GB9810318D0 - Chip components mounting apparatus - Google Patents

Chip components mounting apparatus

Info

Publication number
GB9810318D0
GB9810318D0 GBGB9810318.7A GB9810318A GB9810318D0 GB 9810318 D0 GB9810318 D0 GB 9810318D0 GB 9810318 A GB9810318 A GB 9810318A GB 9810318 D0 GB9810318 D0 GB 9810318D0
Authority
GB
United Kingdom
Prior art keywords
mounting apparatus
chip components
components mounting
chip
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9810318.7A
Other versions
GB2326980A (en
GB2326980B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9810318D0 publication Critical patent/GB9810318D0/en
Publication of GB2326980A publication Critical patent/GB2326980A/en
Application granted granted Critical
Publication of GB2326980B publication Critical patent/GB2326980B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
GB9810318A 1997-07-01 1998-05-15 Chip components mounting apparatus Expired - Fee Related GB2326980B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17592897A JP3512598B2 (en) 1997-07-01 1997-07-01 Chip component mounting device

Publications (3)

Publication Number Publication Date
GB9810318D0 true GB9810318D0 (en) 1998-07-15
GB2326980A GB2326980A (en) 1999-01-06
GB2326980B GB2326980B (en) 2002-01-16

Family

ID=16004710

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9810318A Expired - Fee Related GB2326980B (en) 1997-07-01 1998-05-15 Chip components mounting apparatus

Country Status (5)

Country Link
JP (1) JP3512598B2 (en)
KR (1) KR100300837B1 (en)
CN (1) CN1104833C (en)
GB (1) GB2326980B (en)
MY (1) MY121750A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1547780A4 (en) * 2002-09-30 2012-01-25 Sony Corp Method and device for positioning electronic components
KR101000004B1 (en) 2004-12-24 2010-12-09 미래산업 주식회사 Parts Mounting Method
CN110139500B (en) * 2019-05-28 2021-11-23 铜陵金基科技有限公司 SMT chip mounter and chip mounting production process thereof
EP3982704A4 (en) * 2019-06-05 2022-07-13 Fuji Corporation Parts supply apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board
US4548667A (en) * 1984-03-28 1985-10-22 Wical Robert M Planned coordinate component placement system
KR920002278B1 (en) * 1988-02-15 1992-03-20 다이요유덴 가부시끼가이샤 Mounting apparatus for chip-shaped curcuit component

Also Published As

Publication number Publication date
JP3512598B2 (en) 2004-03-29
CN1208323A (en) 1999-02-17
KR100300837B1 (en) 2001-09-06
GB2326980A (en) 1999-01-06
GB2326980B (en) 2002-01-16
MY121750A (en) 2006-02-28
JPH1126989A (en) 1999-01-29
KR19990013480A (en) 1999-02-25
CN1104833C (en) 2003-04-02

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070515