JP2002176291A - Component mounting apparatus and component mounting method - Google Patents

Abstract

(57) [Summary] [Problem] Simultaneous suction of parts by a plurality of nozzle heads,
Provided are a component mounting apparatus and a component mounting method with high production efficiency that enable simultaneous mounting of components. SOLUTION: A plurality of nozzle heads 11 mounted on a component mounting head 4 can be independently moved in a plane substantially parallel to a mounting surface of a circuit forming body 14, and a gap pitch between the nozzle heads 11 and component supply. The arrangement pitch of the components 13 in the units 2 and 3 or the chamfer pattern pitch of the multi-chamfered circuit forming body 14 is matched. Alternatively, the gap pitch of the nozzle head 11 is set to an integral multiple of the arrangement pitch of the components 13 or the pattern pitch of the circuit forming body 14. Alternatively, the pattern pitch of the circuit forming body 14 is set to an integral multiple of the gap pitch of the nozzle head 11. A plurality of mounting stations 37 may be provided at a predetermined gap in the component mounting head 34, and an arbitrary number of nozzle heads 36 may be mounted at arbitrary positions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting method for mounting a component such as an electronic component on a circuit forming body such as an electronic circuit board.

[0002]

2. Description of the Related Art A conventional component mounting apparatus will be described with reference to the drawings. FIG. 13 shows an outline of a component mounting apparatus 50 according to a conventional technique. In the figure, a component mounting apparatus 50 includes a component supply unit 2 including a component cassette type component supply device that supplies components to be mounted such as electronic components, and a tray supply unit 3 including a tray type component supply device. A component mounting head 4 having a plurality of nozzles for taking out components from the supply units 2 and 3 and mounting the components on a circuit forming body, an XY robot 5 for transporting the component mounting head 4 to a predetermined position, and a component held by the component mounting head 4 A component recognition device 6 for imaging and recognizing the held state of the components, a circuit formed body holding device 7 for carrying the circuit formed body into the component mounting device 50 and holding the same, and a component suction device for various types of components. The main components are a nozzle station 8 for preparing nozzles and a control device 9 for controlling the operation of the entire component mounting apparatus.

In FIG. 13, a component cassette type component supply device 19 having a reel in which a number of components are wound up in a tape shape is set in the component supply section 2. The component mounting head 4 includes a plurality of nozzle heads 11 each including a nozzle 12 that suctions and takes out a component 13 using negative pressure.
Is attached. The illustrated component mounting apparatus 50 includes a component mounting head 4 on which a plurality of nozzle heads 11 are mounted. In the illustrated example, four nozzle heads 11 are mounted. Each nozzle 12 can perform angle correction (θ rotation) by rotation about the illustrated Z axis. The XY robot 5 transports the component mounting head 4 in a plane in the X and Y directions in the drawing. The circuit forming body holding device 7 carries in and holds a circuit forming body 14 such as an electronic circuit board. In addition to the above-described electronic circuit board, the circuit forming body 14 includes, in recent years, a case in which another component is mounted on a component, a case in which a component is directly mounted on a housing of an electronic device, and the like. The component recognition device 6 recognizes the holding state of the component 13 sucked by each nozzle 12 by imaging from below.

During operation of the component mounting apparatus 50 having the above-described configuration, the component mounting head 4 that has moved just above the component 13 supplied to the component supply unit 2 by the component supply unit 19 lowers each nozzle 12. The component 13 is sucked by the negative pressure and taken out from the component supply unit 2. Next, the component mounting head 4 is conveyed by the XY robot 5 to a position facing the component recognition device 6 while holding the component 13 by suction at each nozzle 12. Component recognition device 6
When the component mounting head 4 passes through a position facing the component recognition device 6 at a predetermined speed, the component mounting head 4 is imaged and recognized by the components 13 held by the nozzles 12 of the component mounting head 4. Based on the recognition result, the position and angle of the component 13 with respect to the predetermined suction state are measured.

[0005] The component mounting head 4 moving toward the circuit forming body 14 to be mounted firstly corrects the necessary movement amount and angle deviation based on the measurement result based on a command from the control device 9, and performs the following steps. The components 13 sucked by the two nozzles 12 are positioned at predetermined positions of the circuit forming body 14 and stopped, and the nozzles 12 are lowered to mount the sucked components 13. Hereinafter, similarly, the positioning is performed on the components 13 sucked by the other nozzles 12, and the nozzles 12 are lowered to sequentially mount the sucked components 13 on the circuit forming body 14.

A tray supply unit 3 is provided at the back side in the Y direction of the component mounting apparatus 50 shown in FIG. Large components are mainly supplied from the tray supply unit 3 to the component mounting apparatus. The component 13 supplied by the tray pallet is sucked by the transfer nozzle 51 located above the tray 13 and is transferred to the suction pad 52 provided on the side in the X direction in the drawing. FIG. 14 shows details of the tray supply unit 3. In the figure, the components 13 are stored in a tray pallet 31 and set in a tray main body 32. The transfer nozzle 51 can suck the component 13 and is attached to the transfer shaft 53 so as to be able to reciprocate in the X direction in the drawing. The transfer nozzle 51 is driven by a servomotor mounted inside the transfer shaft 53. On the right side of the tray pallet 31 in the X direction, the same number of suction pads 52 as the number of nozzles 12 (four in the example shown in FIG. 1) mounted on the component mounting head 4 are provided at the same pitch as the gap pitch of the nozzles 12. It is fixed to the component mounting apparatus body.

In the tray supply unit 3 configured as described above, the transfer nozzle 51 pre-adsorbs the component 13 supplied from the tray pallet 31 prior to component mounting.
The component 13 is transported in the X direction and is sequentially set on each suction pad 52. In the example shown in FIG. 14, two parts 13 have already been set on the suction pad 52, and this is repeated twice, so that four suction pads 5
The component 13 is set in all of 2. Returning to FIG.
When mounting the set components 13 on the circuit forming body 14, the component mounting head 4 moves on the suction pad 52, and the four nozzles 12 mounted on the component mounting head 4 simultaneously lower and have the same pitch. At the same time. Hereinafter, the recognition by the component recognition device 6 and
The mounting after the position correction is the same as the case where the components are supplied from the parts cassette type component supply device 19 described above.

In FIG. 13, a nozzle station 8 is provided at a position adjacent to the above-described tray supply unit 3 on the back side in the Y direction of the component mounting apparatus 50 as well. Part 13
It is preferable to use an appropriate nozzle according to the size and specifications of the component 13 as the nozzle 12 to be sucked.
For this purpose, nozzles 12 of different sizes and specifications are prepared in the nozzle station 8. FIG. 15 schematically shows the nozzles 12 prepared and arranged in the nozzle station 8. Each nozzle 12 can be accessed by the nozzle head 11 mounted on the component mounting head 4 shown in the upper part of the figure. In the example shown in FIG. 15, the nozzles 1 arranged in four rows corresponding to the four nozzle heads 11
2 are prepared for four lines. In the figure, a state is shown in which four small-sized (SS), small-sized (S), medium-sized (M), and large-sized (L) nozzles are arranged in four columns for each row from the back side in the Y direction. Is shown. However, this arrangement is an example, and can be arbitrarily changed according to the purpose of production. In the specification, the arrangement in the X direction (the left-right direction in the figure) is referred to as “column”, and the arrangement in the Y direction (the front-back direction in the figure) is referred to as “row”. The same applies to the arrangement of the body. Each nozzle 1 arranged in the nozzle station 8
The pitch between the two rows coincides with the gap pitch of the nozzle head 11.

When replacing the nozzle, the component mounting head 4
Nozzles 12 attached to the four nozzle heads 11
Are exchanged at the same time. That is, the four nozzle heads 1 of the component mounting head 4 moved to the nozzle station 8
1 descends toward the nozzle pallet 56 and simultaneously returns the currently mounted nozzles 12 to the original row (eg, the row of SS in the figure). Then, the nozzle 12 to be mounted next
(For example, row M in the figure), and each nozzle head 11 descends and attaches simultaneously to four columns of nozzles 12 in that row. For this reason, although a total of 16 nozzles in four columns and four rows are arranged in the nozzle station 8, the nozzles are simultaneously replaced for each row, so that only four types (four rows) of nozzle combinations can be provided. Will not be. Alternatively, this is applied to each nozzle head 1
When the nozzles 12 for any combination of the nozzles 12 are to be mounted, it is necessary to move and position the component mounting heads 4 for each nozzle head 11, so that much time is required for nozzle replacement. It will be.

[0010]

As described above, the conventional component mounting apparatus 50 has several problems.
The plurality of nozzle heads mounted on the component mounting head remained fixed, and thus the gap pitch between the nozzle heads was also fixed. Therefore, when picking up parts,
It is good if the gap pitch of each nozzle head coincides with the gap pitch between each component in the component supply unit, but if there is a slight difference between both pitches, simultaneous suction of components by each head is possible. Did not. If simultaneous suction is not possible, it is necessary to perform positioning and suction for components for each nozzle head mounted on the component mounting head, which consumes much time. For this reason, the effect of improving productivity has been impaired even with a plurality of bent heads.

Similarly, the gap pitch between the plurality of nozzles is
If the mounting pitch of the components on the circuit forming body does not slightly match, the component mounting head needs to move for each nozzle to align the nozzles with the predetermined mounting position of the circuit forming body. Requires a lot of time, and the effect of having a plurality of nozzles is impaired. The same problem occurs when components are mounted on the multi-chamfered circuit forming body, and when the pattern pitch of the chamfer does not match the gap pitch of the nozzle heads.

Next, when replacing the nozzles, since the nozzle heads 11 are fixed to the component mounting head 4, only the simultaneous replacement of each row provided on the nozzle pallet 56 of the nozzle station 8 can be performed. There were extreme restrictions on the variations. Alternatively, when an attempt is made to arbitrarily select an individual nozzle 12 for each nozzle head 11, the component mounting head 4 returns the old nozzle 12 and takes out the new nozzle 12 for each nozzle head 11. Therefore, it is necessary to move on the nozzle pallet 56, which requires a lot of man-hours, and lowers production efficiency.

Furthermore, conventionally, with respect to the number and gap pitch of a plurality of nozzle heads of a component mounting head, the number of components arranged in a component supply unit (including a tray supply unit), the component arrangement pitch, and the multi-faced circuit forming body The number of chamfers and the pattern pitch of chamfers are not designed to match well, and when viewed as a whole component mounting system, component mounting that fully exploits the improvement of production efficiency by mounting multiple nozzles It wasn't the way.

Accordingly, the present invention solves the above-mentioned problems of the prior art, and takes advantage of a component mounting apparatus equipped with a plurality of nozzles to simultaneously suction a plurality of components, simultaneously mount a plurality of components, and various combinations. It is an object of the present invention to provide a component mounting apparatus and a component mounting method capable of simultaneously converting nozzles according to (1), (2), and eliminating the factor of tact loss as much as possible to enhance production efficiency.

[0015]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems by providing a plurality of nozzle heads independently of the component mounting head on a plane substantially parallel to the component mounting surface of the circuit forming body. It is intended to solve the problem by providing a mechanism for movably holding the object, and specifically includes the following contents.

That is, the present invention according to claim 1 includes a component mounting head having a plurality of nozzle heads for sucking and extracting a component from a component supply unit and mounting the component at a predetermined position of a circuit forming body. A component mounting apparatus, wherein the plurality of nozzle heads include a mechanism for holding a plane substantially parallel to a component mounting surface of the circuit formed body so as to be independently movable with respect to the component mounting head. The present invention relates to a component mounting apparatus characterized in that: By making a plurality of nozzle heads independently movable, it is possible to simultaneously suction and mount components.

According to a second aspect of the present invention, in the component mounting apparatus, the direction in which the plurality of nozzle heads are arranged is set to X.
A direction orthogonal to the X direction within a plane in which the plurality of nozzle heads can move is defined as a Y direction, a mechanism for movably holding the plurality of nozzle heads is provided for each of the plurality of nozzle heads. A first moving means for moving the first moving means in the X direction with respect to the component mounting head, and / or a second moving means for moving the first moving means in the Y direction. It is characterized by.

According to a third aspect of the present invention, one or both of the first moving means and the second moving means are driven by a servomotor and a ball screw. It is characterized by being.

According to a fourth aspect of the present invention, in the component mounting apparatus, one or both of the first moving means and the second moving mechanism are driven by a linear motor. It is characterized by:

According to a fifth aspect of the present invention, in the component mounting apparatus, the component mounting apparatus further includes a nozzle station for accommodating a plurality of nozzles, and a direction in which the plurality of nozzle heads are arranged is an X direction. A direction perpendicular to the X direction in a plane in which the plurality of nozzle heads can move is defined as Y
When the nozzles are accommodated in the nozzle station, the nozzles accommodated in the nozzle station are arranged in a grid pattern in the X direction and the Y direction. , And each nozzle head accesses an arbitrary row of nozzles along the Y direction, and the plurality of nozzle heads can simultaneously exchange nozzles. It is intended to increase the variation of combinations of nozzles attached to a plurality of nozzle heads.

According to a sixth aspect of the present invention, there is provided a component mounting head including a component mounting head having a plurality of nozzle heads for sucking and removing a component from a component supply unit and mounting the component at a predetermined position on a circuit forming body. A component mounting apparatus, wherein the plurality of nozzle heads are detachably mounted on a plurality of mounting stations provided on the component mounting head. By making the plurality of nozzle heads detachable, it is possible to adjust the gap pitch between the nozzle heads, thereby facilitating simultaneous suction of components and simultaneous mounting.

A component mounting apparatus according to a seventh aspect of the present invention is characterized in that the plurality of mounting stations are provided at equal intervals.

The component mounting apparatus according to the present invention is characterized in that any number of nozzle heads can be mounted on the plurality of mounting stations in any arrangement.

According to a ninth aspect of the present invention, there is provided a component mounting apparatus having a component mounting head having a plurality of nozzle heads for sucking and removing a component from a component supply unit and mounting the component at a predetermined position on a circuit forming body. The present invention relates to a component mounting apparatus, wherein the component mounting head includes a mounting means for slidably mounting the plurality of nozzle heads. Flexibility is provided by the pitch between the plurality of nozzle heads.

According to a tenth aspect of the present invention, the component mounting apparatus according to the present invention adjusts a gap pitch between a plurality of nozzle heads, thereby simultaneously picking up components in the component supply unit.
Alternatively, it is characterized in that either one or both of simultaneous mounting of components on the circuit forming body are enabled.

According to the eleventh aspect of the present invention, in the component mounting apparatus, the simultaneous pick-up of the components in the component supply unit is performed by:
It is characterized in that the components are sucked directly and simultaneously from a tray supply unit that supplies and arranges components on a tray pallet. The purpose of the present invention is to eliminate waste caused by the transfer of parts in the prior art.

According to a twelfth aspect of the present invention, there is provided a component mounting method for picking up a component from a component supply unit using a plurality of nozzle heads, extracting the component, and mounting the component at a predetermined position of a circuit forming body. By adjusting the gap pitch between the plurality of nozzle heads according to one or both of the arrangement pitch of the components of the component supply unit and the mounting pitch of the circuit forming body, the suction of the components is achieved. ,
And a method of mounting one or both of the components simultaneously by a plurality of nozzle heads.

According to a thirteenth aspect of the present invention, there is provided a component mounting method according to the present invention, wherein a plurality of nozzle heads are simultaneously suctioned by a plurality of components, and a gap pitch between the plurality of nozzle heads and an arrangement of components in a component supply unit. It is characterized in that the pitch is adjusted so as to match, or that one of the gap pitch of the nozzle head and the arrangement pitch of the components is an integral multiple of the other.

According to a fourteenth aspect of the present invention, in the method of mounting a plurality of components simultaneously by the plurality of nozzle heads, a gap pitch between the plurality of nozzle heads and a pattern for chamfering a circuit formed body are provided. It is characterized in that the pitch is adjusted to match, or that one of the gap pitch of the nozzle head and the pattern pitch of the circuit forming body is an integral multiple of the other.

According to a fifteenth aspect of the present invention, in the case where the arrangement pitch of the components and the gap pitch of the nozzle heads are made to match, the arrangement number of the components is an integer of the number of the nozzle heads. It is characterized by being doubled. This is because the components are used up by multiple times of component suction by the plurality of nozzle heads.

A component mounting method according to the present invention as set forth in claim 16, wherein when the gap pitch between the nozzle heads is set to be an integral multiple of the arrangement pitch of the components, the arrangement number of the components is reduced by the nozzle head. The number is set to an integral multiple of the integral multiple. This is because the components are used up by multiple times of component suction by the plurality of nozzle heads.

The component mounting method according to the present invention as set forth in claim 17, wherein when the gap pitch of the nozzle heads and the pattern pitch of the circuit forming body are made to coincide with each other, the circuit along the arrangement direction of the nozzle heads. The number of chamfers on the formed body is an integral multiple of the number of the nozzle heads. This is because a plurality of nozzle heads are efficiently used and mounted.

In the component mounting method according to the present invention, when the gap pitch between the nozzle heads is set to be an integral multiple of the pattern pitch of the circuit forming body, the component mounting method may be arranged in the arrangement direction of the nozzle heads. The number of chamfers of the circuit forming body along the number of the nozzle heads is an integral multiple of the integral multiple of the number of the nozzle heads. This is because a plurality of nozzle heads are efficiently used and mounted.

The component mounting method according to the present invention as set forth in claim 19, wherein the arrangement pitch of the components and the pattern pitch of the circuit forming body are the same, or the arrangement pitch of the components and the circuit formation It is characterized in that one of them is an integral multiple of the other with respect to the pattern pitch of the body. This implements efficient component mounting.

According to a twentieth aspect of the present invention, there is provided a component mounting head provided with a component supply unit for supplying a component to be mounted, a plurality of nozzles for taking out the component from the component supply unit and mounting the component. An XY robot for transporting a component mounting head, a circuit forming body holding device for carrying in and holding the circuit forming body, and a control device 9 for controlling the entire operation, wherein the parts taken out by the nozzles are taken out of the circuit forming body. A component mounting device that is mounted in alignment with a mounting position of a circuit forming body held by a holding device, wherein the component is taken out,
Alternatively, the present invention relates to a component mounting apparatus that performs the component mounting method according to any one of claims 12 to 19 when mounting the component. An object of the present invention is to provide a component mounting apparatus that effectively utilizes a plurality of nozzle heads and performs efficient component mounting.

[0036]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG.
1 shows an overview of the component mounting apparatus 1 according to the present embodiment. In the figure, components that are the same as those described in the related art are denoted by the same reference numerals. The component mounting apparatus 1 according to the present embodiment includes a component supply unit 2 including a component cassette type component supply device 19 for supplying components to be mounted, such as electronic components, and a tray supply unit including a tray type component supply device. 3, a component mounting head 4 including a plurality of nozzle heads 11 that take out components from both supply units 2 and 3 and mount the components on a circuit forming body 14.
XY robot 5 for transporting component mounting head 4 to a predetermined position
A component recognition device 6 that images and recognizes the holding state of the component 13 held by the component mounting head 4, and a component mounting device 1
, A circuit forming body holding device 7 for transporting and holding the circuit forming body 14, a nozzle station 8 for preparing suction nozzles 12 corresponding to various types of components, and control for controlling the operation of the entire component mounting apparatus 1. The device 9 is a main component. The above configuration is the same as the component mounting apparatus according to the related art described with reference to FIG.

In the component mounting apparatus 1 according to this embodiment, each of the plurality of nozzle heads 11 mounted on the component mounting head 4 is movably mounted on the component mounting head 4 independently. I have. FIG. 2 shows the details. In the figure, the component mounting head 4 has four nozzle heads 11a, 11b, 11c,
11d is mounted, and nozzles 12a, 12b, 12c and 12d are mounted on each nozzle head, respectively. Each of the nozzles has a component 13a, 13b, 1
3c and 13d are adsorbed respectively. Except where specific nozzle heads, nozzles, and parts are described,
The nozzles 11, nozzles 12, and components 13 are generally called generically. As shown by arrows, each nozzle head 11 has a structure capable of independently moving in the X direction and the Y direction in the drawing with respect to the component mounting head 4. Here, the X direction is a direction in which the nozzle heads 11 are arranged, and the Y direction is a direction orthogonal to the X direction.

The movable structure of each nozzle head will be described with reference to an enlarged view of FIG. FIG. 3 shows the component mounting head 4.
FIG. 2 is a perspective view showing only one nozzle head 11 attached to the nozzle head. In FIG. 3, the nozzle head 1
1, a nozzle 12 is attached, and the nozzle 12
An M (voice coil motor) 15 can drive up and down. The nozzle 12 can rotate (θ rotation) about the Z axis in the figure via a belt by driving a servo motor (not shown) to correct the inclination angle of the sucked component. In the prior art, the nozzle head 11 was fixed to the component mounting head 4 (see FIG. 2). In the present embodiment, it is attached to the component mounting head 4 via a structure that is movable in the X and Y directions in the drawing.

Of these, the nozzle head 11 is moved in the X direction by driving a forward / reverse rotatable servomotor 16 mounted on a fixed plate 21 for fixing the nozzle head 11 movably in the X direction. , The nozzle head 11 is configured to move on the linear guide 18. On the other hand, the movement of the nozzle head 11 in the Y direction is configured as follows. Nozzle head 1
The four slide shafts 22 attached to a fixing plate 21 for fixing the component mounting head 1 are inserted into four through holes 24 provided in a support plate 23 fixed to the component mounting head 4.
Each is fitted slidably in the Y direction. The fixed plate 21 is driven in the Y direction by rotating a ball screw 27 by a forward / reverse rotatable servo motor 26 fixed to the support plate 23. By driving the fixed plate 21, the nozzle head 11 attached to the fixed plate 21 is also driven in the Y direction.

Each nozzle head 11 is individually provided with the above-mentioned structure for movably holding the nozzle head. The fact that each nozzle head 11 can move in the X direction and the Y direction with respect to the component mounting head 4 means that each nozzle head 11
This means that it is possible to move on a plane substantially parallel to the mounting surface of the circuit forming body 14 (see FIG. 1) on which components are mounted. The driving of the nozzle heads 11 in the X and Y directions is not limited to the driving via the ball screws 17 and 27, and may be, for example, a linear motor. Further, in the present embodiment, each nozzle head 11 is preferably provided with a mechanism capable of moving in both the X direction and the Y direction. However, it is needless to say that only one of the nozzle heads 11 can be moved according to the purpose. It is.

Returning to FIG. 1, the operation of the component mounting apparatus 1 according to the present embodiment having the above configuration will be described. First, the circuit forming body 14 such as an electronic circuit board is carried into the circuit forming body holding device 7. The component mounting head 4 is positioned by the XY robot 5 in the component supply unit 2 that supplies the component 13. Each nozzle head 11 of the component mounting head 4
Adjusts the suction position of each nozzle 12 so that the component 13 can be sucked by each nozzle 12 at the same time. Each of the nozzles 12 whose suction position has been adjusted is a component 13 of the component supply unit 2.
, And the suction operation of the component 13 is simultaneously performed by the four nozzles.

Next, the components 13 simultaneously sucked by the nozzles 12 are positioned on the component recognition device 6 by the movement of the component mounting head 4 by the XY robot 5. Then, in accordance with the recognition result of the component recognition device 6, each nozzle 12
Of the reference point of the component 13 is calculated.
In the component mounting apparatus 1 according to the present embodiment, since each nozzle head 11 can independently move in the X direction and the Y direction, position correction can be performed for each nozzle head 11. When the component mounting head 4 moves to a predetermined position facing the circuit forming body 14, the position of each nozzle 12 is independently corrected based on a command from the control device 9, and the components 13 adsorbed by each nozzle 12 are adjusted. All are circuit forming bodies 14
Implemented at the same time. In the prior art, the position correction for each nozzle 11 is individually performed by moving the component mounting head 4, and the operation of sequentially mounting can be performed simultaneously by the independent position correction. Bring improvement. Further, since the nozzles 12 can move independently, the nozzles 12 can move independently even if the pattern pitch, which is the pitch of the multiple patterns in the circuit body 14, does not match the gap pitch of the nozzles 12. Simultaneous implementation is possible as long as it is within the allowable range. Note that a program relating to positioning of each mounted component 13 can be performed by the input operation unit 10.

In FIG. 1, in the tray supply section 3 of the component mounting apparatus 1 according to the present embodiment, the transfer nozzle 51 shown in the conventional component mounting apparatus 50 described with reference to FIG. Related suction pallets 52,
The transfer shaft 53 has been removed. This outline will be described with reference to FIG. In the figure, a predetermined tray pallet 31 containing components 13 to be mounted is moved to a position where each nozzle 12 of the component mounting head 4 can perform a suction operation.
Drawn from. Next, the component mounting head 4 is positioned at the suction position of the tray pallet 31, and the nozzles 12 descend from the nozzle heads 11 to simultaneously suction a predetermined component 13.

In the present embodiment, as described above,
The illustrated four nozzle heads 11 mounted on the component mounting head 4 are independently movable. Therefore, until the component mounting head 4 reaches the position facing the tray pallet 31, the gap pitch between the nozzle heads 11 is
The adjustment is made so as to be equal to the gap pitch between the components 13 arranged in the same row of the tray pallet 31. by this,
Simultaneous suction of the component 13 by each nozzle 12 becomes possible,
The labor required for replacing components using the transfer nozzle 51 according to the conventional technique can be omitted, and the productivity can be greatly improved.

As shown in FIG. 4, the number of components 13 that can be arranged in one row of the tray pallet 31 is an integral multiple of the number of nozzle heads 11 (in the example of FIG.
On the other hand, by designing the number of components to be twice as large as eight), all the components in one row can be completely used up by the component mounting head 4 picking up the components several times. Thereby, the productivity can be improved without a part of the nozzle 12 being incomplete at the time of picking up the components, which does not occur much. This content will be further described later.

Next, in the component mounting apparatus 1 according to the present embodiment, by using the component mounting head 4 having a plurality of independently movable nozzles 12, the number of combinations of the nozzles 12 to be used is increased. Has increased significantly. FIG. 5 shows an outline of a nozzle replacement operation in the nozzle station 8 of the component mounting apparatus 1 shown in FIG. FIG. 5A shows a situation where each nozzle head 11 mounted on the component mounting head 4 moves to the nozzle station 8 and returns each mounted nozzle 12 to the original position of the nozzle pallet 56. . In the illustrated example, the nozzle head 11a has an L nozzle, the nozzle head 11b has an M nozzle, and the nozzle head 1
An S nozzle is attached to 1c, and an SS nozzle is attached to the nozzle head 11d. Each nozzle head 11
Can be moved individually in the Y direction shown in the figure.
Without moving the component mounting heads 4 individually, each nozzle head 11 moves by a predetermined amount in the Y direction as shown by an arrow, and the attached nozzles 12 can be returned to a predetermined place at the same time.

Thereafter, as shown in FIG. 5B, each nozzle head 11 is similarly moved by a predetermined amount in the Y direction to attach a nozzle 12 suitable for a component to be sucked next, and then accesses the required nozzle 12. A predetermined nozzle 12 is attached to all the nozzle heads 11 at the same time. In the example shown,
The nozzle head 11a attaches an s nozzle, the nozzle head 11b attaches an L nozzle, the nozzle head 11c attaches an SS nozzle, and the nozzle head 11d attaches an M nozzle. During this time, the movement of the component mounting head 4 is unnecessary.

As described above, the selection of the nozzles 12 in each nozzle head 11 can be arbitrarily performed, and the mounting can be performed simultaneously for all the nozzles. In the prior art, the combination that can be changed at the same time is limited to a combination of nozzles in the same row. Therefore, according to the present embodiment, it is possible to obtain four times the nozzle combination variation as compared with the conventional one. Alternatively, when an arbitrary nozzle 12 is selected according to the related art, the component mounting head 4 has to move to the position of the nozzle to be attached for each nozzle head 11. Therefore, according to the present embodiment, the arbitrarily selected nozzles can be simultaneously replaced with a ノ ズ ル nozzle replacement time as compared with the conventional one.

The characteristics of the component mounting apparatus according to the present embodiment have been described above, and are included in the above description, i) simultaneous component mounting with a plurality of nozzles, ii) tray supply unit with a plurality of nozzles. Simultaneous picking of parts directly from
iii) Simultaneous nozzle replacement of any combination pattern by a plurality of nozzles does not necessarily have to be performed simultaneously for all of i), ii), and iii), and any one or two of them may be performed as necessary. Of course, the combination may be performed individually. In that case, in the structure for moving each nozzle described above, when only the above ii) is carried out, it is sufficient to provide a movable structure for the nozzle head 11 only in the X direction, and only for the above iii). In order to implement the above, a movable structure only in the Y direction may be provided. When the above-mentioned i) is performed, it is desirable that the mechanism be a movable mechanism in both the X and Y directions as shown in FIGS.

Next, a component mounting apparatus according to a second embodiment of the present invention will be described with reference to the drawings. FIG.
3 shows a component mounting head 34 and a nozzle head 36 of the component mounting apparatus according to the present embodiment. According to the related art, as described above, the gap pitch between the plurality of nozzle heads 11 is different from the pattern pitch of the chamfering of the circuit forming body 14 having multiple chamfers, so that simultaneous mounting may not be possible. Alternatively, since the gap pitch between the plurality of nozzle heads 11 is different from the gap pitch between the components 13 arranged in the tray supply unit 3, it may not be possible to perform simultaneous simultaneous suction. The component mounting apparatus according to the present embodiment has a structure in which a plurality of nozzle heads 36 can be detachably mounted at a plurality of positions on the component mounting head 34, and the gap pitch of the nozzles 12 can be changed, thereby causing the above problem. Is being solved.

In FIG. 6A, the component mounting head 34
, Nine mounting stations 37 to which the nozzle head 36 can be mounted are prepared at equal intervals. Any number of nozzle heads 36 can be mounted at any position of each mounting station 37, and any number that is allowable in design. For example, assuming that each gap pitch of the mounting station 37 is 10 mm, in the example shown in FIG. 6A, four nozzle heads 36 each having a gap pitch of the nozzles 12 of 20 mm are mounted. In this state, if the components are simultaneously sucked from the tray supply unit 3 in which the arrangement pitch of the components is 20 mm, and are simultaneously mounted on the circuit forming body 14 in which the pattern pitch of the multi-cavity is 20 mm, Production efficiency can be increased.

In the example shown in FIG. 6B, when the gap pitch between the nozzles 12 is 10 mm, and when the arrangement pitch of the components of the tray supply unit 3 is 10 mm, the pattern pitch of the multiple pattern forming of the circuit forming body 14 is 10 mm. In some cases, simultaneous mounting or simultaneous suction is possible. Further, according to the pattern in the component mounting of the circuit forming body 14, FIG.
An irregular arrangement of the nozzle heads 36 as shown in FIG. In addition, as shown in FIG. 7B, it is possible to simultaneously mount components or simultaneously suction components by using more nozzles 36, so that the production efficiency can be further improved. The above-described gap pitch of the mounting stations or the number of mounting stations are merely examples, and any of them can be arbitrarily selected within the allowable range of design according to production needs. Further, the gap pitch of the mounting station 37 may not be uniform, and may be set to an arbitrary gap width as needed. In this case, the adjacent mounting station 3
The gap pitch of No. 7 may be smaller than the physical minimum gap pitch due to the diameter of the nozzle head 36 or the like.

Each mounting station 37 has:
Positioning pins are provided so that the nozzle head 36 can be fixed. In addition, an air supply unit, a power connection terminal, and the like are provided so that the nozzle 12 can be moved up and down and rotated θ. The head 11 can perform necessary functions without requiring any special connection, piping, and the like, thereby facilitating attachment and detachment operations.

FIG. 8 shows an alternative to the present embodiment. Here, the nozzle head 36 is configured to be detachably attached to the component mounting head 34 and to be slidably mounted at the same time. In the drawing, the component mounting head 34 is provided with a mounting rail 38 to which a plurality of nozzle heads 36 can be mounted. This allows any number of nozzle heads 36 to be mounted on the component mounting head 34 at an arbitrary gap pitch within a design allowable range. Since the attached nozzle head 38 is slidable, the adjustment of the gap pitch between the nozzle heads is optional, and the circuit forming body 1 is changed every time the model is switched.
This is particularly advantageous in a production mode in which the pattern pitch of No. 4 greatly varies. For a structure in which the position of the mounting station 37 is fixed in advance as shown in FIGS. 6 and 7, the fact that the pitch can be arbitrarily selected as in this alternative is advantageous in that it can meet various production needs. Become.
However, in this alternative, an additional adjustment time for fixing the nozzle head 36 at a predetermined position is required. On the other hand, when the mounting station 37 as shown in FIGS. 6 and 7 is of a fixed type, the structure is simple and the cost is advantageous although there is a lack of flexibility for production.

Next, a component mounting method according to a third embodiment of the present invention will be described with reference to the drawings. In the related art, when component mounting is performed by a component mounting apparatus having a plurality of nozzle heads, the number of nozzle heads and the number of component arrangements of the component supply unit are determined between the number of nozzle heads and the number of chamfers of the circuit formed body. If there is no consistency between the nozzles, some nozzles that do not contribute to production may be generated in some of the multiple nozzle heads, or some of the components may remain unsucked, or some of the multi-cavity circuit forming bodies may not be mounted. . For example, when five components are arranged and supplied to a component supply unit of a component mounting apparatus having four nozzle heads, one component becomes too many after the first four components are simultaneously suctioned, and the next suction is performed. Sometimes only one nozzle head is used, reducing production efficiency. In the present specification, these
If a part of the nozzle, part, circuit forming body, or the like has a surplus in the course of the production operation, it is referred to as “too much”. In the above-described example, one component is generated, and when components are mounted on three multi-panel circuit forming bodies for four nozzles, one component is generated.

Further, when component mounting is performed by a component mounting apparatus having a plurality of nozzles, the gap between the nozzle pitch and the pattern pitch of the chamfer of the circuit forming body, or the gap pitch between the nozzles and the arrangement of components in the component supply unit. If there is no consistency between the pitch and the pitch, simultaneous mounting or simultaneous suction cannot be performed, and the component mounting head needs to move each time and be aligned for mounting or suction at each nozzle, thereby lowering production efficiency. . In the present embodiment, the relationship between the number and pitch of the nozzles and the number and pitch of other elements related to component mounting is improved from the viewpoint of the entire component mounting system, and component mounting that can improve productivity. It provides a method.

First, referring to FIG. 9, the number of chamfers of the multi-chamfered circuit forming body 14 and the number of nozzles 12 (or
The relationship with the number of nozzle heads 11) will be described. In FIG. 9A, the number of the nozzles 12 mounted on the component mounting head 4 is four, and the number of chamfers of the circuit forming body 14 is three. Therefore, when performing simultaneous mounting with each nozzle 12, the nozzle 12 (or the nozzle head 1)
In 1), only one is generated, resulting in production waste. Conversely, if the number of chamfers of 14 of the circuit forming body is 5, one of the multiple chamfering of the circuit forming body becomes too much by the simultaneous mounting by the four nozzles 12, and the production becomes inefficient. In such a case, as shown in FIG. 9B, if the number of chamfers of the circuit forming body 14 and the number of the nozzles 12 are set to the same four, the side of the circuit forming body 1
Efficient component mounting can be performed without much occurrence on the 4 side. Alternatively, even if the number of chamfers of the circuit forming body 14 is set to an integral multiple of the number of the nozzles 12, after the simultaneous mounting by the nozzles 12 a plurality of times, not much is applied to both the nozzles 12 and the circuit forming body 14. It is efficient without any occurrence. In the present specification, when referring to the number of multi-chamfered circuit forming bodies, it refers to the number of rows in a direction in which a plurality of nozzles are arranged (X direction in FIG. 9A).

In the example shown in FIG. 9B, the situation in which parts indicated by □, Δ, and ○ are sequentially and efficiently mounted by the four nozzles 12 for each section of the four-row multi-cavity circuit forming body 14a. Is shown. Pitch between parts p1, p2, p3
Are equal to the gap pitch of the nozzle head 11, and efficient simultaneous mounting becomes possible.

In the example shown in FIG. 10, the pattern pitch of the chamfer of the circuit forming body 14b is の of the gap pitch of the nozzle head 11. In such a case, first, as shown in FIG.
The process is performed on every other row, and then, as shown in FIG. 10B, the circuit is mounted on the remaining faces with a shift of the chamfer pitch of the circuit forming body 14b (（pitch of the gap between the nozzles 12). Thereby, simultaneous mounting becomes possible, and efficient component mounting can be realized. In the illustrated example, the number of chamfers of the circuit forming body is 8, but even if this is a multiple of 8,
2 and the circuit-forming body 14 can be efficiently produced without much occurrence.

Generally, the pattern pitch of the chamfer of the multi-chamfered circuit formed body is set to 1 / N of the gap pitch of the nozzle head 11.
And the number of rows of the multi-chamfered circuit forming body is N, the number of nozzles.
Times or an integral multiple of N, the nozzle 12
Thus, an efficient mounting operation can be realized without causing much trouble in the circuit forming body 14. Where N is
It is an integer other than 0.

Further, in the example shown in FIG.
The pattern pitch of the chamfer 4c is twice the gap pitch of the nozzle 12. In such a case, as shown in FIG.
a and the nozzle head 11c, and the combination of the nozzle head 11b and the nozzle head 11d. That is, regarding the pitch of the gap of the nozzle head 11 according to these two combinations,
The pattern pitch matches the chamfered pattern pitch of b. Therefore, the same components can be simultaneously mounted on the nozzle heads 11a and 11c, and the same components can be simultaneously mounted on the nozzle heads 11b and 11d. Furthermore,
As shown in FIG. 11, even if the components 13a and 13b mounted on a single surface of the circuit forming body are different components, the respective nozzle pitches (p1, p2 and p3 in the drawing) are determined by the nozzle head. 11 and the two parts 13a, 13b, etc. are arranged at the same level in the Y direction in the figure, even if they are different parts, the nozzle heads 11a, 11b, 11c, 11d Simultaneous implementation becomes possible.

Generally, by setting the pattern pitch of the chamfer of the multi-chamfered circuit formed body to be M times the gap pitch of the nozzle head 11, a plurality of nozzles can be used efficiently and the productivity of component mounting can be increased. Can be. Furthermore,
A design in which the mounted components are arranged at the same gap pitch as the nozzle gap pitch in the same direction as the direction in which the plurality of nozzles are arranged (X direction in FIG. 11) even within a single plane of the multi-cavity formation of the circuit forming body 14c. By doing so, it is possible to increase the possibility of simultaneous mounting using a plurality of nozzles, and it becomes more efficient. Here, M is an integer other than 0. Also,
At this time, the number of chamfers of the circuit formed body depends on the nozzle head 11
It is preferable from the standpoint of production efficiency that the number not generate much on the circuit forming body 14 as well. In general, the number of chamfers at this time is an integral multiple of a value obtained by dividing the least common multiple of K and M by M when the number of nozzle heads is K (integer). For example,
If the number of nozzle heads K is 4 and the pitch multiple M is 2, the number of chamfers is an integer multiple of 2. If the number of nozzle heads K is 6 and the pitch multiple M is 4, the number of chamfers is an integer of 3. Preferably, it is doubled.

Next, the same phenomenon will be described with respect to the relationship between the nozzle and the component supply unit. For example, as shown in FIG. 12A, in a component mounting apparatus provided with four nozzles 12,
It is assumed that the number of rows of the component 13 supplied to the component supply unit 2 is 11 from Z1 to Z11. By the four nozzles 12, Z1 to Z4 on the left side of the drawing are sucked by the simultaneous suction A, and thereafter, the following Z5 to Z8 are sucked by the simultaneous suction B. Finally, three rows are provided in the component supply unit. Remains. For this reason, in the next simultaneous suction C, one piece is generated in the nozzle 12 (or three pieces are generated in the component supply section 2 after the simultaneous suction B), and play is generated in the nozzle 12 and is wasted.

As shown in FIG. 12B, the number of the components 12 arranged in the component supply unit 2 is set to be an integral multiple of the number of the nozzles 12, so that the nozzles 12 are attached to the nozzles 12 after a plurality of simultaneous suctions. It is possible to efficiently pick up components without increasing the amount (or without increasing the amount in the component supply unit 2), thereby increasing the production efficiency.

The same concept can be applied to the case where the pitch of the row for supplying the components is smaller than the pitch of the gap between the nozzles. As shown in FIG. 12C, for example, the arrangement pitch of the components 13 is set to 10 mm with respect to the gap pitch of the nozzles 12 of 20 mm, and the nozzles 12 perform the simultaneous suction A on every other component 13 (Z1, Z3, Z5, Z
7) After the suction, in the next simultaneous suction B, the remaining components 13 (Z2, Z4, Z6, Z8) are simultaneously sucked by moving by the arrangement pitch of the components 13 (1/2 of the gap pitch of the nozzles 12). This allows efficient adsorption. At this time, by setting the number of rows of the component supply unit 2 to be an even multiple of the number of the nozzles 12, the number of the component supply unit 2 and the nozzles 12 is reduced, so that the efficiency is improved.

Generally, the arrangement pitch of the components 13 of the component supply unit 2 is set to 1 / N of the gap pitch of the nozzle head 11,
By setting the number of rows of the components 13 to be N times the number of nozzles or an integral multiple of N, efficient mounting and suction can be realized without much occurrence in the nozzles 12 and the component supply unit 2. . Here, N is an integer other than 0. Although the parts supply unit 2 of the parts cassette type is illustrated here, the same concept can be applied to the tray supply unit 3. In the example shown in FIG. 4, the number of tray supply units 3 is set to eight with respect to the number of four nozzles 12, so that the nozzles and parts do not generate much and efficient simultaneous suction is enabled. ing. Conversely, the arrangement pitch of the components 13 of the component supply unit can be set to N times the gap pitch of the nozzle head 11, but in this case, only 1 / N of the nozzle heads 11 can be used. ,
It may not always be efficient. However, part 1
This is advantageous as compared with the case where there is no correlation between the arrangement pitch of No. 3 and the gap pitch of the nozzle head 11.

FIGS. 9 to 11 show the relationship between the plurality of nozzle heads 11 and the circuit forming body 14 in FIG.
In, the plurality of nozzle heads 11 and the component supply unit 2,
Alternatively, the relationship with the tray supply unit 3 is shown. In the component mounting apparatus, the nozzle head 11 is connected to the component supply unit 2.
Then, the component 13 is sucked and mounted on the circuit forming body 14. That is, since the suction and the mounting are performed through the same plurality of nozzle heads 11, from the viewpoint of the above-described efficiency, the pattern pitch of the chamfer of the circuit forming body 14,
It is reasonable that there is a match between the component supply unit 2 and the arrangement pitch of the tray supply unit 3. In the present embodiment, the pattern pitch of the chamfer of the circuit forming body 14 and the arrangement pitch of the components in the component supply unit 2 or the tray supply unit 3 are matched, or any one of the pattern pitch and the arrangement pitch is used. Efficiency is improved by making one of them an integral multiple of the other.

[0068]

According to the component mounting apparatus of the present invention having a plurality of nozzle heads which can be independently moved in a planar manner with respect to the component mounting head, the gap pitch between the nozzle heads can be reduced by the component feeding unit. Simultaneous suction is possible by matching the arrangement pitch, and simultaneous mounting on a multi-cavity circuit forming body is enabled by controlling the planar movement of the nozzle head, and efficient component mounting can be realized. Further, when the nozzle of the nozzle head is replaced, a much larger number of combinations can be realized as compared with the related art, which can contribute to an improvement in productivity.

According to the component mounting apparatus of the present invention having a plurality of nozzle heads which can be detachably mounted on the component mounting head, the gap pitch between the nozzle heads is determined by the arrangement of the components in the component supply section. Simultaneous suction becomes possible by matching the pitch, and simultaneous mounting becomes possible by matching the gap pitch of the nozzle head to the pitch of the multiple patterning pattern of the circuit forming body, so that efficient component mounting can be realized.

The component mounting according to the present invention, which performs a design consistent with respect to each pitch and number between the arrangement of the components of the component supply unit, the plurality of nozzle heads, and the chamfering of the circuit forming body. According to the method, in each component of the component, the nozzle head, and the multiple circuit forming circuit body, each component can be used efficiently without much occurrence, and the productivity of component mounting can be increased.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an outline of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a detailed perspective view showing a component mounting head of the component mounting apparatus shown in FIG.

FIG. 3 is a partially enlarged perspective view of the component mounting head shown in FIG. 2;

FIG. 4 is a detailed perspective view showing a tray supply unit of the component mounting apparatus shown in FIG.

FIG. 5 is an explanatory diagram showing a state of nozzle replacement of the component mounting apparatus shown in FIG. 1;

FIG. 6 is a perspective view showing a component mounting head according to another embodiment of the present invention.

FIG. 7 is a perspective view showing a component mounting head according to another embodiment of the present invention.

FIG. 8 is a perspective view showing an alternative of the component mounting head shown in FIG. 6;

FIG. 9 is an explanatory diagram showing a relationship between a nozzle head and a circuit forming body according to still another embodiment of the present invention.

FIG. 10 is an explanatory diagram showing another application example shown in FIG. 9;

FIG. 11 is an explanatory diagram showing still another application example shown in FIG. 9;

FIG. 12 is an explanatory diagram showing a relationship between a nozzle head and a component supply unit according to still another embodiment of the present invention.

FIG. 13 is a perspective view showing an overview of a conventional component mounting apparatus.

14 is a detailed perspective view showing a tray supply unit of the component mounting apparatus shown in FIG.

FIG. 15 is a detailed perspective view showing a nozzle station of the component mounting apparatus shown in FIG.

[Explanation of symbols]

1. 1. Component mounting device, 2. Parts supply unit, 3. tray supply section; 4. Component mounting head, XY robot,
6. 6. Component recognition device, 7. Circuit forming body holding device, 8. nozzle station, Control device, 11. Nozzle head, 12. Nozzle, 13. Parts, 14. Circuit forming body, 16. Servo motor, 17. Ball screw,
18. Linear guide, 21. Fixing plate, 22.
Slide shaft, 23. Support plate, 26. Servo motor, 27. Ball screw, 31. Tray pallet, 32. Tray body part, 34. Component mounting head, 36. Nozzle head, 37. Mounting station, 38. Mounting rail.

Continuing on the front page (72) Inventor Tomonori Sano 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Person Hiromi Kinoshita 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F term in Matsushita Electric Industrial Co., Ltd. (reference) 5E313 AA01 AA11 AA23 EE02 EE05 EE24 EE25 EE34 FF24 FF28

Claims (20)

[Claims] 1. A component mounting apparatus comprising: a component mounting head having a plurality of nozzle heads for sucking and extracting a component from a component supply unit and mounting the component at a predetermined position on a circuit forming body; However, there is provided a component mounting apparatus comprising a mechanism for holding a plane substantially parallel to a component mounting surface of the circuit formed body so as to be independently movable with respect to the component mounting head. 2. A direction in which the plurality of nozzle heads are arranged is defined as an X direction, and a direction orthogonal to the X direction in a plane in which the plurality of nozzle heads can move is defined as a Y direction.
A mechanism for movably holding the plurality of nozzle heads,
First moving means for moving each of the plurality of nozzle heads in the X direction with respect to the component mounting head;
Characterized by having one or both of the second moving means for moving the moving means in the Y direction,
The component mounting apparatus according to claim 1. 3. The apparatus according to claim 2, wherein one or both of said first moving means and said second moving means are driven by a servomotor and a ball screw. A component mounting apparatus according to item 1. 4. The apparatus according to claim 2, wherein one or both of said first moving means and said second moving mechanism are driven by a linear motor.
A component mounting apparatus according to item 1. 5. The component mounting apparatus further includes a nozzle station that stores a plurality of nozzles, a direction in which the plurality of nozzle heads are arranged is set in an X direction, and in a plane in which the plurality of nozzle heads can move. When the direction orthogonal to the X direction is the Y direction, the nozzles housed in the nozzle station are arranged in a grid pattern in the X direction and the Y direction, and when the nozzles are replaced by the plurality of nozzle heads,
Along the X direction, each nozzle head is positioned at a position corresponding to each nozzle, and along the Y direction, each nozzle head accesses a nozzle in an arbitrary row, and the plurality of nozzle heads can simultaneously exchange nozzles. The component mounting apparatus according to claim 1, wherein: 6. A component mounting apparatus provided with a component mounting head having a plurality of nozzle heads for sucking and extracting a component from a component supply unit and mounting the component at a predetermined position on a circuit forming body, wherein the plurality of nozzle heads are provided. Is mounted detachably on a plurality of mounting stations provided in the component mounting head. 7. The component mounting apparatus according to claim 6, wherein the plurality of mounting stations are provided at equal intervals. 8. The component mounting apparatus according to claim 6, wherein an arbitrary number of nozzle heads can be attached to the plurality of attachment stations in an arbitrary arrangement. 9. A component mounting apparatus comprising a component mounting head having a plurality of nozzle heads for picking up a component from a component supply unit and mounting the component at a predetermined position on a circuit forming body, wherein the component mounting head is And a mounting means for slidably mounting the plurality of nozzle heads. 10. Adjusting a gap pitch between the plurality of nozzle heads to control one or both of simultaneous suction of components in the component supply unit and simultaneous mounting of components on the circuit forming body. The component mounting apparatus according to any one of claims 1, 6, and 9, wherein the component mounting apparatus is enabled. 11. The component mounting apparatus according to claim 10, wherein the simultaneous suction of components in the component supply unit is a simultaneous suction from a tray supply unit that arranges and supplies components on a tray pallet. . 12. A component mounting method for picking up a component from a component supply unit by using a plurality of nozzle heads and mounting the component at a predetermined position of a circuit forming body. And the gap pitch of the plurality of nozzle heads can be adjusted according to one or both of the mounting pitch of the circuit forming body, so that any one of the suction of the component and the mounting of the component is performed. A component mounting method, wherein one or both of them are performed simultaneously by a plurality of nozzle heads. 13. A method in which, when performing simultaneous suction of a plurality of components by the plurality of nozzle heads, adjusting a gap pitch between the plurality of nozzle heads and an arrangement pitch of components in a component supply unit to match. 13. The component mounting method according to claim 12, wherein one of the gap pitch of the nozzle head and the arrangement pitch of the components is adjusted to be an integral multiple of the other. 14. When simultaneously mounting a plurality of components by the plurality of nozzle heads, adjusting the gap pitch between the plurality of nozzle heads and the pattern pitch of chamfering of a circuit forming body, or 13. The component mounting method according to claim 12, wherein one of the gap pitch of the nozzle head and the pattern pitch of the circuit forming body is adjusted to be an integral multiple of the other. 15. The arrangement according to claim 13, wherein when the arrangement pitch of said parts is made to coincide with the gap pitch of said nozzle heads, the arrangement number of said parts is set to an integral multiple of the number of said nozzle heads. The described component mounting method. 16. When the gap pitch between the nozzle heads is set to be an integral multiple of the arrangement pitch of the components, the arrangement number of the components is set to an integral multiple of the integral multiple of the number of the nozzle heads. 2. The method of claim 1, wherein
3. The component mounting method according to item 3. 17. When matching the gap pitch of the nozzle heads with the pattern pitch of the circuit forming bodies, the number of chamfers of the circuit forming bodies along the arrangement direction of the nozzle heads is reduced by the number of the nozzle heads. The component mounting method according to claim 14, wherein the component mounting is performed by an integral multiple. 18. The method according to claim 18, wherein when the gap pitch of the nozzle head is set to be an integral multiple of the pattern pitch of the circuit forming body, the number of chamfers of the circuit forming body along the arrangement direction of the nozzle head is determined by the nozzle The component mounting method according to claim 14, wherein the number of heads is set to an integral multiple of the integral multiple. 19. The arrangement pitch of the parts and the pattern pitch of the circuit forming body match, or
19. The component mounting according to claim 13, wherein one of the arrangement pitch of the components and the pattern pitch of the circuit forming body is an integral multiple of the other. Method. 20. A component supply unit for supplying a component to be mounted, a component mounting head having a plurality of nozzles for taking out the component from the component supply unit and mounting the component, an XY robot for transporting the component mounting head, A circuit forming body holding device for carrying in and holding the circuit forming body, and a control device 9 for controlling the entire operation of the circuit forming body; 20. The component mounting apparatus according to claim 12, wherein the component mounting apparatus mounts the component at a mounting position, when the component is taken out or the component is mounted. A component mounting apparatus characterized by the above-mentioned.