KR20150002532A - Method of mounting electronic component, and electronic component mounting apparatus - Google Patents

Abstract

The present invention provides a method and an apparatus for mounting an electronic component for efficiently performing a mounting operation of a component. In the case a pitch between tape feeders (15) is arranged to be integer times as large as a pitch between adsorption nozzles, adjacent tape feeders (15) are grouped every maximum simultaneous adsorption number, by which electronic components are simultaneously absorbed by the adsorption nozzle (71) to make a feeder block and install the adsorbed electronic components in a predetermined position on a substrate sequentially after continuously absorbing the electronic components every feeder block by using a set of the different adsorption nozzle (71).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component mounting method and an electronic component mounting apparatus,

The present invention relates to an electronic component mounting method and electronic component mounting apparatus for mounting a component supplied from an electronic component supply apparatus onto a substrate.

As a conventional electronic component mounting apparatus, there is a technique described in, for example, Patent Documents 1 to 3. In this technique, electronic components supplied from a plurality of component supplying devices are simultaneously attracted to and held by a plurality of suction nozzles and mounted on a substrate. Here, the interval (nozzle pitch) of the plurality of suction nozzles mounted on the mounting head is matched with the arrangement interval (feeder pitch) of the plurality of component feeding devices, and all of the suction nozzles mounted on the mounting head As shown in Fig.

Japanese Patent Application Laid-Open No. 2007-317999 Japanese Patent Laid-Open No. 2008-147313 Japanese Patent Application Laid-Open No. 2008-218721

However, as shown in Fig. 7, when the nozzle pitch and the feeder pitch do not coincide with each other, all the suction nozzles mounted on the mounting head can not pick up the components at one time. In such a case, first, as shown in Fig. 7A, the components are simultaneously adsorbed by the amount (min) that can be adsorbed by the plurality of adsorption nozzles L1, L3, L5, b) and feeds the parts of the feeder, and a suction mount sequence for simultaneously mounting the components from the same feeder by a plurality of suction nozzles (L2, L4, L6) do. However, in this case, since the feeder transport time is greatly affected, the productivity is poor.

7 (a), if the components are simultaneously adsorbed by the amount that can be adsorbed by the plurality of adsorption nozzles L1, L3, and L5, the amount of adsorbed component It is also considered to repeat the adsorption mounting sequence in which component mounting is carried out as many times as the number of components. However, in this case, since the mounting head reciprocates between the component supply portion and the substrate, the moving distance becomes longer, which is not efficient in the mounting operation.

Accordingly, it is an object of the present invention to provide an electronic component mounting method and an electronic component mounting apparatus that can efficiently perform component mounting operations.

According to an aspect of the present invention, there is provided an electronic component mounting method for mounting electronic components supplied from a plurality of tape feeders simultaneously by a plurality of suction nozzles of a mounting head, Wherein the plurality of tape feeders are arranged at equal intervals such that the pitch between the tape feeders is an integral multiple of the pitch between the suction nozzles, Wherein the plurality of feeder blocks are grouped into a plurality of feeder blocks capable of simultaneously suctioning the electronic parts by the suction nozzles, the electronic parts are successively picked up by using different sets of suction nozzles for the respective feeder blocks, To a predetermined position on the substrate.

The electronic component mounting method further includes grouping the plurality of tape feeders from the maximum simultaneous adsorption number that is the number of components capable of simultaneously picking up an electronic component from the tape feeder by a suction nozzle.

In one aspect of the electronic component mounting apparatus according to the present invention, electronic components supplied from a plurality of tape feeders are simultaneously adsorbed by a plurality of suction nozzles of a mounting head, and the adsorbed electronic component is mounted Wherein the plurality of tape feeders are arranged at equal intervals such that the pitch between the tape feeders is an integral multiple of the pitch between the suction nozzles, A feeder block producing means for forming a plurality of feeder blocks by a plurality of feeder blocks capable of simultaneously sucking the plurality of feeder blocks; , After the electronic component is adsorbed by the component adsorption means, the adsorbed electronic component And a component mounting means for mounting the component to a predetermined position on the substrate.

The electronic component mounting apparatus may further comprise a maximum number of simultaneous adsorption numbers which is the number of components capable of simultaneously adsorbing the electronic component from the tape feeder to the adsorption nozzle based on the pitch between the tape feeders and the pitch between the adsorption nozzles Wherein the feeder block forming means groups the tape feeders adjacent to each other for each maximum number of simultaneous adsorption obtained by the maximum simultaneous adsorption number acquiring means to obtain a plurality of feeder blocks .

According to the present invention, simultaneous adsorption pairs (feeder block and nozzle block) that are not affected by the feeder transport time within one cycle are created, the simultaneous adsorption is carried out continuously with a plurality of feeder blocks, Can be mounted. By optimizing the production operation in this manner, the mounting tact time can be shortened, and the component mounting operation can be performed efficiently.

1 is a plan view showing an electronic component mounting apparatus of the present embodiment.
2 is a view showing a specific configuration of a mounting head.
3 is a block diagram showing a configuration of a control system of an electronic parts mounting apparatus.
Fig. 4 is a flowchart showing a component mounting procedure executed by the controller.
5 is a diagram for explaining the operation of the present embodiment.
6 is a flowchart illustrating a conventional component mounting operation.
7 is a view for explaining a conventional component mounting operation.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a plan view showing an electronic component mounting apparatus according to the present invention.

In the figure, reference numeral 1 denotes an electronic component mounting apparatus. The electronic component mounting apparatus 1 includes a pair of conveying rails 11 extending in the X direction on the upper surface of a base 10. The conveyance rail 11 supports both side portions of the circuit board 5 and is driven by a conveyance motor (not shown) to convey the circuit board 5 in the X direction.

The electronic component mounting apparatus 1 also includes a mounting head 12. The mounting head 12 includes a plurality of suction nozzles for sucking an electronic component in a lower portion thereof. The X-axis gantry 13 (a support for supporting the mounting head 12 movably in the X-axis direction) and the Y- The X-axis gantry 13 can be horizontally moved in the X and Y directions on the base 10 by a support 14 (a support for supporting the X-axis gantry 13 movably in the Y-axis direction).

2 is a perspective view showing an example of the mounting head 12. As shown in Fig.

The mounting head 12 has a plurality of suction nozzles 71 that move up and down independently of each other, and each suction nozzle 71 can vacuum-adsorb the electronic component 72.

When the Z-axis motor 73 is rotated in the forward and reverse directions, the nut 74 moves up and down along the feed screw 75, Is moved up and down. By rotating the motor 76, it is possible to correct the horizontal rotation angle of the vacuum-chucked electronic component 72 at the lower end of the suction nozzle 71.

Although only three suction nozzles 71 are shown in Fig. 2, the mounting head 12 of the present embodiment is capable of mounting a maximum of six suction nozzles 71. Fig.

In such an electronic component mounting apparatus 1, an electronic component supplying apparatus (tape feeder) 15 for supplying electronic components is mounted on both sides of the conveying rail 11 in the Y direction. Here, the tape feeder 15 can be mounted in parallel on the feeder bank. A plurality of guide rails extending in the Y direction are provided on the feeder bank. By inserting the tape feeder 15 between the guide rails, positioning of the tape feeder 15 in the X direction is performed have. The electronic component supplied from the tape feeder 15 is vacuum-adsorbed by the suction nozzle 71 of the mounting head 12 and is mounted on the circuit board 5.

Between the component supply device 15 and the circuit board 5, a recognition camera 21 made of a CCD camera is disposed. The detection camera 21 detects the position of the suction nozzle 71 (or the suction nozzle 71) in order to detect the shift of the suction position of the electronic component (the shift between the center position of the suction nozzle 71 and the center position of the suctioned component) To pick up the electronic component.

The mounting head 12 is provided with a distance sensor 22. The distance sensor 22 measures the distance (height) in the Z direction between the suction nozzle 71 and the circuit board 5 by the sensor light.

Further, a substrate recognition camera 23 is attached to the mounting head 12. The substrate recognition camera 23 picks up the state of the mark on the substrate, the state of the electronic component after mounting the substrate, and the state of the electronic component supplied to the supplying position of the electronic component supplying device.

The electronic component mounting apparatus 1 is provided with a nozzle changing device 16 for changing the suction nozzle 71 in accordance with the size and shape of the component to be sucked. A plurality of kinds of nozzles are stored and managed in the nozzle exchanging device 16.

In this embodiment, the electronic parts are simultaneously adsorbed by the suction nozzles 71 mounted on the plurality of nozzle shafts. At this time, when the electronic parts can not be simultaneously adsorbed by all of the adsorption nozzles 71 due to the difference between the pitch between the adsorption nozzles and the pitch between the tape feeders, the adsorption nozzle 71 A group (a nozzle block) and a group of a tape feeder 15 (a feeder block) for simultaneously attracting an electronic component to the nozzle block are created, and the electronic components are simultaneously adsorbed by dividing into a plurality of circuits. At this time, the electronic parts are sucked by using different nozzle blocks from different feeder blocks every time so as not to be influenced by the part feeding time of the tape feeder. After the electronic components are picked up, vision recognition is sequentially performed by the recognition camera 21, and mounting position correction based on the recognition result is performed to sequentially mount the electronic components.

3 is a block diagram showing a configuration of the control system of the electronic parts mounting apparatus 1. In Fig.

The electronic component mounting apparatus 1 includes a controller 30 formed of a microcomputer having a CPU, a RAM, and a ROM for controlling the entire apparatus. The controller 30 controls each of the components 31 to 35 shown below.

The vacuum mechanism 31 generates a vacuum and generates a negative pressure of vacuum in each adsorption nozzle 71 through a vacuum switch (not shown).

The X-axis motor 32 is a driving source for moving the placing head 12 along the X-axis gantry 13 in the X-axis direction. The Y-axis motor 33 drives the X-axis gantry 13 in the Y- Axis direction along the Y-axis direction. The controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 so that the mounting head 12 can move in the X and Y directions.

The Z-axis motor 34 is a driving source for moving the suction nozzles 71 in the Z direction. Although only one Z-axis motor 34 is shown here, it is actually installed as many as the number of suction nozzles 71. [ The? -axis motor 35 is a driving source for simultaneously rotating a plurality of suction nozzles 71 around each nozzle shaft.

Fig. 4 is a flowchart showing a component mounting process executed by the controller 30. Fig. The component mounting process is a process for simultaneous adsorption of components and mounting of components on a tape feeder (12 mm tape feeder) whose pitch between the tape feeders is twice the pitch between the suction nozzles.

First, in step S1, the controller 30 determines whether or not the tape feeder that supplies the electronic components to be mounted on the substrate is a tape feeder of interest (12 mm tape feeder or 16 mm tape feeder). Here, the maximum simultaneous adsorption number is determined based on the pitch between the tape feeders and the pitch between the adsorption nozzles. The maximum simultaneous adsorption number is the maximum number of parts capable of simultaneously adsorbing the electronic component from the tape feeder 15 by the suction nozzle 71 at one time. In the case of the tape feeder of interest, as shown in Fig. 5, six suction nozzles 71 are arranged at regular intervals, and six tape feeders 25 are also arranged at regular intervals. Since the pitch between the tape feeders is twice the pitch between the suction nozzles, the maximum simultaneous adsorption number becomes three. The maximum simultaneous adsorption number 3 may be input to the CPU as a recommended value in advance for the target tape feeder, and may be calculated by the CPU.

If it is determined in step S1 that the tape feeder is not the target tape feeder, the process proceeds to step S2, where the controller 30 carries out the component mounting process of the other feeder and ends the component mounting process. On the other hand, if it is determined in step S1 that the tape feeder is the target, the process proceeds to step S3.

In step S3, the controller 30 determines whether or not the number of mounted components of the electronic component with respect to the substrate is equal to or larger than the maximum number of suction nozzles (here, 6) mountable to the mounting head 12. [ If it is determined that the number of items to be loaded is six or more, the process proceeds to step S4. If the number of items to be loaded is less than six, the process proceeds to step S10 described later.

In step S4, the controller 30 determines the feeder use number to be six. Here, the number of feeder uses is the number of tape feeders used for component pickup within one cycle of component pickup, transportation, and mounting.

Next, in step S5, the controller 30 groups the tape feeders 15 by three and creates two of them. That is, among the six tape feeders to be used, three adjacent tape feeders are used as one group (feeder block), one of them is a first feeder block, and the other is a second feeder block. In addition, the controller 30 groups the suction nozzles 71 by three, and creates two of them. In this embodiment, one of the six suction nozzles 71 mounted on the mounting head 12 is used as one group (nozzle block), and one of the suction nozzles 71 is a first nozzle block, One side is referred to as a second nozzle block.

In step S6, the controller 30 moves the mounting head 12 to a position above the first feeder block so that all of the suction nozzles 71 belonging to the first nozzle block from the tape feeders belonging to the first feeder block 71 ), And the process proceeds to step S7.

In step S7, the controller 30 moves the mounting head 12 from above the first feeder block to above the second feeder block, and proceeds to step S8.

In step S8, the controller 30 simultaneously adsorbs the electronic components from all of the tape feeders belonging to the second feeder block by all of the suction nozzles 71 belonging to the second nozzle block, and then proceeds to step S9.

In step S9, the controller 30 successively mounts the electronic components adsorbed and held by the suction nozzle 71 to the substrate, and finishes the component mounting process.

In step S10, the controller 30 determines the number of feeders to be used as the number of electronic parts to be mounted on the board.

Next, in step S11, the controller 30 determines whether the number of feeder uses determined in step S10 is greater than three (four or more). If it is determined that the number of feeders to be used is greater than three, the process proceeds to step S12. If the number of feeders is determined to be three or less, the process proceeds to step S13 described later.

In step S12, the controller 30 creates two feeder blocks and proceeds to step S6. In the step S12, among the four or more and less than six tape feeders to be used, three adjacent tape feeders are used as the first feeder block, and the remaining tape feeder is used as the second feeder block. In addition, the controller 30 creates two nozzle blocks. Here, among the six suction nozzles 71 mounted on the mounting head 12, one of the three suction nozzles 71 selected as the first nozzle block and the remaining suction nozzle 71 as the second nozzle block, Block.

In step S13, the controller 30 creates one feeder block. Here, three or less tape feeders to be used are assumed to be the first feeder block. In addition, the controller 30 creates one nozzle block. Here, among the six suction nozzles 71 mounted on the mounting head 12, the suction nozzles 71 of the selected number of used minutes are used as the first nozzle block.

In step S14, the controller 30 moves the mounting head 12 to a position above the first feeder block, and from all the tape feeders belonging to the first feeder block, by the suction nozzle 71 belonging to the first nozzle block The electronic components are sucked at the same time, and the process proceeds to step S15.

In step S15, the controller 30 sequentially mounts the electronic components, which are held by suction by the suction nozzle 71, on the substrate, and finishes the component mounting process.

Steps S5, S12 and S13 correspond to the feeder block creating means, Steps S6 to S8 and S14 correspond to the component adsorbing means, Step S9 And S15 correspond to the component mounting means.

Next, the operation and effects of the present embodiment will be described.

When a plurality of tape feeders 15 are mounted on the feeder bank and the supply operation of the electronic components is performed in the electronic component mounting apparatus, the tape feeder 15 drives and controls the feeder motor to feed the carrier tape in the transport direction. As a result, the electronic component can be picked up by the suction nozzle 71 of the mounting head 12 at the component suction position.

Here, the width of the tape feeder 15 depends on the width of the carrier tape. In the case of the tape feeder 15 having a relatively narrow width, the tape feeder 15 is inserted between the guide rails of the feeder bank So that the pitch between the suction nozzles and the pitch between the tape feeders coincide with each other. Therefore, in this case, by dropping all the six suction nozzles 71 at the same time, the electronic parts can be sucked from the six tape feeders at one time.

On the other hand, when the pitch between the suction nozzles and the pitch between the tape feeders do not coincide with each other, and the tape feeders 15 are mounted on the guide rails one by one due to the restriction of the width of the tape feeders 15, The pitch between the suction nozzles is twice as large as the pitch between the suction nozzles. Therefore, the electronic components can not be simultaneously adsorbed by all the six suction nozzles 71 at one time.

In this case, as shown in Fig. 5 (a), there are three suction nozzles 71 that can be simultaneously adsorbed at one time. Therefore, in this case, three electronic components are sucked in two by two, and then six electronic components sucked by the six suction nozzles 71 are successively mounted on the board.

4), the controller 30 controls the tape feeder 15 to be used in one cycle of the suction, transport, and mounting of the electronic component, that is, when the number of parts mounted on the substrate of the electronic component is six or more (Step S4). Next, the controller 30 creates two feeder blocks by using three adjacent tape feeders as one feeder block (step S5). That is, in the example shown in Fig. 5 (a), the tape feeders a to c are referred to as a first feeder block, and the tape feeders d to f are referred to as a second feeder block. The suction nozzles L1, L3 and L5 are referred to as a first nozzle block, and the suction nozzles L2, L4 and L6 are referred to as a second nozzle block.

First, the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 to move the loading head 12 to the component feed position of the tape feeders a to c belonging to the first feeder block Then, the vacuum mechanism 31 is driven and controlled to simultaneously vacuum-adsorb the electronic components from the tape feeders a to c (step S6). At this time, as shown in Fig. 5 (a), the electronic components are simultaneously adsorbed by the suction nozzles L1, L3, and L5 belonging to the first nozzle block.

Next, the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 while holding the electronic components by the suction nozzles L1, L3, and L5, (D to f) belonging to the second feeder block (step S7). Then, the vacuum mechanism 31 is driven and controlled to vacuum-adsorb the electronic components from the tape feeders d to f (step S8). At this time, the electronic components are simultaneously adsorbed by the suction nozzles (L2, L4, L6) belonging to the second nozzle block. As a result, as shown in Fig. 5 (b), the electronic parts are attracted and held by all six suction nozzles L1 to L6. Further, during the component sucking operation by the second feeder block, feeder feeding is performed in the tape feeders (a to c) belonging to the first feeder block.

Then, the controller 30 sequentially mounts the electronic components sucked by the six suction nozzles L1 to L6 on the substrate (step S9). Thus, one cycle is completed. During the component mounting operation, feeder feeding is performed on the tape feeders d to f belonging to the second feeder block.

If the remaining number of electronic components to be mounted on the board is four (No at step S3), the controller 30 determines that the tape feeder 15 to be used in the next one cycle, (Step S10). Subsequently, the controller 30 creates two feeder blocks from the four tape feeders used (step S12). That is, in the example shown in Fig. 5 (a), the tape feeders a to c are referred to as a first feeder block, and the tape feeder d is referred to as a second feeder block. The suction nozzles L1, L3, and L5 are referred to as a first nozzle block, and the suction nozzle L2 is referred to as a second nozzle block.

First, the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 to move the loading head 12 to the component feed position of the tape feeders a to c belonging to the first feeder block . At this time, the feeders of the tape feeders a to c are fed during the component sucking operation of the second feeder block in the previous cycle, and the electronic components are in a predetermined component supply position. That is, the component suction operation can be performed without waiting for feeder feeding. Therefore, the controller 30 can vacuum-adsorb the electronic component immediately after moving the mounting head 12 to the component feed position of the tape feeders a to c. At this time, the electronic components are simultaneously adsorbed by the suction nozzles (L1, L3, L5) belonging to the first nozzle block.

Next, the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 while holding the electronic components by the suction nozzles L1, L3, and L5, To the component feeding position of the tape feeder d belonging to the second feeder block (step S7). At this time, in the tape feeder (d), feeder feeding is performed during the component mounting operation in the previous cycle, and the electronic component is in a predetermined component feeding position. That is, the component suction operation can be performed without waiting for feeder feeding. Therefore, the controller 30 can move the mounting head 12 to the component feed position of the tape feeder d, and immediately vacuum-adsorb the electronic component. At this time, the electronic parts are simultaneously adsorbed by the suction nozzle L2 belonging to the second nozzle block.

As a result, the four suction nozzles (L1 to L3 and L5) hold the electronic parts by suction. Then, the controller 30 sequentially mounts the electronic components adsorbed by the four adsorption nozzles L1 to L3 and L5 onto the substrate (step S9). Thus, one cycle is completed.

Further, in the above embodiment, a plurality of tape feeders are grouped into three and three feeder blocks, three and two feeder blocks, three and one feeder block on the basis of the maximum simultaneous adsorption number 3, Various changes can be made according to the interval.

Conventionally, it has been considered that the reel that is being used is left unattended for parts management. The tape is fed by suction until a part disappears from a predetermined tape feeder, and then the tape is fed from another tape feeder come.

That is, when the pitch between the suction nozzles and the tape feeder do not match (for example, the pitch between the tape feeders is twice the pitch between the suction nozzles), as shown in Fig. 7A, , L3 and L5, and then the mounting head is moved to the position shown in Fig. 7 (b), and the remaining plurality of suction nozzles L2, L3 and L4 are used After the components are simultaneously adsorbed from the tape feeders (a to c), the adsorption mounting sequence for mounting the components on the substrate is performed.

In this case, after the components are adsorbed by the first nozzle blocks L1, L3, and L5, the feeder blocks a to c wait for feeder feed, and then the second nozzle blocks L2, L4, . Therefore, when the feeder consumes time such as a feeder requiring two feeds, the feeder feed time is greatly influenced and the productivity is poor.

Thus, as shown in Fig. 7 (a), the components are simultaneously adsorbed by an amount that can be adsorbed by a plurality of adsorption nozzles, and then, while the component feeder of the feeder is being performed, It is also considered to repeat the sequence. The adsorption mounting sequence in this case is performed by the procedure shown in Fig.

That is, if it is judged that the tape feeder for supplying the electronic component to be mounted on the board is the tape feeder (12 mm tape feeder) of the object (Yes in step S21 of Fig. 6) (Here, 3) of the suction nozzles mounted on the suction nozzle 12 (step S23).

At this time, when it is judged that the number of mounted articles is 3 or more, the number of feeder uses is determined to be three (step S24), and one feeder block and one nozzle block are created (step S25). Here, three tape feeders to be used are assumed to be a first feeder block, and the three suction nozzles selected one by one from the six suction nozzles mounted on the mounting head 12 are referred to as a first nozzle block.

After the electronic components are simultaneously adsorbed from all the tape feeders belonging to the first feeder block by all of the suction nozzles belonging to the first nozzle block (step S26), the suction-held electronic components are transported onto the substrate, (Step S27).

On the other hand, when it is judged that the number of parts to be mounted is less than 3, the number of feeders to be used is determined as the number of electronic parts to be mounted on the board (step S28), and one feeder block and one nozzle block are created one by one (step S29). In this case, less than three tape feeders to be used are directly used as the first feeder block, and one of the six suction nozzles mounted on the mounting head 12 is used as the suction nozzle of the selected number of minutes, Block.

Then, the electronic components are simultaneously adsorbed from all the tape feeders belonging to the first feeder block by all of the suction nozzles belonging to the first nozzle block (step S26), and the adsorbed and held electronic components are transported onto the substrate, (Step S27).

However, in this case, since the mounting head reciprocates between the component supply portion and the substrate, the moving distance becomes longer, which is not efficient in the mounting operation.

On the other hand, in the present embodiment, the number of tape feeders used is actively increased, and a simultaneous adsorption pair (a feeder block and a nozzle block) which is not affected by the feeder conveyance time within one cycle is created, After simultaneous adsorption, the component is mounted on the substrate. Therefore, the above-described inefficient mounting operation can be solved (the number of cycles can be reduced), and the mounting tact time can be shortened, so that the productivity can be improved.

Particularly, in the case of one type of component to be mounted like the LED substrate, since the component management is simple, it is preferable to increase the feeder of the same component so as to increase productivity,

As described above, in the present embodiment, the production operation can be optimized.

One; Component mounting device
5; Circuit board
11; Conveying rail
12; Mounting head
13; X-axis gantry
14; Y-axis gantry
15; Tape feeder (part feeder)
16; Nozzle exchange device
21; Recognition camera
23; Substrate recognition camera
30; controller
31; Vacuum mechanism
32; X-axis motor
33; Y-axis motor
34; Z-axis motor
35; θ-axis motor
71; Absorption nozzle

Claims (4)

An electronic component mounting method for simultaneously mounting an electronic component supplied from a plurality of tape feeders by a plurality of suction nozzles of a mounting head and mounting the sucked electronic component at a predetermined position on the substrate,
The plurality of tape feeders are arranged at equal intervals such that the pitch between the tape feeders becomes an integral multiple of the pitch between the suction nozzles,
Grouping the plurality of tape feeders into a plurality of feeder blocks capable of simultaneously adsorbing electronic components by the adsorption nozzle,
Wherein the electronic parts are successively attracted to each other by using a set of suction nozzles different for each of the feeder blocks, and then the attracted electronic parts are successively mounted at predetermined positions on the substrate. The method according to claim 1,
Wherein said plurality of tape feeders are grouped from a maximum simultaneous adsorption number which is the number of parts capable of simultaneously picking up an electronic component from said tape feeder by said suction nozzle. An electronic component mounting apparatus for simultaneously mounting an electronic component supplied from a plurality of tape feeders by a plurality of suction nozzles of a mounting head and mounting the suctioned electronic component at a predetermined position on the substrate,
The plurality of tape feeders are arranged at equal intervals such that the pitch between the tape feeders is an integral multiple of the pitch between the suction nozzles,
Feeder block creating means for grouping the plurality of tape feeders into a plurality of feeder blocks capable of simultaneously adsorbing electronic components by the adsorption nozzle;
Component picking means for continuously picking up the electronic component using a different set of suction nozzles for each feeder block created by the feeder block creation means,
And component mounting means for picking up the electronic component by the component pickup means and then sequentially mounting the picked-up electronic component at a predetermined position on the substrate. The method of claim 3,
And a maximum simultaneous adsorption number acquiring means for acquiring the maximum simultaneous adsorption number which is the number of parts capable of simultaneously adsorbing the electronic component by the adsorption nozzle from the tape feeder based on the pitch between the tape feeders and the pitch between the adsorption nozzles In addition,
Wherein the feeder block creation means groups the tape feeders adjacent to each other for each maximum number of simultaneous adsorption obtained by the maximum simultaneous adsorption number acquisition means to create a plurality of feeder blocks.

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