KR101531389B1 - Film feeding and attaching apparatus, semiconductor chip package fabricating apparatus with the same, and method for fabricating semiconductor chip package - Google Patents

Abstract

The present invention relates to a film feeding and attaching device for cutting a fluorescent film strip into a piece of fluorescent film and attaching the piece of fluorescent film to the upper side of the semi-finished product of the semiconductor chip package, and a semiconductor chip package manufacturing apparatus And a method of manufacturing a semiconductor chip package. The disclosed film supply and adhering apparatus includes a film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film, A film attaching unit for attracting and attaching a piece of fluorescent film onto an upper surface of a semiconductor chip package semi-finished product including a semiconductor chip mounted on a lead frame and a sealing resin layer for sealing the semiconductor chip do.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film feeding and attaching apparatus, a semiconductor chip package manufacturing apparatus having the same, and a semiconductor chip package fabricating apparatus with the same,

The present invention relates to a semiconductor chip package manufacturing apparatus and a manufacturing method for continuously manufacturing a semiconductor chip package such as an LED package to which a piece of fluorescent film is attached.

BACKGROUND ART An LED package used as an indicator of an electronic device, a backlight unit of an LCD panel, a lighting device, or the like, typically mounts a light emitting diode (LED), which is a kind of semiconductor chip, on a lead frame, And is sealed with a light-transmitting resin to protect the electrode connection portion. As the sealing resin, for example, silicone resin is used, and in order to improve brightness upon light emission, a phosphor powder may generally be mixed with the sealing resin.

However, in such a conventional LED package, it is difficult to control the thickness of the sealing resin layer mixed with the phosphor and precisely control the blending ratio of the phosphor, so that it is difficult to control the light emitting quality of the LED package, resulting in low yields of good products, high heating value and low luminous efficiency.

In addition, there is a problem that the sealing resin may not be used due to solidification of the sealing resin during long-term storage, resulting in an increase in cost.

Korean Patent Publication No. 10-1102237 Korean Patent Publication No. 10-2011-0074098

The present invention provides a manufacturing apparatus and a manufacturing method of a semiconductor chip package, such as an LED package having a piece of fluorescent film, and a film supply and adhering apparatus provided in the semiconductor chip package manufacturing apparatus.

The present invention also provides a film feeding and attaching device for cutting a fluorescent film strip into a piece of fluorescent film and attaching the piece of fluorescent film to the upper side of the semi-finished product of the semiconductor chip package, and a semiconductor chip package manufacture And a method of manufacturing a semiconductor chip package.

The present invention relates to a film feeding unit for supplying a non-broken extended phosphor film strip, cutting the fluorescent film strip to form a piece of fluorescent film, and a lead frame, A film attaching unit for adsorbing and attaching a piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package having a semiconductor chip mounted on a frame and a sealing resin layer for sealing the semiconductor chip Film supply and attachment apparatus.

The present invention also relates to a semiconductor device comprising a semiconductor chip mounting unit for mounting a semiconductor chip on a lead frame, a sealing resin dispensing unit for injecting a sealing resin to seal the semiconductor chip, A curing unit for curing the sealing resin to form a sealing resin layer, and a semiconductor chip package manufacturing apparatus including the film supplying and adhering apparatus.

The film feeding unit may include a film separating die for separating the fluorescent film strip from the fluorescent film strip and a supporting tape strip for supporting the fluorescent film strip, a separator for separating the fluorescent film strip separated from the supporting tape strip, An unwinding roller for unwinding a roll wound on the fluorescent film strip and a supporting tape strip supporting the fluorescent film strip to supply the film to the film separating die, and a separator for separating the fluorescent film strip And a supporting tape rewinding roller for recovering and rewinding the remaining support tape strip.

Wherein the film separating die has an edge protruding at an acute angle for changing a traveling direction of the supporting tape strip, and when the supporting tape strip passes the edge, May be configured to separate from the support tape strip.

The film feeding unit may further include a film supporting rod which supports the piece of fluorescent film formed by cutting until the piece of fluorescent film is sucked by the film attaching unit.

The film feeding unit may include a plurality of the fluorescent film strips, the plurality of fluorescent film strips being arranged in the width direction thereof, and the plurality of fluorescent film strips and the support film supporting the plurality of fluorescent film strips may be rolled A film separating die for separating the plurality of fluorescent film strips supplied from the fluorescent film unwinding roller from the supporting film, a plurality of fluorescent film strips separated from the supporting film, And a support film rewinding roller for recovering and rewinding the remaining support film after the plurality of fluorescent film strips are separated from the support film rewinding roller .

Wherein the film separating die has an edge protruding at an acute angle for changing a traveling direction of the supporting film, and when the supporting film passes the edge, the plurality of fluorescent film strips Can be configured to separate from the support film.

The film feeding unit may further include a film piece supporting portion for supporting the plurality of pieces of fluorescent film formed by cutting with the cutter until the film is attached by the film attaching unit.

The width of the fluorescent film strip may be the same as the length of one side of the fluorescent film piece.

The film attaching unit may include a collet that sucks and transports the piece of fluorescent film and places it on the upper side of the semi-finished product of the semiconductor chip package.

The film attaching unit may further include a pick-up alignment sensor for sensing an adsorption attitude and an adsorption point of the piece of fluorescent film adsorbed on the collet.

The film attaching unit may further include a pressing pusher for pressing the piece of fluorescent film placed on the upper side of the semi-finished product of the semiconductor chip package toward the upper side.

The film supply and adhering apparatus of the present invention is characterized by comprising a loading unit for loading the semi-finished product of the semiconductor chip package to be supplied to the film adhering unit, An adhesive resin dispensing unit for applying an adhesive resin to the upper surface of the semiconductor chip package to fix the semiconductor chip package, and an unloading unit for unloading and collecting the semi- (unloading unit).

The present invention also provides a method of manufacturing a semiconductor device, comprising: a semiconductor chip mounting step of mounting a semiconductor chip on a lead frame; a sealing resin injecting step of sealing the semiconductor chip by injecting a sealing resin; A sealing resin curing step of forming a resin layer, and a fluorescent film piece attaching step of attaching a fluorescent film piece to an upper side of the sealing resin layer, wherein the fluorescent film piece attaching step comprises: A fluorescent film strip supplying step of supplying a film strip, a fluorescent film strip forming step of cutting the fluorescent film strip to form a fluorescent film strip, a pick-up step of picking up a fluorescent film strip to absorb the fluorescent film strip, And a fluorescent film piece mounting step of placing a piece of fluorescent film adsorbed on the upper side of the sealing resin layer The present invention provides a method for manufacturing a paper.

Wherein the step of supplying the fluorescent film strip includes supplying the fluorescent film strip and a supporting tape strip for supporting the fluorescent film strip to a film separating die, Separating the strip from the support tape strip, and cutting the fluorescent film strip separated from the support tape strip into a piece of fluorescent film.

Wherein the plurality of fluorescent film strips are arranged successively in a width direction of the fluorescent film strips, wherein the plurality of fluorescent film strips and the supporting film for supporting the plurality of fluorescent film strips are disposed on a film separating die the method comprising: separating the plurality of fluorescent film strips from the supporting film in the film separating die; and separating the plurality of fluorescent film strips separated from the supporting film, The number of the fluorescent film strips may be the same as the number of the fluorescent film strips.

The step of attaching the fluorescent film piece may further comprise a step of applying a resin for bonding to apply an adhesive resin to the upper surface of the sealing resin layer prior to the step of mounting the fluorescent film piece.

The step of attaching the fluorescent film piece may further include a step of pressing the fluorescent film piece to press the fluorescent film piece to be fixed on the upper side of the sealing resin layer.

According to the present invention, it is possible to continuously and automatically produce a semiconductor chip package to which a piece of fluorescent film is attached on the upper side. Therefore, product yield and productivity are improved, and the production cost can be reduced.

Further, the LED package, which is a kind of semiconductor chip package produced by the present invention, has a low calorific value to improve the luminous efficiency and reduce the amount of phosphor powder or fluorescent ink used compared with an LED package in which a phosphor powder or a fluorescent ink is mixed with a sealing resin layer And the production cost can be reduced.

In addition, according to the embodiment of the present invention, since the fluorescent film piece can be cut and formed in real time, the cost and time for preparation of the fluorescent film can be reduced.

1 is a sectional view showing an LED package to which a piece of fluorescent film is attached.
2 is a perspective view showing a form in which a lead frame used for manufacturing an LED package is mounted on a carrier.
3 is a block diagram illustrating a semiconductor chip package manufacturing apparatus according to an embodiment of the present invention.
Fig. 4 is a plan view schematically showing one embodiment of the film supply and adhering apparatus of Fig. 3;
5 is a perspective view showing an example of a feeding unit of FIG.
FIG. 6 is a perspective view showing an example of an adhesive resin dispensing unit for bonding in FIG. 4; FIG.
7 is a front view showing an example of the film feeding unit of Fig.
FIG. 8 is a perspective view showing a phosphor film strip roll mounted on a phosphor film unwinding roller of FIG. 7; FIG.
Fig. 9 is a perspective view showing an example of the film attaching unit of Fig. 4;
Fig. 10 is a front view showing another example of another film feeding unit that can replace the film feeding unit of Fig. 7; Fig.
Fig. 11 is a perspective view for explaining the operation performed by the film feeding unit of Fig. 10; Fig.
12 is a flowchart showing a method of manufacturing a semiconductor chip package according to an embodiment of the present invention.

Hereinafter, a film supply and adhering apparatus, a semiconductor chip package manufacturing apparatus, and a manufacturing method according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The terminology used herein is a term used to properly express the preferred embodiment of the present invention, which may vary depending on the intention of the user or operator or the custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.

First, an example of a semiconductor chip that can be manufactured using the semiconductor chip package manufacturing apparatus of the present invention will be described. FIG. 1 is a cross-sectional view showing an LED package with a piece of fluorescent film attached thereto, and FIG. 2 is a perspective view showing a form in which a lead frame used for manufacturing an LED package is mounted on a carrier. Referring to Fig. 1, the semiconductor chip package shown is an LED package (light emitting diode package) 1, and the lead frame 14 is formed with a groove 16 (see Fig. 2) . The LED 2 is mounted on the bottom of the groove 16 and the LED 2 is connected by a bonding wire 4 and a terminal (not shown) of the lead frame 14. The grooves 16 are filled with a transparent sealing resin and cured through a curing process to form a sealing resin layer 6. The sealing resin may be, for example, a transparent silicone resin. On the upper side of the sealing resin layer 6, an adhesive resin is applied to form a bonding resin layer 7, and the fluorescent film pieces 8 are attached thereon. A phosphor material is included in the fluorescent film piece 8 so that the luminance of light projected from the LED package 1 is improved. The adhesive resin may be, for example, OCA (optical clean adhesive).

1 and 2, in the process of manufacturing the semiconductor chip package 1, the lead frame 14 is mounted on each of the units 110, 120, 130, 40, 80, 160 ( 3), a plurality of lead frames 14 are carried on the carrier 11. The semiconductor chip 2 mounted on the lead frame 14 and connected by the bonding wire 4 and the semiconductor chip 2 mounted on the lead frame 14, A semiconductor chip package semi-finished product 18 having a sealing resin layer 6 for sealing the semiconductor chip package is mounted on the carrier 11. On the other hand, the carrier 11 is formed with the transfer holes 12 spaced apart by an interval equal to the distance between the adjacent pair of the lead frames 14 in a line in the longitudinal direction of the carrier 11. [

3 is a block diagram illustrating a semiconductor chip package manufacturing apparatus according to an embodiment of the present invention. 1 and 3, an apparatus for manufacturing a semiconductor chip package according to an embodiment of the present invention includes a semiconductor chip mounting unit 110, a sealing resin dispensing unit 120, A curing unit 130, a film supply and adhering apparatus 150, and a second curing unit 160. [

The semiconductor chip mounting unit 110 mounts the semiconductor chip 2 on the lead frame 14 and connects the lead frame 14 and the semiconductor chip 2 with the bonding wire 4. The resin dispensing unit 120 for sealing injects the sealing resin into the lead frame groove 16 (see FIG. 2) so that the semiconductor chip 2 is sealed. The first curing unit 130 hardens the injected sealing resin to form the sealing resin layer 6. [

The film supply and adhering apparatus 150 includes an adhesive resin dispensing unit 40 for adhering, a film feeding unit 50, and a film attaching unit 80. The adhesive resin dispensing unit 40 forms an adhesive resin layer 7 by applying an adhesive resin to the upper surface of the sealing resin layer 6. A film feeding unit 50 cuts the unbroken and stretched phosphor film strip 9 (see FIG. 8) to form a piece of fluorescent film 8. The film attaching unit 80 adsorbs and attaches the fluorescent film pieces 8 to the upper surface of the sealing resin layer 7 on which the adhesive resin layer 7 is formed. The second curing unit 160 hardens the adhesive resin to fix the fluorescent film piece 8 on the upper surface of the sealing resin layer 6 and further hardens the sealing resin layer 6 So that the semiconductor chip package 1 is completed.

Fig. 4 is a plan view schematically showing one embodiment of the film supply and adhering apparatus of Fig. 3, Fig. 5 is a perspective view showing an example of a feeding unit of Fig. 4, FIG. 2 is a perspective view showing an example of an adhesive resin dispensing unit for adhering; FIG. 4, the film supply and adhering apparatus 150 includes a semiconductor chip package semi-finished product 18 (see FIG. 1) mounted on the carrier 11 (see FIG. 2) (See Fig. 1) to the fluorescent film piece 8 (see Fig. 1).

The film supply and adhering apparatus 150 includes a loading unit 21, a feeding unit 30, a resin dispensing unit 40 for adhering, a film feeding unit 50, a film attaching unit 80, an unloading unit 93, and a controller 99. [0034] 2, 4 and 5, the feeding unit 30 moves the carrier 11 on which a plurality of semiconductor chip package semi-finished products 18 (see FIG. 1) are mounted in a direction parallel to the Y axis . The carrier 11 is loaded on a conveying rail 31 extending parallel to the Y-axis and is conveyed along the conveying rail 31. A loading unit 21 is disposed on one side of the conveying rail 31 and an unloading unit 93 is disposed on the other side of the conveying rail 31. The loading unit 21 sequentially loads the carrier 11 on which the semiconductor chip package semi-finished product 18 (see FIG. 1) is mounted on one side of the transfer rail 31. The semi-finished product 18 thus loaded moves along the feed rail 31 and is sequentially supplied to the resin dispenser unit 40 for adhering and the film attaching unit 80.

The feeding unit 30 is provided with a reciprocating bar 33 extending parallel to the feed rail 31 on the side of the feed rail 31 and a plurality of bars 33 projecting toward the feed rail 31 from the reciprocating bar 33 And a transfer pin (pin) 36 protruding downward from the end of each transfer rod 35. The transfer rods 35, The reciprocating bar 33 reciprocates by a distance between a pair of adjacent lead frames 14 mounted on the carrier 11 and reciprocates in a clockwise and counterclockwise direction by a certain angle about its own longitudinal axis Alternate rotation. With this configuration, when the reciprocating bar 33 rotates counterclockwise by a predetermined angle, the feed pin 36 descends and its lower end is inserted into the feed through hole 12 of the carrier 11, 33 are moved in parallel to the positive (+) direction of the Y axis so that the carrier 11 and the plurality of lead frames 14 mounted thereon are shifted by one pitch. When the reciprocating bar 33 is rotated by a predetermined angle in the clockwise direction, the conveying pin 36 rises and the lower end of the conveying pin 33 is disengaged from the conveying through hole 12. When the reciprocating bar 33 is rotated in the Y- In parallel with the direction of the arrow. By the repetition of the above-described mechanism, the plurality of lead frames 14 and the carrier 11 on which the plurality of lead frames 14 are mounted move along the feed rail 31 at a pitch. The controller 99 controls the operation of the feeding unit 30 by aligning the timing with the operation of the other units 21, 40, 50, 80 and 93.

2, 4, and 6, the resin dispenser unit 40 for adhering is disposed between the loading unit 21 and the film attaching unit 80. The time required for performing the operation of the resin dispensing unit 40 for bonding tends to be longer than the time required for performing the operation of the film attaching unit 80 so that the film supplying and attaching apparatus 150 A single film attaching unit 80 and a pair of adhesive resin dispensing units 40 may be provided.

The resin dispenser unit 40 for adhering includes a syringe 42 filled with a fluid resin for adhesion such as OCA and a syringe 42 for holding the syringe 42 in a horizontal direction, And a syringe driver (44) for moving the syringe in the direction of the syringe. At the lower end of the syringe 42, there is formed a nozzle 43 through which a fluid resin is discharged. When the semiconductor chip package semi-finished product 18 (see Fig. 1), which is mounted on the carrier 11 and is transported along the transport rail 31 in parallel with the positive (+) direction of the Y axis is positioned below the syringe 42, The syringe 42 is moved in parallel by the syringe driver 44 so that the lead frame 43 and the lead frame 14 are aligned with each other and the adhesive resin is fed to the sealing resin layer 6 . The discharge method of the resin is, for example, a dot method in which discharge is performed with a small interval by intervals, and a write method in which the discharge is continuously performed without interruption. The syringe driver 44 can move the syringe 42 finely during the discharge of the resin to appropriately distribute the resin. At this time, the controller 99 controls the operation of the resin dispensing unit 40 for bonding according to the timing and timing of the operation of the other units 21, 30, 50, 80 and 93.

On the other hand, if the syringe 42 is filled with the sealing resin instead of the adhesive resin, the resin dispenser unit 40 for bonding may be used as the sealing resin dispenser unit 120 (see Fig. 3). In this case, the loading unit 21 is provided with a plurality of lead frames 14 mounted with a semiconductor chip 2 (see Fig. 1) wired by a bonding wire 4 (see Fig. 1) Is mounted. When the carrier 11 on which the lead frame 14 is mounted is loaded on the conveying rail 31 and stops below the syringe 42, the sealing resin accommodated in the syringe 42 contacts the groove of the lead frame 14 (18). When the resin dispenser unit 40 for bonding is used as the resin dispenser unit 120 for sealing, the carrier 11 on which the lead frame 14 is mounted is discharged from the loading unit 21 to the unloading unit 93 The film feeding unit 50 and the film attaching unit 90 are stopped until they are collected.

FIG. 7 is a front view showing an example of the film feeding unit of FIG. 4, and FIG. 8 is a cross-sectional view of a fluorescent film strip roll mounted on a phosphor film unwinding roller of FIG. FIG. 9 is a perspective view showing an example of the film attaching unit of FIG. 4; FIG. 4, 7, and 8, the film feeding unit 50 includes a film separating die 62, a cutter 75, a film supporting rod 71, An unwinding roller 52, and a rewinding roller 54 for supporting tape.

The fluorescent film unwinding roller 52 includes a fluorescent film strip 9 extending continuously and a fluorescent film strip 9 formed by winding together a supporting tape strip 19 for supporting the fluorescent film strip 9 in close contact with the fluorescent film strip 9, A strip roll R1 is mounted and the fluorescent film strip roll R1 is unwound and fed to the film separating die 62. [ Before the fluorescent film strip roll R1 is mounted on the fluorescent film unwinding roller 52, a wide roll formed by winding a fluorescent film and a supporting tape closely supporting the fluorescent film is fixed And are sliced at a width (WF) interval. The width WF of the fluorescent film strip 9 is equal to the length of one side of the fluorescent film piece 8 formed in a tetragon.

The supporting tape rewinding roller 54 separates the fluorescent film strip 9 from the film separating die 62 and recovers the remaining supporting tape strip 19 to form the supporting tape strip roll R2. The support tape rewinding roller 54 is disposed below the fluorescent film unwinding roller 52. The fluorescent film strip 9 and the support tape strip 19 discharged from the fluorescent film unwinding roller 52 are guided to the film separating die 62 by the first and second guide rollers 56 and 57, The path of the support tape strip 19 from which the fluorescent film strip 9 is removed from the separation die 62 to the support tape rewinding roller 54 is guided by the third to fifth guide rollers 58, 59, do.

The film separating die 62 separates the fluorescent film strip 9 from the fluorescent film strip 9 in the supporting tape strip 19 which closely supports the fluorescent film strip 9. The film separating die 62 is a member provided with a wedge-shaped edge 64. The film separating die 62 is provided with a fluorescent film strip 9 and a supporting tape strip 19 for supporting and supporting the fluorescent film strip 9, Side surface 66 and an inclined surface 67 that is inclined to form an acute angle AA with the upper surface 66 end. The support tape strip 19 slides along the inclined surface 67 and moves toward the supporting tape rewinding roller 54. [

An edge 64 protruding at an acute angle AA is provided at one side end where the upper side surface 66 and the inclined surface 67 meet. The advancing direction of the support tape strip 19 at the edge 64 is abruptly changed and the fluorescent film strip 9 is separated from the support tape strip 19 when the support tape strip 19 passes the edge 64 .

The cutter 75 is configured such that a blade is vertically raised and lowered and separated from the supporting tape strip 19 to cut the fluorescent film strip 9 which is off the edge 64 to form the fluorescent film piece 8 . The cutter 75 is lowered and cut when the length of the fluorescent film strip 9 out of the edge 64 is protruded by the length of one piece of fluorescent film 8. On the other hand, the film support rod 71 supports the piece of fluorescent film 8 formed by cutting with the cutter 75 so as not to fall to the floor.

4, 7, and 9, the film attaching unit 80 is configured to attach the film piece 8 of the fluorescent film held by the film supporting rod 71 to the semiconductor chip To the package semi-finished product 18 (see Fig. 1). The fluorescent film piece 8 is attached to the upper side of the sealing resin layer 6 (see Fig. 1) coated with the adhesive resin. The film attaching unit 80 includes a collet 82 for sucking the piece of fluorescent film 8 supported by the film support rod 71 by vacuum suction and a collet 82 for supporting the collet 82, And a collet driver 84 that moves in directions parallel to the X-axis, the Y-axis, and the Z-axis, respectively. The collet 82 moves and descends to align on the extension line VL of the film support rod 71 to pick up and pick up the piece of fluorescent film 8 supported by the film support rod 71. [

The film attaching unit 80 further includes a pickup alignment sensor 89 that senses the adsorbed posture of the piece of fluorescent film 8 adsorbed on the collet 82 and the point of adsorption. The pickup alignment detection sensor 89 may be, for example, a camera module having an image sensor (not shown). The collet 82 is set so as to adsorb the center point of the fluorescent film piece 8 but when it is actually adsorbed, a point slightly off the center point can be adsorbed, and the posture in which the film piece 8 is attracted also slightly deviates from the set angle It is possible. The collet 82 that has adsorbed the fluorescent film piece 8 moves to the upper side of the pickup alignment detection sensor 89 and the pickup alignment detection sensor 89 picks up the fluorescent film piece 8 on which the fluorescent film piece 8 is adsorbed, do. The controller 99 compares the picked up posture and information about the picked up point with a default value to calculate an error and the collet 82 picks up the picked up alignment sensor 89 from the feed rail 31 To move the collet 82 to a position and a posture of the collet 82 in consideration of the error when the fluorescent film piece 8 is placed on the upper side of the sealing resin layer 6 of the semi-finished product 18, . When the collet 82 stops the vacuum suction at the upper side of the semi-finished product 18, the fluorescent film piece 8 is dropped by the gravity and is put on the upper side of the sealing resin layer 6. [

The film attaching unit 80 is separated from the collet 82 and the fluorescent film pieces 8 are attached to the adhesive resin layer 7 (see FIG. 1) so that the fluorescent film pieces 8 loaded on the semi-finished product 18 are brought into close contact with the adhesive resin layer 7 And a pressing pusher 87 which presses downward the pressing plate 87. As shown in Fig. The pressing pusher 87 is provided after the collet 82 along the traveling direction of the semi-finished product 18 on the conveying rail 31.

The unloading unit 103 is configured such that the semiconductor chip package semi-finished product 18 which has advanced to the other side of the conveyance rail 31 along the conveyance rail 31 is supported by the carrier 11 2) is unloaded and collected.

Fig. 10 is a front view showing another example of another film feeding unit which can replace the film feeding unit of Fig. 7, Fig. 11 is a front view showing the operation of the film feeding unit of Fig. It is a perspective view. 10 and 11, the film feeding unit 250 includes a fluorescent film unwinding roller 252, a film separating die 262, a cutter 275, a film piece supporting portion 271, And a support film rewinding roller 254.

The fluorescent film unwinding roller 252 includes a plurality of long fluorescent film strips 9 extended continuously and a support film 20 for supporting the fluorescent film strip 9 in close contact with each other, A film roll (R3) is mounted, and the fluorescent film roll (R3) is unwound and fed to the film separating die (262). The plurality of fluorescent film strips 9 are arranged in the direction of the width WF2 and are supported by the supporting film 20 having the same width as the sum of the widths WF2 of the plurality of fluorescent film strips 9. [ A plurality of fluorescent film strips 9 may be attached to the support film 20 and rolled together to form a fluorescent film roll R3. Meanwhile, a wide roll formed by winding a fluorescent film and a supporting film closely supporting it is sliced at a predetermined width (WF2), and a plurality of sliced rolls are wound together with a fluorescent film unwinding roller The fluorescent film roll R 3 can be formed. The width WF2 of the fluorescent film strip 9 is the same as the length of one side of the fluorescent film piece 8 formed in a tetragon.

The support film rewinding roller 254 separates the plurality of fluorescent film strips 9 from the film separating die 262 and recovers the remaining support film 20 to form the supporting film roll R4. The support film rewinding roller 254 is disposed below the fluorescent film unwinding roller 252. The plurality of fluorescent film strips 9 and the supporting film 20 discharged from the fluorescent film unwinding roller 252 are guided to the film separating die 262 by the first and second guide rollers 256 and 257, The path of the support film 20 from which the plurality of fluorescent film strips 9 are removed from the film separating die 262 to the support film rewinding roller 254 passes through the third to fifth guide rollers 258, 259 and 260 .

The film separating die 262 separates the plurality of fluorescent film strips 9 supplied from the fluorescent film unwinding roller 252 from the supporting film 20. The film separating die 262 is a member provided with an edge 264 having a wedge-shaped cross section. The plurality of fluorescent film strips 9 and the supporting film 20 which closely supports the film strips 9 are slid and moved An upper surface 266 and an inclined surface 267 inclined to form an acute angle AA2 with the distal end of the upper surface 266. The support film 20 slides along the slope 267 and moves toward the supporting film rewinding roller 254. [

An edge 264 protruding at an acute angle AA2 is provided at one side end where the upper side 266 and the inclined surface 267 meet. The advancing direction of the support film 20 at the edge 264 is abruptly changed and a plurality of fluorescent film strips 9 are spaced apart from the support film 20 when the support film 20 passes the edge 264 Separated.

The cutter 275 is configured such that a blade is vertically raised and lowered to cut a plurality of fluorescent film strips 9 separated from the edge film 264 and separated from the support film 20 to form a number of fluorescent film strips 9 The number of the fluorescent film pieces 8 is equal to the number of the fluorescent film pieces 8. The cutter 275 is lowered and cut when the length of the plurality of fluorescent film strips 9 that are out of the edge 264 is protruded by the length of one piece of fluorescent film 8. On the other hand, the film piece supporting portion 271 supports the plurality of fluorescent film pieces 8 formed by cutting by the cutter 275 so as not to fall to the bottom until they are adsorbed by the film attaching unit 80 (see Fig. 9) . The film support part 271 is not limited to the block shape shown in FIG. 11, but may be provided in the same number as the number of pieces of the fluorescent film 8 to be cut by the film support rod 71 shown in FIG. 7 .

The collet 82 of the film attaching unit 80 shown in Fig. 9 picks up a plurality of cut pieces of fluorescent film pieces 8 one by one and places them on the upper side of the semiconductor chip package semi-finished product 18 Leave. The plurality of fluorescent film strips 9 are not pushed forward until they are all picked up by the collet 82 while the plurality of fluorescent film pieces 8 supported by the film piece supporting portion 271 are picked up by the collet 82, 271, the plurality of fluorescent film strips 9 are advanced again and cutting proceeds when all the fluorescent film pieces 8 are removed.

12 is a flowchart showing a method of manufacturing a semiconductor chip package according to an embodiment of the present invention. Hereinafter, a method of manufacturing a semiconductor chip package according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4 and FIG. A method for manufacturing an LED package 1 according to an embodiment of the present invention includes a semiconductor chip mounting step S10, a sealing resin injecting step S20, a sealing resin curing step S30, , And a fluorescent film piece attaching step (S40). The above process is sequentially performed while a plurality of lead frames 14 are mounted on the carrier 11. [ In the semiconductor chip mounting step S10, the semiconductor chip 2, that is, the LED is mounted on the groove 18 of the lead frame 14, and the terminals of the lead frame 14 and the terminals of the semiconductor chip 2 are connected to the wires 4 ) Bonding, which may be performed in the semiconductor chip mounting unit 110. [

The sealing resin injecting step S20 is a step of sealing the semiconductor chip 2 by injecting a sealing resin into the groove 18 of the lead frame 14 on which the semiconductor chip 2 is mounted, Unit 120. < / RTI > The sealing resin curing step S30 is a step of curing the sealing resin injected into the groove 18 to form the sealing resin layer 6, and may proceed in a first curing unit. Depending on the type of the sealing resin, heat can be applied or the sealing resin can be cured by irradiating ultraviolet rays (UV).

The fluorescent film piece attaching step S40 includes a resin application step S41 for bonding, a fluorescent film strip supplying step S42, a fluorescent film piece forming step S43, a fluorescent film piece pick- S44), a fluorescent film piece mounting step (S45), and a fluorescent film piece pressing step (S46). The fluorescent film piece attaching step S40 is a step of attaching the fluorescent film piece 8 to the upper surface of the sealing resin layer 6 and attaching the resin resin 7 (7) to the syringe 42 of the resin dispensing unit 40 ), Loading the semiconductor chip package semi-finished product 18, and operating the film supply and adhering apparatus 150 to implement.

The adhesive resin application step S41 is implemented by the operation of the resin dispensing unit 40 for bonding as a step of applying an adhesive resin to the upper side of the sealing resin layer 6. The fluorescent film strip feeding step S42 is a step of supplying the fluorescent film strip 9 (see FIG. 7 or 10) which is not cut off. In this step S42, one fluorescent film strip 9 and a supporting tape strip 19 (see Fig. 7) supporting it are supplied to the film separating die 62 (see Fig. 7), or a plurality of fluorescent film strips (See Fig. 11) and the support film 20 (see Fig. 10) for supporting the same can be supplied to the film separating die 262 (see Fig. 11).

The fluorescent film piece forming step S43 is a step of cutting the fluorescent film strip 9 to form a fluorescent film piece 8. 7 and 8, the fluorescent film piece forming step S43 includes the steps of separating the fluorescent film strip 9 from the supporting tape strip 19 in the film separating die 62, And cutting the fluorescent film strip 9 separated by the cutter 75 into the fluorescent film piece 8. 10 or 11, the fluorescent film piece forming step S43 includes a step of separating the plurality of fluorescent film strips 9 from the supporting film 20 in the film separating die 262, Cutting the plurality of fluorescent film strips 9 separated from the fluorescent film strip 20 into cutter pieces 275 to be the same number of fluorescent film pieces 8 as the number of fluorescent film strips 9.

The fluorescent film piece pick-up step (S44) is a step of adsorbing the fluorescent film piece (8). The step of mounting the fluorescent film pieces S45 is a step of placing the adsorbed fluorescent film pieces 8 on the upper side of the sealing resin layer 6 to which the adhesive resin is applied. The fluorescent film piece pressing step S46 is a step of pressing the fluorescent film piece 8 so as to be fixed to the upper surface of the sealing resin layer 6. [ The support tape strip 19 separated from the fluorescent film piece 9 is recovered by the support tape rewinding roller 54 (see Fig. 7). A more specific description of the fluorescent film piece attaching step (S40) has already been described with reference to Figs. 7 to 9, and thus a duplicated description will be omitted.

The lead frame 14 discharged outside the film feeding and attaching device 150 after the fluorescent film piece attaching step S40 is cured by the additional second curing unit 160 to form the LED package 1, . ≪ / RTI >

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

1: LED package 8: fluorescent film piece
21: loading unit 30: feeding unit
31: feed rail 40: resin dispensing unit for bonding
50: Film feeding unit 62: Film separation die
75: Cutter 80: Film attaching unit
93: Unloading unit 150: Film feeding and attaching device

Claims (18)

delete A film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film; And
A film attaching unit for adhering and attaching the piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package including a lead frame, a semiconductor chip mounted on the lead frame, and a sealing resin layer for sealing the semiconductor chip, an attaching unit,
Said film feeding unit comprising:
A film separating die for separating the fluorescent film strip from the fluorescent film strip and a supporting tape strip for supporting the fluorescent film strip;
A cutter for cutting the fluorescent film strip separated from the support tape strip into a piece of fluorescent film;
A fluorescent film unwinding roller for releasing a roll wound on the fluorescent film strip and a supporting tape strip for supporting the fluorescent film strip to supply the film to the film separating die; And
And a support tape rewinding roller for recovering and rewinding the remaining support tape strips after separating the fluorescent film strip. 3. The method of claim 2,
Wherein the film separating die has an edge protruding at an acute angle for changing a traveling direction of the supporting tape strip, and when the supporting tape strip passes the edge, And is configured to separate from the support tape strip. 3. The method of claim 2,
Wherein the film feeding unit further comprises a film supporting rod for supporting the piece of fluorescent film formed by cutting until the piece of fluorescent film is sucked by the film attaching unit. A film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film; And
A film attaching unit for adhering and attaching the piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package including a lead frame, a semiconductor chip mounted on the lead frame, and a sealing resin layer for sealing the semiconductor chip, an attaching unit,
Said film feeding unit comprising:
Wherein the plurality of fluorescent film strips are arranged in the width direction of the fluorescent film strip,
A plurality of fluorescent film strips and a supporting film for supporting the plurality of fluorescent film strips;
A film separating die for separating the plurality of fluorescent film strips supplied from the fluorescent film unwinding roller from the supporting film;
A cutter for cutting the plurality of fluorescent film strips separated from the support film into a number of fluorescent film pieces equal in number to the number of fluorescent film strips; And
And a support film rewinding roller for recovering and rewinding the remaining support film separated from the plurality of fluorescent film strips. 6. The method of claim 5,
Wherein the film separating die has an edge protruding at an acute angle for changing a traveling direction of the supporting film, and when the supporting film passes the edge, the plurality of fluorescent film strips And is configured to separate from the support film. 6. The method of claim 5,
Wherein the film feeding unit further comprises a film piece supporting portion for supporting the plurality of pieces of fluorescent film formed by cutting by the cutter until the film is attached by the film attaching unit. A film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film; And
A film attaching unit for adhering and attaching the piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package including a lead frame, a semiconductor chip mounted on the lead frame, and a sealing resin layer for sealing the semiconductor chip, an attaching unit,
Wherein the width of the fluorescent film strip is equal to the length of one side of the fluorescent film piece. delete A film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film; And
A film attaching unit for adhering and attaching the piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package including a lead frame, a semiconductor chip mounted on the lead frame, and a sealing resin layer for sealing the semiconductor chip, an attaching unit,
Wherein the film attaching unit has a collet for sucking and transporting the piece of fluorescent film and placing it on the upper side of the semi-finished product of the semiconductor chip package,
Wherein the film attaching unit further comprises a pickup alignment detection sensor for detecting an adsorption attitude and an adsorption point of a piece of fluorescent film adsorbed on the collet. A film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film; And
A film attaching unit for adhering and attaching the piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package including a lead frame, a semiconductor chip mounted on the lead frame, and a sealing resin layer for sealing the semiconductor chip, an attaching unit,
Wherein the film attaching unit further comprises a pressing pusher for pressing the piece of fluorescent film placed on the upper side of the semi-finished product of the semiconductor chip package to the upper side. A film feeding unit for supplying an unbroken stretched phosphor film strip and cutting the fluorescent film strip to form a piece of fluorescent film;
A film attaching unit for adhering and attaching the piece of fluorescent film onto an upper surface of a semi-finished product of a semiconductor chip package including a lead frame, a semiconductor chip mounted on the lead frame, and a sealing resin layer for sealing the semiconductor chip, attaching unit);
A loading unit for loading the semiconductor chip package semi-finished product to be supplied to the film attaching unit;
An adhesive resin dispensing unit for applying an adhesive resin to the upper surface of the semiconductor chip package so that the piece of fluorescent film is adhered to the upper surface of the semi-finished product of the semiconductor chip package; And
And an unloading unit for unloading and collecting the semi-finished product of the semiconductor chip package with the piece of fluorescent film attached thereto. A semiconductor chip mounting unit for mounting a semiconductor chip on a lead frame;
A sealing resin dispensing unit for injecting a sealing resin so that the semiconductor chip is sealed;
A curing unit for curing the sealing resin to form a sealing resin layer; And
The apparatus for manufacturing a semiconductor chip package according to any one of claims 2, 3, 4, 5, 6, 7, 8, 10, 11 and 12. A semiconductor chip mounting step of mounting a semiconductor chip on a lead frame;
A sealing resin injecting step of injecting a sealing resin to seal the semiconductor chip;
A sealing resin curing step of curing the injected sealing resin to form a sealing resin layer; And
And attaching a fluorescent film piece to an upper side of the sealing resin layer, wherein the fluorescent film piece attaching step comprises:
A fluorescent film strip supplying step of supplying an unbroken extended fluorescent film strip;
A fluorescent film strip forming step of cutting the fluorescent film strip to form a fluorescent film strip;
A pick-up step of picking up the fluorescent film piece to absorb the fluorescent film piece; And
And placing a piece of the fluorescent film on the upper side of the sealing resin layer. 15. The method of claim 14,
Wherein the step of supplying the fluorescent film strip comprises supplying the fluorescent film strip and a supporting tape strip supporting the fluorescent film strip to a film separating die,
The step of forming the fluorescent film piece includes the steps of separating the fluorescent film strip from the supporting tape strip in the film separating die and cutting the fluorescent film strip separated from the supporting tape strip into a piece of fluorescent film Wherein the semiconductor chip package is a semiconductor package. 15. The method of claim 14,
Wherein a plurality of the fluorescent film strips are provided, and the plurality of fluorescent film strips are arranged successively in the width direction thereof,
Wherein the step of supplying the fluorescent film strips includes supplying the plurality of fluorescent film strips and a supporting film for supporting the plurality of fluorescent film strips to a film separating die,
Wherein the step of forming the fluorescent film piece comprises the steps of: separating the plurality of fluorescent film strips from the supporting film in the film separating die; separating the plurality of fluorescent film strips separated from the supporting film into a number Of the fluorescent film of the semiconductor chip package. 15. The method of claim 14,
Wherein the step of attaching the fluorescent film piece further comprises a step of applying a resin for bonding to apply an adhesive resin to the upper surface of the sealing resin layer prior to the step of mounting the fluorescent film piece. 15. The method of claim 14,
Wherein the step of attaching the fluorescent film piece further comprises a step of pressing the fluorescent film piece so that the piece of fluorescent film is fixed on the upper side of the sealing resin layer.

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