CN1183818C - Component and device mounting device - Google Patents

Component and device mounting device Download PDF

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Publication number
CN1183818C
CN1183818C CN 01112008 CN01112008A CN1183818C CN 1183818 C CN1183818 C CN 1183818C CN 01112008 CN01112008 CN 01112008 CN 01112008 A CN01112008 A CN 01112008A CN 1183818 C CN1183818 C CN 1183818C
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component
mounting
head
direction
feeder
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CN 01112008
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Chinese (zh)
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CN1317926A (en )
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田村孝太
石部敏幸
菜嶋保积
西辉树
梶原正敏
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株式会社村田制作所
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Abstract

提供一种能缩短安装头的移动距离和生产节拍时间、且安装位置精度优良的元器件安装装置,系将振动送料器与托板组合并设置的元器件供给部(3)和设置印刷电路基板的元器件供给部(4)分别独立并沿相互并行的X轴方向往复驱动,将具有沿Z轴方向往复驱动的吸附喷嘴(5)的安装头(6)沿Y轴方向直线状往复驱动,并具有对保持在吸附喷嘴处的电子元器件进行摄像的元器件摄像机(7)。 Component feed unit can be shortened to provide a mounting head moving distance and a tact time, and excellent in mounting position accuracy component mounting apparatus, the vibration feeder system in combination with a pallet and set (3) and a printed circuit board the component supply unit (4) which are independent of each other along the X axis direction parallel to the reciprocating drive, having a suction nozzle (5) is reciprocally driven along the Z-axis direction of the mounting head (6) in the Y-axis direction linearly reciprocally driven, and held in the suction nozzle having the electronic component at the component imaging camera (7).

Description

元器件安装装置 Component mounting apparatus

技术领域 FIELD

本发明涉及元器件安装装置,具体涉及一种用于将电子元器件安装在印刷电路基板等的安装对象物上时的元器件安装装置。 The present invention relates to a component mounting apparatus, particularly relates to a component mounting apparatus for mounting electronic components on a printed circuit board mounting an object such as when the.

背景技术 Background technique

作为用于安装电子元器件场合的以往的元器件安装装置之一的元器件安装装置,是在XY轴机械手上安装具有保持电子元器件的保持机构(通过真空吸附电子元器件的吸附喷嘴和机械夹持的夹持机构等)的头部,以通过保持机构保持电子元器件的状态使头部移动,并将电子元器件安装在预定的印刷电路基板等的安装对象物的预定位置上。 As one of the conventional component mounting apparatus of an electronic component mounting apparatus for mounting components in the case, having a holding mechanism is mounted the electronic component in the XY-axis robot hand (vacuum suction by the suction nozzle of the electronic component and the mechanical clamping means clamping the head, etc.) to keep holding the electronic component by the state of the head moving mechanism and mounting the electronic component is mounted at a predetermined position of a predetermined object on the printed circuit board or the like.

作为这种方式的元器件安装装置,例如有如图4所示的元器件安装装置,它具有:载置元器件排列整齐用的托盘等的元器件供给夹具的元器件供给部51,载置作为电子元器件的安装对象的基板等的安装对象物的元器件安装部52,具有从元器件供给部51对电子元器件进行吸附和保持的真空吸附喷嘴等的元器件保持机构53的安装头54,装有安装头54的XY轴机械手55,用于获得电子元器件的位置信息而在预定位置对保持在安装头54的元器件保持机构53上的电子元器件进行摄像的元器件摄像装置(摄像机)56和为了获得安装位置信息而对基板等的元器件安装对象进行摄像的安装对象物摄像装置(摄像机)57,在由安装头54的元器件保持机构53对电子元器件进行吸附和保持的状态下,通过使安装头54沿箭头a,b,c,d所示方向移动将电子元器件安装在安装对象物的预定位置。 As the component mounting apparatus of this embodiment, for example, component mounting apparatus shown in FIG. 4, which includes: mounting component 51 arranged in the component feed part with a component feed tray neatly like jig, placing a Component mounting portion of the substrate or the like of the object to an object of mounting electronic components 52, having adsorbing and retaining vacuum suction nozzle, the electronic component from the component feed mechanism holding portion 51 of the component mounting head 54 53 , the mounting head 54 equipped with an XY-axis robot 55, for obtaining the position information of the electronic component while the holding mechanism 53 on the electronic component in the component mounting head 54 at a predetermined position of the imaging component of the imaging device ( camera) 56 and a mounting position in order to obtain information on the component mounting board or the like of an object installed in an imaging apparatus imaging an object (camera) 57, the head 54 is held by the component mounting mechanism 53 for adsorbing and holding the electronic components under the state, the mounting head 54 in the arrow a, b, c, d moves toward the direction indicated by the electronic component mounting mounted at a predetermined position of the object.

然而,在上述以往的电子元器件安装装置中,必须使安装头54移动到元器件吸附位置、元器件位置识别用的元器件摄像装置56的摄像位置以及元器件安装位置(例如基板上的预定位置)共计3个位置,安装头54的移动距离(动线)变长,为电子元器件的安装,安装头54的移动、停止所需时间和摄像所得图象的运算处理所需时间的合计时间是必须的,从而成为难以缩短生产节拍时间的主要原因。 However, in the conventional electronic component mounting apparatus, the mounting head 54 must be moved to a component pickup position, the imaging position and the component mounting position of the component position recognizing component imaging device 56 (e.g., on a predetermined substrate position) in total three positions, a moving distance of the mounting head 54 (actuator line) becomes long, for the installation of electronic components, moving the mounting head 54 is stopped and the time required for the arithmetic processing time required for imaging the resulting total image time is required, thus becoming the main reason is difficult to shorten the tact time. 另外,虽然也有将用于确认元器件安装位置的安装对象物摄像装置(摄像机)载置于安装头上的元器件安装装置,但在此场合,必须包含用于对作为安装对象物的基板等进行摄像的位置并在至少4个位置使安装头移动,存在动线更长的问题。 Further, although there will be used to confirm an object image pickup device mounting component mounting position (camera) mounted on the component mounting apparatus mounting head, but in this case, the substrate must contain a mounting for the like object and the imaging position of the mounting head is moved in at least four positions, there is a problem of a longer moving lines.

另外,在上述以往的元器件安装装置中,在将元器件安装部(基板等的安装对象物)52安装到XY工作台(未图示)的场合,产生必须使XY工作台沿与安装头54的移动方向相同方向移动并进行安装位置的微调的情况,存在不仅位置控制困难、且设备重复,从而引起成本增大的问题。 Further, in the conventional component mounting apparatus, a component mounting portion (mounting substrate or the like object) 52 is mounted to the XY stage (not shown) of the case, it must be generated along with the XY stage mounting head 54 is the same as the case of the moving direction and the moving direction of the fine adjustment of the mounting position, there is not only difficult to control the position, and the apparatus repeatedly, thereby causing a problem of increased cost.

另一方面,在元器件供给部中虽然一般是对使许多个电子元器件排列整齐配置的的托盘等的元器件供给夹具进行设置,但为进一步提高自动化的生产率,要求将元器件连续地供给元器件供给部或元器件供给夹具,并要求与此相应的对策。 On the other hand, although the component supply unit is typically many trays neatly arranged electronic components such as the component feed jig setting, but to further improve the productivity of automation, requires continuously supplying component component supply unit or component feed clamp and requires countermeasures corresponding thereto.

发明内容 SUMMARY

本发明鉴于上述以往元器件安装装置存在的问题,其目的在于提供一种能缩短安装头的移动距离、缩短生产节拍时间且安装位置精度优良的元器件安装装置。 The present invention is a conventional component mounting apparatus in view of the above problems, it is an object to provide a moving distance of the mounting head, to shorten the tact time and excellent in mounting position accuracy component mounting apparatus.

本发明的元器件安装装置的特点是,具有:一个元器件供给部,该元器件供给部设有元器件供给夹具和送料器,送料器为振动送料器、整体(bulk)送料器、带状送料器、粘结条送料器中的一种或多种的组合,并且元器件供给部在驱动装置的作用下沿预定方向作直线往复运动,一个对安装对象物加以设置的元器件安装部,所述元器件安装部在驱动装置的作用下沿与上述元器件供给部的移动方向平行的方向直线往复运动,一个具有用于对元器件进行保持的元器件保持机构的安装头,该安装头在驱动装置作用下沿与上述元器件供给部和元器件安装部的移动方向垂直的方向直线往复运动,安装头在上述元器件供给部中拾取已设置元器件,并将该元器件装到所述元器件安装部中所设置的安装对象物上的预定位置,一个元器件摄像装置,该摄像装置在上述安装头 Component features of the present invention is a mounting apparatus, comprising: a component feed section, the component feed section and is provided with a component feed gripper feeder, a vibrating feeder feeder, whole (Bulk) feeder strip feeder, feeding the adhesive strip feeder combination or more, and the component feed unit for reciprocating motion under the action of drive means in a predetermined direction, a component mounting portion to be disposed on the mounting object, the component mounting portion under the action of drive means in a direction parallel to the moving direction of the component feed direction of the linear portion of the reciprocating motion, having a component for holding the component mounting head holding mechanism, the mounting head direction perpendicular to the moving direction of the component supply portion and a component mounting portion in the direction of action of the drive means a linear reciprocating motion, the mounting head picks up components are arranged above the component feed unit, and the components attached to the said predetermined position on the component mounting portion provided in the mounting object, a component imaging device, the imaging device in the mounting head 线移动过程中对保持在上述安装头的元器件保持机构中的元器件摄像,分别对上述元器件供给部、元器件安装部和安装头进行驱动控制的驱动控制装置以及对由上述元器件摄像装置拍摄的图象进行运算处理的图象运算处理装置。 During movement of the line is maintained at the head of the mounting components holding the imaging mechanism components, each of the above component feed section, the component mounting section and the mounting head drive control means drives and controls components of the image pickup by the image capturing means performs image processing arithmetic operation processing apparatus.

采用本发明的元器件安装装置,由于在对元器件供给部和元器件安装部分别独立并相互平行地往复驱动的同时,对具有元器件保持机构的安装头沿与元器件供给部和元器件安装部的移动方向垂直的方向往复驱动,并通过元器件摄像装置对保持在元器件保持机构中的元器件进行摄像,故能在安装头动作过程中通过元器件摄像装置对元器件进行摄像并获得安装位置的补偿信息。 Using the component mounting apparatus of the present invention, since the mounting portions at the same time independent of the component supply section and components, and reciprocally driven parallel to each other, the holding mechanism has a component mounting head along the component feed section and Component mounting the moving direction perpendicular to the reciprocating drive portion, and the image of the component held in the holding means by the component image pickup apparatus components, it is capable of imaging components on the component mounting head by operation of the imaging apparatus and information on the position compensation. 因此,通过仅使安装头沿预定方向直线移动,即能从元器件供给部拾取元器件并高精度地安装到元器件安装部的安装对象物的预定位置。 Accordingly, only the mounting head by linearly moving in a predetermined direction, i.e., from the component feed unit and pickup components mounted with high accuracy to a predetermined position of the mounting object component mounting portion. 其结果是与以往的使安装头移动3个或4个位置的场合相比,在能缩短移动距离并缩短生产节拍时间的同时,并能提供一种防止设备重复、经济性优良、安装位置精度高的元器件安装装置。 As a result, with the conventional case where the mounting head is moved three or four positions compared to the moving distance can be shortened and at the same time shorten a tact time, and can provide a method of preventing duplication of equipment, excellent in economy, mounting position accuracy high component mounting apparatus.

另外,在本发明中,由于元器件供给部中对托盘、托板等的元器件供给夹具、或振动送料器、整体送料器、带状送料器、粘结条送料器中的一种或多种加以组合设置,故能连续供给种类和大小不同的元器件,能进一步提高自动化的生产率。 Further, in the present invention, since the component feed unit is supplied to the jig pallet, pallet components, etc., or a vibration feeder, the entire feeder, the feeder strip, the adhesive strip feeding hopper of one kind or species to be provided in combination, it can be continuously supplied components of different types and sizes, productivity can be further improved automation.

附图说明 BRIEF DESCRIPTION

图1为用于说明本发明一实施形态的元器件安装装置的整体构成图。 1 is an overall configuration diagram for explaining a component mounting apparatus according to an embodiment of the present invention.

图2为大致表示上述元器件安装装置的安装动作的俯视图。 FIG 2 is a plan view generally showing the operation of mounting the component mounting apparatus of.

图3为表示其他实施形态的元器件供给方式的概略图。 3 is a schematic view showing other embodiment of component feed embodiment.

图4为表示以往一般的元器件安装动作的概略图。 FIG 4 is a schematic view showing a conventional component mounting operation in general.

具体实施方式 detailed description

以下根据附图说明本发明的实施形态。 The following drawings illustrate embodiments of the present invention.

图1和图2为用于说明本发明一实施形态的元器件安装装置的图,其中,图1为为表示元器件安装装置的整体构成的立体图,图2为大致表示元器件安装装置的安装动作的俯视图。 1 and FIG. 2 for a component mounting apparatus described embodiment of the present invention, wherein FIG. 1 is a perspective view showing the entire configuration of the component mounting apparatus, indicated generally in FIG. 2 is a component mounting apparatus mounting a plan view of the operation.

图中,1为元器件安装装置,该元器件安装装置1构成为在L字状的底座件2上载置有元器件供给部3、元器件安装部4、具有4个真空吸附喷嘴(元器件保持机构)5的安装头6、元器件摄像机(元器件摄像装置)7等。 FIG, 1 is a component mounting apparatus, the component mounting apparatus 1 configured as component supply unit is placed 3, the component mounting portion 4, the vacuum nozzle having four (Component 2 of the L-shaped base member holding means) 5 of the mounting head 6, the camera component (Component imaging means) 7 and the like. 另外,本元器件安装装置1还具有分别对上述元器件供给部3、元器件安装部4、吸附喷嘴5和安装头6进行驱动控制的驱动控制装置(未图示)和对来自上述元器件摄像机7的图象进行运算处理的图象运算处理装置(未图示)。 Further, this component mounting apparatus 1 further includes a driving control means respectively for the above component supply unit 3, the component mounting portion 4, the suction nozzle 5 and the mounting head 6 drives and controls (not shown) and the above-described components from an image processing unit (not shown) of the camera 7 performs image calculation processing.

上述底座件2由振动衰减率比金属件高且热膨胀系数小的材料如混凝土、陶瓷、金属与陶瓷的复合材料或者大理石等一体形成,并构成在底座本体2a的后端一体形成垂直壁2b。 The base member 2, such as concrete, ceramics, composites, metals and ceramics or marble, etc. are integrally formed of a vibration damping factor than the metal member and the thermal expansion coefficient of the material, and constitutes the vertical wall 2b of the rear end of the base body 2a is integrally formed. 因此,能在使各机构部动作时的振动有效衰减的同时抑制由直线电动机等驱动装置的发热引起的各机构部的位置偏移,从而能提高并保持电子元器件的安装精度。 Thus, at the same time to the vibration operation of the respective effective attenuation mechanism portion of the respective positional shift suppressing mechanism portion caused by heat generation of the linear motor drive means, so as to improve and maintain the electronic component mounting accuracy. 另外,由于底座件2由上述材料一体形成,各机构部振动时的相位相同,与各机构部分散振动时的情况相比,能抑制由振动造成的弊害。 Further, since the base member 2 are integrally formed of the above material, the same phase at each of the vibration mechanism, compared with the case when the vibrating bodies scattered portion can suppress the vibration caused by the evils.

上述元器件供给部3从装置正面看配置在底座本体2a的左端部,并由未图示的直线电动机沿直线电动机滑动件(驱动装置)在X轴方向(前后方向)直线往复驱动。 See section 3 above the component feed left end portion disposed in the base body 2a from the front of the device, not shown, by a linear motor along a linear motor slider (drive means) in the X-axis direction (longitudinal direction) of the linear reciprocating drive. 在该元器件供给部3的上面设置有排列整齐地配置有许多个电子元器件的托板(元器件供给夹具)3a。 In the above component supply unit 3 is provided with a neatly arranged manner are disposed a plurality of electronic components pallet (component feed jig) 3a. 在该托板3a上形成有容置电子元器件的容置凹部,且该容置凹部排列成具有与上述各吸附喷嘴5的排列间距对应的间距。 3a onto the pallet accommodating concave portion is formed accommodating the electronic component and the accommodating recess portion arranged to have a pitch of each of the suction nozzles 5 corresponding to the arrangement pitch. 因此能以4个吸附喷嘴5一次保持4个电子元器件。 4 it is possible to a holding the electronic component 5 at the suction nozzle 4.

上述元器件供给部3上配设有振动送料器30。 3 above component supply unit 30 is provided with a vibration feeder. 该振动送料器30通过振动供给部32将许多个电子元器件依次供给至上述托板3a的各容置凹部。 The vibration feeder 3032 to a plurality of electronic components are sequentially supplied to each of the pallet accommodating concave portion of the feed section 3a through the vibration.

上述元器件安装部4配置在底座本体2a的中央部,并通过直线电动机8沿一对直线电动机滑动件(驱动装置)8a在与上述元器件供给部3的移动方向平行的X轴方向(前后方向)直线往复驱动。 Component mounting portion 4 is disposed above the central portion 2a of the base body, and by a linear motor along a pair of linear motors 8 sliders (drive means) in the X-axis direction. 8A parallel to the moving direction of the component feeding section 3 (front and rear direction) of the linear reciprocating drive. 在该元器件安装部4的上面设置有安装有电子元器件的印刷电路基板(安装对象物)4a。 In the above component mounting portion 4 is provided with electronic components mounted on a printed circuit board (object to be attached) 4a.

上述安装头6位于元器件供给部3和元器件安装部4的上方并配设在固定于垂直壁2b上的架台9上。 The mounting head 6 is positioned above the component feeding section 3 and the component mounting portion 4 is disposed on and fixed to the vertical wall 2b gantry 9. 该架台9上安装固定有一对直线电动机滑动件10,且上述安装头6通过直线电动机11沿直线电动机滑动件10在与X轴方向垂直的Y轴方向(左右方向)直线往复驱动。 The fixed frame has a pair of linear motor slider 10 on the stage 9, the mounting head 6 and the linear motor 11 through the slider 10 along a linear motor (lateral direction) linearly reciprocally driven in the Y-axis direction perpendicular to the X-axis direction.

驱动上述安装头6的直线电动机11采用直接驱动方式的直线电动机,另外,作为直线电动机圆编码器则采用玻璃标尺、金属标尺等,以能进行全封闭的高精度定位。 Linear motor drive 11 of the mounting head 6 using the direct drive linear motor, in addition, as a linear motor is used a circular glass scale encoders, the metal scale, etc., can be closed to the high-precision positioning.

上述各真空吸附喷嘴5固定在固定件5a上,并且该固定件5a沿固定于上述安装头6的一对直线电动机滑动件12a在Z轴方向(上下方向)可移动地加以支承。 Each of the vacuum nozzle 5 is fixed to the fixed member 5a, 5a and the fixing member along the mounting head 6 is fixed to a linear motor slider member 12a in the Z-axis direction (vertical direction) can be movably supported. 另外,上述固定件5a通过使与伺服电动机13连接的凸轮板14旋转而沿Z轴方向往复驱动。 Further, the fixing member 5a and reciprocally driven in the Z-axis direction by rotating the cam plate 13 is connected to the servo motor 14. 并且,上述各吸附喷嘴5为能通过未图示的旋转定位驱动装置将吸附保持着的电子元器件围绕Z轴(图1的θ方向)旋转定位地加以支承。 Further, each suction nozzle 5 is positioned by a rotary drive means (not shown) to maintain the suction of the electronic component about the ([theta] direction in FIG. 1) Z axis is supported to be positionally.

上述元器件摄像机7配置固定在元器件供给部3与元器件安装部4之间,并构成为当安装头6从元器件供给部3向元器件安装部4直线移动时对吸附保持在上述吸附喷嘴5处的电子元器件进行摄像。 Component 7 is disposed above the camera is fixed between the component supply section 3 and the component mounting portion 4, and is configured to 6:00 when the mounting head moves the component feed section 3 to 4 from the linear portion of the mounting components sucked and held on the suction electronic Component nozzle 5 can be imaged. 然后求得相对于由上述摄像机7拍摄的电子元器件的基准点(一般为吸附喷嘴的中心点)的偏移量,并相应于该偏移量算出X轴、Y轴及θ的补偿量。 Determined offset is then captured by the video camera with respect to the electronic component 7 reference point (normally the center point of the suction nozzle), and the compensation amount X axis, Y axis and θ corresponds to the calculated shift amount.

另外,在上述元器件供给部3与元器件摄像机7之间配设有填充有粘接剂、导电性粘接剂、焊剂等的涂敷部16。 Further, the adhesive 3, the conductive adhesive, solder, etc. is coated with component camera unit is disposed between 7 filled with a component feed section 16 described above. 在元器件供给部3中将拾取的电子元器件搬运到元器件安装部4时,能通过该涂敷部16将粘接剂和焊剂等自动地涂敷在该电子元器件上,并能提高生产率。 In the component feed section 3 will be conveyed to the electronic component pickup 4, the coating unit 16 by the adhesive flux and the like are automatically applied on the electronic component by component mounting portion, and can improve the productivity.

上述架台9上与安装头6独立配设有多目的头17。 Said gantry 9 and the mounting head 6 is provided with a separate multi-purpose head 17. 该多目的头17由直线电动机18沿直线电动机滑动件10作Y轴方向直线往复驱动。 The multi-purpose head 17 by a straight line 18 along the Y-axis direction of the motor 10 for the slider of the linear motor the linear reciprocating drive. 多目的头17上配置有基板摄像机19。 Multipurpose board camera 19 is disposed on the head 17. 求得对于通过该基板摄像机19拍摄的印刷电路基板4a的实际安装位置的偏移量,并相应于该偏移量算出X轴、Y轴的补偿量。 Obtained by adding the offset for the actual installation location of the printed circuit board 19 the board imaging camera 4a of the compensation amount and the corresponding X axis, Y-axis to the calculated shift amount.

由于将上述多目的头17与安装头6独立配置,故能在安装头6在元器件供给部3中进行电子元器件拾取动作时拍摄印刷电路基板4a,能缩短生产节拍时间。 Since the object of the multi-head 17 with the mounting head 6 arranged independently, it can be performed in the electronic component mounting head 6 in the component feeding unit 3 captures the pick-up operation of the printed circuit board 4a, the tact time can be shortened. 另外,在多目的头17上除摄像机19外还可载置用于在印刷电路基板4a上涂敷粘接剂的粘接剂分配器。 Further, in addition to the multi-purpose head 17 outside the camera 19 may also be placed on a printed circuit board for applying the adhesive 4a on the adhesive dispenser.

本实施形态的元器件安装装置1还具有将通过前道工序设备A装配的印刷电路基板运至上述元器件安装部4、并在该元器件安装部4中将安装电子元器件的安装完毕的印刷电路基板4a运至后道工序设备B的元器件搬运部20。 The present embodiment further includes a component mounting apparatus 1 will be transported through the printed circuit assembly of the apparatus A before the procedure of the above-described component mounting portion to the substrate 4, and the component is mounted in the mounting portion 4 for mounting electronic components completed 4a printed circuit board transported to the transport unit after the procedure Component B of the device 20.

该元器件搬运部20包括:并列配置在底座本体2a上的右侧端部的一对运入轨道21、21和运出轨道22、22,沿该运入、运出轨道21、22在X轴方向往复移动的运入、运出台车23、24,使该各台车23、24分别独立往复驱动的同步皮带25、25及旋转驱动电动机26,对配置于上述运入、运出台车23、24的上方并设置于该台车23、24中的印刷电路基板加以夹持的移载件27、27,沿上下方向(Z轴方向)和左右方向(Y轴方向)移动驱动各移载件27的移载驱动机构28。 The component conveying unit 20 includes: disposing a pair of parallel rails carried into the right end portion of the base main body 2a out of 21, 21 and rails 22, along which transport into, out of the track 21 in X reciprocating axial direction brought into or introduction of vehicles 23, 24, so that each carriage 23 and 24 are independently driven reciprocating the timing belt 25, 25 and the rotation drive motor 26, disposed in the carry-on, the introduction of transport vehicles 23 , the top 24 is provided on the printed circuit board and the carriage 23 to be clamped in the transfer member 27, 27 in the vertical direction (Z axis direction) (Y-axis direction) and the lateral direction of each drive transfer the transfer member 27 driving mechanism 28.

而且,将前道工序设备A中安装的印刷电路基板运送到在前道工序设备A的受让位置待机的运入台车23,且运入台车23以该状态移动到与元器件安装部4并行的位置。 Further, the printed circuit board conveying apparatus A in the procedure before the installation of the apparatus A FEOL assignee brought into the standby position of the carriage 23, the carriage 23 and is brought into the state to move to a component mounting portion 4 parallel position. 接着,移载件27将运入台车23的印刷电路基板运送到元器件安装部4的预定位置并进行固定。 Next, the transfer member 27 will be brought into the carriage printed circuit board 23 is conveyed to a predetermined position of the component mounting portions 4 and fixed.

接着,一旦元器件在印刷电路基板上安装结束,移载件27即将安装好的印刷电路基板运送至运出台车24,且该运出台车24移动至后道工序设备B的的受让位置。 Then, once the components mounted on the printed circuit board end of the transfer member 27 mounted printed circuit board about to be transported to the introduction of transport vehicle 24, and the introduction of the transport car 24 is moved to the position assigned device B processes.

以下说明本实施形态的作用效果。 The following functions and effects of the present embodiment.

由本实施形态的元器件安装装置1将电子元器件安装在印刷电路基板时,首先,在振动送料器30将电子元器件供至托板3a的各容置凹部、元器件供给部3沿X轴方向移动的同时,安装头6沿Y轴方向移动并在预定的拾取位置(吸附喷嘴中心与容置凹部中心一致的位置)处定位。 Each accommodating concave portion when the component mounting apparatus 1 according to the present embodiment for mounting electronic components on a printed circuit board, first, the vibration feeder 30 will be supplied to the electronic components 3a of the pallet, the component feed section 3 along the X-axis direction while moving the mounting head 6 in the Y-axis direction and at a predetermined pick-up position (a position corresponding suction nozzle center portion and the accommodating concave center) is positioned. 固定件5a在该拾取位置处下降并通过各吸附喷嘴5吸附保持电子元器件,其后吸附喷嘴5上升。 5a fixture lowered at the pick-up position and the electronic components held by each suction nozzle 5 suction, thereafter the suction nozzle 5 increases.

在该拾取工序时,多目的头17在元器件安装部4中设置好的印刷电路基板4a的上方移动,摄像机19对印刷电路基板摄像,图象运算处理装置算出对于目标安装位置的X轴、Y轴的补偿量。 When the pick-up step, the multi-purpose head 17 over the component mounting portions 4 is provided in the printed circuit board 4a is a good move, the printed circuit board imaging camera, an image processing arithmetic device 19 calculates the X-axis of the target mounting position, Y compensation axis. 另外,多目的头17在摄像后退避至不与安装头4干涉的位置。 In addition, multi-purpose head 17 is retracted to a position not interfering with the mounting head 4 after imaging.

另一方面,在此期间,在元器件搬运部20中,运入台车23运入由前道工序设备A中安装的印刷电路基板,移载件27则在元器件安装部4中进行设置。 On the other hand, in the meantime, the components in the transport unit 20, transported into the transport carriage 23 is mounted into the printed circuit board by the first procedure in the apparatus A, the transfer member 27 is set in the component mounting portion 4 .

接着上述拾取工序后,上述安装头6直线移动至元器件安装部4的上方。 Subsequently the pick-up step, the mounting head 6 to move linearly above the component mounting portions 4. 在进行该移动时,元器件摄像机7对保持在各吸附喷嘴5处的电子元器件摄像,图象运算处理装置算出对于各电子元器件的吸附喷嘴5的X轴、Y轴及θ方向的补偿量。 During this movement, the camera 7 Component of holding the electronic component image pickup, an image processing unit of each suction nozzle 5 at the suction nozzle is calculated for each of the compensation of the electronic component 5 in the X-axis, Y-axis direction and θ the amount.

而且,安装头6在元器件安装部4的印刷电路基板4a的上方移动,为使电子元器件在这种状态下与印刷电路基板4a的预定安装位置一致,在加上上述算出的补偿量并进行元器件安装部4的X轴方向的定位的同时进行安装头6的Y轴方向的定位,各吸附喷嘴5仅旋转预定角度并进行θ方向的定位。 Furthermore, the mounting head 6 moves above the component mounting portion 4a of the printed circuit board 4 of the electronic component to a state in which the printed circuit 4a predetermined mounting position of the substrate is uniform, plus the amount of compensation and the calculated simultaneously positioning the X-axis direction component mounting portion 4 of the Y-axis direction for positioning the mounting head 6, each of the adsorption 5 is rotated by a predetermined angle positioning and direction θ of the nozzle.

接着使固定件5a下降并将电子元器件安装在印刷电路基板4a的预定安装位置。 Then the fixing member 5a lowered and mounting the electronic component in a predetermined mounting position of the printed circuit board 4a. 其后,固定件5a上升并返回至应对下一电子元器件进行拾取的位置。 Thereafter, the fixing member 5a rises and returns to the position of the electronic components to deal with the next pickup. 通过重复这种一系列的动作,将各电子元器件安装在印刷电路基板4a上。 By repeating this series of operations, each of the electronic components mounted on the printed circuit board 4a. 然后,通过移载件27将安装完毕的印刷电路基板4a移送到运出台车24上并运出至后道工序设备B。 Then, the printed circuit board by the transfer member 27 is installed 4a is transferred onto the transport vehicle 24 and transported out of the introduction to the following process equipment B.

采用本实施形态,由于使元器件供给部3和元器件安装部4分别独立且配设成可沿前后方向(X轴方向)移动,使具有可沿上下方向(Z轴方向)移动的吸附喷嘴5的安装头6配设成可沿左右方向(Y轴方向)直线移动,且在上述安装头6移动时通过元器件摄像机7对由吸附喷嘴5吸附保持的电子元器件进行摄像,故能在安装头6移动过程中通过元器件摄像机7对电子元器件进行摄像而获得安装位置的补偿信息。 According to this embodiment, since the component supply section 3 and the component mounting portions 4 are each independently of the front and rear and is disposed to be movable along a direction (X axis direction), so that having a suction nozzle in the vertical direction (Z axis direction) of 5 of the mounting head 6 is disposed so as to be left-right direction (Y-axis direction) of the linear movement, and the imaging by the camera 7 Component electronic components held by the suction nozzle 5 at the suction head 6 moves during the mounting, it can in 6 during movement of the mounting head 7 for imaging the electronic component mounting position compensation information obtained by the camera components. 因此只需使安装头6沿Y轴方向直线移动,即能由元器件供给部3拾取电子元器件并高精度地安装在元器件安装部4的印刷电路基板4a的预定的安装位置上。 So only the mounting head 6 is moved linearly in the Y-axis direction, that is able to pick up the electronic component 3 from the component feed unit and accurately mounted at a predetermined mounting position of the component mounting portions 4 of the printed circuit board 4a on. 其结果是,与以往的使安装头移动到3个位置或4个位置的场合相比,能在缩短移动距离和缩短生产节拍的同时,提供一种防止设备重复、经济性优良、安装位置精度高的元器件安装装置1。 As a result, movement of the mounting head to a conventional three positions or four positions compared to the case, the movement distance can be shortened and at the same time shortening the tact, there is provided apparatus for preventing duplicate positional accuracy, excellent economy, mounting high component mounting apparatus 1.

另外,在本实施形态中,由于在元器件供给部3中组合设置托板3a和将电子元器件供给该托板3a的振动送料器30,故能连续供给种类和大小不同的电子元器件,能进行连续运转,进一步提高生产率。 Further, in the present embodiment, since the vibration feeder 30 in the component feed section 3 is provided in combination tray 3a and feeding the electronic components 3a of the pallet, it can continuously supply different sizes and types of electronic components, capable of continuous operation, and further improve productivity.

在本实施形态中,由于在设有电子元器件安装在印刷电路基板上的元器件供给部3、元器件安装部4的同时,还设有将由前道工序设备A中安装的印刷电路基板运入元器件安装部4、并将安装完毕的印刷电路基板运出至后道工序设备B的元器件运送部20,故可进行无人化连续生产,能大幅度提高生产率。 In the present embodiment, since the component feed unit is provided with electronic components mounted on the printed circuit board 3, while the component mounting portions 4 is also provided by the previous process printed circuit installed in the apparatus A substrate carrying the component mounting portion 4, and the transport of the printed circuit board is installed to a rear portion of the component conveying device B channel process 20, it can be unmanned continuous production can greatly increase productivity.

另外,虽然在上述实施形态中对将振动送料器30与元器件供给部3组合并连续供给电子元器件的场合作了说明,但本发明并不限于此,例如,如图3所示,也可将带状送料器35与元器件供给部3组合。 Further, although the vibration feeder 30 in combination with the component supply section 3 and the case of continuous supply of electronic components has been described in the above embodiment, but the present invention is not limited thereto, e.g., FIG. 3, also ribbon feeder 353 may be combined with the component feed section. 该带状送料器35构成为将许多电子元器件放在条带上的元器件带37安装在与元器件供给部3上固定的固定台36上,并由驱动滚轮38对该元器件带37进行运送。 The feeder 35 is configured to strip a number of the electronic components on the component tape strip 37 mounted on a fixed portion 3 and the upper fixing component feed table 36 by the drive roller 38 of the belt 37 Component be transported. 即使在这种场合,也能将电子元器件依次供给托板3a并获得上述同样的效果。 Even in this case, electronic components can be sequentially supplied to the pallet 3a and the same effects as described above.

另外,虽然在上述实施形态中对将电子元器件安装在印刷电路基板上的场合作了说明,但本发明的元器件安装装置并不限于此,例如也可适用于精密机械零件的装配。 Further, although the case where the electronic component mounted on the printed circuit board has been described in the above embodiment, the component mounting apparatus of the present invention is not limited to this example is also applicable to the assembly of precision mechanical parts.

而且,在上述元器件供给部中并不限于上述振动送料器、带状送料器,也可将整体(bulk)送料器、粘结条送料器等其他连续供给机构加以组合。 Further, in the above component supply unit is not limited to the above-described vibrating feeder, the strip feeder can also be integral (Bulk) feeder, and other adhesive article feeder means are combined continuously supplied.

Claims (1)

  1. 1.一种元器件安装装置,其特征在于,具有:一个元器件供给部,所述元器件供给部设有元器件供给夹具和送料器,所述送料器为振动送料器、整体送料器、带状送料器、粘结条送料器中的一种或多种的组合,并且所述元器件供给部在驱动装置的作用下沿预定方向作直线往复运动,一个对安装对象物加以设置的元器件安装部,所述元器件安装部在驱动装置的作用下沿与所述元器件供给部的移动方向平行的方向直线往复运动,一个具有用于对元器件进行保持的元器件保持机构的安装头,所述安装头在驱动装置作用下沿与所述元器件供给部和元器件安装部的移动方向垂直的方向直线往复运动,所述安装头在所述元器件供给部中拾取已设置元器件,并将该元器件装到所述元器件安装部中所设置的安装对象物上的预定位置,一个元器件摄像装置,所述元器 A component mounting apparatus comprising: a component feed section, the component feed unit is provided with a component feed gripper and feeder, the feeder is a vibrating feeder, the entire feeder, feeder strip, the adhesive strip feeding a composition of one or more feeders and the component feed unit for reciprocating motion under the action of drive means in a predetermined direction, to be arranged on a mounting element object device mounting section, said component mounting portion under the action of drive means in a direction parallel to the moving direction of the component feed unit to reciprocate linearly in a direction, a component having a mounting for holding components of the holding means head, said mounting head drive means acting in the vertical direction of movement of the component supply unit and a component mounting portion direction of the linear reciprocating motion of the pickup head is mounted on the component supplying portion disposed meta device, and the component is attached to a predetermined position on the component mounting portion provided in the mounting object, a component imaging device, said filter element 摄像装置在所述安装头直线移动过程中对保持在所述安装头的元器件保持机构中的元器件进行摄像,分别对所述元器件供给部、元器件安装部和安装头进行驱动控制的驱动控制装置以及对由所述元器件摄像装置拍摄的图象进行运算处理的图象运算处理装置。 Imaging means for imaging the head is held in the component mounting components holding mechanism linearly moving the head during the installation, on each of the component supply section, component mounting portion and the mounting head driving control drive control means and the image captured by the component imaging device performing image processing arithmetic operation processing apparatus.
CN 01112008 2000-03-17 2001-03-16 Component and device mounting device CN1183818C (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105149924A (en) * 2015-09-09 2015-12-16 舒建文 Workpiece attaching machine

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067757A1 (en) * 2002-02-06 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Blank mounting apparatus for fabrication of quartz oscillator
JP4203303B2 (en) * 2002-03-28 2008-12-24 Juki株式会社 The electronic component mounting apparatus
DE10236004B4 (en) 2002-08-06 2007-08-23 Siemens Ag Device for fitting substrates with electrical components
JP2004103923A (en) 2002-09-11 2004-04-02 Tdk Corp Device for mounting electronic part and method for mounting the same
JP3879679B2 (en) 2003-02-25 2007-02-14 松下電器産業株式会社 Electronic component mounting apparatus and an electronic component mounting method
CN1592574B (en) 2003-09-01 2010-06-09 重机公司 Adsorption position corrector of electronic device in electronic device mounting machine
US20060075631A1 (en) 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
DE102005013283B4 (en) 2005-03-22 2008-05-08 Siemens Ag Automatic placement machine for populating substrates with electrical components
CN101662928B (en) 2009-09-14 2011-07-06 邓智军 Circuit board framing device and drilling and milling device with image framing
CN102641821A (en) * 2011-02-17 2012-08-22 一诠精密工业股份有限公司 Adhesive dispensing machine for optical lens adhesion
JP6135598B2 (en) * 2013-08-20 2017-05-31 株式会社村田製作所 Tip of the transfer apparatus
CN104105356B (en) * 2014-07-30 2017-04-05 东莞市新泽谷机械制造股份有限公司 Bifurcated positioning sheet feeding mechanism

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765993A (en) * 1987-01-20 1988-08-23 Owades Joseph L Preparation of alcohol-free barley malt-based beverage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105149924A (en) * 2015-09-09 2015-12-16 舒建文 Workpiece attaching machine

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