JPH07302997A - Automatic mounting apparatus of electronic component - Google Patents

Abstract

PURPOSE:To obtain an automatic mounting apparatus in which a mounting error due to the attachment error of a suction nozzle is not generated. CONSTITUTION:An operator attaches all kinds of suction nozzles 14 to be used next to arbitrary positions on a mounting head 15. Then, when the mounting head 15 reaches a part on a component recognition device 16, the tip face of every nozzle 14 is recognized by the device 16, and the kind of every nozzle on every mounting position is detected by a CPU so as to be stored as nozzle data inside a RAM.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component automatic mounting apparatus for picking up electronic components by a suction nozzle attached to a mounting head and mounting them on a printed circuit board.

[0002]

2. Description of the Related Art An electronic component automatic mounting apparatus of this type is disclosed in Japanese Patent Laid-Open No.
Japanese Patent Laid-Open No. 148599 discloses that a plurality of suction nozzles for sucking an electronic component are attached to a mounting head for a plurality of types according to the type of the electronic component. The nozzle type data for each mounting position on the head is stored, and the nozzle is switched and used according to the type of electronic component to be extracted next. Therefore, the type of nozzle to be attached to the head or the type of nozzle to be attached to a predetermined position of the head has been determined in advance according to the type of nozzle.

[0003]

However, in the above-mentioned prior art, when the nozzle is erroneously attached due to an operation error, it is impossible to adsorb the electronic component or the component is not correctly recognized. There was a defect that the suction force was too strong or too weak, which caused a mounting error. Therefore, an object of the present invention is to prevent a mounting error or the like due to a nozzle mounting error.

[0004]

Therefore, the present invention is directed to an electronic component automatic mounting apparatus for switching a plurality of suction nozzles mounted on a mounting head and picking up an electronic component by a nozzle of a type suitable for a component type and mounting the electronic component on a printed circuit board. A detection means for detecting the type of nozzle attached to the mounting head and a storage means for storing the type of nozzle detected by the detection means for each attachment position of the nozzle to the head are provided.

Further, according to the present invention, in an electronic component automatic mounting apparatus for picking up an electronic component by a suction nozzle mounted on a mounting head and mounting it on a printed circuit board, a detecting means for detecting the type of the nozzle mounted on the mounting head by the outer diameter of the nozzle. And a storage means for storing the type of nozzle detected in the detection means.

[0006]

According to the structure of the first aspect, when the nozzle is attached to the mounting head, the detection means detects the type of the attached nozzle, and the storage means stores the nozzle type for each attachment position of the nozzle. According to the configuration of claim 2, when the nozzle is attached to the mounting head, the detection unit detects the type of the attached nozzle by the outer diameter of the nozzle, and the storage unit stores the type of the nozzle for each attachment position of the nozzle. .

[0007]

An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2 and FIG. 3, reference numeral 1 denotes a Y table which moves in the Y direction by rotation of the Y axis motor 2, and 3 indicates movement in the X direction on the Y table 1 by rotation of the X axis motor 4. As a result, an XY table that moves in the XY directions, and a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component) is mounted is fixedly mounted on a fixing unit (not shown).

Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, and by rotating the ball screw 10, the supply base 7 is guided by the linear guide 12 via a nut 11 fitted to the ball screw 10 and fixed to the supply base 7. Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently, and mounting heads 15 having six suction nozzles 14 are arranged at equal intervals on the outer edge of the table 13 in accordance with the intermittent pitch.

The suction nozzle I picks up the component 5 from the supply device 8 and picks up the component 5 at the stop position (the position marked with a black dot in the upper part of FIG. 2) is the suction station I, and the suction station I is mounted. When the head 15 descends, the suction nozzle 14 sucks the component 5. Reference numeral II denotes a recognition station in which the mounting head 15 that has picked up the component 5 stops due to intermittent rotation of the rotary table 13, and the positional deviation of the component 5 with respect to the suction nozzle 14 is recognized by the component recognition device 16 as detection means.

Reference numeral III denotes a mounting station (a position marked with a black circle in the lower part of FIG. 2) in which the mounting head 15 stops in order to mount the component 5 held by the suction nozzle 14 on the printed circuit board 6. When the head 15 descends, X
The component 5 is mounted on the printed circuit board 6 stopped at a predetermined position by the movement of the Y table 3. The mounting head 15 is attached to a lower portion of a head elevating shaft 18 that vertically penetrates the rotary table 13 at two locations, an inner side and an outer side, and an upper portion of the shaft 18 is fixed to an L-shaped roller mounting body 19. There is. An upper cam follower 20 and a lower cam follower 21 projecting inward are rotatably supported on the upper portion of the roller mounting body 19.

Reference numeral 23 shown in FIG. 3 is a support base that supports the rotary table 13 so as to be rotatable in the horizontal direction below, and a cylindrical cam 24 is formed around the support base 23. The cylindrical cam 24 is sandwiched between the upper cam follower 20 and the lower cam follower 21 by a spring (not shown), and the head 15 is supported by the cam 24 and is moved by the rotation of the rotary table 13.

In the suction station I and the mounting station III, the cam 24 is notched, and the vertical moving members 25 and 26 are moved up and down by driving a cam (not shown).
By being sandwiched between the cam followers 20 and 21 and supporting the head 15 and moving up and down, the mounting head 15 can be moved up and down for component suction and component mounting in the station.

Reference numeral 28 denotes a drive power cord for transmitting a current from a drive circuit 39, which will be described later, for driving a pulse motor 31, which will be described later, and is connected to each mounting head 15. Reference numeral 29 is a vacuum tube which communicates with a vacuum source (not shown) for sucking the chip component 5 from the suction nozzle 14.
The pulse motor 31 is incorporated in the mounting head 15, and the suction nozzle 14 penetrates and is attached to the rotor (not shown). Reference numeral 32 denotes a diffuser plate attached to the rotor, which serves as a background portion of the image when the chip component 5 is recognized, and is uniformly dark in a reflection method in which illumination is applied to the chip component 5 and the reflected light is recognized. In the transmissive method in which illumination is applied from above the component 5 to recognize the silhouette image by the transmitted light, the light applied to the diffuser plate 32 is uniformly diffused and irradiated to the component 5. Done The diffusion plate 32 has a suction nozzle 14
Has a hole through it. Nozzle 14 is diffusion plate 3
It can be locked in a raised position and a lowered use position with respect to 2.

The suction nozzle 14 for sucking the component 5 by the rotation of the pulse motor 31 can be positioned at an arbitrary angular position regardless of whether the rotary table 13 is rotating or stopped. A plurality of types of suction nozzles 14 can be attached to the mounting head 15 as shown in FIGS. 4 and 5, and any type of suction nozzle 14 can be attached to all attachment positions. As for the mounting position, the numbers in FIG. 5 are treated as they are as the mounting position numbers, and the nozzle type data are treated as A to F as shown in FIG.

In FIG. 3, reference numeral 49 denotes an elevating lever that moves up and down to swing the swing lever 50 of the component supply device 8. The lift lever swings the lever 50 and is wound in the tape reel 51 and is not shown. The tape is fed so that the chip component 5 stored in the tape is supplied to the suction position of the nozzle 14. Control block of electronic component automatic mounting device FIG.
It will be explained based on.

Reference numeral 35 is a CPU as a detecting means, and R
According to the program stored in the OM 36, various operations related to mounting of the chip component 5 are controlled based on various data stored in the RAM 37 as a storage unit. 38
Is an interface, and the motor 31 of each head 15 is connected to the interface 38 via a drive circuit 39. Reference numeral 40 is a nozzle check key for starting the operation of checking the nozzle type.

As shown in FIG. 7, the RAM 37 stores nozzle type data for each nozzle mounting position number, and the data of FIG. 7 is hereinafter referred to as nozzle data. The RAM 37 stores the mounting data shown in FIG. 8 and the component library data shown in FIG. In the mounting data, the step number indicates the component mounting order, the reel number indicates the position on the supply base 7 where the component supply device 8 for supplying the component 5 of the component type to be taken out is arranged, and the component type and mounting Position data is stored.

The CPU 35 determines the component type to be sucked next from each step number of the mounting data, reads the nozzle type corresponding to the component type from the component library data,
The nozzle mounting position where the suction nozzle 14 of the nozzle type is mounted is determined from the nozzle data, and the nozzle 14 at the nozzle mounting position is positioned and selected so that the component 5 can be taken out from the component supply device 8. The CPU 35 detects the nozzle type by recognizing the nozzle tip surface by the component recognition device 16 and automatically creates and stores the nozzle data shown in FIG.

An image of the nozzle tip surface is stored in the RAM 37 for each nozzle type, and the recognition device 16 can detect the nozzle type. The operation will be described below with the above configuration. First, the operator attaches to each mounting head 15 the nozzles 14 of the nozzle types A to F, which are the suction nozzles 14 to be used next. If the operator definitely prepares six suction nozzles 14 of each of the six types, he will install the suction nozzles 14 at any attachment position where he can attach the nozzle 14 he is holding without being particular about the attachment position.

This operation is performed for all the mounting heads 15, and the nozzle check key 40 is pressed to start the nozzle type detection operation. That is, each time the mounting head 15 is stopped on the component recognition device 16 by intermittent rotation of the rotary table 13 as shown in FIG. 1, the lower surface of the head 15 is imaged and the screen of FIG. 10, for example, is recognized. Actually, FIG.
Has a dark background, the tip surface is bright, and the portion of the suction hole for sucking the component 5 is also dark, and in particular, the cylindrical component 5 is angled on the tip surface of the nozzle 14 attached at the attachment position number 3. Since the V-shaped groove is engraved so that it can be adsorbed without displacement, the groove portion is also dark. The recognition is based on the recognition of the above-described reflection method in which the illumination (not shown) directly hits the lower end surface of the nozzle 14 and the reflected light is imaged and recognized by the camera. Is stored on the screen (may be stored in the RAM 37), and the nozzle type for each nozzle mounting position is detected by recognizing the image of the nozzle tip surface at that position. At the time of this recognition operation, all the nozzles 14 are not in the raised use position, and the camera is focused. Alternatively, all the nozzles 14 may be lowered to the use position.

Next, the CPU 35 writes the nozzle type for each nozzle mounting position, creates nozzle data as shown in FIG. 7, and stores it in the RAM 37 for each head number specified for each head. This operation is performed for each head 15.
Next, the automatic operation start key (not shown) is pressed to start the automatic operation of mounting the chip component 5.

That is, the head 15 reaches the adsorption station I by the intermittent rotation of the rotary table 13, but before the head 15 reaches the station I, the CPU 35 executes the step of the mounting data in the RAM 37 shown in FIG. First, the component type to be sucked is determined from the data of No. 1, the nozzle type of the suction nozzle 14 corresponding to the component type is read from the component library data shown in FIG. 9 of the component type, and the nozzle type is read from the nozzle data of FIG. The nozzle mounting position at which the nozzle 14 is mounted is read out so that the suction nozzle 14 at the nozzle take-out position reaches a position where the chip component 5 supplied by the component supply device 8 can be supplied.
Is rotated and the nozzle 14 is positioned. The nozzle 1
Before being positioned, 4 is projected to a usable position by a projection mechanism (not shown).

Next, the mounting head 15 descends and the nozzle 14 takes out the component 5 to be sucked by the component supply device 8 and the mounting head 15 rises. Here, since there is no mistake in the nozzle type, there is no chance that the adsorption error or the adsorption becomes unstable due to the different nozzle type. Next, the mounting head 15 reaches the recognition station II by the intermittent rotation of the rotary table 13, and the component recognition device 16 recognizes the component 5 sucked by the suction nozzle 14. The recognition is performed by the above-mentioned reflection method or transmission method. In the recognition, there is no mistake in the nozzle type, so the nozzle is too large, and the component 5
There is no such thing that the image of is hidden and cannot be recognized.

When the recognition is completed, the pulse motor 31 is rotated to perform the angular positioning of the component 5 so as to reach the angular position of θ1 which is the angular data indicated by θ in the mounting data of FIG. The rotation may be performed before the head 15 reaches the mounting station. Next, when the mounting station III is reached, the mounting head 15 descends, the vacuum suction of the suction nozzle 14 is cut off, and the component 5 is mounted at a predetermined position on the printed circuit board 6. Even in this mounting, since there is no mistake in the nozzle type, for example, the suction force of the nozzle 14 is too strong and the component 5 is taken home without being mounted, or it is too weak and drops quickly so that it can be mounted in a correct position. There will be no mistakes in the installation. At the time of mounting the girder, the XY table 3 is moved and positioned so as to be mounted at the position of the data shown by X and Y in FIG. 8 in consideration of the correction based on the recognition result of the component 5.

In the present embodiment, the recognition method performed by the component recognition device for detecting the nozzle type is the reflection method, but the nozzle outer diameter is detected by the transmission method using the silhouette image of the transmitted light to detect the nozzle type. May be detected. Also,
In the present embodiment, the image of the recognition device is assumed to image all the nozzles 14 as shown in FIG. 10, but all the nozzles cannot be imaged, and at least only the nozzle that adsorbs the component 5 is imaged in the center of the screen. In such a case, the recognition processing may be performed while rotating the nozzles 14 one by one by the pulse motor in the recognition station II.

Further, regardless of the component recognizing device, a line sensor in which the light receiving elements are arranged in the horizontal direction is provided in any station so that the light from the light sources arranged in the horizontal direction is shielded by the tip of the nozzle 14. The nozzle type may be detected based on the light shielding position of the line sensor or the degree of light shielding.

[0027]

As described above, according to the present invention, the data of the nozzle type and the mounting position to the mounting head are stored according to the mounted nozzle, so that the mounting error of the component due to the mounting error of the nozzle occurs. You can eliminate what you do. Further, if the nozzle type is detected based on the nozzle outer diameter, the detection can be easily performed.

[Brief description of drawings]

FIG. 1 is a side view showing a state in which a suction nozzle attached to a mounting head is recognized.

FIG. 2 is a plan view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 3 is a side view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 4 is a perspective view showing a mounting head.

FIG. 5 is a view of the mounting head as viewed from below and a diagram showing a suction nozzle to be mounted.

FIG. 6 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 7 is a diagram showing nozzle data.

FIG. 8 is a diagram showing mounting data.

FIG. 9 is a diagram showing component library data.

FIG. 10 is a diagram showing a recognition image of the lower surface of the mounting head to which the suction nozzle is attached.

[Explanation of symbols]

 5 Chip-shaped Electronic Components (Electronic Components) 6 Printed Circuit Board 14 Suction Nozzle 15 Mounting Head 16 Component Recognition Device (Detection Unit) 35 CPU (Detection Unit) 37 RAM (Storage Unit)

Claims (2)

[Claims] 1. An electronic component automatic mounting apparatus for switching a plurality of suction nozzles mounted on a mounting head and picking up an electronic component by a nozzle of a type suitable for a component type and mounting the electronic component on a printed circuit board, the type of nozzle mounted on the mounting head. An electronic component automatic mounting apparatus comprising: a detection unit that detects the position of the nozzle; and a storage unit that stores the type of nozzle detected by the detection unit for each mounting position of the nozzle to the head. 2. In an electronic component automatic mounting apparatus for switching an adsorption nozzle mounted on a mounting head and picking up an electronic component by a nozzle of a type suitable for a component type and mounting the electronic component on a printed circuit board, the type of the nozzle mounted on the mounting head is changed. An electronic component automatic mounting apparatus comprising: a detection unit that detects the outer diameter of a nozzle; and a storage unit that stores the type of nozzle detected by the detection unit.