JP2009252925A - Electronic component mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system capable of efficiently executing concurrent component-mounting jobs on a plurality of substrates including different kinds of substrates. <P>SOLUTION: In an electronic component mounting line 1 where a plurality of printers 2 are connected to an upstream side of a mounting device 3, printers 2(1)-2(4) are arranged in a layout with the substrate transfer direction as the Y direction corresponding to each of a plurality of substrate transfer lanes L1-L4 for transferring a substrate 6 in the X direction in the mounting device 3. The substrate 6 which is transferred in the Y direction after print work in a posture with the longitudinal direction and is turned to a direction orthogonally crossing the substrate transfer direction is delivered to connection conveyors 5(1)-5(4) by substrate delivery devices 4(1)-4(4) established in the respective printers 2(1)-2(4), and is further delivered to the mount devices 3(1)-3(4) via the connection conveyors 5(1)-5(4), thus easily extending the printers 2 according to the number of lanes in the mounting device 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting system for manufacturing a mounting substrate by mounting electronic components on a substrate.

  An electronic component mounting system that manufactures a mounting board by mounting electronic components on a substrate is a screen printing device that prints a soldering paste on the electronic component, an electronic component mounting device that mounts the electronic component on the printed substrate, etc. The electronic component mounting line of the structure which connected was connected. In recent years, in the electronic industry, a large variety of small-quantity production has become the mainstream, and there is a demand for a facility configuration that has both high production efficiency and flexibility that can handle various production forms.

  In order to realize such a production facility, various characteristic mechanisms and configurations have been introduced in the devices constituting the layout of the electronic component mounting line and the electronic component mounting line. For example, a configuration (see Patent Document 1) including a plurality of substrate transport conveyors that can be operated independently is used for the purpose of improving the efficiency of transporting substrates and simultaneously transporting a plurality of substrates. As a result, a plurality of substrates can be produced at the same time, and the production efficiency is excellent. At the same time, a facility capable of producing a plurality of types of substrates and having excellent multi-product compatibility can be realized.

Further, in order to produce a plurality of substrates at the same time, it is necessary to increase the processing capacity of the screen printing apparatus for supplying solder bonding paste to the substrates in accordance with the number of substrates produced. For this reason, a configuration in which a plurality of screen printing devices are arranged in series in the electronic component mounting line to increase the overall processing capacity (see Patent Document 2), or by simultaneously printing two substrates with the same mask plate Various mechanisms such as a method for increasing the number of processed sheets (see Patent Document 3) and a method for increasing the number of processed sheets by arranging independent screen printing mechanisms in series in the same apparatus (see Patent Document 4) are used. Yes.
Japanese Patent Laid-Open No. 4-129630 JP 2004-142299 A JP 2000-37847 A JP 2000-168040 A

  However, the prior art examples disclosed in Patent Documents 2 to 3 have the following problems. That is, in the examples shown in Patent Documents 2 and 3, since all of the substrates are transported by a single substrate transport path, the substrate transport after the printed substrate is sent to the electronic component mounting apparatus on the downstream side. The order is fixed, and it is difficult to supply necessary substrates to the downstream apparatus at necessary timing. For this reason, it is difficult to apply the configuration shown in the above-described prior art example to the mixed flow production in which different kinds of substrates are simultaneously flowed. As described above, the conventional electronic component mounting system has a problem that it is difficult to efficiently perform the component mounting operation simultaneously on a plurality of substrates including different types of substrates.

  Therefore, an object of the present invention is to provide an electronic component mounting system capable of efficiently performing component mounting work simultaneously and in parallel on a plurality of substrates including different types of substrates.

  An electronic component mounting system according to the present invention is a plurality of screen printing apparatuses that target a rectangular substrate and print an electronic component bonding paste on the substrate upstream of the electronic component mounting device that mounts the electronic component on the substrate. The electronic component mounting system includes a plurality of first substrates that convey the substrate in a first direction in a posture in which a longitudinal direction of the rectangle is aligned with a substrate conveyance direction. Each of the plurality of screen printing apparatuses is provided corresponding to one of the plurality of first substrate transport mechanisms, and has a posture in which the longitudinal direction of the rectangle is orthogonal to the substrate transport direction. A second substrate transport mechanism for transporting the substrate in a second direction orthogonal to the first direction, and further, a printing operation is performed by the screen printing apparatus; Thus by moving the conveyed the substrate in the first direction with a substrate transfer means to pass to the first substrate transfer mechanism.

  According to the present invention, in an electronic component mounting system configured by connecting a plurality of screen printing devices on the upstream side of an electronic component mounting device, a plurality of first substrates for transporting the substrate to the electronic component mounting device in a first direction. A transport mechanism is provided, and each of the plurality of screen printing apparatuses corresponds to one of the plurality of first substrate transport mechanisms, and the substrate is orthogonal to the first direction in a posture in which the longitudinal direction is orthogonal to the substrate transport direction. A second substrate transport mechanism substrate that transports in the second direction is provided, and further, the first substrate transport is performed by changing the direction of the substrate that is printed by the screen printing apparatus and transported by the second substrate transport mechanism at a right angle in a horizontal plane. By adopting a configuration that includes a board delivery means for passing to the mechanism, it is possible to easily add a screen printing apparatus according to the number of lanes of the first board transport mechanism of the electronic component mounting apparatus, The concurrently component mounting operations can be executed efficiently a plurality of substrates, including the type of substrate as a target.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a configuration of an electronic component mounting system according to an embodiment of the present invention, FIG. 2 is a plan view of an electronic component mounting apparatus in the electronic component mounting system according to an embodiment of the present invention, and FIG. FIG. 4 is a plan view of a screen printing apparatus in an electronic component mounting system according to an embodiment of the present invention; FIG. 4 and FIG. 5 are cross-sectional views of the screen printing apparatus in the electronic component mounting system according to an embodiment of the present invention; FIG. 7 is a plan view showing a configuration of an electronic component mounting system according to an embodiment of the present invention.

  First, the configuration of the electronic component mounting system will be described with reference to FIG. An electronic component mounting line 1 forming this electronic component mounting system has a function of mounting an electronic component on a substrate and manufacturing the mounting substrate for a rectangular substrate, and the electronic component mounting the electronic component on the substrate On the upstream side (left side in FIG. 1) of the mounting apparatus 3 (hereinafter simply referred to as “mounting apparatus 3”), a screen printing apparatus 2 (hereinafter simply referred to as “printing apparatus”) that prints a paste for joining electronic components on a substrate. 2 ”) is connected.

  In the present embodiment, the electronic component mounting line 1 is configured to include two mounting devices 3 arranged in series, and the mounting target substrate 6 is placed in each of the mounting devices 3 in the X direction (first order). Four substrate transport lanes L1, L2, L3, and L4 that are transported in one direction are provided. Note that the serial numbers in L1 to L4 indicate the arrangement order from the left side (upper side in FIG. 1) toward the downstream side. One printing apparatus 2 is coupled to each of the board conveyance lanes, and four printing apparatuses 2 are arranged on the electronic component mounting line 1 as a whole. In the description of the present specification, for a plurality of devices having the same configuration, such as a printing device and a mounting device, the respective devices are distinguished by attaching subscripts (1), (2),. The subscripts attached to the mounting device 3 indicate the arrangement order from the upstream side of the electronic component mounting line of the device, and the printing device 2 corresponds to the board transport lanes L1, L2, L3, L4 of the mounting device 3. Subscripts (1), (2)... Are attached to each device.

  On the upstream side of the substrate transport lanes L1, L2, L3, and L4 of the mounting device 3 (1), the connecting conveyors 5 (1), 5 (2), and 5 (3) each having a function of transporting the substrate 6 linearly. ), 5 (4) are connected, and on the upstream side of each connecting conveyor 5 (1), 5 (2), 5 (3), 5 (4), each printing device 2 (1), 2 ( 2) Substrate delivery devices 4 (1), 4 (2), 4 (3) and 4 (4) attached downstream of 2 (3) and 2 (4) are connected. Here, the printing apparatuses 2 (1), 2 (2), 2 (3), and 2 (4) all have postures in which the substrate transport center line CR in each apparatus is oriented in the Y direction (second direction). Is arranged in. The printing apparatuses 2 (1), 2 (4), and the printing apparatuses 2 (2), 2 (3) are in a mutually symmetrical position with respect to the line center line CL of the electronic component mounting line 1, and make a pair. The printing apparatuses 2 (1) and 2 (4) are arranged closer to the mounting apparatus 3 (1) than the printing apparatuses 2 (2) and 2 (3).

  The substrate 6 to be printed is conveyed in the Y direction (second direction) in each printing apparatus 2 with the posture in which the longitudinal direction of the rectangle is oriented in the X direction (arrows a1, a2, a3, a4), and the screen printing unit 7 The printed substrates 6 carried out from the respective printing apparatuses 2 after the printing operation by the above are delivered to the respective connecting conveyors 5 by the respective substrate delivery apparatuses 4. These substrates 6 are transported in the X direction by the respective connecting conveyors 5 (arrows b1, b2, b3, b4) and transferred to the substrate transport lanes L1, L2, L3, L4 of the mounting apparatus 3 (1). These substrates 6 are transported downstream along the substrate transport lanes L1, L2, L3, and L4, and electronic components are sequentially mounted on the substrate 6 by the mounting devices 3 (1) and 3 (2). The substrate 6 may be the same type of substrate 6 and the printing apparatus 2 is individually connected to each substrate transfer lane, so that different types of substrates are loaded in each substrate transfer lane. May be.

  Next, the configuration of the mounting apparatus 3 will be described with reference to FIG. In the center of the base 11, four pairs of substrate transport rails 12 </ b> A, 12 </ b> B, 12 </ b> C, 12 </ b> D provided with a conveyor mechanism are arranged in the substrate transport direction (X direction). Substrate transport rails 12A, 12B, 12C and 12D equipped with a conveyor mechanism transport the substrate 6 passed from the printing device 2 via the substrate delivery device 4 and the connecting conveyor 5 in the rectangular longitudinal direction (arrow l). A plurality of first substrate transport mechanisms (corresponding to four substrate transport lanes L1, L2, L3, and L4 in this case) are configured to transport in the first direction in a posture that matches the direction.

  Component supply units 13A and 13B are provided on the outer sides of the board transport rails 12A and 12D, respectively, and a plurality of tape feeders 14 are arranged in parallel on the component supply units 13A and 13B. The tape feeder 14 feeds an electronic component to a component pickup position by a component mounting mechanism described below by pitch-feeding a carrier tape holding an electronic component mounted on the substrate 6. A Y-axis movement table 15 is disposed at the end of the base 11 on the X direction side, and the two X-axis movement tables 16A and 16B coupled to the Y-axis movement table 15 have mounting heads 17A and 16A, respectively. 17B is installed. The mounting heads 17A and 17B include a plurality of unit mounting heads, and hold electronic components by vacuum suction using suction nozzles mounted on the unit mounting heads.

  By driving the Y-axis movement table 15 and the X-axis movement tables 16A and 16B, the mounting heads 17A and 17B move horizontally in the X direction and the Y direction. As a result, the mounting heads 17A and 17B suck and take out the electronic components from the tape feeders 14 of the component supply units 13A and 13B, respectively, and transfer them to the substrate 6 positioned on the mounting stages of the substrate transport rails 12A, 12B, 12C, and 12D. Mount.

Component recognition cameras 18A and 18B are provided on the movement paths of the mounting heads 17A and 17B. The mounting heads 17A and 17B holding electronic components move above the component recognition cameras 18A and 18B, so that the component recognition cameras are moved. 18A and 18B recognize the electronic components held by the mounting heads 17A and 17B by imaging them from below. A substrate recognition camera 19 that moves integrally is provided on the lower surface side of the mounting heads 17A and 17B. As the mounting heads 17A and 17B move to the mounting stage described above, the substrate recognition camera 19 images the substrate 6 positioned on the mounting stage and recognizes the position.

  Next, the structure of the printing apparatus 2 will be described with reference to FIGS. 3, 4, and 5. 4 shows an AA arrow view in FIG. 3, and FIG. 5 shows a BB arrow view in FIG. As shown in FIG. 3, the printing apparatus 2 has a configuration in which a screen printing unit 7 is arranged on a base 2a. The screen printing unit 7 positions a substrate 6 at a printing position and holds it. 21 is provided. A rectangular substrate 6 to be printed is a carry-on conveyor 20 attached to the upstream side of the printing apparatus 2 in a posture in which the longitudinal direction (arrow 1) of the rectangle is orthogonal to the substrate conveyance direction (Y direction) in the printing apparatus 2. Is carried into the substrate positioning part 21 via

  A substrate delivery device 4 is attached downstream of the printing device 2. As shown in FIG. 5, the substrate delivery device 4 is provided with a delivery conveyor 42 that conveys the substrate 6 on an upper part of a column member 41 that is erected on a base 4a, and a suction pad 43a above the delivery conveyor 42. A configuration is provided in which a substrate transfer unit 43 for transferring the substrate 6 by suction is provided. The substrate transfer unit 43 moves up and down and reciprocates in the X direction by a transfer unit drive mechanism (not shown). Thereby, the board | substrate 6 conveyed to the delivery conveyor 42 can be hold | maintained by the suction pad 43a, can be moved to a X direction, and can be transferred to the connection conveyor 5. FIG.

  In the above-described embodiment, an example in which the substrate delivery device 4 is configured separately from the printing device 2 has been described. However, the substrate conveyance rail 28 of the printing device 2 is extended downstream and integrated with the delivery conveyor 42. It may be the configuration. In this case, the operation mode is such that the substrate 6 is directly transferred from the extended substrate transport rail 28 to the connection conveyor 5. Moreover, although the example which delivers the board | substrate 6 to the connection conveyor 5 by the board | substrate transfer unit 43 provided with the suction pad 43a was shown in the said embodiment, as a delivery method of the board | substrate 6, in addition to the transfer by adsorption | suction, board | substrate delivery Various mechanisms such as a method of transferring the substrate 6 to the connecting conveyor 5 by pushing out the substrate 6 by a pusher provided in the apparatus 4, and a horizontal movement of the substrate by a transfer operation in which the substrate 6 is lifted from the lower surface side and horizontally moved by a predetermined pitch. Can be selected.

  The detailed configuration of the screen printing unit 7 will be described with reference to FIG. In FIG. 4, the substrate positioning unit 21 stacks a Y-axis table 22, an X-axis table 23 and a θ-axis table 24, and further combines a first Z-axis table 25 and a second Z-axis table 26 thereon. Configured. The configuration of the first Z-axis table 25 will be described. Similarly, on the upper surface side of the horizontal base plate 24 a provided on the upper surface of the θ-axis table 24, the horizontal base plate 25 a is held up and down by a lifting guide mechanism (not shown). The base plate 25a is moved up and down by a Z-axis lifting mechanism configured to rotationally drive a plurality of feed screws 25c via a belt 25d by a substrate moving Z-axis motor 25b.

Two vertical frames 25e are erected on the base plate 25a, and a pair of substrate transport rails 28 constituting a substrate transport path are held at the upper end of the vertical frame 25e. The substrate transport rails 28 are arranged in the Y direction, and support and transport both ends of the substrate 6 to be printed by a conveyor mechanism provided on these substrate transport rails 28. The substrate transport rail 28 is provided corresponding to one of the plurality of substrate transport rails 12 </ b> A to 12 </ b> D of the mounting device 3 in each of the plurality of printing apparatuses 2, and the longitudinal direction of the rectangle is aligned with the substrate transport direction. This is a second substrate transport mechanism that transports the substrate 6 in a second direction (Y direction) orthogonal to the first direction. By driving the first Z-axis table 25, the substrate 6 held by the substrate transport rail 28 can be lifted and lowered with respect to the screen printing mechanism together with the substrate transport rail 28.

  The configuration of the second Z-axis table 26 will be described. A horizontal base plate 26a is disposed between the substrate transport rail 28 and the base plate 25a so as to be movable up and down along a lifting guide mechanism (not shown). The base plate 26a is lifted and lowered by a Z-axis lifting mechanism configured to rotationally drive a plurality of feed screws 26c via a belt 26d by a lowering part lifting motor 26b. A substrate receiving portion 27 is detachably mounted on the upper surface of the base plate 26a. The substrate receiving part 27 receives and holds the substrate 6 transported to the printing position by the screen printing mechanism from below.

  In the printing operation by the screen printing unit 7, the board transport rail 28 receives the board 6 supplied from the upstream device via the carry-in conveyor 20, and carries the board 6 to the printing position by the screen printing mechanism for positioning. Then, the substrate 6 on which printing has been performed by the screen printing mechanism is unloaded from the printing position by the substrate transport rail 28 and transferred to the transfer conveyor 44 of the substrate transfer device 4.

  By driving the second Z-axis table 26, the substrate receiving portion 27 moves up and down with respect to the substrate 6 held on the substrate transport rail 28. Then, the substrate receiving portion 27 supports the substrate 6 from the lower surface side when the lower surface of the substrate receiving portion 27 abuts on the lower surface of the substrate 6. A clamp mechanism 29 is disposed on the upper surface of the substrate transport rail 28. The clamp mechanism 29 is provided with two clamp members 29a arranged opposite to the left and right. The clamp member 29a on one side is advanced and retracted by the drive mechanism 29b to clamp and fix the substrate 6 from both sides.

  Next, the structure of a screen printing mechanism that is disposed above the substrate positioning unit 21 and prints paste on the substrate conveyed to the printing position will be described. 4 and 5, a mask plate 32 is extended on a mask frame 31 held by a mask holder (not shown), and a pattern hole 32 a is provided in the mask plate 32 corresponding to a printing portion on the substrate 6. It has been. On the mask plate 32, a squeegee unit 33 is movably disposed by a squeegee moving mechanism 37.

  The squeegee unit 33 has a structure in which two squeegee lifting mechanisms 35 for raising and lowering a pair of squeegees 36 arranged opposite to each other are arranged on a horizontal moving plate 34. The squeegee unit 33 is moved forward and backward in the X direction by a squeegee moving mechanism 37 in which a feed screw 37b rotated by a squeegee moving motor 37a is screwed to a nut member 37c fixed to the lower surface of the moving plate 34. Move horizontally in the direction.

  As shown in FIG. 4, the squeegee moving mechanism 37 and the head Y-axis table 40Y are positioned above the substrate positioning unit 21 and held on the upper part of the frame 2b erected at the end of the base 2a in the X direction. Has been. As shown in FIG. 5, a camera head unit 38 and a mask cleaning unit 39 are mounted on the head X-axis table 40X that moves in the Y-axis direction by the head Y-axis table 40Y. The camera head unit 38 includes a substrate recognition camera 38a for imaging the substrate 6 from above and a mask recognition camera 38b for imaging the mask plate 32 from the lower surface side, and the mask cleaning unit 39 is the mask plate 32. A cleaning head for cleaning the lower surface of the head is provided.

By driving the head X-axis table 40X and the head Y-axis table 40Y and moving the camera head unit 38 and the mask cleaning unit 39 horizontally, recognition of the substrate 6 and recognition of the mask plate 32 can be performed simultaneously. If necessary, the lower surface of the mask plate 32 can be cleaned. When these operations are not performed, the camera head unit 38 and the mask cleaning unit 39 are in a position retracted from the upper side of the substrate positioning unit 21 to the side.

  Next, the printing operation by the screen printing unit 7 will be described. First, the substrate 6 to be printed supplied via the carry-in conveyor 20 is carried into the printing position by the substrate carrying rail 28 and aligned with the substrate receiving part 27. Next, the second Z-axis table 26 is driven to raise the substrate receiving portion 27 and receive the lower surface of the substrate 6. Next, the substrate positioning unit 21 is driven to align the substrate 6 with respect to the mask plate 32, and then the first Z-axis table 25 is driven to raise the substrate 6 together with the substrate transport rail 28, so that the pattern holes 32a Is brought into contact with the lower surface of the mask plate 32 provided with

  Thereafter, the horizontal position of the substrate 6 is fixed by clamping the substrate 6 by the clamp mechanism 29. In this state, one of the two squeegees 36 is lowered and brought into contact with the mask plate 32. Next, the paste is printed on the substrate 6 through the pattern holes 32a by sliding the squeegee 36 in the squeezing direction (Y direction) on the mask plate 32 supplied with paste such as cream solder.

  Next, a substrate carry-out operation in the printing apparatus 2 will be described with reference to FIG. FIG. 6A shows a state in which the substrate 6 to be printed is held by the substrate positioning unit 21 in the printing apparatus 2. As shown in FIG. 6B, the substrate 6 that has been printed by the screen printing unit 7 is transported to the substrate delivery device 4 side by the substrate delivery rail 28 (arrow e), and is provided in the substrate delivery device 4. Transfer to the delivery conveyor 42.

  Next, as shown in FIG. 6C, the substrate transfer unit 43 is lowered in the substrate delivery device 4, and the substrate 6 transferred to the delivery conveyor 42 is sucked and held by the suction pad 43a. Thereafter, the substrate transfer unit 43 is raised and moved in the X direction to transfer the substrate 6 onto the connecting conveyor 5 as shown in FIG. 6D (arrow f). As a result, the substrate 6 that has been transported in the Y direction in the printing apparatus 2 and printed is moved in the X direction by the substrate delivery apparatus 4 and delivered to the connecting conveyor 5, and further downstream by the connecting conveyor 5. To the loading device 3.

  That is, in the configuration of the electronic component mounting line 1, the mounting device 3 includes a plurality of first substrate transport mechanisms that transport the substrate 6 in the X direction (first direction) in a posture in which the longitudinal direction of the rectangle is aligned with the substrate transport direction. There are certain substrate transport rails 12A, 12B, 12C, 12D. The printing apparatus 2 is provided corresponding to each of the substrate transport rails 12A, 12B, 12C, and 12D and transports the substrate 6 in the Y direction (second direction) in a posture in which the longitudinal direction of the rectangle is orthogonal to the substrate transport direction. And a substrate transport rail 28 as a second substrate transport mechanism. The substrate delivery device 4 and the connecting conveyor 5 are substrates that are printed by the printing device 2 and transferred to the substrate transport rails 12A, 12B, 12C, and 12D by moving the substrate 6 transported by the substrate transport rail 28 in the X direction. Construct delivery means.

  By adopting such a configuration, it is possible to easily add the screen printing apparatus 2 in accordance with the number of board conveyance lanes of the electronic component mounting apparatus 3. Therefore, in mixed-flow production where component mounting work is performed in parallel on multiple boards including different types of boards, board transfer lanes can be secured for each board type, which has been unavoidable in the prior art. There is no reduction in work efficiency due to restrictions on the substrate transfer sequence, and mixed flow production can be performed efficiently.

The configuration of the electronic component mounting line 1 shown in FIG. 1 shows a layout example in which four printing apparatuses 2 are arranged symmetrically with respect to the line center line of the electronic component mounting line 1. Depending on convenience, a layout as shown in FIG. 7 may be adopted. That is, in the electronic component mounting line 1A shown in FIG. 7, four printing apparatuses 2 (1), 2 (2), 2 (3), and 2 (4) are arranged in parallel on one side of the electronic component mounting line 1A. Then, the board delivery devices 4 (1), 4 (2), 4 (3), and 4 (4) attached to each printing device 2 are connected to the connecting conveyors 5 (1) and 5 (2) having different conveyance lengths. ), 5 (3), and 5 (4) are connected to the mounting device 3 (1). Thereby, the space in the line width direction occupied by the four printing apparatuses 2 can be reduced as compared with the arrangement example shown in FIG. 1, and the supply of the substrate 6 to the printing apparatus 2 is reduced by the line center line. Can only be done from one side.

  The electronic component mounting system according to the present invention has an effect that a printing operation can be efficiently performed simultaneously on a plurality of substrates including different types of substrates, and the electronic component is mounted on the substrate. This is useful in the field of electronic component mounting for manufacturing mounting boards.

The top view which shows the structure of the electronic component mounting system of one embodiment of this invention The top view of the electronic component mounting apparatus in the electronic component mounting system of one embodiment of this invention The top view of the screen printing apparatus in the electronic component mounting system of one embodiment of this invention Sectional drawing of the screen printing apparatus in the electronic component mounting system of one embodiment of this invention Sectional drawing of the screen printing apparatus in the electronic component mounting system of one embodiment of this invention Operation explanatory diagram of board conveyance operation in electronic component mounting system of one embodiment of the present invention The top view which shows the structure of the electronic component mounting system of one embodiment of this invention

Explanation of symbols

1,1A Electronic component mounting line 2 Printing device (screen printing device)
3. Mounting device (electronic component mounting device)
4 Substrate delivery device 5 Link conveyor 6 Substrate 7 Screen printing unit 12A, 12B, 12C, 12D Substrate transport rail (first substrate transport mechanism)
21 Substrate positioning unit 28 Substrate transport rail (second substrate transport mechanism)
L1, L2, L3, L4 Board transfer lane

Claims (1)

An electronic component that is formed by connecting a plurality of screen printing devices for printing an electronic component bonding paste on the substrate upstream of an electronic component mounting device for mounting an electronic component on the substrate, targeting a rectangular substrate An implementation system,
The electronic component mounting apparatus includes a plurality of first substrate transport mechanisms that transport the substrate in a first direction in a posture in which a longitudinal direction of the rectangle is matched with a substrate transport direction;
Each of the plurality of screen printing apparatuses is provided corresponding to one of the plurality of first substrate transport mechanisms, and the first substrate is placed in a posture in which a longitudinal direction of the rectangle is orthogonal to the substrate transport direction. A second substrate transport mechanism for transporting in a second direction orthogonal to the direction;
The apparatus further comprises substrate transfer means for transferring the substrate transferred to the first substrate transport mechanism by moving the substrate transported by the second substrate transport mechanism performed by the screen printing apparatus in the first direction. Electronic component mounting system.

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