CN1208323A - Chip part mounting apparatus - Google Patents
Chip part mounting apparatus Download PDFInfo
- Publication number
- CN1208323A CN1208323A CN98102757A CN98102757A CN1208323A CN 1208323 A CN1208323 A CN 1208323A CN 98102757 A CN98102757 A CN 98102757A CN 98102757 A CN98102757 A CN 98102757A CN 1208323 A CN1208323 A CN 1208323A
- Authority
- CN
- China
- Prior art keywords
- base plate
- printed base
- template
- chip part
- transport platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides a chip part mounting apparatus which divides a part mounting position of a printed substrate into a plurality of groups, distributes holding holes of a moulding board in a two-dimension direction, the holding holes is formed based on the groups, when mounting an adsorbed chip part on the printed substrate, the moulding board is moved by a transport table and the printed substrate is moved in the two-dimension direction by another transport table, the chip part is mounted at a predetermined postion on the printed substrate, thereby a high density mounting corresponding to the chip part can be easily realized.
Description
The present invention relates to a kind of chip component installation device that the chip part of the lead that does not have resistor, electric capacity etc. is installed on the defined position of printed base plate, particularly relate to a kind ofly on printed base plate, the chip component installation device that multichannel is installed that is called as of several chip parts is installed in action once simultaneously.
As Fig. 7, Figure 8 shows that existing chip component installation device, it is open in No. 15835/91 communique of Japanese patent laid-open publication gazette.As shown in Figure 7, be equipped with a plurality of funnels 1, in each funnel 1, contain plurality of chips parts 2 in the parts supply stage of chip component installation device.Each funnel 1 is connected on the compoboard 4 of location by guide pipe 3, is equipped with template 5 below this location compoboard 4.This template 5 is made up of mutual incorporate guiding die plate 5a and template substrate 5b, is formed with some retaining holes 6 on the guiding die plate 5a up.Template 5 can upper and lowerly move by the drive source (not shown), by the conveyer belt (not shown) template is transported to erection stage simultaneously, as shown in Figure 8, is equipped with the absorbing unit of the adsorption nozzle 7 of plural number at erection stage.
Resemble the chip component installation device of said structure, at first supply with the stage, lift template 5 by drive source and overlap with location compoboard 4 at parts, at this state, send chip part 2 from funnel 1 guide spool 3, chip part 2 falls in the retaining hole 6 of template 5 through location compoboard 4.Chip part 2 is loaded into template 5 on the belt conveyor not shown in the figures after falling in each retaining hole 6 of template 5, carries till erection stage, carries in the way at this, and by vibration template 5, chip part 2 is the state of laying across in retaining hole 6.Then, at erection stage, suct each chip part 2 by adsorption nozzle 7 from the retaining hole 6 of template 5 after, as shown in Figure 8, by supplying with printed base plate 8, each chip part 2 temporarily is fixed on the defined position of the printed base plate 8 that is coated with pasty state scolding tin 9 in advance under adsorption nozzle 7.Like this, chip part 2 is from template 5 transfers to state on the printed base plate 8, and this printed base plate 8 of heating in reflow ovens dissolves pasty state scolding tin 9, the electrode of welding chip parts 2 on the flange of printed base plate 8 then.
That is, chip component installation device is as constituted above supplied with the stage at parts, after chip part 2 is dropped in each retaining hole 6 of template 5, by belt conveyor conveying template 5 till erection stage; At this erection stage, for each chip part 2 is shifted to printed base plate 8 from the retaining hole 6 of template 5, so be installed in the quantity of the chip part 2 on the printed base plate 8 and the retaining hole 6 of position being formed with correspondence on the template 5, once action, plurality of chips parts 2 just can be installed on the printed base plate 8 simultaneously.
Above-mentioned existing chip apparatus for mounting component, each chip part 2 that is installed on the printed base plate 8 is corresponding one by one with the position of each retaining hole 6 on being formed on template 5, the installation situation of chip part 2 is densifications on printed base plate 8, be accompanied by this situation, the some retaining holes 6 that form on template 5 are not only approaching, and some adsorption nozzles 7 of absorbent core chip part 2 also dispose very approaching, so have can not high-density installation chip part 2 problem.
The object of the present invention is to provide a kind of chip component installation device, making its parts installation site of cutting apart the chip part that is installed on the printed base plate is plural groups, in advance on template, on two-dimensional directional, distribute the corresponding retaining hole of respectively organizing, make every group all to be formed with retaining hole, simultaneously with behind the chip part in the adsorption nozzle absorption retaining hole of absorbing unit, mobile printing substrate on two-dimensional directional is installed each chip part simultaneously on institute's allocation of printed base plate.By above-mentioned structure, not only the packing density of chip part is low on the comparable printed base plate of each retaining hole of template, and each adsorption nozzle of absorbing unit also can the configuration of low-density ground, the easily high-density installation of corresponding chip part.
The objective of the invention is to realize by following technical scheme.
Chip component installation device of the present invention, the parts installation site of its corresponding printed base plate, and fall and arrange in several retaining holes on being formed on template be housed in chip part in a plurality of funnels, after carrying this template under the absorbing unit, a plurality of adsorption nozzles with this absorbing unit, absorbent core chip part in the retaining hole, and this chip is installed to the defined position of printed base plate, wherein, the parts installation site of above-mentioned printed base plate is divided into a plurality of groups, the retaining hole of distributing above-mentioned template at two-dimensional directional, retaining hole is formed by above-mentioned each group, move above-mentioned printed base plate to above-mentioned two-dimensional directional, the chip part that adsorbs on the above-mentioned adsorption nozzle is being installed on the printed base plate by above-mentioned every group.
Purpose of the present invention also can further be realized by following technical measures.
Under absorbing unit, carry the transportation means of said chip to be formed by the XY worktable of the fixed part that constitutes the two-dimensional linear motor, at least two transport platform constituting the movable part of two-dimensional linear motor, in the template that moves under the absorbing unit on the transport platform, move printed base plate on another transport platform at two-dimensional directional, the degree of freedom of the circulating path in the time of can improving template and move can correctly be proofreaied and correct the relative position of each adsorption nozzle and printed base plate simultaneously.
Concrete structure of the present invention is provided in detail by following examples and accompanying drawing thereof.
Fig. 1 is the front elevation of chip component installation device of the present invention.
Fig. 2 is the side view of chip component installation device of the present invention.
Fig. 3 is the mode view that has the mobile route of transport platform in the chip component installation device of the present invention.
Fig. 4 is the profile of the operating principle of explanation transport platform.
Fig. 5 A and Fig. 5 B are that the position of the retaining hole of the parts installation site of printed base plate and template concerns key diagram.
Fig. 6 is the profile of the critical piece of template and transport platform.
Fig. 7 has the action schematic diagram that falls chip part on template in the existing chip component installation device.
Fig. 8 is from the template of Fig. 7 action schematic diagram to printed base plate mounting core chip part.
See also Fig. 1 to shown in Figure 3, on the stand 10 of chip component installation device, be fixed with XY worktable 11, upload in this XY worktable 11 and be equipped with first to the 3rd transport platform 12,13,14.Above XY worktable 11, be equipped with a plurality of funnels 15, in these funnels 15, contain chip part.Each funnel 15 is connected with winding displacement dish 17 on being installed in stand 10 by guide pipe 16, is that parts are supplied with stage S1 under the winding displacement dish 17 of component parts supply mean.The video camera 19 of absorbing unit 18 and a pair of shooting usefulness is installed on stand 10, is erection stage S2 under absorbing unit 18.Be portrait cognitive phase S3 under the video camera 19 of two shooting usefulness, this portrait cognitive phase S3 is positioned at the straight line bilateral symmetry position that parts supply stage S1 and erection stage S2 connect into.Situation as shown in fig. 1, absorbing unit 18 moves to the right, and the video camera 19 of the shooting usefulness on right side has just omitted.Have again in the front side of XY worktable 11, be equipped with two conveyers 20, carry printed base plate 21 by this conveyer 20.Between two conveyers 20, give row stage S4 for substrate.
As shown in Figure 4, XY worktable 11 has the fixed part of two-dimensional linear motor, is formed with several protuberances 22a on its stator 22 of being made up of the high magnetic permeable material of pure iron etc., for example forms clathrate in the 1mm pitch, by the surface of resin molding 23 covering stators 22.The the 1st to the 3rd transport platform 12,13,14 constitutes the movable part of two-dimensional linear motor, on the rotor of forming by the nonmagnetic substance of aluminium etc. 24, embed a plurality of magnetic cores 25 with sinker dentation end face, each protuberance 22a of this sinker dentation end face relative stator 22 has some relative phase differences.Be wound with coil 26 on each magnetic core 25, by the direction and the size of these coil 26 control supplying electric currents, first to the 3rd transport platform 12,13,14 for example at 0.01mm pitch scale, can move freely at two-dimensional directional on XY worktable 11.Because be blown into the pressure-air that forms the air gap at stator 22 and 24 of rotors, on XY worktable 11 so first to the 3rd transport platform 12,13,14 can slide mobile.
On first transport platform 12 and second transport platform 13, be fixed with template 27 respectively, as shown in Figure 6, on template 27, be formed with several retaining holes 27a that accommodates usefulness that accommodates chip part 28.1.-4. first transport platform 12 circulates at the circulating path of the left-half of Fig. 3 and moves, and 5.-8. second transport platform 13 circulate mobile at the right half part circulating path of Fig. 3.First and second transport platform 12,13 moves with mutual different circulating path like this.Upload in the 3rd transport platform 14 and to be equipped with printed base plate 21, the 3rd transport platform 14 moves back and forth between row stage S4 at erection stage S2 and the substrate of Fig. 3, as described later, at erection stage S2, the chip part 28 that is installed on the printed base plate 21 is to move at two-dimensional directional.
Shown in Fig. 5 A and Fig. 5 B, the formation position of retaining hole 27a is differed one corresponding on the parts installation site of chip part 28 on the printed base plate 21 and template 27, each retaining hole 27a is distributed at two-dimensional directional in the parts installation site of chip part 28 relatively, forms retaining hole 27a on every group.That is,, under possible situation, separate mutual parts installation site, be a plurality of installation sites group, for example cut apart four installation site group A-D as considering the packing density of parts installation site on Fig. 5 printed base plate that A is shown in 21.Shown in Fig. 5 B, be divided into four zones of A-D above the template 27 for another example,, distribute the retaining hole 27a that forms corresponding installation site group A-D at each regional A-D.At the packing density of each the retaining hole 27a of each regional A-D on the template 27 be chip part 28 on the printed base plate 21 packing density 1/4, equally, the configuration density of the adsorption nozzle not shown in the figures of absorbing unit 18 also be chip part 28 on the printed base plate 21 packing density 1/4.
The following describes the action that constitutes the said chip apparatus for mounting component.
At first, work begins to allow first and second transport platform 12,13 be positioned at respectively on the XY worktable 11, for example moves to Fig. 3 upper left corner and the upper right corner, orientates the initial point of first and two transport platform 12,13 as.Supply with stage S1 to parts then and move first transport platform 12, supply with stage S1 at these parts, by guide pipe 16 and winding displacement dish 17, the chip part 28 that is housed in the funnel 15 falls in each retaining hole 27a of template 27 fixing on first transport platform 12.At this moment, second transport platform 13 is in above-mentioned origin position standby.
Like this, after chip part 28 falls within on the template 27 on first transport platform 12, the circulating path of first transport platform, 12 process Fig. 3 1., supplying with stage S1 from parts moves to portrait cognitive phase S3, then, 2., 3., 4. return supply stage S1 through circulating path, circulate mobile circulating path later on 1. one 4..Moreover, first transport platform 12 is supplied with stage S1 from parts and is moved to portrait cognitive phase S3, substitute first transport platform 12, second transport platform 13 is supplied with stage S1 from origin position to parts and is moved, and the chip part 28 that is housed in the funnel 15 falls in each retaining hole 27a of template 27 fixing on this second transport platform 13.After, second transport platform 13 lags behind for 1 to 3 operation of first transport platform 12, the circulating path of the mobile Fig. 3 that circulates simultaneously 5.-8., the template 27 on corresponding first and second transport platform 12,13 is carried out the action of defined in each stage.
That is, first transport platform 12 is supplied with stage S1 from parts and is moved to portrait cognitive phase S3, here, moves back and forth a little in the XY direction, and the chip part 28 among the retaining hole 27a of the template 27 on first transport platform 12 is vibrated.At this moment, by the direction and the size of supplying electric current on the control coil 26, can move back and forth first transport platform 12 according to amplitude and the various spread pattern of acceleration.That is, in each retaining hole 27a of template 27, chip part 28 is laid across by vibration with various spread patterns, and the poor alignment phenomenon of chip 28 almost is eliminated.Then, at portrait cognitive phase S3, whether the video camera 19 by shooting usefulness can be identified in has chip or situation such as does not lay across in each retaining hole 27a.
Then, first transport platform 12 moves to erection stage S2 from portrait cognitive phase S3, and at this erection stage S2, each chip 28 on the template 27 is adsorbed by the adsorption nozzle not shown in the figures of absorbing unit 18, takes out from retaining hole 27a.Distributing each retaining hole 27a of formation, the parts installation site of the not corresponding printed base plate 21 of chip part 28 that adsorbs on each adsorption nozzle on four regional A-D on the template 27.Whether first transport platform 12 is returned portrait cognitive phase S3 then, have chip part 28 not to be removed by portrait identification, if just do not return supply stage S1, falls into chip part 28 again in each retaining hole 27a of template 27.
The 3rd transport platform 14 is given row stage S4 at substrate, receiving printed base plate 21 backs from conveyer 20 moves to erection stage S2, at this erection stage S2, fixedly each chip part 28 of absorbing unit 18 sides of pasty state scolding tin not shown in the figures is used in the defined position on printed base plate 21.At this moment, it is one corresponding to differ in each chip part 28 of above-mentioned absorbing unit 18 sides and the parts installation site of printed base plate 21, at erection stage S2, move the 3rd transport platform 14 with two-dimensional directional, at each chip part 28 of defined fixed-site absorbing unit 18 sides of printed base plate 21.For example move the 3rd transport platform 14 each regional A, B, C, the D of gang form 27 in order, on the printed base plate 21 at first behind the corresponding region A fixed chip 28, corresponding region B, C, D fixed chip 28 in turn, corresponding all installation sites group A-D fixed chip parts 28 on printed base plate 21 at last again.The 3rd transport platform 14 moves for row stage S4 from erection stage S2 to substrate then, gives row stage S4 at this substrate, the printed base plate 21 of each chip part 28 is installed is discharged to conveyer 20 from the 3rd transport platform 14.
For the template 27 on second transport platform 13, all carry out identical action in each stage, but the second above-mentioned transport platform 13 lags behind for first to the 3rd operation of first transport platform 12,5.-8. circulate with different circulating paths with first transport platform 12 simultaneously and move, for example: 4. first transport platform 12 moves to circulating path, when supplying with stage S1 facing to parts, 7. second transport platform 13 moves to circulating path, facing to portrait cognitive phase S3.Therefore, when the template 27 on for example relative second transport platform 13 finds that chip part 28 arrangements are bad, only need second transport platform 13 on the mobile XY worktable 11 of calibration phase S5 (consulting Fig. 3) from portrait cognitive phase S3, revise stage S5 at this, allow second transport platform 13 stop and revising, first transport platform 12 and the 3rd transport platform 14 are moved as described above like that, and printed base plate 21 can mounting core chip part 28 relatively.In contrast, when stopping first transport platform 12, second transport platform 13 and the 3rd transport platform 14 move as described above like that, and printed base plate 21 can mounting core chip part 28 relatively.
In the above-described embodiments, parts are supplied with between stage S1 and the erection stage S2 situation that moves first and second transport platform 12,13 with mutual different circulating paths and are illustrated, running rate is higher, no matter use which side and the 3rd transport platform 14 of first and second transport platform 12,13 can be on printed base plate 21 mounting core chip part 28.
In the foregoing description, the parts installation site of printed base plate 21 is divided into four groups, on template 27, distribute the situation of corresponding four groups of retaining hole 27a to illustrate, but the number of cutting apart of parts installation site is not limited only to four groups, the packing density of the chip part 28 on the corresponding printed base plate 21, the parts installation site of cutting apart printed base plate 21 also can be a plurality of groups beyond four groups.
The invention process produce following effect after the above-mentioned structure.
Chip component installation device of the present invention, the parts installation position of its corresponding printed base plate Being housed in of putting and fall and arrange in several retaining holes that are formed on the template is multiple Chip part in several funnels, carry this template under the absorbing unit after, use A plurality of adsorption nozzles of this absorbing unit, absorbent core chip part in the retaining hole, and to This chip part is installed in the defined position of printed base plate, wherein, and above-mentioned printed base plate The parts installation site is divided into a plurality of groups, distributes the maintenance of above-mentioned template at two-dimensional directional The hole is formed in above-mentioned each group, to the above-mentioned printing of above-mentioned moving in two dimensional directions retaining hole Substrate is installed the chip that above-mentioned adsorption nozzle adsorbs at above-mentioned every group printed base plate Parts. Not only can make each retaining hole of template than the installation of chip part on the printed base plate Density is low, and each adsorption nozzle of absorbing unit also can low-density the ground configuration, can hold The change places high-density installation of corresponding chip part.
Moreover, the fixed part of two-dimensional linear motor by XY worktable consist of, two-dimensional linear The movable part of motor is consisted of, is moved under absorbing unit by at least two transport platform Template on the moving transport platform, the printing on another transport platform of moving in two dimensional directions Substrate, the free degree of the circulating path in the time of can improving template and move simultaneously can be correct Proofread and correct the relative position of each nozzle and printed base plate.
Claims (2)
1, a kind of chip component installation device, the parts installation site of its corresponding printed base plate, and fall and arrange in several retaining holes on being formed on template be housed in chip part in a plurality of funnels, after carrying this template under the absorbing unit, a plurality of adsorption nozzles with this absorbing unit, absorbent core chip part in the retaining hole, and this chip part is installed to the defined position of printed base plate, it is characterized in that, the parts installation site of cutting apart above-mentioned printed base plate, be a plurality of groups, the retaining hole of on two-dimensional directional, distributing above-mentioned template, retaining hole is formed in above-mentioned each group, move above-mentioned printed base plate at two-dimensional directional, the chip part that adsorbs on the above-mentioned adsorption nozzle is being installed on the above-mentioned printed base plate by above-mentioned each group.
2, chip component installation device according to claim 1, it is characterized in that, its XY worktable by the fixed part that constitutes the two-dimensional linear motor, at least two transport platform that constitute the movable part of two-dimensional linear motor are formed, and move above-mentioned template and above-mentioned printed base plate respectively by these transport platform.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17592897A JP3512598B2 (en) | 1997-07-01 | 1997-07-01 | Chip component mounting device |
| JP175928/1997 | 1997-07-01 | ||
| JP175928/97 | 1997-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1208323A true CN1208323A (en) | 1999-02-17 |
| CN1104833C CN1104833C (en) | 2003-04-02 |
Family
ID=16004710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98102757A Expired - Fee Related CN1104833C (en) | 1997-07-01 | 1998-07-01 | Chip part mounting apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3512598B2 (en) |
| KR (1) | KR100300837B1 (en) |
| CN (1) | CN1104833C (en) |
| GB (1) | GB2326980B (en) |
| MY (1) | MY121750A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950873A (en) * | 2019-06-05 | 2022-01-18 | 株式会社富士 | Component supply device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004028816A1 (en) * | 2002-09-30 | 2004-04-08 | Sony Corporation | Method and device for positioning electronic components |
| KR101000004B1 (en) | 2004-12-24 | 2010-12-09 | 미래산업 주식회사 | Parts Mounting Method |
| CN110139500B (en) * | 2019-05-28 | 2021-11-23 | 铜陵金基科技有限公司 | SMT chip mounter and chip mounting production process thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694800A (en) * | 1979-12-28 | 1981-07-31 | Taiyo Yuden Kk | Method and device for mounting electronic part |
| US4528747A (en) * | 1982-12-02 | 1985-07-16 | At&T Technologies, Inc. | Method and apparatus for mounting multilead components on a circuit board |
| US4548667A (en) * | 1984-03-28 | 1985-10-22 | Wical Robert M | Planned coordinate component placement system |
| KR920002278B1 (en) * | 1988-02-15 | 1992-03-20 | 다이요유덴 가부시끼가이샤 | Mounting apparatus for chip-shaped curcuit component |
-
1997
- 1997-07-01 JP JP17592897A patent/JP3512598B2/en not_active Expired - Fee Related
-
1998
- 1998-05-15 GB GB9810318A patent/GB2326980B/en not_active Expired - Fee Related
- 1998-06-30 MY MYPI98002986A patent/MY121750A/en unknown
- 1998-06-30 KR KR1019980025439A patent/KR100300837B1/en not_active IP Right Cessation
- 1998-07-01 CN CN98102757A patent/CN1104833C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113950873A (en) * | 2019-06-05 | 2022-01-18 | 株式会社富士 | Component supply device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1104833C (en) | 2003-04-02 |
| GB2326980A (en) | 1999-01-06 |
| JPH1126989A (en) | 1999-01-29 |
| MY121750A (en) | 2006-02-28 |
| GB9810318D0 (en) | 1998-07-15 |
| GB2326980B (en) | 2002-01-16 |
| JP3512598B2 (en) | 2004-03-29 |
| KR100300837B1 (en) | 2001-09-06 |
| KR19990013480A (en) | 1999-02-25 |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |