JP5682958B2 - Component mounter - Google Patents

Description

  The present invention relates to a component mounter that picks up a die supplied by a wafer pallet and mounts it on a circuit board.

  The dies supplied by the wafer pallet are formed by dicing the wafer into a grid pattern, and are attached to the dicing sheet. Therefore, when the die is picked up from the dicing sheet, it is necessary to peel the die from the dicing sheet. is there. The die peeling method includes a push-up peeling method and a slide peeling method. In the push-up peeling method, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2010-129949), a die divided from a wafer on a stretchable dicing sheet to which a wafer diced in a grid pattern is attached is attached. When picking up and picking up with a suction nozzle, the sticking part of the die to be sucked out of the dicing sheet is pushed up from directly below it with a pot, and the sticking part of the die is partially peeled from the dicing sheet. However, the die is sucked by the suction nozzle and picked up from the dicing sheet.

  However, in the case of a die that is thin and easily broken, the slide peeling method is used because the die may be broken by the above push-up peeling method. In the slide peeling method, as described in Patent Document 2 (Japanese Patent No. 3209736), a suction nozzle (collet) for picking up a die on a dicing sheet to which a large number of dies are attached, and a sheet suction hole are provided. And holding the die on the dicing sheet by suction with the suction nozzle pad, and sliding the sheet suction hole of the peeling stage from the front side of the sticking portion of the die directly below the sticking portion of the die. By doing so, the sticking part of the die is gradually peeled off.

  In Patent Document 3 (Japanese Patent Laid-Open No. 11-97489), two heads are mounted on one apparatus, a die on a dicing sheet is picked up by one head and placed on a positioning table, and the other head is used. The die on the positioning table is picked up and mounted on the circuit board.

  In Patent Document 4 (Japanese Patent Laid-Open No. 2008-4810), a plurality of process devices such as a die pickup device and a mounting device are arranged on a component mounting line, and the die pickup device and the mounting device are connected by a shuttle. The die pick-up device picks up the die on the dicing sheet and places it on the shuttle. The shuttle transfers the die to the mounting device, and the mounting device picks up the die from the shuttle and mounts it on the circuit board.

JP 2010-129949 A Japanese Patent No. 3209736 JP-A-11-97489 JP 2008-4810 A

  In general, the process of separating and picking up a die from a dicing sheet takes time compared to the process of mounting the die on a circuit board. In order to shorten the tact time of the die pick-up process, it is effective to increase the sheet peeling speed to shorten the time required for sheet peeling. If the detachable die is peeled from the sheet, if the slide speed of the peeling stage is increased, the thin die may break or the sheet may fail to peel. For this reason, it is necessary to slide the peeling stage gently, the time required for sheet peeling becomes longer, the takt time of the die pick-up process becomes longer, and as a result, the takt time of the die mounting process also increases, resulting in high productivity. Can not meet the demands.

  Therefore, the problem to be solved by the present invention is to perform a process of peeling and picking up a die from a dicing sheet and a process of mounting the die on a circuit board with a single component mounting machine. It is to be able to meet the demand.

In order to solve the above-mentioned problems, the invention according to claim 1 is to convey a wafer pallet having a dicing sheet on which a large number of dies formed by dicing a wafer are attached, a plurality of work heads, and a circuit board. And a die transfer stage on which a plurality of dies separated from the dicing sheet can be placed, and the die on the dicing sheet is operated by any one of the plurality of work heads. while it placed on the die transfer stage to pick up, as the first feature to be implemented in the circuit board to pick up the die on the die transfer stage other working head, further, a plurality of work Each of the heads picks up a die on the dicing sheet and places it on the die transfer stage (die pickup step), That both operation (die mounting step) that implements the dies on the transfer stage to the circuit board to pick up a feasible it is an second feature.

  In the present invention, since a die transfer stage is provided that can mount a plurality of dies separated from the dicing sheet, the die is separated from the dicing sheet during the waiting time of the step of mounting the die on the circuit board. Can be stocked on the transfer stage. Thereby, in the die mounting process, the die stocked on the die transfer stage can be efficiently mounted on the circuit board, and the tact time of the die mounting process can be prevented as much as possible from being extended by the die pickup process. High productivity requirements can be met.

In this case, as in the first and third aspects , each of the plurality of work heads picks up the die on the dicing sheet and places it on the die transfer stage (die pickup step), and on the die transfer stage. both operation of mounting on a circuit board to the die is picked up (die mounting step) may be feasible. In this way, a plurality of work heads can be operated efficiently and productivity can be improved.

In the present invention, in the die pick-up process, the die may be peeled from the dicing sheet by a push-up peeling method as described in Patent Document 1 or the like, or picked up by the working head as in claim 4 The die attachment portion is provided with a peeling stage that sucks the die attachment portion from the lower surface side of the dicing sheet and peels the die attachment portion, and holds and holds the die on the dicing sheet by the work head. It is also possible to detach the sticking part of the die from the front side of the sheet by sliding the peeling stage directly below the sticking part of the die. In such a slide peeling method, it is necessary to gently slide the peeling stage to prevent the thin die from cracking, etc., and the time required for the sheet peeling becomes longer, so the takt time of the die pick-up process becomes longer. During the waiting time of the process, the die can be peeled off from the dicing sheet and stocked on the die transfer stage, so that the tact time of the die mounting process can be prevented from being extended as much as possible, and high production can be achieved. Can meet sex demand.

Further, as in claim 2 , a wafer pallet and another component supply unit (tape feeder, tray feeder, etc.) are set so as to be detachable, and any one of a plurality of work heads can be connected to another component supply unit. A component to be supplied may be picked up and mounted on a circuit board. In this way, various mounting processes can be handled.

  Further, as in claim 5, the plurality of robots that move the plurality of work heads may have a configuration in which the X-axis that moves in the conveying direction of the conveyor is shared. In this way, the configuration of the plurality of robots that move the plurality of work heads can be simplified, and the apparatus cost can be reduced.

FIG. 1 is an external perspective view of a component mounter showing an embodiment of the present invention. FIG. 2 is a plan view of the component mounter. FIG. 3 is an external perspective view of the wafer pallet.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described with reference to FIGS.
On the base table 11 of the component mounting machine, a conveyor 13 for conveying the circuit board 12 in the X direction, a wafer pallet set table 15 for setting the wafer pallet 14 (see FIG. 3) to be replaceable, and other components A feeder set base 16 and the like for setting a supply unit (tape feeder, tray feeder, etc.) to be replaceable are provided.

  As shown in FIG. 3, a wafer pallet 14 is formed by expanding a stretchable dicing sheet 18 on which a wafer (a large number of dies 17) diced in a grid pattern is attached to a wafer mounting plate 19 having a circular opening. In this state, the wafer mounting plate 19 is attached to the pallet body 20 with screws 21 or the like.

  As shown in FIGS. 1 and 2, two XY robots 22 and 23 are provided on the base 11 of the component mounter. Each XY robot 22, 23 shares two X slide guides 24, 25 (X axis) extending in the transport direction (X direction) of the conveyor 13, and the X slide guides 24, 25 have X slides 26, 27 is supported to be slidable in the X direction, Y slides 26a and 27a are supported to be slidable in the Y direction on the X slides 26 and 27, and work heads 28 and 29 are detachably attached to the Y slides 26a and 27a, respectively. Is attached. Each of the working heads 28 and 29 includes various heads (for example, a head that holds only one suction nozzle, a rotary head that holds a plurality of suction nozzles, a dispensing head, and a thermocompression / ultrasonic mounting head. Etc.). Each work head 28 and 29 may be equipped with a camera (not shown) that images the parts such as the die 17.

  The wafer pallet setting table 15 is provided with a push-up unit 31 (see FIG. 1), and the work head 28 sucks and picks up the die 21 on the dicing sheet 18 of the wafer pallet 14 set on the wafer pallet setting table 15. At this time, the sticking part of the die 17 to be adsorbed in the dicing sheet 18 is pushed up from directly below by the push-up pot of the unit 31 while the sticking part of the die 17 is partially peeled from the dicing sheet 18. The working head 28 sucks the die 21 and picks it up from the dicing sheet 18.

  Instead of the push-up unit 31, a peeling stage for peeling the die 17 from the dicing sheet 18 by a slide peeling method may be provided. Here, the peeling stage sucks the sticking portion of the die 17 picked up by the work head 28 from the lower surface side of the dicing sheet 18 to peel the sticking portion of the die 17 from the sheet. In the slide peeling method, when the die 21 on the dicing sheet 18 of the wafer pallet 14 is sucked and picked up by the work head 28, the die 17 on the dicing sheet 18 is sucked and held by the work head 28. After the peeling part is slid from the front side of the sticking part of the die 17 to the position immediately below the sticking part of the die 17, the sticking part of the die 17 is gradually peeled off, and then the die 17 is picked up by the working head 28. To do.

  A die transfer stage 32 on which a plurality of dies 17 separated from the dicing sheet 18 can be placed is provided in an empty space on the base 11 of the component mounter. During the operation of the component mounting machine, the operation of picking up the die 17 on the dicing sheet 18 by one work head 28 and placing it on the die transfer stage 32 is repeated according to the production program, The die 17 on the transfer stage 32 is picked up and mounted on the circuit board 12.

  When the number of dies 17 placed on the die transfer stage 32 exceeds a predetermined number, the work head 28 that has been used as a sheet peeling head until then can also be used as a mounting head. Thus, the die 17 on the die transfer stage 32 can be picked up and mounted on the circuit board 12. Further, the working head 29 used as the mounting head can also be used as a sheet peeling head.

  In addition, when a component supply unit such as a tape feeder or a tray feeder is set on the feeder set base 16, according to the production program, the empty work head of the two work heads 28 and 29 is the component supply unit. The components supplied from the circuit board 12 can be picked up and mounted on the circuit board 12.

  In the present embodiment described above, since the die transfer stage 32 on which a plurality of dies 17 separated from the dicing sheet 18 can be placed is provided, during the waiting time of the step of mounting the die 17 on the circuit board 12, The die 17 can be peeled from the dicing sheet 18 and stocked on the die transfer stage 32. Thereby, in the die mounting process, the die 17 stocked on the die transfer stage 32 can be efficiently mounted on the circuit board 12, and the tact time of the die mounting process is extended as much as possible by the die pick-up process. And can meet the demand for high productivity.

  Moreover, in this embodiment, the two work heads 28 and 29 each pick up the die 17 on the dicing sheet 18 and place it on the die transfer stage 32 (die pickup step), and the die transfer stage. Since both the operation of picking up the die 17 on 32 and mounting it on the circuit board 12 (die mounting process) can be performed, the two work heads 28 and 29 can be operated efficiently to improve productivity. it can.

  Further, in this embodiment, the wafer pallet 14 and other component supply units (tape feeder, tray feeder, etc.) can be set, and are supplied from another component supply unit by one of the two work heads 28 and 29. Since the components are picked up and mounted on the circuit board 12, various mounting processes can be handled.

  In this embodiment, the two XY robots 22 and 23 that move the two work heads 28 and 29 share the X slide guides 24 and 25 (X axis) that move in the transport direction of the conveyor 13. Therefore, the configuration of the two XY robots 22 and 23 for moving the two work heads 28 and 29 can be simplified, and the apparatus cost can be reduced.

  By the way, when the slide peeling method is used as the sheet peeling method of the die 17, it is necessary to gently slide the peeling stage in order to prevent the thin die 17 from cracking, and the time required for the sheet peeling becomes long. In this embodiment, the die 17 can be peeled off from the dicing sheet 18 and stocked on the die transfer stage 32 during the waiting time of the die mounting process. The tact time can be prevented from being extended by the die pick-up process as much as possible, and the demand for high productivity can be satisfied.

  The present invention is not limited to the above-described embodiment. For example, one working head used as a sheet peeling head can be turned upside down, and the one working head is sucked by the die 17 peeled from the dicing sheet 18. In this state, the die 17 may be turned upside down, and the die 17 may be sucked by the other work head and mounted on the circuit board 12.

  In addition, the number of work heads (number of robots) in the present invention is not limited to two, and may be three or more. Further, the conveyor 13, the wafer pallet set table 15, the feeder set table 16, the die transfer stage. Needless to say, the present invention can be implemented with various changes within a range not departing from the gist, such as the position of 32 may be changed as appropriate.

  DESCRIPTION OF SYMBOLS 11 ... Base stand, 12 ... Circuit board, 13 ... Conveyor, 14 ... Wafer pallet, 15 ... Wafer pallet set stand, 16 ... Feeder set stand, 17 ... Die, 18 ... Dicing sheet, 22, 23 ... XY robot, 24, 25 ... X slide guide (X axis), 26, 27 ... X slide, 26a, 27a ... Y slide, 28, 29 ... Working head, 31 ... Push-up unit, 32 ... Die transfer stage

Claims (5)

In a component mounter including a wafer pallet mounted with a dicing sheet on which a large number of dies formed by dicing a wafer are attached, a plurality of work heads, and a conveyor that conveys a circuit board,
A die transfer stage capable of mounting a plurality of dies separated from the dicing sheet; and picking up a die on the dicing sheet by any one of the plurality of work heads and placing the die on the die transfer stage. A component mounter that picks up the die on the die transfer stage with another work head and mounts it on a circuit board ,
The plurality of work heads each have an operation of picking up a die on the dicing sheet and mounting the die on the die transfer stage, and an operation of picking up the die on the die transfer stage and mounting on the circuit board. A component mounter characterized by both being executable . In a component mounter including a wafer pallet mounted with a dicing sheet on which a large number of dies formed by dicing a wafer are attached, a plurality of work heads, and a conveyor that conveys a circuit board,
A die transfer stage capable of mounting a plurality of dies separated from the dicing sheet; and picking up a die on the dicing sheet by any one of the plurality of work heads and placing the die on the die transfer stage; A component mounter that picks up the die on the die transfer stage with another work head and mounts it on a circuit board,
The wafer pallet and other component supply units are set to be detachable,
Part products mounter you characterized in that mounted on one of the circuit board to pick up a component supplied from the other component supply unit at the work head of the plurality of working heads. The plurality of work heads each have an operation of picking up a die on the dicing sheet and mounting the die on the die transfer stage, and an operation of picking up the die on the die transfer stage and mounting on the circuit board. The component mounter according to claim 2 , wherein both can be executed. A peeling stage is provided for sucking the sticking portion of the die picked up by the working head from the lower surface side of the dicing sheet and peeling the sticking portion of the die, and sucking and holding the die on the dicing sheet by the working head while, according to claim 1 to 3, characterized in that the sheet peeling the sticking portion of the die the release stage from the front side of the attaching portion of the die by sliding to below the sticking portion of the die The component mounting machine according to any one of the above.   5. The component mounting machine according to claim 1, wherein the plurality of robots that move the plurality of work heads have a common X axis that moves in a conveying direction of the conveyor.

Images