, the method further comprises:
and putting the thinned thin packaging substrate into a magnetic carrier, wherein the magnetic carrier is matched with the magnetic steel sheet to fix the thinned thin packaging substrate.
According to the SMT tin paste printing method based on the thin packaging substrate, provided by the invention, the thickness of the functional area of the substrate is kept unchanged by changing the surface shape of the substrate, the thickness of the non-functional area, such as the plate edge, the cutting channel, the Block connection and other areas, is reduced by referring to the thickness of the magnetic steel sheet, after the packaging substrate is covered and fixed by the magnetic steel sheet after being reduced, the tin paste printing surface of the substrate becomes an integral plane, printing can be realized by using a common steel mesh, the printing quality is better than that of the prior art, and the printing yield of the thin printing substrate is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of SMT solder paste printing for thick package substrates in the prior art;
FIG. 2 is a schematic diagram of SMT solder paste printing for a thin package substrate in the prior art;
FIG. 3 is a flow chart illustrating an SMT solder paste printing method based on a thin package substrate according to an embodiment;
FIG. 4 is a schematic diagram of an embodiment of SMT solder paste printing on a thin package substrate.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
At present, the existing SMT solder paste printing process is directed at a substrate with a thickness greater than 0.15mm, as shown in fig. 1: because the deformation and the warpage of the packaging substrate (11) are small, the printing process of the solder paste (14) can be completed by adopting direct printing without a carrier and adopting a common printing steel mesh (13). Meanwhile, for the substrate with the thickness less than 0.15mm, as shown in fig. 2, the prior art uses a magnetic carrier (21) to load the package substrate (11), then covers a magnetic steel sheet (22) to fix the substrate, exposes the area near the substrate bonding pad (12), then performs back half etching on the printing steel mesh (23) according to the distribution area of the magnetic steel sheet (22), and uses the magnetic carrier (21) with the half etching printing steel mesh (23) matched with the magnetic steel sheet to complete the solder paste printing process.
In the technical scheme, firstly, because the steel mesh in the prior art uses half etching, the service life of the steel mesh after half etching is shortened, and the other half etching area is easy to deform after being used for a period of time to influence the overall coplanarity of the steel mesh, thereby reducing the printing quality of the solder paste. Secondly, the semi-etched steel mesh forms a convex step, the substrate covered with the magnetic steel sheet forms a concave step, the convex step and the concave step are matched in motion in the solder paste printing process, and poor matching relation easily causes poor printing forming.
Based on the problems in the prior art, the invention aims to provide an SMT (surface mount technology) solder paste printing method based on a thin package substrate, which can solve the problem that the thin package substrate is easy to form badly in the solder paste printing process.
In one embodiment, as shown in fig. 3, there is provided a thin package substrate-based SMT solder paste printing method, the method including:
step 302, before solder paste printing, dividing the thin packaging substrate into a functional area and a non-functional area according to the layout of the thin packaging substrate;
step 304, thinning the non-functional area of the thin packaging substrate to form a thinned area;
308, fixing the magnetic steel sheet in the corresponding thinning area to enable the printing surface formed by the thin packaging substrate to be a flat surface;
and 310, printing solder paste through a common printing steel mesh.
In this embodiment, in order to change the convex step and the concave step for matching in motion, the surface shape of the substrate is changed, and then the substrate is fixed by matching with the magnetic steel sheet, so that the printing surface forms a plane, and the plane are matched by matching with the common steel sheet, so that the plane contact matching is realized. Specifically, first, before performing solder paste printing, the thin package substrate is divided into a functional region and a non-functional region according to the layout of the thin package substrate. Then, thinning is performed on the non-functional area of the thin package substrate to form a thinned area.
In one embodiment, the non-functional region of the thin package substrate includes: the board edge, the cutting path and the Block connection area.
In one embodiment, the functional region of the thin package substrate includes: SMD, DM, and WB regions. Smd (surface Mounted devices) is a surface mounter, dm (die mount) is a wafer mounting, and wb (wire bonding) is a bonding wire.
The specific thinning area may be as shown in fig. 4, and requires that the thickness of the functional area of the package substrate (31) is kept constant by the substrate manufacturer, for example: assumed to be 0.15 mm. And thinning 70um aiming at the thickness of non-functional areas such as plate edges, cutting channels, Block connection and other areas. Then, the magnetic steel sheet (22) is manufactured according to the layout design of the thinning area, the magnetic carrier (21) is used for loading the thinned stepped packaging substrate (31), the tin paste printing surface becomes an integral plane after the substrate is fixed by the magnetic steel sheet (22), and the printing can be carried out by using a common steel mesh (13) and the printing quality is better than that of the existing method. It is understood that the thinning method can be realized in the substrate manufacturing process or by laser thinning after the substrate leaves factory.
In the above embodiment, the thickness of the functional area of the substrate is kept unchanged by changing the surface shape of the substrate, the thickness of the non-functional area, such as the plate edge, the cutting channel, the Block connection and other areas, is reduced by referring to the thickness of the magnetic steel sheet, after the thinned packaging substrate is covered and fixed by the magnetic steel sheet, the solder paste printing surface of the substrate becomes an integral plane, and the substrate can be printed by using a common steel mesh, thereby achieving better printing quality than the prior art and improving the printing yield of the thin printing substrate.
In one embodiment, there is provided a thin package substrate-based SMT solder paste printing method, in which the step of thinning a non-functional area of the thin package substrate to form a thinned area further includes:
and performing laser thinning in the non-functional area by using a laser device to form a thinned area.
In this embodiment, referring to fig. 4, by using the existing substrate, laser thinning is performed by a laser device for non-functional areas such as plate edges, cutting streets, Block connections, and the like, a magnetic steel sheet is designed according to the layout of the thinned area, the printed surface of the solder paste becomes an integral plane after the substrate is fixed by the magnetic steel sheet, and printing can be performed by using a common steel mesh, thereby achieving better printing quality than that of the existing method.
In one embodiment, the thickness of the magnetic steel sheet is the same as the thickness that is thinned.
In this embodiment, referring to fig. 4, the thickness of the magnetic steel sheet is the same as the thickness of the magnetic steel sheet to be thinned, so that the printing surface formed after fixing can be ensured to be an integral plane, and further, stable printing quality can be achieved by matching with a common printing steel mesh in the solder paste printing process.
In one embodiment, the thickness of the thin package substrate is 0.15 mm.
In one embodiment, the thickness of the magnetic steel sheet is: 0.07 mm.
In one embodiment, there is provided a thin package substrate based SMT solder paste printing method, the method further comprising, prior to the step of fixing the magnetic steel sheet in the corresponding thinned region:
and placing the thinned thin packaging substrate into a magnetic carrier, wherein the magnetic carrier is matched with the magnetic steel sheet for fixing the thinned thin packaging substrate.
In this embodiment, as shown in fig. 4, the thin package substrate can be effectively fixed by the attraction force generated by the magnetic carrier and the magnetic steel sheet, so as to ensure the stability of the printing process.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. An SMT solder paste printing method based on a thin package substrate is characterized by comprising the following steps:
dividing a thin packaging substrate into a functional area and a non-functional area according to the layout of the thin packaging substrate before solder paste printing is carried out;
thinning the non-functional area of the thin packaging substrate to form a thinned area;
designing a corresponding magnetic steel sheet matched with the layout of the thinning area;
fixing the magnetic steel sheet in the corresponding thinning area to enable the printing surface formed by the thin packaging substrate to be a flat surface;
and (4) carrying out solder paste printing through a common printing steel mesh.
2. The thin package substrate-based SMT solder paste printing method of claim 1, wherein the thinning of the non-functional area of the thin package substrate to form a thinned area further comprises:
and performing laser thinning in the non-functional area by using a laser device to form a thinned area.
3. An SMT paste printing method based on a thin package substrate according to claim 2, wherein the thickness of the magnetic steel sheet is the same as the thickness to be thinned.
4. An SMT paste printing method according to claim 3, wherein the thin package substrate has a thickness of 0.15 mm.
5. An SMT paste printing method based on a thin package substrate according to claim 4, wherein the thickness of the magnetic steel sheet is 0.07 mm.
6. The thin package substrate-based SMT solder paste printing method according to any one of claims 1-5, wherein the non-functional area of the thin package substrate comprises: the board edge, the cutting path and the Block connection area.
7. An SMT paste printing method according to claim 6, wherein the functional area of the thin package substrate comprises: SMD, DM, and WB regions.
8. An SMT paste printing method based on a thin package substrate according to claim 7, wherein prior to the step of securing the magnetic steel sheets in the corresponding thinned regions further comprises:
and putting the thinned thin packaging substrate into a magnetic carrier, wherein the magnetic carrier is matched with the magnetic steel sheet to fix the thinned thin packaging substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910992958.6A CN110729201B (en) | 2019-10-18 | 2019-10-18 | SMT (surface Mount technology) solder paste printing method based on thin package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910992958.6A CN110729201B (en) | 2019-10-18 | 2019-10-18 | SMT (surface Mount technology) solder paste printing method based on thin package substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110729201A true CN110729201A (en) | 2020-01-24 |
| CN110729201B CN110729201B (en) | 2021-08-17 |
Family
ID=69220299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910992958.6A Active CN110729201B (en) | 2019-10-18 | 2019-10-18 | SMT (surface Mount technology) solder paste printing method based on thin package substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110729201B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| JP2011029568A (en) * | 2009-07-27 | 2011-02-10 | Taisei:Kk | Holding fixture and holding method for mounting thin-plate printed wiring board |
| CN103826394A (en) * | 2008-10-17 | 2014-05-28 | 林克治 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
| CN108901142A (en) * | 2018-08-14 | 2018-11-27 | 奇酷互联网络科技（深圳）有限公司 | A kind of SMT tin feeding device and add tin method |
| CN208216239U (en) * | 2018-05-25 | 2018-12-11 | 南京恒电电子有限公司 | A kind of realization batch Rogers's high frequency printing thin substrate paste-tin printing apparatus |
-
2019
- 2019-10-18 CN CN201910992958.6A patent/CN110729201B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN103826394A (en) * | 2008-10-17 | 2014-05-28 | 林克治 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
| JP2011029568A (en) * | 2009-07-27 | 2011-02-10 | Taisei:Kk | Holding fixture and holding method for mounting thin-plate printed wiring board |
| CN208216239U (en) * | 2018-05-25 | 2018-12-11 | 南京恒电电子有限公司 | A kind of realization batch Rogers's high frequency printing thin substrate paste-tin printing apparatus |
| CN108901142A (en) * | 2018-08-14 | 2018-11-27 | 奇酷互联网络科技（深圳）有限公司 | A kind of SMT tin feeding device and add tin method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
| CN111993768B (en) * | 2020-08-10 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110729201B (en) | 2021-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8199527B2 (en) | Electronic component and manufacturing method therefor | |
| US6137183A (en) | Flip chip mounting method and semiconductor apparatus manufactured by the method | |
| US7637415B2 (en) | Methods and apparatus for assembling a printed circuit board | |
| CN1325136A (en) | Mfg. for producing plate-shape body and semiconductor device | |
| CN111540820A (en) | Die bonding method of LED chip and display device | |
| US20120051017A1 (en) | Electronic Component and Method of Manufacturing the Same | |
| WO2020252966A1 (en) | Component with electronic element, and production process therefor and camera module therewith | |
| CN110729201B (en) | SMT (surface Mount technology) solder paste printing method based on thin package substrate | |
| US20120018498A1 (en) | Pre-solder method and rework method for multi-row qfn chip | |
| CN104853540A (en) | SMT chip packaging process | |
| US8900926B2 (en) | Chip package method | |
| JPH03218039A (en) | Mounting method of semiconductor element | |
| JP4243178B2 (en) | Manufacturing method of semiconductor device | |
| CN101489359A (en) | Method for avoiding solder bridge | |
| CN218183656U (en) | Backboard and electronic device | |
| KR100902838B1 (en) | Method for applying soldering cream using silicon pad | |
| US20090014504A1 (en) | Method of Supplying Paste Solder Material and Metal Mask Therefor | |
| KR100691995B1 (en) | SMD type Speaker Mounting Structure of Mobile Station and Method thereof | |
| US6951299B2 (en) | Tooling frame able to adhere to tin | |
| CN114615809A (en) | Magnetic suction type carrier | |
| CN115966541A (en) | Metal clamping group, semiconductor device group, preparation method and application thereof | |
| CN106024745A (en) | Pin mounting structure of semiconductor and welding method thereof | |
| CN116723631A (en) | PCB and PCB packaging method | |
| KR20040103744A (en) | Module for a data carrier with improved bump counterparts | |
| US20070205250A1 (en) | Printed circuit board apparatus and method for assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |