JP2000151189A - Device and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic components, that can supply a plurality of kinds of the electronic components efficiently, and improve mounting efficiency. SOLUTION: In the mounting device of electronic components for mounting the electronic components onto a substrate 3 by a mounting head 7 with a plurality of suction heads, electronic components P1, P2, and P3 being accommodated into a tray 14 of a second supply part 12 are transferred to a middle stage 18 that has a suction seat with a pitch equal to the array pitch of the suction head by a supply head 16, and vacuum suction is made for retaining. Then, the middle stage 18 is moved closer to the substrate 3 for standby, and the electronic parts P1, P2, and P3 are collectively picked up by the mounting head 7 for mounting to the substrate 3, thus efficiently supplying a plurality of kinds of the electronic components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus, a multi-head for driving a plurality of suction heads by the same driving means may be used as a means for shortening a mounting tact time. In this method, a plurality of electronic components are simultaneously picked up by a plurality of suction heads, and the electronic components are supplied in an arrangement form matching the arrangement pitch of the suction heads in an electronic component supply unit.

[0003]

However, in an actual mounting apparatus, it is not always possible to match the arrangement of the electronic components in the supply section of the electronic components with the arrangement pitch of the suction heads. In particular, when using a tray as a method of supplying electronic components when targeting a plurality of types of electronic components, the arrangement pitch of the electronic components on the tray usually differs depending on the electronic components, and a tape feeder or a bulk feeder may be used. This is because, even when a feeder is used, the arrangement pitch may not be adjusted depending on the type of electronic component. For this reason, when different types of electronic components are simultaneously mounted, the cases that can be handled by a multi-head are limited. In a conventional electronic component mounting apparatus, a plurality of types of electronic components are efficiently supplied to improve the mounting efficiency. It was difficult.

An object of the present invention is to provide an electronic component mounting apparatus and a mounting method capable of efficiently supplying a plurality of types of electronic components and improving the mounting efficiency.

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component on a substrate by using a mounting head having a plurality of suction heads. An intermediate stage having a holding unit that holds a plurality of electronic components transferred from the supply unit by vacuum suction at a pitch equal to the arrangement pitch of the suction heads is provided.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus according to the first aspect, wherein the intermediate stage has a plurality of holding units.

According to a third aspect of the present invention, there is provided the electronic component mounting apparatus according to the first aspect, wherein the moving means moves the intermediate stage from the electronic component supply section to the vicinity of the board positioning section. With.

According to a fourth aspect of the present invention, there is provided a method for mounting an electronic component on a substrate by using a mounting head having a plurality of suction heads. The components are transferred to and held on an intermediate stage having a holding unit for holding by vacuum suction at a pitch equal to the arrangement pitch of the suction heads, and the held electronic components are collectively stored in the mounting head for each holding unit. Pick up by.

According to the present invention, by providing an intermediate stage having a plurality of holding units for vacuum-sucking a plurality of types of electronic components transferred from a supply unit of the electronic components at a pitch equal to the arrangement pitch of the mounting heads, A plurality of types of electronic components can be efficiently supplied.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, and FIG. 3A is a front view of an intermediate stage of the electronic component mounting apparatus. FIG. 3B is a cross-sectional view of an intermediate stage of the electronic component mounting apparatus, FIGS. 4A, 4B, and 4C are process explanatory diagrams of the electronic component mounting method, and FIG. FIG. 3 is a perspective view of a supply head of the electronic component mounting apparatus.

First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports and positions the substrate 3. Therefore, the transport path 2 serves as a substrate positioning portion. On both sides of the transport path 2, first supply units 4A and 4B for electronic components are arranged, and a large number of tape feeders 5 are arranged in each supply unit 4A and 4B. The tape feeder 5 stores the electronic components held by the tape, and supplies the electronic components by feeding the tape at a pitch.

On the X-axis table 6, a mounting head 7 for electronic components is mounted. The mounting head 7 is a multi-head having a plurality of (three in this embodiment) suction heads 7a. X-axis table 6 includes Y-axis table 8A and Y-axis table 8A.
Both ends are supported by guides 8B arranged side by side facing the shaft table 8A. Therefore, by driving the X-axis table 6 and the Y-axis table 8A, the mounting head 7 moves horizontally, and picks up electronic components from the pick-up position 9 of the tape feeder 5 by the nozzles mounted at the lower end of each suction head 7a. And substrate 3
Transfer to the top. Between the transport path 2 and the second supply unit 4B,
A camera 10 for recognizing electronic components is provided.

A second supply unit 12 is provided on the side of the base 1. A tray 14 for storing different types of electronic components P1, P2, and P3 is placed on a tray placement unit 13 provided in the second supply unit 12. A tray feeder 15 for stacking and storing the trays 14 is provided adjacent to the tray placement unit 13. The tray 14 is supplied from the tray feeder 15 and placed on the tray placement unit 13.

The electronic components P1, P2, P3 in the tray 14
Is transferred to the intermediate stage 18 by moving the supply head 16 by moving means including an X-axis table 17X and a Y-axis table 17Y, and is held by vacuum suction. A moving table 18 as moving means is provided along the conveying path 2 between the conveying path 2 and the supply section 4B.
From the supply unit 12 to the vicinity of the positioning unit of the substrate 3. Then, the electronic components held by the intermediate stage 18 are picked up by the plurality of suction heads 7 a of the mounting head 7 and mounted on the substrate 3.

Next, the intermediate stage 18 for mounting electronic components will be described with reference to FIG. As shown in FIG. 3A, the intermediate stage 18 is configured such that an annular member 22 is rotatably mounted on an outer periphery of a fixed portion 21 which is a columnar member fixed to a bracket 20. The fixed portion 21 is provided with a longitudinal suction hole 21a at a center position thereof,
The suction hole 21a is connected to a vacuum suction source via a pipe 26.

The intermediate stage 18 has A, B,
C is divided into three positions, and A, B,
At each of the positions C, a suction hole 21b is provided which branches vertically upward from the suction hole 21a. The suction hole 21b communicates with the suction hole 24 of the suction seat 23 holding the electronic component. Vacuum suction from the pipe 26 in a state where the suction hole 24 communicates with the suction hole 21b of the fixed portion 21 causes the suction seat 23 to suck and hold the electronic component.

[0017] As shown in FIG.
It is provided radially at the position where it is distributed. FIG.
The cross section at the position is shown, and the suction seats 23A1, 23A are shown.
A2, 23A3, and 23A4 can hold different types of electronic components by detachably mounting corresponding components having different shapes and sizes. Similarly, the suction seats 23B1 and 23B are also radially located at the positions B and C.
2,23B3,23B4 and 23C1,23C2,2
3C3 and 23C4 are provided, and can respectively hold different types of electronic components.

The pitch P between the suction seats 23 shown in FIG. 3A is set equal to the arrangement pitch of the suction heads provided in the mounting head 7. Therefore, by lowering the transfer head 7 on the intermediate stage 18 in a state where the electronic components are held on the three suction seats 23 located on the upper surface of the intermediate stage 18, respectively, the three electronic components are held by a single pickup operation. The components can be picked up by being sucked to the respective suction heads 7a. At this time, it is assumed that the suction heads 7a of the transfer head 7 correspond to different types of electronic components, respectively.
By setting the shape and size of the suction seat at each position of B and C to correspond to each electronic component, three different electronic components are held on the intermediate stage 18 and these three electronic components are simultaneously held. It can be supplied to the mounting head 7.

The three suction seats on the same plane, for example, (23A1, 23B1, 23C1) constitute a first holding portion for holding three electronic components at a predetermined arrangement pitch. Similarly, (23A2, 23B2, 23C2), (2
3A3, 23B3, 23C3), (23A4, 23B
The combination of (4, 23C4) constitutes second to fourth holders, that is, the intermediate stage 18 has four sets of holders each including three suction seats 23.
By rotating the pulley 29 coupled to the annular member 22 by the motor 27 via the belt 30 and the pulley 28, any one of the four sets of holding parts is positioned on the upper surface which is the suction position. Can be.

The electronic component mounting apparatus is configured as described above. Next, the operation will be described. In FIG. 2, the electronic component P is picked up from the supply units 4A and 4B by moving the mounting head 7. At this time, the arrangement pitch P of the suction heads of the mounting head 7 and the arrangement pitch P of the tape feeders 5 of the supply unit 4 (the arrangement pitch of every other tape feeder 5 in the present embodiment) are set to be the same, and therefore are the same. The three electronic components can be picked up simultaneously by the suction operation. After this, the mounting head 7 is
The electronic component is moved upward, whereupon the position of the electronic component is recognized. And the suction head 7a
The electronic components are sequentially placed on the substrate 3 by causing the
Mount at the mounting position of.

After mounting the electronic components housed in the supply unit 4, the electronic components housed in the second supply unit 12 are mounted. Tray placement section 1 of second supply section 12
3, a tray 14 containing three different types of electronic components P1, P2, and P3 is placed. These electronic components are supplied to the tray 1 by a supply head 16 as shown in FIG.
4 and the suction seat 2 of the intermediate stage 18
3A1, 23B1, and 23C1 (see FIG. 3), respectively, and held by vacuum suction.

The operation of supplying the electronic components to the intermediate stage 18 is performed in parallel with the operation of mounting the electronic components on the substrate 3 by the mounting head 7. In response, electronic components are supplied to a plurality of sets of holding units. Here, how many sets of holding parts are supplied with electronic components in advance is determined by a balance between the mounting tact time by the mounting head 7 and the transfer tact time by the supply head 16.

Next, the intermediate stage 18 is the moving table 1
9 moves to the side of the substrate 3 positioned on the transport path 2 and waits at this position. Thereafter, the mounting head 7 is moved, and as shown in FIG.
By lowering a on the intermediate stage 18, three kinds of different electronic components P1, P2, and P3 are collectively picked up simultaneously for each holding unit. After this, the mounting head 7
Moves onto the substrate 3 after the position of the electronic component is recognized by the camera 10 in the same manner as described above, and the electronic components P1, P2, and P3 held by the suction heads 7a are sequentially transferred to the substrate 3 as shown in FIG. 3 is implemented.

As described above, while the mounting head 7 is performing the mounting operation, a plurality of different types of electronic components are previously mounted on the intermediate stage 18 by the supply head 16 in parallel with this operation. More preferably, intermediate stage 1
8 is moved to the vicinity of the substrate 3 and put on standby to supply a plurality of electronic components at the same time and to reduce the time required for moving the mounting head 7 to improve the supply efficiency, thereby shortening the mounting tact time. Thus, productivity can be improved.

In the present embodiment, an example has been shown in which the electronic components supplied from the tray 14 are transferred to the intermediate stage 18 and are on standby. However, the present invention is not limited to this.
When the arrangement pitch is different from the arrangement pitch of the suction heads 7a, a transfer unit similar to the supply head 16 is provided in the supply unit 4B to transfer the electronic components supplied from the tape feeder 5 to the intermediate stage 18. It may be.

Further, by using a supply head 16 'having a plurality of kinds of suction nozzles capable of position switching as shown in FIG. 5 as the supply head 16, the shape and size of the target electronic component greatly differ. Even in such a case, it is possible to more efficiently supply the electronic components without the need to replace the nozzle. This supply nozzle 1
Reference numeral 6 'denotes a configuration in which a plurality of different types of nozzles 31 are radially mounted on a rotary block 32, and the nozzle positions are switched by a rotary index mechanism 33.

[0027]

According to the present invention, there is provided an intermediate stage having a plurality of sets of holding portions for vacuum-sucking a plurality of types of electronic components transferred from a supply portion of the electronic components at a pitch equal to the arrangement pitch of the mounting heads. Therefore, a plurality of types of electronic components can be supplied at the same time, so that the mounting tact time can be shortened and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

3A is a front view of an intermediate stage of the electronic component mounting apparatus according to one embodiment of the present invention; FIG. 3B is a cross-sectional view of the intermediate stage of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4A is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention. FIG. 4B is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention. Process explanatory diagram of the electronic component mounting method of one embodiment

FIG. 5 is a perspective view of a supply head of the electronic component mounting apparatus according to the embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 2 transport path 3 substrate 4A, 4B supply unit 5 tape feeder 7 mounting head 7a suction head 12 second supply unit 14 tray 16 supply head 18 intermediate stage 23A1, 23B1, 23C1 suction seat

Claims (4)

[Claims] An electronic component mounting apparatus for mounting an electronic component on a substrate by a mounting head having a plurality of suction heads, wherein the plurality of electronic components transferred from an electronic component supply unit are attached to the suction head. An electronic component mounting apparatus, comprising: an intermediate stage having a holding section for holding by vacuum suction at a pitch equal to the arrangement pitch. 2. The electronic component mounting apparatus according to claim 1, wherein said intermediate stage has a plurality of holding portions. 3. The electronic component mounting apparatus according to claim 1, further comprising a moving unit configured to move the intermediate stage from an electronic component supply unit to a position near a substrate positioning unit. 4. An electronic component mounting method for mounting an electronic component on a substrate by a mounting head having a plurality of suction heads, wherein a plurality of electronic components are supplied from an electronic component supply unit at a pitch equal to the arrangement pitch of the suction heads. It is transferred and held on an intermediate stage having a holding unit that holds by vacuum suction at a pitch,
A method of mounting an electronic component, wherein the held electronic components are collectively picked up by the mounting head for each holding unit.