CN215266352U - Mini LED die bonder - Google Patents

Abstract

The utility model discloses a Mini LED die bonder, comprises a table plate, be equipped with on the platen along X axle direction and the mobilizable work box of Y axle direction, still be equipped with on the platen with the first magazine that the work box aligns and with the first material subassembly that pushes away of first magazine matched with, the ascending relative both sides of work box X axle are equipped with subsides dress subassembly respectively, subsides dress subassembly is including carrying the material platform and inciting somebody to action carry the chip on the material platform to remove to the material subassembly that moves on the work box, subsides dress subassembly still including grab ring subassembly, second magazine and with second magazine matched with second pushes away the material subassembly, grab the ring subassembly and be used for carry the material platform and transport brilliant ring between the second magazine. The utility model provides a solid brilliant machine of Mini LED has realized automatic feeding and has realized the automatic ring that trades to satisfy the production demand of Mini LED product, need not to shut down in the production process and change carrier or brilliant ring, improve the production efficiency of the solid brilliant machine of Mini LED greatly.

Description

Mini LED die bonder

Technical Field

The utility model relates to a semiconductor package equipment technical field especially relates to a solid brilliant machine of Mini LED.

Background

With the development of the LED display screen technology, Mini LED chips with the size of 50-200 microns appear on the market, the size of the Mini LED chips is smaller than that of the traditional LED chips, and then more chips can be pasted on the same display area, so that the display effect of the LED display screen is more exquisite, and the brightness, the color gamut and other various performances of the LED display screen are improved. In the subsequent packaging production process of LED products, because the quantity of the chips that can paste on carriers such as PCB or glass substrate is increased by a wide margin to the less messenger of size of Mini LED chip, and in order to make the LED product have better display effect, usually need paste the multiple Mini LED chip of dress on the carrier, and current solid brilliant machine can only paste a chip once, lead to pasting the brilliant ring that needs the shut down many times in order to change or supplementarily hold the Mini LED chip of dress in-process, influence the production efficiency of solid brilliant machine, cause the output reduction of LED product in unit interval, consequently current solid brilliant machine is difficult to satisfy the demand of market to the production of Mini LED product.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: a high-efficiency Mini LED die bonder is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be: a Mini LED die bonder comprises a table plate, wherein a working box which is movable along the X-axis direction and the Y-axis direction is arranged on the table plate, a first material box which is aligned with the working box and a first material pushing assembly which is matched with the first material box are further arranged on the table plate, surface-mounted assemblies are respectively arranged on two opposite sides of the working box in the X-axis direction, each surface-mounted assembly comprises a material carrying table and a material moving assembly which moves a chip on the material carrying table to the working box, each surface-mounted assembly further comprises a grab ring assembly, a second material box and a second material pushing assembly which is matched with the second material box, and the grab ring assembly is used for carrying a crystal ring between the material carrying table and the second material box.

Furthermore, a movable plate capable of ascending and descending along the Z-axis direction is arranged on the bedplate, the first material boxes are arranged on the movable plate, a plurality of material bins are arranged on the first material boxes at intervals in the Z-axis direction, the first material pushing assembly comprises a first push rod movably arranged along the Y-axis direction, and the first push rod is aligned with one of the material bins.

Furthermore, the moving plate is provided with at least two first material boxes, the first material boxes are arranged in a row along the X-axis direction, and the first material pushing assembly is movably arranged along the X-axis direction.

Furthermore, the second material box comprises a main frame and at least two crystal ring fixing plates, wherein the crystal ring fixing plates are arranged on the main frame at intervals along the Z-axis direction, and the crystal ring fixing plates are movably arranged along the Y-axis direction relative to the main frame respectively.

Furthermore, the main frame can be arranged in a lifting mode in the Z-axis direction.

Furthermore, the second pushing assembly comprises a second push rod which is movably arranged along the Y axis, and the second push rod is aligned with one of the wafer ring fixing plates.

Furthermore, the grab ring component comprises a sucker and a first driving piece, and the first driving piece drives the sucker to move in the Y-axis direction and the Z-axis direction.

Further, the material moving assembly comprises a crystal taking assembly, a correcting assembly and a crystal fixing assembly, the correcting assembly comprises a correcting table, the crystal taking assembly comprises a crystal taking arm for moving the chip on the material loading table to the correcting table, and the crystal fixing assembly comprises a crystal fixing arm for moving the chip on the correcting table to the working box.

Further, the correcting table comprises a vacuum suction plate, and the vacuum suction plate is rotatably arranged relative to the correcting table.

Furthermore, the correcting component also comprises a second driving piece driving the correcting table to move along the X-axis direction and the Y-axis direction.

The beneficial effects of the utility model reside in that: the utility model provides a solid brilliant machine of Mini LED adopts first magazine to hold carriers such as a plurality of PCBs or glass substrate, and send the carrier into the work box through first material pushing component, realize automatic feeding, and store a plurality of brilliant rings in the second magazine, be attached to the chip on the brilliant ring respectively, push away the material subassembly through the second and release the brilliant ring second magazine and pick up the second through the grab ring subassembly and push away the brilliant ring that the material subassembly was released and remove this brilliant ring to the material loading bench, and the claw ring subassembly can also be with empty brilliant ring from the material loading bench put back in the second magazine or put into the assigned position, in order to realize that automatic ring changing provides sufficient quantity and kind of chip for the material moving subassembly and supply the material moving subassembly subsides dress, and then satisfy the production demand of Mini LED product, need not to shut down in the production process and change carrier or brilliant ring, improve the production efficiency of solid brilliant machine of Mini LED greatly.

Drawings

Fig. 1 is a schematic structural view of a Mini LED die bonder in a first embodiment of the present invention;

fig. 2 is a top view of a Mini LED die bonder in accordance with a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of a work box in a Mini LED die bonder in a first embodiment of the present invention;

fig. 4 is a schematic structural view of a first material box and a moving plate in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 5 is a schematic structural view of a first material pushing assembly in a Mini LED die bonder in the first embodiment of the present invention;

fig. 6 is a schematic structural view of a material loading table in a Mini LED die bonder in the first embodiment of the present invention;

fig. 7 is a schematic structural view of a second material box and a second material pushing assembly in a Mini LED die bonder in the first embodiment of the present invention;

fig. 8 is a schematic structural view of a grab ring assembly in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 9 is a schematic structural view of a thimble in a Mini LED die bonder in a first embodiment of the present invention;

fig. 10 is a schematic structural diagram of a calibration assembly in a Mini LED die bonder according to a first embodiment of the present invention.

Description of reference numerals:

1. a platen; 11. a working box; 12. a material loading platform; 13. moving the plate; 14. a partition plate; 15. taking a crystal lens barrel; 16. a correction lens barrel; 17. fixing a lens cone; 18. a thimble; 2. a first magazine; 21. a storage bin; 3. a first pusher assembly; 31. a first push rod; 4. a grab ring assembly; 41. a suction cup; 42. a first driving member; 5. a second magazine; 51. a main frame; 52. a crystal ring fixing plate; 53. a suction part; 6. a second pusher assembly; 61. a second push rod; 62. an electromagnet; 7. taking a crystal component; 71. a crystal taking arm; 72. taking a crystal welding head; 8. a correction component; 81. a correction table; 82. a vacuum suction plate; 83. a second driving member; 9. a die bonding assembly; 91. a die bonding arm; 92. and (5) a die bonding welding head.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 10, a Mini LED die bonder includes a platen 1, wherein a work box 11 movable along an X-axis direction and a Y-axis direction is disposed on the platen 1, a first material box 2 aligned with the work box 11 and a first material pushing assembly 3 matched with the first material box 2 are further disposed on the platen 1, surface-mounted assemblies are respectively disposed on two opposite sides of the work box 11 in the X-axis direction, each surface-mounted assembly includes a material loading table 12 and a material transferring assembly for transferring a chip on the material loading table 12 onto the work box 11, each surface-mounted assembly further includes a grab ring assembly 4, a second material box 5 and a second material pushing assembly 6 matched with the second material box 5, and the grab ring assembly 4 is used for transferring a die ring between the material loading table 12 and the second material box 5.

From the above description, the beneficial effects of the present invention are: the utility model provides a solid brilliant machine of Mini LED has realized automatic feeding and has realized the automatic ring that trades to satisfy the production demand of Mini LED product, need not to shut down in the production process and change carrier or brilliant ring, improve the production efficiency of the solid brilliant machine of Mini LED greatly.

Further, a movable plate 13 capable of ascending and descending along the Z-axis direction is arranged on the platen 1, the first material box 2 is arranged on the movable plate 13, a plurality of material bins 21 are arranged on the first material box 2 in the Z-axis direction at intervals, the first material pushing assembly 3 comprises a first push rod 31 capable of being movably arranged along the Y-axis direction, and the first push rod 31 is aligned with one of the material bins 21.

As can be seen from the above description, the plurality of bins 21 are disposed at intervals along the Z-axis direction in the first magazine 2 to accommodate a plurality of carriers, and the lifting of the moving plate 13 drives the first magazine 2 to move in the Z-axis direction, so that the first push rod 31 is aligned with different bins 21 to push out the carriers in the bins 21.

Further, at least two first material boxes 2 are arranged on the moving plate 13, the first material boxes 2 are arranged in a row along the X-axis direction, and the first material pushing assembly 3 is movably arranged along the X-axis direction.

As can be seen from the above description, a plurality of magazines may be arranged in a row on the moving plate 13, and the first pushing assembly 3 moves to align the first pushing rod 31 with the storage bins 21 of different first magazines 2, so as to increase the storage capacity of the carrier on the Mini LED die bonder.

Further, the second magazine 5 includes a main frame 51 and at least two wafer fixing plates 52, the wafer fixing plates 52 are disposed on the main frame 51 at intervals along the Z-axis direction, and the wafer fixing plates 52 are respectively movably disposed along the Y-axis direction relative to the main frame 51.

Further, the main frame 51 is arranged to be movable in the Z-axis direction.

Further, the second pushing assembly 6 includes a second pushing rod 61 movably disposed along the Y axis, and the second pushing rod 61 is aligned with one of the wafer ring fixing plates 52.

As can be seen from the above description, a plurality of movable wafer ring fixing plates 52 are disposed in the second material box 5 to hold the wafer rings, the second material pushing assembly 6 drives the wafer ring fixing plates 52 to move to drive the wafer rings to extend out of the second material box 5 for being picked up by the claw ring assembly, and the main frame 51 can be lifted in the Z-axis direction to align the corresponding wafer ring fixing plates 52 with the second material pushing assembly 6.

Further, the grab ring assembly 4 includes a suction cup 41 and a first driving member 42, and the first driving member 42 drives the suction cup 41 to move in the Y-axis direction and the Z-axis direction.

As can be seen from the above description, the grab ring assembly 4 includes a suction cup 41 for sucking the wafer ring and a first driving member 42 for driving the suction cup 41 to move, and the first driving member 42 drives the suction cup 41 to move so that the suction cup 41 drives the wafer ring to move, so as to move the wafer ring from the second magazine 5 to the loading platform 12 or place the empty wafer ring at a designated position.

Further, the material moving assembly comprises a material taking assembly 7, a correcting assembly 8 and a die bonding assembly 9, the correcting assembly 8 comprises a correcting table 81, the material taking assembly 7 comprises a die taking arm 71 for moving the chip on the material loading table 12 to the correcting table 81, and the die bonding assembly 9 comprises a die bonding arm 91 for moving the chip on the correcting table 81 to the work box 11.

From the above description, the movement of the chip from the wafer ring to the correcting stage 81 and then from the correcting stage 81 to the carrier in the work box 11 is completed by the wafer picking arm 71 and the wafer fixing arm 91, and the position and angle of the chip are corrected by the correcting stage 81, so that the chip is prevented from being shifted on the carrier or the electrode of the chip is prevented from being reversed, and defective products are avoided.

Further, the calibration stage 81 includes a vacuum suction plate 82, and the vacuum suction plate 82 is rotatably disposed with respect to the calibration stage 81.

As is apparent from the above description, the chip is placed on the vacuum suction plate 82 of the correcting table 81, the chip is fixed on the correcting table 81 by the vacuum generated by the vacuum suction plate 82, and the angle of the chip and the orientation of the electrodes of the chip are corrected by the rotation of the vacuum suction plate 82.

Further, the calibration assembly 8 further includes a second driving member 83 for driving the calibration stage 81 to move along the X-axis direction and the Y-axis direction.

As can be seen from the above description, the second driving member 83 drives the calibration stage 81 to move in the horizontal direction to calibrate the position of the chip.

Example one

Referring to fig. 1 to 10, a first embodiment of the present invention is: a Mini LED die bonder is used for mounting a Mini LED chip on a carrier such as a PCB or a glass substrate to obtain a Mini LED product.

As shown in fig. 1 and 2, the Mini LED die bonder includes a platen 1, a work box 11 for fixing a carrier position is disposed on the platen 1, two opposite sides of the work box 11 in an X-axis direction are respectively provided with a mounting component for mounting a Mini LED chip on a carrier, the mounting component includes a material loading table 12 for loading a die ring attached with the Mini LED chip and a material transferring component for transferring the Mini LED chip from the material loading table 12 to the carrier, and the material transferring component specifically includes a die taking component 7 for picking up the Mini LED chip from the die ring, a correcting component 8 for correcting the position of the Mini LED chip, and a die bonder component 9 for bonding the Mini LED on the carrier.

Specifically, the crystal taking assembly 7 comprises a crystal taking welding head 72 and a crystal taking arm 71 arranged at the output end of the crystal taking welding head 72, the platen 1 is provided with a crystal taking lens barrel 15 for identifying the position of a Mini LED chip on a crystal ring, the crystal taking lens barrel 15 is arranged right above the material table, the crystal taking welding head 72 drives the crystal taking arm 71 to swing so that the crystal taking arm 71 picks up the corresponding Mini LED chip from the crystal ring and then moves the Mini LED chip to the correcting assembly 8, the correcting assembly 8 corrects the position and the angle of the Mini LED chip, the crystal fixing assembly 9 comprises a crystal fixing welding head 92 and a crystal fixing arm 91 arranged at the output end of the crystal fixing welding head 92, the platen 1 is provided with a crystal fixing lens barrel 17 for identifying the position to be picked and mounted on a carrier, the crystal fixing lens barrel 17 is arranged right above the work box 11, and the crystal fixing welding head 92 drives the crystal fixing arm 91 to swing so that the crystal fixing arm 91 finishes picking and correcting the mounted position on the correcting assembly 8 The Mini LED chip is placed at a corresponding position on the carrier in the work box 11, and solder paste is coated on the carrier in advance to fix the Mini LED chip and the carrier, so that the mounting of one Mini LED chip is completed. The mounting assemblies on the two opposite sides of the working box 11 run simultaneously to sequentially attach the Mini LED chips to the carrier according to the process rules, so that the number of the Mini LED chips which can be attached to the carrier in unit time is increased by times, and the production efficiency of the Mini LED product is improved.

As shown in fig. 3, the work box 11 is movably disposed on the platen 1 along the X-axis direction and the Y-axis direction, the work box 11 has a holding cavity defined by a pressing plate and a top plate disposed at an interval in the Z-axis direction and two baffles disposed at an interval in the X-axis direction, the top plate is disposed on the work box 11 in a liftable manner along the Z-axis direction, the two baffles are respectively movably disposed along the X-axis direction, when the carrier enters the holding cavity, the baffles and the top plate respectively move to reduce the volume of the holding cavity and clamp the carrier, so as to fix the carrier in the work box 11, so that the work box 11 can be adapted to carriers of different sizes, and the top plate is further provided with a plurality of vacuum holes to adsorb the carrier, so that the relative position of the carrier and the top plate is kept fixed during the movement of the top plate, so that the position of the carrier is kept fixed when the Mini LED die bonder mounts Mini LED chips on the carrier, and after the mounting is finished, releasing the carrier by the top plate and the baffle plate so that the carrier flows out of the Mini LED die bonder.

Referring to fig. 1, 4 and 5, a movable plate 13 capable of ascending and descending along a Z-axis direction is disposed on the platen 1, a first magazine 2 is disposed on the movable plate 13, the first magazine 2 has a plurality of bins 21 spaced along the Z-axis direction, each bin 21 contains a carrier, an opening of the bin 21 faces a feeding end of the working box 11, a first pushing assembly 3 for pushing the carrier in the first magazine 2 into the working box 11 is further disposed on the platen 1, the first pushing assembly 3 includes a first push rod 31 movably disposed along the Y-axis direction, the first push rod 31 is aligned with one of the bins 21 to push the carrier in the bin 21 into the working box 11, and the movable plate 13 drives the first magazine 2 to ascend and descend along the Z-axis direction to align the first push rod 31 with different bins 21, so as to realize continuous feeding of carriers into the working box 11 and automatic feeding.

Preferably, the movable plate 13 is provided with two first material boxes 2, the two first material boxes 2 are arranged in a row along the X-axis direction, the movable plate 13 is provided with a partition plate 14 for separating the two first material boxes 2, the material pushing assembly is movably arranged in the X-axis direction so that the first push rod 31 can be aligned with the material bins 21 of different first material boxes 2 to realize automatic feeding, the number of carriers which can be accommodated on the Mini LED die bonder is increased by arranging a plurality of first material boxes 2, and after all the carriers in one first material box 2 are pushed out, the first material box 2 can be taken down and reloaded with the carriers, at the moment, the first material pushing assembly 3 can still push out the carriers from the other first material box 2, so that the Mini LED die bonder can keep continuous operation.

As shown in fig. 6, the material loading platform 12 is movably disposed on the platen 1 along the X-axis direction and the Y-axis direction, the material loading platform 12 is rotatable relative to the platen 1, and the movement and rotation of the material loading platform 12 enable the crystal taking arm 71 to align with any Mini LED chip on the wafer ring placed on the platen 1, so that the crystal taking arm 71 can pick up the corresponding Mini LED chip according to the process rule and attach the chip to the surface of the carrier.

Referring to fig. 1, 7 and 8, the mounting assembly further includes a second magazine 5 disposed near the material loading platform 12, the second magazine 5 includes a main frame 51 capable of ascending and descending in the Z-axis direction and a plurality of wafer fixing plates 52 for holding wafer rings, the wafer fixing plates 52 are disposed on the main frame 51 at intervals in the Z-axis direction, each wafer fixing plate 52 is movably disposed on the main frame 51 in the Y-axis direction, and the wafer rings placed on the wafer fixing plates 52 can extend out of the second magazine 5 or retract into the second magazine 5 by moving the wafer fixing plates 52.

In detail, the mounting assembly further includes a second pushing assembly 6 for pushing the wafer ring fixing plate 52 out of the main frame 51 or retracting the main frame 51, and a grab ring assembly 4 for transporting the wafer ring. The second pushing assembly 6 includes a second pushing rod 61 movable along the Y-axis direction, an electromagnet 62 is disposed at an end of the second pushing rod 61, a suction portion 53 for the electromagnet 62 to adsorb is disposed at one end of the wafer ring fixing plate 52, the wafer ring fixing plate 52 can be pushed and pulled to drive the wafer ring fixing plate 52 to move through the extension and retraction of the second pushing rod 61 and the cooperation between the electromagnet 62 and the suction portion 53, and the second pushing rod 61 can be aligned with the corresponding wafer ring fixing plate 52 by the lifting of the main frame 51 in the Z-axis direction, so that the corresponding wafer ring can be taken out from the second material box 5 for the wafer taking assembly 7 to take. The grab ring assembly 4 comprises a suction cup 41 and a second driving member 83 for driving the suction cup 41 to move, the second driving member 83 can drive the suction cup 41 to move in the Y-axis direction and to ascend and descend in the Z-axis direction, so that the suction cup 41 can suck or release the wafer rings from the wafer ring fixing plate 52 and the material loading table 12, the wafer rings above the material loading table 12 are placed back to the wafer ring fixing plate 52 or a designated waste material storage place, and the wafer rings with the Mini LED chips attached thereto are picked up from the wafer ring fixing plate 52 and moved to the material loading table 12, thereby realizing automatic ring replacement.

As shown in fig. 9, the mounting component further includes a thimble 18 disposed below the material loading table 12, the thimble 18 is liftable in the Z-axis direction and abuts against the blue film of the wafer ring, so that the Mini LED chip attached to the other side of the blue film of the wafer ring is separated from the blue film of the wafer ring, so that the corresponding Mini LED chip is picked up by the crystal taking arm 71, and the thimble 18 is movable in the X-axis direction and the Y-axis direction, so that the thimble 18 is aligned with the Mini LED chip to be picked up on the wafer ring, and the corresponding Mini LED chip is accurately jacked up.

As shown in fig. 1 and 10, the calibration assembly 8 includes a calibration stage 81 and a second driving member 83 for driving the calibration stage 81 to move in the X-axis direction and the Y-axis direction, a rotatable vacuum suction plate 82 is disposed on the calibration stage 81, after the Mini LED chip is placed on the vacuum suction plate 82 by the crystal taking arm 71, the vacuum suction plate 82 adsorbs the Mini LED chip to fix the position of the Mini LED chip, and the position of the Mini LED chip is calibrated by the horizontal movement of the calibration stage 81, i.e., the rotation of the vacuum suction plate 82.

In order to improve the correction accuracy of the correction assembly 8, the platen 1 is provided with a correction lens barrel 16, the correction lens barrel 16 is arranged right above the correction table 81, after the Mini LED chip is placed on the correction table 81, the correction lens barrel 16 photographs the Mini LED chip and judges the offset distance and the offset angle of the Mini LED chip, and then the correction table 81 acts according to the recognition result to align the Mini LED chip, so as to ensure that the Mini LED chip is correctly positioned and angled after being mounted on the carrier.

To sum up, the utility model provides a Mini LED die bonder adopts first magazine to hold including a plurality of carriers, and send the carrier in the first magazine into the work box through first material pushing component, realize automatic feeding, Mini LED die bonder still adopts the second magazine that can hold a plurality of brilliant rings, and make the brilliant ring fixed plate in the second magazine drive brilliant ring business turn over second magazine through second material pushing component, then carry the brilliant ring between brilliant ring fixed plate and material loading platform by grabbing the material subassembly, realize automatic ring changing, so that Mini LED die bonder can run continuously and paste a large amount of same or different Mini LED chips to the carrier, satisfy the production demand of Mini LED product; the Mini LED die bonder is provided with the correction assembly, the correction assembly comprises a correction table capable of moving in the horizontal direction and a vacuum suction plate rotatably arranged on the correction table, the Mini LED chip is placed on the vacuum suction plate by the crystal taking arm and is adsorbed by the vacuum suction plate, the correction lens barrel shoots the Mini LED chip and analyzes the offset distance and angle of the Mini LED chip, and then the correction table and the vacuum suction plate generate corresponding actions according to analysis results to calibrate the position and angle of the Mini LED chip, so that the mounting precision of the Mini LED chip on a carrier is improved.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims (10)

1. The utility model provides a solid brilliant machine of Mini LED, includes the platen, be equipped with on the platen along X axle direction and the mobilizable work box of Y axle direction, its characterized in that: the wafer conveying device is characterized in that a first material box aligned with the working box and a first material pushing assembly matched with the first material box are further arranged on the platen, surface mounting assemblies are respectively arranged on two opposite sides of the working box in the X-axis direction, each surface mounting assembly comprises a material carrying table and a material moving assembly for moving a chip on the material carrying table to the working box, each surface mounting assembly further comprises a grab ring assembly, a second material box and a second material pushing assembly matched with the second material box, and the grab ring assembly is used for conveying a wafer ring between the material carrying table and the second material box.

2. The Mini LED die bonder of claim 1, wherein: the movable plate capable of ascending and descending along the Z-axis direction is arranged on the bedplate, the first material box is arranged on the movable plate, a plurality of material bins are arranged on the first material box in the Z-axis direction at intervals, the first material pushing assembly comprises a first push rod movably arranged along the Y-axis direction, and the first push rod is aligned with one of the material bins.

3. The Mini LED die bonder of claim 2, wherein: the movable plate is provided with at least two first material boxes, the first material boxes are arranged in a row along the X-axis direction, and the first material pushing assembly is movably arranged along the X-axis direction.

4. The Mini LED die bonder of claim 1, wherein: the second material box comprises a main frame and at least two crystal ring fixing plates, wherein the crystal ring fixing plates are arranged on the main frame at intervals along the Z-axis direction, and the crystal ring fixing plates are movably arranged along the Y-axis direction relative to the main frame respectively.

5. The Mini LED die bonder of claim 4, wherein: the main frame is arranged in a lifting manner in the Z-axis direction.

6. The Mini LED die bonder of claim 5, wherein: the second pushing assembly comprises a second push rod which is movably arranged along the Y axis, and the second push rod is aligned with one of the wafer ring fixing plates.

7. The Mini LED die bonder of claim 4, wherein: the grab ring component comprises a sucker and a first driving piece, and the first driving piece drives the sucker to move in the Y-axis direction and the Z-axis direction.

8. The Mini LED die bonder of claim 1, wherein: the material moving assembly comprises a material taking assembly, a correcting assembly and a die fixing assembly, the correcting assembly comprises a correcting table, the material taking assembly comprises a die taking arm for moving a chip on the material carrying table to the correcting table, and the die fixing assembly comprises a die fixing arm for moving the chip on the correcting table to the working box.

9. The Mini LED die bonder of claim 8, wherein: the correcting table comprises a vacuum suction plate, and the vacuum suction plate is rotatably arranged relative to the correcting table.

10. The Mini LED die bonder of claim 8, wherein: the correcting component also comprises a second driving piece driving the correcting table to move along the X-axis direction and the Y-axis direction.

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