JPH1126989A - Chip component mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily cope with high density mounting of chip components, by mounting each chip component on a specified position of a printed board, while moving the board in the two-dimensional direction. SOLUTION: The mount density of component mounting positions on a printed wiring board is taken into account, and four mounting position groups A-D are set by division, so as to separate mutual component mounting positions to the utmost. On the other hand, the upper surface of a template 27 is divided into four regions A-D, and holding holes 27a corresponding to the mounting position groups A-D are dispersedly formed in the respective regions A-D. When a chip component sucked by a suction nozzle is mounted on the printed board, it is moved in the two-dimensional direction by a carriage stand, and the chip component is mounted on a specified position of the printed board. Thereby high density mounting of chip components is easily realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting apparatus for mounting a chip component having no lead wire, such as a resistor and a capacitor, at a predetermined position on a printed circuit board.
The present invention relates to a chip component mounting apparatus called a multi-mounter for mounting a large number of chip components on a printed circuit board simultaneously by one operation.

[0002]

2. Description of the Related Art FIGS. 7 and 8 illustrate a conventional example of this type of chip component mounting apparatus, which is disclosed in Japanese Patent Publication No. 3-15835. As shown in FIG. 7, a plurality of hoppers 1 are arranged on a component supply stage of the chip component mounting apparatus, and a large number of chip components 2 are stored in each hopper 1. Each hopper 1 is connected to a positioning plate 4 via a guide pipe 3, and a template 5 is arranged below the positioning plate 4. The template 5 includes a guide plate 5a and a base plate 5b integrated with each other, and a large number of holding holes 6 are formed in the upper guide plate 5a. Further, the template 5 can be moved up and down by a driving source (not shown), and is conveyed to a mount stage by a feed belt (not shown). As shown in FIG. A suction unit having a plurality of suction nozzles 7 is provided on the stage.

In the chip component mounting apparatus configured as described above, first, the template 5 is mounted on the component supply stage.
Is lifted up by a driving source and superimposed on the positioning plate 4, and the chip component 2 is sent out from the hopper 1 to the guide pipe 3 in this state, whereby the chip component 2 is passed through the positioning plate 4 into the holding hole 6 of the template 5. Fall. After dropping the chip component 2 into each holding hole 6 of the template 5 as described above, the template 5 is placed on a feed belt (not shown) and transported to the mount stage. The chip component 2 is placed in the holding hole 6 in a state of lying down. Next, after each chip component 2 is sucked up from the holding hole 6 of the template 5 by the suction nozzle 7 on the mount stage, the printed circuit board 8 is supplied just below the suction nozzle 7 as shown in FIG. The component 2 is temporarily fixed on a paste-like solder 9 previously applied to a predetermined position on a printed circuit board 8. Thereby, the chip component 2 is moved from the template 5 to the printed circuit board 8.
Then, by heating the printed board 8 in a reflow furnace, the paste solder 9 is melted and the electrodes of the chip component 2 are soldered to the lands of the printed board 8.

Therefore, according to the chip component mounting apparatus configured as described above, after the chip component 2 is dropped into each holding hole 6 of the template 5 at the component supply stage, the template 5 is moved to the mount stage by the feed belt. Since each chip component 2 can be transferred from the holding hole 6 of the template 5 to the printed board 8 on the mount stage, the holding hole 6 corresponding to the quantity and position of the chip component 2 mounted on the printed board 8 5, a large number of chip components 2 can be simultaneously mounted on the printed circuit board 8 by one operation.

[0005]

In the above-described conventional chip component mounting apparatus, the position of each chip component 2 mounted on the printed board 8 and each holding hole 6 formed in the template 5 are one-to-one. Therefore, as the mounting state of the chip components 2 on the printed circuit board 8 becomes higher in density, it is necessary only to form a large number of holding holes 6 close to the template 5. In addition, since a large number of suction nozzles 7 for sucking the chip components 2 must be arranged close to each other, there is a problem that it is impossible to cope with high-density mounting of the chip components 2.

[0006]

According to the present invention, a component mounting position of a chip component mounted on a printed circuit board is divided into a plurality of groups, and holding holes corresponding to these groups are previously formed in a template in a two-dimensional direction. Sort and form for each group,
After the chip components in the holding holes are sucked by the suction nozzle of the suction unit, each chip component is mounted at a predetermined position on the board while moving the printed board in the two-dimensional direction.
With this configuration, not only the holding holes of the template can be made coarser than the mounting density of the chip components on the printed circuit board, but also the suction nozzles of the suction unit can be arranged in a rough state. It is possible to easily cope with high-density mounting.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a chip component mounting apparatus according to the present invention, chip components stored in a plurality of hoppers are dropped into a large number of holding holes formed in a template corresponding to component mounting positions on a printed circuit board. In the chip component mounting apparatus, after the template is conveyed to a position directly below the suction unit, the chip components are suctioned from the holding holes by a plurality of suction nozzles of the suction unit and mounted at a predetermined position on the printed circuit board, The component mounting position of the printed circuit board is divided into a plurality of groups, the holding holes of the template are distributed in the two-dimensional direction to form the respective groups, and the printed circuit board is moved in the two-dimensional direction to move the suction nozzle to the suction nozzle. The suctioned chip components are mounted on the printed circuit board for each of the groups.

As means for transporting the template directly below the suction unit, an XY table constituting a fixed portion of the two-dimensional linear motor and at least two transport tables constituting a movable portion of the two-dimensional linear motor are provided. When the template is moved directly below the suction unit on the carrier, and the printed circuit board is moved two-dimensionally on the other carrier,
The degree of freedom of the circulation path when the template moves can be increased, and the relative position between each suction nozzle and the printed circuit board can be accurately corrected.

[0009]

Embodiments will be described with reference to the drawings.
FIG. 1 is a front view of a chip component mounting apparatus according to an embodiment, and FIG.
FIG. 3 is a side view of the mounting device, FIG. 3 is a plan view schematically showing a moving path of a carrier provided in the mounting device, FIG. 4 is a cross-sectional view illustrating the operation principle of the carrier, and FIG. FIG. 6 is an explanatory view showing a relationship between the component mounting position and the position of the holding hole of the template. FIG.

As shown in FIGS. 1 to 3, an XY table 11 is fixed on a gantry 10 of a chip component mounting apparatus, and first to third transfer tables 12, 13, 14 are mounted on the XY table 11. Is placed. XY table 11
A plurality of hoppers 15 are disposed above the hopper 15, and chip components are stored in these hoppers 15. Each hopper 1
Numeral 5 is connected to an arrangement board 17 attached to the gantry 10 via a guide pipe 16, and a component supply stage S1 is located immediately below the arrangement board 17 constituting component supply means. A suction unit 18 and a pair of imaging cameras 19 are mounted on the gantry 10, and a mount stage S2 is located immediately below the suction unit 18. Immediately below both imaging cameras 19 are image recognition stages S3, and these image recognition stages S3 are located symmetrically with respect to a straight line connecting the component supply stage S1 and the mount stage S2. However, in FIG. 1, for convenience of illustration, the suction unit 18 is shown shifted to the right, and the imaging camera 19 on the right is not shown. Further, two conveyors 20 are arranged on the front side of the XY table 11, and the printed circuit boards 21 are transported by the conveyors 20. A substrate supply / discharge stage S4 is provided between the two conveyors 20.

[0011] As shown in FIG.
A plurality of projections 22a are formed in a grid at a pitch of, for example, 1 mm on a stator 22 made of a material having high magnetic permeability such as pure iron. It is covered with a resin coat 23. On the other hand, the first to third transfer tables 12, 13, and 14 constitute a movable portion of a two-dimensional linear motor, and a plurality of magnets having a comb-shaped end surface on a movable element 24 made of a nonmagnetic material such as aluminum. A core 25 is incorporated, and these comb-shaped end faces are opposed to the respective protrusions 22 a of the stator 22 with a slight phase difference. Each magnet core 25
A coil 26 is wound around the XY table 11 by controlling the direction and magnitude of a current supplied to the coil 26 so that the first to third transfer tables 12, 13, 14 It can move freely in two-dimensional directions at intervals of 0.01 mm. Since high-pressure air that forms an air gap between the stator 22 and the mover 24 is blown out, the first to third transfer tables 12, 13, and 14 smoothly move on the XY table 11. Go to

A template 27 is fixed on each of the first transfer table 12 and the second transfer table 13, and as shown in FIG.
Are formed in a large number. The first transfer table 12 circulates along the left half circulation path of FIG. 3, and the second transfer table 13 moves in the right half circulation path of FIG.
To circulate. Thus, the first and second transfer tables 1
2 and 13 move on different circulation paths. On the other hand, a printed circuit board 21 is placed on the third transfer table 14, and the third transfer table 14 reciprocates between the mount stage S2 and the substrate supply / discharge stage S4 in FIG. It moves and moves in a two-dimensional direction when the chip component 28 is mounted on the printed board 21 on the mount stage S2 as described later.

As shown in FIG. 5, the component mounting position of the chip component 28 on the printed circuit board 21 and the template 2
7 does not correspond one-to-one with the formation positions of the holding holes 27a, and the holding holes 27a are distributed in the two-dimensional direction with respect to the component mounting position of the chip component 28 and are formed for each group. In other words, as shown in FIG. 5A, in consideration of the mounting density of the component mounting positions on the printed circuit board 21, a plurality of mounting position groups, such as four mounting positions, are set so that the component mounting positions are separated from each other as much as possible. Divide into groups AD. On the other hand, as shown in FIG.
7 is divided into four regions A to D, and each region A to D
The holding holes 27a corresponding to the mounting position groups A to D are separately formed. As a result, the mounting density of each holding hole 27a for each of the regions A to D in the template 27 becomes 1/4 of the mounting density of the chip component 28 on the printed circuit board 21, and similarly, the suction unit (not shown) of the suction unit 18 The arrangement density of the nozzles is also 1/4 of the mounting density of the chip components 28 on the printed circuit board 21.

Next, the operation of the chip component mounting apparatus constructed as described above will be described. First, prior to the start of the work, the first and second transfer tables 12 and 13 are moved to predetermined positions on the X and Y tables 11 respectively. The position is moved to, for example, the upper left corner and the upper right corner in FIG. 3, and the origins of the first and second transfer tables 12 and 13 are aligned. Thereafter, the first transfer table 12 is moved to the component supply stage S1, and in the component supply stage S1, each of the holding holes 27a of the template 27 fixed on the first transfer table 12 is placed in the hopper 15. The stored chip parts 28 are transferred to the guide pipe 16 and the arrangement board 17.
Fall through. At this time, the second transfer table 13 is waiting at the above-described origin position.

After dropping the chip component 28 onto the template 27 on the first carrier 12 in this manner, the first carrier 12 is moved to the component supply stage S through the circulation path shown in FIG.
1 to the image recognition stage S3, and then return to the component supply stage S1 via the circulation path,
Thereafter, the circulation route is circulated. When the first transfer table 12 moves from the component supply stage S1 to the image recognition stage S3, the second transfer table is replaced with the second transfer table 12 instead of the first transfer table 12.
Is moved from the origin position to the component supply stage S1, and the chip component 28 stored in the hopper 15 is dropped into each holding hole 27a of the template 27 fixed on the second transfer table 13. I do. Thereafter, the second transfer table 13
Circulates through the circulation path 1 to 3 in FIG. 3 with a delay of one to three steps with respect to the first transfer table 12, and moves the template 27 on the first and second transfer tables 12 and 13 at each stage by a predetermined amount. The operation is performed.

That is, when the first transfer table 12 moves from the component supply stage S1 to the image recognition stage S3, the first transfer table 12 is slightly reciprocated in the X and Y directions, and the holding holes 27a of the template 27 on the first transfer table 12 are moved. Inside chip part 2
8 vibrates. At this time, by controlling the direction and magnitude of the current supplied to the coil 26, the first transfer table 12 can be reciprocated in various patterns having different amplitudes and accelerations. Therefore, the chip components 28 also vibrate in various patterns in the respective holding holes 27a of the template 27 and fall down, and the misalignment of the chip components 28 is almost eliminated. Thereafter, the image pickup camera 19 in the image recognition stage S3 uses the imaging camera 19 to determine whether or not the chip component 28 is present in each holding hole 27a, whether the chip component 28 is lying down sideways, and the like.
Are recognized as images.

Next, when the first transfer table 12 moves from the image recognition stage S3 to the mount stage S2, the chip components 28 on the template 27 are moved by the respective suction nozzles (not shown) of the suction unit 18 at the mount stage S2. It is sucked and taken out from the holding hole 27a. Here, since each holding hole 27 a is formed by being divided into four regions A to D on the template 27, the chip components 28 sucked by the suction nozzles do not correspond to the component mounting positions of the printed circuit board 21. . Then, the first transfer table 1
2 returns to the image recognition stage S3, and the presence or absence of a chip component 28 removal failure is image-recognized. If there is no failure, the process returns to the component supply stage S1, and the chip component 28 falls again into each holding hole 27a of the template 27. .

On the other hand, the third transfer table 14 receives the printed circuit board 21 from the transfer conveyor 20 at the substrate supply / discharge stage S4, and then moves to the mount stage S2, where each chip component on the suction unit 18 side is mounted at the mount stage S2. 2
8 is temporarily fixed at a predetermined position on the printed circuit board 21 using paste solder (not shown). At this time, as described above, each chip component 28 on the suction unit 18 side is
Since the third mounting table S2 is moved two-dimensionally on the mount stage S2, the chip components 28 on the suction unit 18 side Temporarily fixed in position. For example,
When the third carriage 14 is moved in the order of A, B, C, and D in accordance with each area of the template 27, the printed board 21
First, the chip components 28 corresponding to the region A are temporarily fixed, and then the chip components 28 corresponding to the regions B, C, and D are temporarily fixed sequentially, and finally, all the mounting position groups A on the printed circuit board 21. The chip components 28 corresponding to .about.D are temporarily fixed. Thereafter, the third transfer table 14 moves from the mount stage S2 to the substrate supply / discharge stage S4, and the printed circuit board 21 on which the chip components 28 are mounted is transferred from the third transfer table 14 at the substrate supply / discharge stage S4. Conveyor 2
Discharged to zero.

The same operation is performed at each stage on the template 27 on the second carrier 13, but the second carrier 13 is moved relative to the first carrier 12 as described above. The first transfer table 12 is delayed by one to three steps.
Reciprocating along a circulation path different from the above, for example, the first transfer table 12 moves along the circulation path to
When moving toward 1, the second transfer table 13 moves along the circulation path and moves toward the image recognition stage S3. Therefore, for example, the template 2 on the second transfer table 13
In the case where the misalignment of the chip component 28 is found with respect to the X7, only the second carrier 13 is moved from the image recognition stage S3 to the correction stage S5 on the X, Y table 11 (see FIG. 3).
To the second transfer table 13 in this correction stage S5.
If the first and third transfer tables 12 and 14 are moved as described above while the correction is stopped and the chip components 28 can be mounted on the printed circuit board 21. Conversely, while the first carrier 12 is stopped, if the first carrier 13 and the third carrier 14 are moved as described above, the chip 28 can be implemented.

In the above embodiment, the case where the first and second transfer tables 12 and 13 are moved along different circulation paths between the component supply stage S1 and the mount stage S2 has been described. Although slightly reduced, the chip component 28 may be mounted on the printed circuit board 21 using one of the first and second carriers 12 and 13 and the third carrier 14.

In the above embodiment, the printed circuit board 21
Is described in which the component mounting positions are divided into four groups, and the holding holes 27a corresponding to the four groups are allocated to the template 27 and formed in each group. However, the number of divisions of the component mounting positions is limited to four groups. Needless to say, the component mounting positions of the printed board 21 may be divided into a plurality of groups other than four according to the mounting density of the chip components 28 on the printed board 21.

[0022]

The present invention is embodied in the form described above and has the following effects.

The chip components housed in the plurality of hoppers are dropped and aligned in a large number of holding holes formed in the template corresponding to the component mounting positions on the printed circuit board,
After transporting this template directly below the suction unit,
In a chip component mounting apparatus for mounting a chip component at a predetermined position on a printed circuit board by sucking a chip component from a holding hole with a plurality of suction nozzles of the suction unit, the component mounting position of the printed circuit board is divided into a plurality of groups, and the template The holding holes are distributed in the two-dimensional direction to form the respective groups, and the printed board is moved in the two-dimensional direction to mount the chip components sucked by the suction nozzles on the printed board in the respective groups. With this configuration, not only the holding holes of the template can be made coarser than the mounting density of the chip components on the printed circuit board, but also the suction nozzles of the suction unit can be arranged in a rough state, so that the height of the chip components can be reduced. It is possible to easily cope with density mounting.

An XY table constituting a fixed part of the two-dimensional linear motor, and at least two carriages constituting a movable part of the two-dimensional linear motor are provided, and one of the carriages moves the template directly below the suction unit. By moving the printed circuit board in the two-dimensional direction using the other carrier, the degree of freedom of the circulation path when the template moves can be increased, and the relative position between each suction nozzle and the printed circuit board can be accurately corrected. be able to.

[Brief description of the drawings]

FIG. 1 is a front view of a chip component mounting apparatus according to an embodiment.

FIG. 2 is a side view of the mounting device.

FIG. 3 is a plan view schematically showing a moving path of a carrier provided in the mounting device.

FIG. 4 is a cross-sectional view illustrating the operation principle of the transfer table.

FIG. 5 is an explanatory diagram showing a relationship between a component mounting position on a printed circuit board and a position of a holding hole of a template.

FIG. 6 is a cross-sectional view showing a main part of the template and a transfer table.

FIG. 7 is an explanatory diagram showing an operation of dropping a chip component onto a template provided in a conventional chip component mounting apparatus.

8 is an explanatory diagram illustrating an operation of mounting a chip component on a printed circuit board from the template of FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 XY table 12 1st conveyance stand 13 2nd conveyance stand 14 3rd conveyance stand 15 Hopper 16 Guide pipe 17 Arrange board 18 Suction unit 19 Imaging camera 20 Conveyor 21 Printed board 22 Stator 24 Mover 25 Magnet Core 26 Coil 27 Template 27a Holding hole 28 Chip component S1 Component supply stage S2 Mount stage S3 Image recognition stage S4 Substrate supply / discharge stage

Claims (2)

[Claims] 1. A chip component stored in a plurality of hoppers is dropped and aligned in a number of holding holes formed in a template corresponding to component mounting positions on a printed circuit board.
After transporting this template directly below the suction unit,
In a chip component mounting apparatus that suctions chip components from inside the holding holes with a plurality of suction nozzles of the suction unit and mounts the chip components at predetermined positions on a printed circuit board, dividing the component mounting position of the printed circuit board into a plurality of groups;
The holding holes of the template are distributed in the two-dimensional direction for each of the groups, and the printed circuit board is moved in the two-dimensional direction, and the chip components sucked by the suction nozzles are transferred to the printed circuit board for each of the groups. A chip component mounting device characterized by mounting. 2. The template and the printed circuit board according to claim 1, further comprising: an XY table that forms a fixed portion of the two-dimensional linear motor, and at least two carriers that form a movable portion of the two-dimensional linear motor. The chip component mounting device is configured to move each of these on these transport tables.