JP3512598B2 - Chip component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting apparatus for mounting a chip component having no lead wire, such as a resistor or a capacitor, at a predetermined position on a printed circuit board. In particular,
The present invention relates to a chip component mounting apparatus called a multi-mounter for mounting a large number of chip components on a printed circuit board simultaneously by one operation. 2. Description of the Related Art FIGS. 7 and 8 illustrate a conventional example of this type of chip component mounting apparatus, which is disclosed in Japanese Patent Publication No. 3-15835. As shown in FIG. 7, a plurality of hoppers 1 are provided on a component supply stage of the chip component mounting apparatus, and a large number of chip components 2 are stored in each hopper 1. Each hopper 1 is connected to a positioning plate 4 via a guide pipe 3, and a template 5 is arranged below the positioning plate 4. The template 5 includes a guide plate 5a and a base plate 5b integrated with each other, and a large number of holding holes 6 are formed in the upper guide plate 5a. Further, the template 5 can be moved up and down by a driving source (not shown), and is transported to a mount stage by a feed belt (not shown). As shown in FIG. A suction unit having a plurality of suction nozzles 7 is provided on the stage. [0003] In the chip component mounting apparatus configured as described above, first, the template 5 is mounted on the component supply stage.
Is lifted up by a driving source and superimposed on the positioning plate 4, and in this state, the chip component 2 is sent out from the hopper 1 to the guide pipe 3, so that the chip component 2 passes through the positioning plate 4 into the holding hole 6 of the template 5. Fall. After dropping the chip component 2 into each holding hole 6 of the template 5 as described above, the template 5 is placed on a feed belt (not shown) and transported to the mount stage. The chip component 2 is turned over in the holding hole 6. Next, after each chip component 2 is sucked up from the holding hole 6 of the template 5 by the suction nozzle 7 on the mount stage, the printed circuit board 8 is supplied just below the suction nozzle 7 as shown in FIG. The component 2 is temporarily fixed on a paste-like solder 9 previously applied to a predetermined position on a printed circuit board 8. Thus, the chip component 2 is moved from the template 5 to the printed board 8.
Then, the printed board 8 is heated in a reflow furnace, whereby the paste solder 9 is melted and the electrodes of the chip component 2 are soldered to the lands of the printed board 8. Therefore, according to the chip component mounting apparatus configured as described above, after dropping the chip component 2 into each holding hole 6 of the template 5 at the component supply stage, the template 5 is moved to the mount stage by the feed belt. Since each chip component 2 can be transferred from the holding hole 6 of the template 5 to the printed board 8 on the mount stage, the holding holes 6 corresponding to the quantity and position of the chip components 2 mounted on the printed board 8 5, a large number of chip components 2 can be simultaneously mounted on the printed circuit board 8 by one operation. In the above-described conventional chip component mounting apparatus, the positions of each chip component 2 mounted on the printed board 8 and each holding hole 6 formed in the template 5 are determined. Because of the one-to-one correspondence, as the mounting state of the chip components 2 on the printed circuit board 8 becomes higher in density, it is necessary to form a large number of holding holes 6 close to the template 5 with this. Not only that, but also a large number of suction nozzles 7 for sucking the chip components 2 must be arranged close to each other, so that there is a problem that high-density mounting of the chip components 2 cannot be performed. SUMMARY OF THE INVENTION The present invention provides a two-dimensional linear
An XY table that constitutes the fixed part of the motor and a two-dimensional linear
A first to a third transfer table constituting a movable portion of the motor,
And transferring the template to the first and second carriages.
Each of the first and second transfer tables is placed on an XY table.
Circulate through different routes on the
The substrate is placed on a third carrier, and the third carrier is moved to X
It is moved in a two-dimensional direction on the Y table. So
Then, the component mounting positions of the chip components mounted on the printed circuit board are divided into a plurality of groups, and the holding holes corresponding to the respective groups are preliminarily allocated to the template in the two-dimensional direction and formed for each group , Text by the first or second carrier
The suction plate is transported directly below the suction unit , and the chip components in the holding holes are suctioned by the suction nozzle of the suction unit.
Each chip component is mounted at a predetermined position on the board while moving the printed board in the two-dimensional direction by the third carrier . With this configuration, not only the holding holes of the template can be made coarser than the mounting density of the chip components on the printed circuit board, but also the suction nozzles of the suction unit can be arranged in a rough state. It is possible to easily cope with high-density mounting. [0007] In the chip component mounting apparatus of the present invention, a plurality of holding holes formed in a template corresponding to the component mounting position of the printed circuit board by the chip components housed in a plurality of hoppers. After the template is transported to a position directly below the suction unit, the chip components are suctioned from the holding holes by a plurality of suction nozzles of the suction unit and mounted at a predetermined position on the printed circuit board. The fixed part of the two-dimensional linear motor
XY table and movable part of two-dimensional linear motor
To first to comprise a third and a transport stand, by dividing the component mounting position of the printed circuit board into a plurality of groups, the formed per group by distributing the holding hole of the template in a two-dimensional direction, the template To the first and second transfer tables
Each of the first and second carriers is placed on the
When circulating along different paths on the XY table,
Then, the printed circuit board is placed on the third transfer table,
Is moved in the two-dimensional direction on the XY table.
By moving, the chip components sucked by the suction nozzles are mounted on the printed circuit board for each group. An embodiment will be described with reference to the drawings.
FIG. 1 is a front view of a chip component mounting apparatus according to an embodiment, and FIG.
FIG. 3 is a side view of the mounting apparatus, FIG. 3 is a plan view schematically showing a moving path of a carrier provided in the mounting apparatus, FIG. 4 is a cross-sectional view illustrating the operation principle of the carrier, and FIG. FIG. 6 is an explanatory view showing the relationship between the component mounting position and the position of the holding hole of the template. FIG. As shown in FIGS. 1 to 3, an XY table 11 is fixed on a gantry 10 of a chip component mounting apparatus, and first to third transfer tables 12, 13, 14 are mounted on the XY table 11. Is placed. XY table 11
A plurality of hoppers 15 are arranged above the hopper 15, and chip components are stored in these hoppers 15. Each hopper 1
Numeral 5 is connected to an arrangement board 17 attached to the gantry 10 via a guide pipe 16, and a component supply stage S1 is located immediately below the arrangement board 17 constituting component supply means. A suction unit 18 and a pair of imaging cameras 19 are attached to the gantry 10, and a mount stage S2 is located immediately below the suction unit 18. Immediately below both imaging cameras 19 are image recognition stages S3. These image recognition stages S3 are symmetrical with respect to a straight line connecting the component supply stage S1 and the mount stage S2. However, in FIG. 1, for convenience of illustration, the suction unit 18 is shown shifted to the right, and the imaging camera 19 on the right is not shown. In addition, two conveyors 20 are arranged on the front side of the XY table 11, and the printed circuit boards 21 are transported by the conveyors 20. A substrate supply / discharge stage S4 is provided between the two conveyors 20. [0011] As shown in FIG.
A plurality of projections 22a are formed in a grid at a pitch of, for example, 1 mm on a stator 22 made of a material having high magnetic permeability such as pure iron. It is covered with a resin coat 23. On the other hand, the first to third transfer tables 12, 13, and 14 constitute a movable portion of a two-dimensional linear motor, and a plurality of magnets having a comb-shaped end surface on a movable element 24 made of a nonmagnetic material such as aluminum. A core 25 is incorporated, and these comb-shaped end faces are opposed to the respective protrusions 22 a of the stator 22 with a slight phase difference. Each magnet core 25
A coil 26 is wound around the XY table 11 by controlling the direction and magnitude of the current supplied to the coil 26 so that the first to third transfer tables 12, 13, and 14 It can move freely in two-dimensional directions at intervals of 0.01 mm. Since high-pressure air that forms an air gap between the stator 22 and the mover 24 is blown out, the first to third transfer tables 12, 13, and 14 smoothly move on the XY table 11. Go to A template 27 is fixed on each of the first transfer table 12 and the second transfer table 13, and as shown in FIG.
Many storage holding holes 27a are formed. The first transfer table 12 circulates in the left half circulation path of FIG. 3, and the second transfer table 13 moves in the right half circulation path of FIG.
To circulate. Thus, the first and second transfer tables 1
2 and 13 move on different circulation paths. On the other hand, a printed board 21 is placed on the third transfer table 14, and the third transfer table 14 reciprocates between the mount stage S2 and the substrate supply / discharge stage S4 in FIG. Then, as described later, when the chip component 28 is mounted on the printed board 21 on the mount stage S2, the chip component 28 moves in a two-dimensional direction. As shown in FIG. 5, the component mounting position of the chip component 28 on the printed circuit board 21 and the template 2
The holding positions of the holding holes 27a in FIG. 7 do not correspond one-to-one, and the holding holes 27a are distributed in the two-dimensional direction with respect to the component mounting position of the chip component 28 and are formed for each group. In other words, as shown in FIG. 5A, in consideration of the mounting density of the component mounting positions on the printed circuit board 21, a plurality of mounting position groups such as four mounting positions are set so that the component mounting positions are separated from each other as much as possible. Divide into groups AD. On the other hand, as shown in FIG.
7 is divided into four regions A to D, and each region A to D
The holding holes 27a corresponding to the mounting position groups A to D are separately formed. As a result, the mounting density of each holding hole 27a in each of the regions A to D in the template 27 becomes １ ／ of the mounting density of the chip component 28 on the printed circuit board 21, and similarly, the suction unit (not shown) of the suction unit 18 The arrangement density of the nozzles is also １ ／ of the mounting density of the chip components 28 on the printed circuit board 21. Next, the operation of the chip component mounting apparatus configured as described above will be described. First, prior to the start of the work, the first and second transfer tables 12 and 13 are moved to predetermined positions of the X and Y tables 11 respectively. The position is moved to, for example, the upper left corner and the upper right corner in FIG. 3, and the origins of the first and second transfer tables 12 and 13 are aligned. Thereafter, the first transfer table 12 is moved to the component supply stage S1, and in the component supply stage S1, each of the holding holes 27a of the template 27 fixed on the first transfer table 12 is placed in the hopper 15. The stored chip parts 28 are transferred to the guide pipe 16 and the arrangement board 17.
Fall through. At this time, the second transfer table 13 is waiting at the above-described origin position. After dropping the chip component 28 onto the template 27 on the first transfer table 12 in this manner, the first transfer table 12 is moved through the circulation path shown in FIG.
1 to the image recognition stage S3, and then return to the component supply stage S1 via the circulation path,
Thereafter, the circulation path is circulated. When the first transfer table 12 moves from the component supply stage S1 to the image recognition stage S3, the second transfer table 12 is replaced with the second transfer table 12 instead of the first transfer table 12.
Is moved from the origin position to the component supply stage S1, and the chip components 28 stored in the hopper 15 are dropped into the holding holes 27a of the template 27 fixed on the second transfer table 13. I do. Thereafter, the second transfer table 13
Circulates through the circulation path of FIG. 3 with a delay of one to three steps with respect to the first transfer table 12, and moves the template 27 on the first and second transfer tables 12 and 13 at each stage by a predetermined amount. The operation is performed. That is, when the first transfer table 12 moves from the component supply stage S1 to the image recognition stage S3, the first transfer table 12 is slightly reciprocated in the X and Y directions, and the holding holes 27a of the template 27 on the first transfer table 12 are moved. Inside chip part 2
8 vibrates. At this time, by controlling the direction and magnitude of the current supplied to the coil 26, the first transfer table 12 can be reciprocated in various patterns having different amplitudes and accelerations. Therefore, the chip components 28 also vibrate in various patterns in the holding holes 27a of the template 27 and are turned sideways, and the misalignment of the chip components 28 is almost eliminated. Thereafter, at the image recognition stage S3, the imaging camera 19 uses the imaging component 19 to determine whether or not the chip component 28 is present in each holding hole 27a, whether the chip component 28 is lying down, and the like.
Are recognized as images. Next, when the first transfer table 12 moves from the image recognition stage S3 to the mount stage S2, each chip component 28 on the template 27 is moved by the respective suction nozzles (not shown) of the suction unit 18 at the mount stage S2. It is sucked and taken out from the holding hole 27a. Here, since the holding holes 27a are formed by being divided into four areas A to D on the template 27, the chip components 28 sucked by the suction nozzles do not correspond to the component mounting positions on the printed circuit board 21. . After that, the first transfer table 1
2 returns to the image recognition stage S3, and the presence or absence of a chip component 28 removal failure is image-recognized. If there is no failure, the process returns to the component supply stage S1, and the chip component 28 falls again into each holding hole 27a of the template 27. . On the other hand, the third transfer table 14 receives the printed circuit board 21 from the transfer conveyor 20 at the substrate supply / discharge stage S4, and then moves to the mount stage S2, where the chip components on the suction unit 18 side are mounted at the mount stage S2. 2
8 is temporarily fixed at a predetermined position on the printed circuit board 21 using paste solder (not shown). At this time, as described above, each chip component 28 on the suction unit 18 side is
Since the third transfer table 14 is moved in the two-dimensional direction on the mount stage S2, the chip components 28 on the suction unit 18 side Temporarily fixed in position. For example,
When the third carriage 14 is moved in the order of A, B, C, and D in accordance with each area of the template 27, the printed circuit board 21 is moved.
First, the chip components 28 corresponding to the region A are temporarily fixed, and then the chip components 28 corresponding to the regions B, C, and D are temporarily fixed in sequence, and finally all the mounting position groups A on the printed circuit board 21. The chip components 28 corresponding to .about.D are temporarily fixed. Thereafter, the third transfer table 14 moves from the mount stage S2 to the substrate supply / discharge stage S4, and the printed circuit board 21 on which each chip component 28 is mounted is transferred from the third transfer table 14 at the substrate supply / discharge stage S4. Conveyor 2
Discharged to zero. The same operation is performed at each stage on the template 27 on the second carrier 13, but the second carrier 13 is moved relative to the first carrier 12 as described above. The first transfer table 12 is delayed by one to three steps.
Reciprocates along a circulation path different from that of the parts supply stage S, for example, the first transfer table 12 moves along the circulation path.
When moving toward 1, the second transport table 13 moves along the circulation path and heads toward the image recognition stage S3. Therefore, for example, the template 2 on the second transfer table 13
If a misalignment of the chip components 28 is found with respect to 7, the second transfer table 13 is moved from the image recognition stage S3 to the correction stage S5 on the X, Y table 11 (see FIG. 3).
To the second transfer table 13 in the correction stage S5.
When the first and third transfer tables 12 and 14 are moved as described above while the correction is stopped and the chip components 28 can be mounted on the printed circuit board 21. Conversely, while the first carrier 12 is stopped, if the first carrier 13 and the third carrier 14 are moved as described above, the chip components can be moved relative to the printed circuit board 21. 28 can be implemented. [0020] [0021] In the above embodiment, the printed circuit board 21
In the above description, the component mounting positions are divided into four groups, and the holding holes 27a corresponding to the four groups are allocated to the template 27 and formed for each group. Needless to say, the component mounting position of the printed board 21 may be divided into a plurality of groups other than four according to the mounting density of the chip components 28 on the printed board 21. The present invention is embodied in the form described above, and has the following effects. X constituting a fixed part of the two-dimensional linear motor
Constructs the Y table and the movable part of the two-dimensional linear motor
A first and a third carrier, and a first and a second carrier.
The cradle circulates on the XY table along different paths.
By this, the first and second transfer tables are placed
Move the template directly below the suction unit to
Then, the third transfer table on which the printed circuit board is placed is moved to the XY table.
To move in a two-dimensional direction on the
Increase the degree of freedom of the circulation route when the rate moves
As well as the relative position of each suction nozzle and the printed circuit board
Can be corrected accurately, and on a printed circuit board.
Component mounting positions of chip components mounted on the
And holding holes corresponding to each group in advance.
It was divided into two-dimensional directions on the plate and formed in each group.
Therefore, not only can each holding hole of the template be made coarser than the mounting density of chip components on the printed circuit board,
Each suction nozzle of the suction unit can also be arranged in the crude state, therefore, it is possible to easily cope with high-density mounting of the chip component. [0024]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a chip component mounting apparatus according to an embodiment. FIG. 2 is a side view of the mounting device. FIG. 3 is a plan view schematically showing a moving path of a carrier provided in the mounting device. FIG. 4 is a cross-sectional view illustrating the operation principle of the transfer table. FIG. 5 is an explanatory diagram illustrating a relationship between a component mounting position on a printed circuit board and a position of a holding hole of a template. FIG. 6 is a cross-sectional view showing a main part of the template and a transfer table. FIG. 7 is an explanatory view showing an operation of dropping a chip component onto a template provided in a conventional chip component mounting apparatus. 8 is an explanatory diagram illustrating an operation of mounting a chip component on a printed circuit board from the template of FIG. 7; [Description of Signs] 11 XY table 12 First transfer table 13 Second transfer table 14 Third transfer table 15 Hopper 16 Guide pipe 17 Arrange board 18 Suction unit 19 Imaging camera 20 Transfer conveyor 21 Printed circuit board 22 Stator 24 mover 25 magnet core 26 coil 27 template 27a holding hole 28 chip component S1 component supply stage S2 mount stage S3 image recognition stage S4 substrate supply / discharge stage

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 13/02

Claims (1)

(57) [Claim 1] A chip component housed in a plurality of hoppers is dropped into a large number of holding holes formed in a template corresponding to component mounting positions on a printed circuit board. Line up,
After transporting this template directly below the suction unit,
An XY table constituting a fixed part of a two-dimensional linear motor in a chip component mounting apparatus in which a plurality of suction nozzles of the suction unit suck chip components from the holding holes and mount the chip components at predetermined positions on a printed circuit board.
And the first to the first parts constituting the movable part of the two-dimensional linear motor.
A third transfer table for dividing a component mounting position of the printed circuit board into a plurality of groups;
The template is distributed in the dimensional direction to form each of the groups, and the template is transferred to the first and second transfer tables.
And the first and second transfer tables are mounted on the XY
While circulating on the table in different paths,
The printed circuit board is placed on the third carrier, and the third
Is moved two-dimensionally on the XY table
Accordingly , the chip component mounted on the suction nozzle is mounted on the printed circuit board for each of the groups.