JP3196596B2 - Electronic component manufacturing method and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention is suitable electronic component manufacturing method and an electronic attached to the production of electronic components with bump
It relates to a component mounting method .

[0002]

2. Description of the Related Art In recent years, electronic components having bumps have been widely used. In this electronic component, the bumps are mounted on the electrodes formed on the upper surface of the substrate and joined, but due to the structure of this electronic component, when forming the bumps, the surface on which the bumps are formed faces upward. In the case of performing a bump formation process and inspecting the characteristics of electronic components or mounting the components on a substrate, the bumps need to be supplied to the mounting line with the bumps facing downward. For this reason, conventionally, a plurality of electronic components are mounted on a carrier with the surface on which the bumps are formed facing upward, the carrier is sent to a bump forming line to form the bumps, and the electronic components on which the bumps are formed are taken out of the carrier. After being turned upside down, it was stored in a tray for installation and sent out to the inspection process and mounting process together with the tray.

[0003]

However, the conventional method requires a carrier and a tray for transporting electronic components. In addition, unnecessary work and cost are required because the operation of taking out the electronic component from the carrier, turning it over, and storing it in a tray is performed.

[0004] The present invention is to abolish the tray, also an object to provide a reversing method easily Ru electron can be done component manufacturing operations and the electronic component mounting method of the electronic component.

[0005]

[0006]

According to a method of manufacturing an electronic component of the present invention, one side on which bumps are formed faces upward,
A mounting step of mounting an electronic component on a first mounting portion formed on one surface of the carrier, a bump forming step of forming a bump on one electrode, and a carrier mounting the electronic component on which the bump is formed. A plurality of superimposing steps, inverting the plurality of superimposed carriers upside down, facing the first mounting portion, and facing one side to the second mounting portion formed on the other surface on the back side of one surface of the carrier. And a reversing step of mounting the electronic component in the state described above.

Further, according to the electronic component mounting method of the present invention, there is provided a step of mounting an electronic component on a first mounting portion formed on one surface of a carrier with one surface on which bumps are formed facing upward, A step of forming a bump on the electronic component mounted on the substrate, a step of stacking a plurality of carriers on which the electronic component with the bump formed is mounted, and inverting the stacked carrier up and down, thereby forming one surface of the carrier. Mounting the electronic component in a state in which one side having the bumps formed on the second mounting portion formed on the other surface on the back side of the electronic component is faced down; The method includes a step of supplying the electronic component from the carrier to the component mounting apparatus, and mounting the electronic component on a substrate.

[0008]

According to the above arrangement, the electronic component is first mounted on each of the plurality of first mounting portions provided on the carrier with one surface on which the bumps are formed facing upward. And
In this state, a bump is formed on each electronic component.

[0009] Then, a plurality of carriers on which the electronic components on which the bumps are formed are mounted on one another, and the stacked carriers are turned upside down at once. Then, the vertical relationship between the first mounting portion and the second mounting portion facing the first mounting portion is reversed. Thus, the electronic component mounted on the first mounting portion is held by the second mounting portion. At this time,
One side of the electronic component, on which the bumps are formed, faces downward.

When the electronic component is mounted on a substrate, the carrier is supplied to the electronic component mounting apparatus together with the carrier turned upside down, and the electronic component is mounted on the substrate by the electronic component mounting apparatus.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a carrier according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along line XX of FIG. 1, and FIG.
FIG. 3 is a perspective view of the carrier according to the first embodiment of the present invention as viewed from the back side.

In FIG. 1, reference numeral 1 denotes a plate-shaped carrier made of a heat-resistant material, and one surface A is in an upward state. Reference numeral 2 denotes a first mounting portion formed on one surface A side (four places in this embodiment), and the first mounting portion 2 has a shape recessed from one surface A side of the carrier 1 downward. , First
Around the mounting portion 2, an inclined surface 3 having the same taper as an inclined surface of a mold body of an electronic component described later is formed. 4 is a notch. On the other side of the carrier 1, FIG.
As shown in FIG. 2, a second mounting portion 5 is provided so as to be positioned upside down from the first mounting portion 2. The second mounting portion 5 is also formed to have a slightly concave shape from the other surface, the central portion being the lowest concave portion 7, and the step 6 being formed at a position one step higher than this. Reference numeral 8 denotes a step formed on one surface A and engaging with the notch 4 of the other carrier 1.

FIG. 4 is a perspective view of a solder bump forming line in the first embodiment of the present invention. In FIG.
Is provided over the entire bump formation line, and the carrier 1
Is a conveyor that conveys in a straight line.

On the upstream side of the conveyor 9, the carrier 1 is placed with the surface on which the electronic component P forms the bumps facing upward.
The carrier 1 is stacked on a cart 10b and supplied to the loader 10. And loader 1
0 is a carrier holding head 1 that moves vertically and horizontally
The uppermost carrier 1 of the carriers 1 stacked at 0 a is picked up and placed on the conveyor 9.

Reference numeral 11 denotes a solder ball mounting device for mounting solder balls on electronic components on the carrier 1 sent by the conveyor 9 and a plurality of solder balls stored in the solder ball supply section 11a are simultaneously held by the suction head 11a. And mount it on the electronic component P. Reference numeral 12 denotes a heating device for forming solder bumps by melting and solidifying the mounted solder balls, and 13 denotes an inspection device for observing the solder bumps formed by the camera 14 and inspecting the quality of the formation of the solder bumps. It is. Reference numeral 15 denotes an unloader that includes a carrier holding head 15a that moves vertically and horizontally, picks up the carrier 1 that has been inspected from the conveyor 9 and stacks the carrier 1 on a carriage 15b with the solder bumps facing upward. is there. The plurality of stacked carriers 1 is a trolley 1
Each 5b is sent to the next step.

Next, a method for manufacturing an electronic component using a carrier according to the first embodiment will be described with reference to FIG. First, as shown in FIG. 5A, the carrier 1 is held with one surface A facing upward, and the electronic component P is mounted on the first mounting portion 2 on the one surface A side. At this time, the substrate 16 of the electronic component P is oriented upward, that is, one side on which the bumps are formed is oriented upward, and the inclined surface 17a of the mold body 17 of the electronic component P is oriented to the inclined surface 3 of the first mounting portion 2. The electronic component P is positioned with respect to the carrier 1 by contact with the carrier 1. The carriers 1 on which the electronic components P are mounted are supplied in a state of being stacked on the loader 10 described above, and are loaded one by one on the conveyor 9 by the loader 10. Then, it is sent to the solder ball mounting device 11 by the conveyor 9.

Next, by the solder ball mounting device 11,
The solder balls 18 are mounted on the substrate 16 of the electronic component P. Then, as shown in FIG. 5C, the carrier 1 is put into the heating device 12, and the solder balls 18 are melted and solidified to form solder bumps 19. Then, the inspection of the solder bumps 19 is performed by the inspection device 13, and the solder bumps 19 are stacked by the unloader 15.

Then, as shown in FIG. 5D, the plurality of carriers 1 are stacked one above the other. At this time, the notch 4 of the lower carrier 1 and the step 8 of the upper carrier 1 are formed.
Are engaged, the carriers 1, that is, the electronic components P are arranged in the upper and lower tiers while being positioned respectively. In addition, right above the electronic component P, the second mounting portion 2 of the carrier 1 above the electronic component P is located exactly. An empty carrier 1 is stacked on the top of the stacked carriers 1. Then, as shown in FIG. 5E, the plurality of carriers 1 are turned upside down at the same time.
Then, the other surface B of the carrier 1 faces upward. However, until the state shown in FIG.
When the carrier 1 is inverted, the side on which the bump 19 is formed faces downward, and the electronic component P falls slightly downward, and the second part of the lower carrier 1 is held. It is held by the mounting unit 5. At this time,
The substrate 1 is placed on the substrate receiving surface 6 around the second mounting portion 5.
6, the electronic component P is positioned with respect to the carrier 1. The second mounting portion 5 has a substrate receiving surface 6.
A recess 7 which is one step lower than the
9 does not directly contact the carrier 1, and the bump 19 is accommodated in the concave portion 7 in a state of being floated from the carrier 1.

In this way, a large number of electronic components P can be turned upside down with the electronic components P mounted on the carrier 1 at a time.

The electronic component P can be placed on a shipping line together with the plurality of inverted carriers 1 or sent to a mounting line for the electronic component, and a line for inspecting the electrical characteristics of the electronic component P can be obtained. Can also be sent to Therefore, since the carrier 1 can be used as a tray for storing the electronic components P, the tray and the work of transferring to the tray, which have been conventionally required, can be eliminated.

Next, referring to FIG. 6, as shown in FIG. 5 (e), after the bumps 19 of the electronic component P are sent in a downward position, the electrical characteristics of the electronic component P are inspected. The steps will be described. Now, when the carrier 1 is sent to this inspection process, the carrier 1 holds the electronic component P in a state where the bumps 19 of the electronic component P face down (the mold body 17 faces up). In FIG. 6, reference numeral 20 denotes a transport conveyor that transports the carrier 1 in this state to the right side in FIG. Reference numeral 21 denotes a loader provided on the upstream side in the feed direction of the conveyor 20. The loader 21 places the carriers 1 on the transport conveyor 20 one by one. Reference numeral 22 denotes an inspection stage provided with a plurality of terminals 22a that contact the individual bumps 19 of the electronic component P.
X-axis 24, Y-axis 25 from carrier 1 carried in front of 2
The electronic component P is picked up and transferred to the inspection stage 22 by the transfer head 26 that moves. Inspection of the electrical characteristics and functions of the electronic component P is performed on the terminals 22.
This is performed by an inspection unit (not shown) connected to a. As a result of the inspection performed by the inspection stage 22, the defective electronic component P is discarded in a disposal box 23 arranged beside the inspection stage 22. The electronic component P having a good inspection result is returned to the carrier 1 again.
The sheets are stacked again by the unloader 27.

Next, with reference to FIG. 7, a description will be given of a process of mounting the carrier 1 having undergone the inspection of FIG. 6 on the circuit board 33. Reference numeral 30 denotes a carrier feeder in which the tested carriers 1 are stored in a plurality of stages.
, The carrier 1 is supplied to the electronic component mounting device 36 one by one. Numeral 31 denotes a mounting line, and
It is a conveyor for transferring the circuit boards 33 discharged one by one. A flux 35 (or cream solder) is applied to the circuit board 33 by a screen printing device 34 before being sent from the loader 32 to the electronic component mounting device 36. Then, as shown in FIG. 8A, the suction is performed by suction nozzles 40 moving in the vertical and horizontal directions from the carrier 1 supplied from the carrier feeder 30, and the electronic components P are mounted on the circuit board 33 one by one. You. The circuit board 33 on which the electronic components P have been mounted is mounted on the reflow device 37.
Then, as shown in FIG. 8B, the electronic component P is soldered to the circuit board 33, and the soldered circuit board 33 is stocked in the unloader 38 in a stacked state and discharged to the next step. Is done.

In the above-described inspection step and electronic component mounting step, the electronic component P is held and transported by the transfer head 26 and the suction nozzle 40 with the surface of the electronic component P on which the bumps 19 are formed facing down. For this reason, conventionally, the electronic components P are individually turned upside down and stored in a dedicated tray, and this tray is sent to an inspection line or an electronic component mounting line. However, if the carrier 1 of the present invention is used, the dedicated tray is used. Can be abolished,
In addition, since a plurality of electronic component P reversing operations can be performed at the same time, it is possible to reduce costs for managing the tray, reversing the reversing operation, and storing the components in the tray.

In the first embodiment, the solder bumps 19 are formed by mounting the solder balls 18 on the electronic components P. However, instead of the solder balls 18, cream solder is used by using a screen printing device or a dispenser. The solder bumps may be formed by applying to P and melting the cream solder.

Next, a second embodiment of the present invention will be described with reference to FIGS. The first mentioned above
The electronic component P in this embodiment has a mold body 17 formed by a mold, and the positional accuracy of the inclined surface 17a is high. Therefore, the electronic component P is positioned with reference to the inclined surface 17a.

However, some electronic components with bumps have a sealing portion 43 in which a resin is applied to one side of a substrate 42 as shown in FIG. 12 by, for example, potting and the resin is solidified. . In such an electronic component, the sealing portion 43 is formed from a gentle curved surface,
It is difficult to perform positioning based on this curved surface. For this reason, in the second embodiment, as shown in FIGS. 9 to 11, the first mounting portion 2 is provided on the one surface A side of the carrier 1. At the four corners, protrusions 4
1 is protruding. The configuration on the other surface B side is the first
The description is omitted because it is the same as that of the embodiment.

FIG. 12 also shows the electronic component Q side.
As shown in (a) and (b), a notch 42 a in which a corner of the electronic component Q is cut is provided at a position corresponding to the protrusion 41. Then, as shown in FIG. 13, the notch 42a is aligned with the protrusion 41, and the sealing portion 43 of the electronic component Q is moved to the first position.
In the mounting part 2 of the above.

In this way, as shown in FIG. 14A, the electronic component Q is positioned by the notch 42a and the projection 41, and the one surface A on which the bump 19 is formed faces upward. be able to. Hereinafter, the bumps 19 are formed on the substrate 42 in the same manner as in the first embodiment. In this way, the same manufacturing method as that of the first embodiment can be applied to the electronic component Q having no molded body formed by using a mold.

[0030]

According to the present invention, since the tray and the work of storing it in the tray, which have been required conventionally, can be eliminated, the manufacturing cost of electronic components can be reduced accordingly. In addition, since the electronic components are turned upside down in a state where a plurality of carriers are stacked, it is possible to easily perform the operation of turning over many electronic components at one time, thereby increasing the productivity of the electronic components.

[Brief description of the drawings]

FIG. 1 is a perspective view of a carrier according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a perspective view of the carrier according to the first embodiment of the present invention as viewed from the back side.

FIG. 4 is a perspective view of a solder bump forming line according to the first embodiment of the present invention.

5A is a process explanatory view of an electronic component manufacturing method using a carrier according to the first embodiment. FIG. 5B is a process explanatory view of an electronic component manufacturing method using a carrier according to the first embodiment. Process explanatory diagram of the electronic component manufacturing method using the carrier according to the first embodiment (d) Process explanatory diagram of the electronic component manufacturing method using the carrier according to the first embodiment (e) Using the carrier according to the first embodiment Process explanatory diagram of the electronic component manufacturing method

FIG. 6 is a perspective view of an inspection line according to the first embodiment of the present invention.

FIG. 7 is a perspective view of a mounting line according to the first embodiment of the present invention.

FIG. 8A is an explanatory view of a process of an electronic component manufacturing method using a carrier according to the first embodiment. FIG. 8B is an explanatory view of a process of an electronic component manufacturing method using a carrier according to the first embodiment.

FIG. 9 is a perspective view of a carrier according to a second embodiment of the present invention.

FIG. 10 is a sectional view taken along line YY of FIG. 9;

FIG. 11 is a perspective view of the carrier according to the second embodiment of the present invention as viewed from the back side.

FIG. 12A is a side view of an electronic component according to the second embodiment of the present invention. FIG. 12B is a bottom view of the electronic component according to the second embodiment of the present invention.

FIG. 13 is a partially enlarged perspective view of a carrier according to the second embodiment of the present invention.

FIGS. 14A and 14B are process explanatory views of an electronic component manufacturing method using a carrier according to the second embodiment; FIGS. 14B and 14B are process explanatory diagrams of an electronic component manufacturing method using a carrier according to the second embodiment;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier 2 1st mounting part 5 2nd mounting part 19 Bump A One surface P Electronic component Q Electronic component

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Claims (4)

(57) [Claims] 1. A mounting step of mounting an electronic component on a first mounting portion formed on one surface of a carrier with one surface on which a bump is formed facing upward, and then mounting a bump on the electrode on one surface. A step of forming a bump; a step of stacking a plurality of carriers on which the electronic components on which the bumps are formed; and a step of inverting the stacked plurality of carriers up and down so as to face the first mounting portion, and An inverting step of mounting the electronic component on a second mounting portion formed on the other surface on the back side of the one surface with the one surface facing downward. Wherein said bump forming step, mounting the solder balls on the electronic component, the electronic component manufacturing method according to claim 1, wherein the forming the solder balls heated to melt the bump. Wherein said bump forming step, a cream solder is applied to the electronic component, the electronic component manufacturing method according to claim 1, wherein the forming bumps melted by heating the cream solder. 4. A step of mounting an electronic component on a first mounting portion formed on one surface of a carrier with one surface on which a bump is formed facing upward, and A step of forming a bump on the electronic component; a step of stacking a plurality of carriers each having the electronic component on which the bump is formed; and inverting the stacked carrier upside down, so that the other of the back side of the one surface of the carrier is inverted. Mounting the electronic component on the second mounting portion formed on the surface of the electronic component with the one surface on which the bumps are formed facing downward, and mounting the carrier mounting the electronic component on the second mounting portion. An electronic component mounting method, comprising the steps of: supplying an electronic component to an apparatus; removing the electronic component from the carrier; and mounting the electronic component on a substrate.