JP2001257308A - Semiconductor device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device, with which alignment between thin-type semiconductor elements, each consisting of a wiring board and a chip and transfer, can be made easily, when stacking them and a carriage of them can also be made easily, and also provide a method of manufacturing the same. SOLUTION: The semiconductor device consists of a plurality of semiconductor elements as wiring boards, mounted with a semiconductor chip 11 which are stacked on an element substrate. The wiring boards 2, 3, 4, except for the first-layer wiring board 1 which is in contact with the element substrate, have cutouts 6. Regions 12 of the first-layer wiring board surrounded by the cutouts 6 are used as wiring board holding sections. The stacked wiring boards are carried with the wiring board holding sections formed in the first-layer wiring board which is chucked by a chucking nozzle of a chucking head. The chucking head can be equipped with a positioning pin, and the positioning pin can be equipped with a temperature sensor and a load sensor to manage processing points at the time of stacking, imparted with these functions for the pin and sensors.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a plurality of semiconductor elements mounted on a wiring board, stacking these wiring boards, and mounting the semiconductor element on an element substrate, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, packages of semiconductor devices have been tending to be packaged by stacking wiring boards on which semiconductor elements are mounted in response to demands for large capacity, high integration, and thinning. For example, a plurality of wiring boards having a plurality of connection electrodes and leads electrically connected to the connection electrodes are prepared, and a semiconductor element in which the plurality of connection electrodes are electrically connected to the leads of the wiring board is provided. There is a semiconductor device which is mounted on each wiring substrate, and a wiring substrate on which the semiconductor element is mounted is laminated on an element substrate on which external terminals are formed, and the external terminals are electrically connected to connection electrodes of the wiring substrate. .

[0003]

As described above, especially for the demand for thinning, the thickness of a semiconductor element formed of a wiring board on which a chip such as a silicon semiconductor on which elements and integrated circuits are formed is mounted. It becomes thin, for example, about 50 μm, and it is extremely difficult to align and transport a plurality of these thin semiconductor elements due to the difference in the level of each warp state of the semiconductor elements consisting of the wiring board and the chip. It was difficult. The present invention has been made in view of such circumstances, and provides a semiconductor device and a method for manufacturing the same, which can easily perform alignment and transport when stacking thin semiconductor elements including a wiring board and a chip. Things.

[0004]

SUMMARY OF THE INVENTION The present invention is directed to a semiconductor device in which a plurality of wiring boards on which a semiconductor chip is mounted are stacked on an element substrate as semiconductor elements. A notch is formed in other wiring boards, and a region surrounded by the notch on the first-layer wiring board is used as a wiring board holding portion. The stacked wiring boards are suctioned by a suction nozzle of a suction head and transported by a wiring board holding portion provided on the first layer wiring board. A positioning pin can be provided on the suction head, or a temperature sensor or a load sensor can be attached to the positioning pin to control these processing points during lamination while providing these functions. As described above, according to the present invention, a plurality of protrusions are provided on the suction head having the XYZ axes of the semiconductor manufacturing apparatus as a means for performing positioning and transport when stacking a plurality of wiring boards. The plurality of protrusions have a suction nozzle function, and also have a temperature measurement function for measuring a heating temperature during lamination or a function for measuring pressure during lamination. The function of each projection makes it possible to perform conveyance by suction, temperature measurement, and load measurement.

That is, a semiconductor device according to the present invention includes a plurality of wiring boards having a plurality of connection electrodes and leads electrically connected to the connection electrodes, and a plurality of connection electrodes mounted on the wiring board. At least one semiconductor element electrically connected to the lead of the wiring board, and an external electrode mounted on the plurality of wiring boards in a stacked state and electrically connected to the connection electrode of the wiring board. A first substrate in contact with the device substrate.
A notch is formed in a wiring board other than this wiring board on the wiring board of the layer, and a region surrounded by the notch on the wiring board of the first layer is used as a wiring board holding portion. And The plurality of wiring boards may be rectangular and substantially all have the same shape. A plurality of wiring boards other than the first-layer wiring board may be arranged, and the cutout may be formed in the same region of each wiring board. The wiring board may be formed with an external terminal cutout in which the external terminal electrically connected to the connection electrode of the wiring board is formed. The notch is formed on at least one of a pair of opposite sides of the wiring board,
The terminal notch may be formed on a side adjacent to the side on which the notch is formed.

According to a method of manufacturing a semiconductor device of the present invention, at least one semiconductor electrically connected to a lead is connected to a plurality of wiring boards having a plurality of connection electrodes and leads electrically connected to the connection electrodes. Mounting the element,
Forming external terminals on an element substrate on which the wiring substrate is stacked and mounted, and wiring the wiring board on which the at least one semiconductor element is mounted, excluding a first-layer wiring substrate directly in contact with the element substrate; Forming a notch at a predetermined position on the substrate, laminating the plurality of wiring boards with the first-layer wiring board being the lowermost layer, and surrounding the notch in the first-layer wiring board. Transporting the laminated wiring board by adsorbing the suction nozzle to the separated area and mounting the same on the element substrate, and heating the element substrate and the plurality of wiring boards laminated on the element substrate. Connecting the external terminals to the connection electrodes of the wiring board by applying pressure.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. First, a semiconductor device will be described with reference to FIG. FIG. 1 is a cross-sectional view of a semiconductor device and a cross-sectional view of a wiring board on which chips constituting the semiconductor device are mounted.
2. Description of the Related Art In semiconductor devices, semiconductor elements are often stacked and used for high-density mounting. As shown in FIG. 1A, a stacked semiconductor device using a wiring substrate on which a chip is mounted has a chip 11 on which an integrated circuit or the like is formed mounted on wiring substrates 1 to 4 and these wiring substrates 1 to 4. 4 are laminated. The wiring substrate 1 is directly mounted on an element substrate 10 made of, for example, an epoxy resin or the like to which an external terminal 18 made of solder or the like is attached. The wiring boards 2 to 4 are stacked on the first layer, and the external terminals 18 are electrically connected to the connection electrodes 16 formed around the semicircular cutouts of the wiring boards 1 to 4. This stacked semiconductor device is used for, for example, a memory.

FIG. 1B is a cross-sectional view of a wiring board 1 constituting a stacked semiconductor device, for example. The wiring board 1
For example, it is made of a polyimide film having a thickness of about 25 μm. A plurality of leads 1 made of plated copper foil or the like having a thickness of about 20 μm are formed on the first surface of the wiring board 1.
7 are formed. A connection electrode 15 connected to each lead 17 is formed in a region near the end of the wiring board 1. Connection electrode 1 formed on second surface of wiring board 1
6 is electrically connected to the lead 17 on the back surface. The connection electrode 16 is electrically connected to the connection electrode 15 via a semicircular notch formed in the wiring board 1. The chip 11 has a thickness of about 50 μm. This chip 1
1 is mounted on the first surface of the wiring board 1. Lead 17
A gold bump 14 formed on a connection electrode (not shown) of the chip 11 is joined to a tip end opposite to the tip to which the connection electrode 15 is connected. Further, an underfill resin sealing body 13 such as an epoxy resin is formed between the wiring board 1 and the chip 11 so as to cover a connection portion including the gold bump 14.

Further, as will be described later, the wiring board 1 is provided with a wiring board holding portion, but the other wiring boards 2 to 4 have cutouts, which are features of the present invention, in areas corresponding to the holding portions. Are formed. Next, referring to FIGS. 2 and 3, a state in which a chip constituting a semiconductor element and a wiring board on which the chip is mounted will be described in detail. FIG. 2 is a perspective view of a wiring board on which a chip is mounted, and FIG. 3 is a perspective view of the wiring board in a stacked state. In this embodiment, an example is shown in which four wiring boards are stacked as a semiconductor device. However, in the present invention, any number of two or more wiring boards can be used.

The wiring boards 1 to 4 are all rectangular and have the same shape, and the wiring boards 2 to 3 are sequentially laminated with the lowermost wiring board 1 as a first layer. A chip 11 on which an integrated circuit or the like is formed is mounted on the wiring boards 1 to 4. Since FIGS. 2 and 3 are schematically described, the chip 1
A description of a connection system for electrically connecting the wiring board 1 to the wiring boards 1 to 4 is omitted. Notches for positioning are formed in these wiring boards 1-4. The method of forming the notch differs from that of the other in the first-layer wiring board 1. This is because the notch 6 is the second
It is characterized in that it is applied to the wiring board 2 of the first layer, but is not applied to the wiring board 1 of the first layer which is the lowermost surface. The shape of the notch 6 is preferably a semicircle, but the shape is not particularly limited as long as a positioning effect can be obtained. Further, the notch 5 is formed on the entire wiring board. The notch 5 is formed on a side adjacent to the side on which the notch 6 is formed.

Since the notches 5 and 6 are both used for positioning, the pins of the suction head are arranged, but the suction area 12 of the first layer wiring board 1 surrounded by the notches 6 has The suction nozzle of the suction head is suctioned to hold the wiring board. Therefore, the notch 6 is also used as a suction notch. The notch 5 is also used as an external terminal notch since the external terminal is formed and arranged in this portion. Next, referring to FIG. 4 and FIG.
The method of manufacturing the semiconductor device shown in FIG.

FIG. 4 and FIG. 5 are cross-sectional views showing the manufacturing process of the semiconductor device. First, the element substrate 10 on which the stacked wiring substrates are mounted is prepared. The element substrate 10 is made of, for example, an epoxy resin or the like. A solder paste is printed on the main surface of the element substrate 10 (FIG. 4A). Next, the printed solder paste is reflowed so that solder balls 1
8 (FIG. 4B). Instead of using a solder paste, a ball may be formed by reflow using a solder ball. Next, the laminated wiring substrates 1 to 4 are mounted on the element substrate 10. At this time, solder balls 18
Are arranged so as to enter the notch 5 of the wiring board (FIG. 4).
(C)). Thereafter, the element substrate 10 and the laminated wiring substrates 1 to 4 are heated and pressed by the heat press 19 to form the stacked semiconductor device shown in FIG. Solder ball 18
Are connected to the connection electrodes 15 and 16 formed in the cutouts 5 of the respective wiring boards, and constitute external terminals.

Next, a semiconductor manufacturing apparatus for implementing the method of manufacturing a semiconductor device will be described with reference to FIGS. FIG.
Is a semiconductor that processes a supply step of a wiring board on which a chip is mounted, a notch formation step, a wiring board laminating step, a mounting step of a wiring board on an element substrate, a pressing step of a laminated wiring board, and a carry-out of a semiconductor device. It is the schematic of a manufacturing apparatus. In FIG. 6, the supply step of the wiring board on which the chip is mounted is a supply apparatus, the notch forming step is a cutting apparatus, the wiring board laminating step is a laminating apparatus, and the mounting step of the wiring board on the element substrate is a transporting apparatus. The pressing step of the stacked wiring boards is performed by a pressing device. Separates the chip on which the elements, integrated circuits, etc. are formed from the wafer by wafer processing,
This is mounted on a wiring board. The plurality of wiring boards thus formed are carried on a substrate tray (supply device) and transported to the semiconductor manufacturing apparatus. The transported substrate tray is loaded with a plurality of wiring boards and transported to a vicinity of a cutting device such as a mold.

In the cutting device (die), the wiring substrates 1 to 4 are arranged, and a notch is formed in the shape shown in FIG. 2 by the die. The notch 5 is formed in the wiring board 1 so as to be aligned in a semicircular shape on a pair of opposing sides. Wiring board 2,
In the portions 3 and 4, the notch 5 is formed so as to be aligned in a semicircular shape on a pair of opposing sides, and the notch 6 is formed on the side adjacent to the side where the notch 5 is formed. The notches 5, 6 are both used for positioning. The notch 6 is also used as a suction notch. The notch 5 is also used as an external terminal notch because the external terminal is disposed in this portion.

In the laminating apparatus, the notched wiring boards are sequentially stacked to form a stacked body of the wiring boards. The wiring board 1 of the first layer is disposed in the lowermost layer, and the wiring boards 2 to 4
Are sequentially laminated thereon to form the laminate shown in FIG. Since the cutouts 5 and 6 are formed at the same position on all the wiring boards, the cutouts of the stacked body are also formed to overlap. However, since the notch 6 is not formed in the wiring board 1 of the first layer, the area where the notch of the other wiring board is to be formed is used as the area where the suction nozzle sucks.

In the transfer device, the stacked wiring boards are transferred to the pressing device in a state of a stacked body. As a transport device,
The positioning head shown in FIG. 7 is used. FIG. 7 is a side view and a bottom view of the positioning head. The positioning head 7 has at least two positioning and suction pins (suction nozzles) 8 and a plurality of positioning auxiliary pins 9 formed on a pair of opposing sides. Further, a part of the positioning assisting pin 9 can be provided with a temperature sensor or a load measuring sensor function to manage the processing points at the time of lamination. The pin length of the positioning and suction pin 8 is different from that of the positioning assisting pin 9 by the thickness of the wiring board. Further, although there are ten positioning assisting pins 9 in FIG. 7, the number is not particularly limited.

Next, referring to FIG. 8, a description will be given of a state in which the laminate of the wiring boards is transported. FIG. 8 is a cross-sectional view of the positioning head on which the laminate of the wiring boards is mounted. The laminated body of the wiring board is moved down by the positioning head 7,
The four wiring boards 1 to 4 are positioned by the suction nozzle 8 and the positioning auxiliary pins 9 which are positioning and suction pins, and the suction nozzle 8 comes into contact with the first wiring board 1 which is the lowermost surface of the laminated body, and is positioned. The positioning and fixing are completed by the vacuum 20 from the inside of the suction pin 8, and at the time of lamination, it is possible to manage the processing point at the time of lamination by a part of the temperature sensor or the load measuring sensor of the positioning auxiliary pin 9. As described above, in the embodiment, the electrical connection between the wiring board and the chip is performed by the bump on the connection electrode of the chip. However, the present invention is not limited to such a method. A method is also possible in which an anisotropic conductive resin film is interposed and a conductive path is formed in the film. Since the anisotropic conductive resin film is provided between the chip and the wiring board, it plays a role of a resin sealing body that seals a space between the two.

[0018]

According to the semiconductor device of the present invention having the above-described structure, positioning and transporting when stacking thin semiconductor elements composed of a wiring board and a chip can be easily performed.
Also, as means for positioning and transporting when stacking a plurality of wiring boards, a plurality of protrusions provided on a suction head having an XYZ axis of a semiconductor manufacturing apparatus have a suction nozzle function, and It has a temperature measurement function for measuring the heating temperature at the time of measurement or a function for measuring pressure during lamination. The function of each projection makes it possible to perform conveyance by suction, temperature measurement, and load measurement.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor device of the present invention and a cross-sectional view of a wiring board on which a chip constituting the semiconductor device is mounted.

FIG. 2 is a perspective view of a stacked wiring board that forms the semiconductor device of the present invention.

FIG. 3 is a perspective view illustrating lamination of a wiring substrate included in the semiconductor device of the present invention.

FIG. 4 is a cross-sectional view illustrating a manufacturing process of the semiconductor device of the present invention.

FIG. 5 is a sectional view showing a manufacturing process of the semiconductor device of the present invention.

FIG. 6 is a schematic diagram of a semiconductor manufacturing apparatus of the present invention.

FIGS. 7A and 7B are a side view and a bottom view of a positioning head of a transfer device constituting the semiconductor manufacturing apparatus of the present invention.

FIG. 8 is a cross-sectional view illustrating a state of holding the wiring board of the positioning head of FIG. 7;

[Explanation of symbols]

1, 2, 3, 4 ... wiring board, 5 ... positioning notch for external terminal, 6 ... positioning notch for suction,
7 positioning head, 8 positioning and suction pin (suction nozzle), 9 positioning auxiliary pin,
10 ... element substrate, 11 ... chip, 12 ...
・ Suction area, 13 ・ ・ ・ Underfill resin sealing body,
14 ... gold bump, 15, 16 ... connection electrode,
17 ... wiring, 18 ... external terminal, 19 ...
・ Heat press, 20 ・ ・ ・ Vacuum.

Claims (6)

[Claims] A wiring board having a plurality of connection electrodes and leads electrically connected to the connection electrodes; and a plurality of connection electrodes mounted on the wiring board, wherein the plurality of connection electrodes are electrically connected to the leads of the wiring board. At least one semiconductor element that is electrically connected, and an element substrate that is mounted in a state where the plurality of wiring boards are stacked and has an external electrode that is electrically connected to the connection electrode of the wiring board. A notch is formed in a wiring board other than this wiring board on the first layer wiring board in contact with the element substrate, and a region surrounded by the notch on the first layer wiring board is A semiconductor device used as a wiring board holding unit. 2. The method according to claim 1, wherein the plurality of wiring boards have a rectangular shape,
2. The semiconductor device according to claim 1, wherein all the semiconductor devices have substantially the same shape. 3. The wiring board according to claim 2, wherein a plurality of wiring boards other than the first-layer wiring board are arranged, and the cutouts are formed in the same region of each wiring board. Semiconductor device. 4. An external terminal notch for disposing the external terminal electrically connected to the connection electrode of the wiring board is formed in the wiring board. The semiconductor device according to claim 3. 5. The notch is formed on at least one of a pair of opposing sides of the wiring board, and the terminal notch is formed on a side adjacent to the side on which the notch is formed. 5. The semiconductor device according to claim 2, wherein: 6. mounting at least one semiconductor element electrically connected to the leads on a plurality of wiring boards having a plurality of connection electrodes and leads electrically connected to the connection electrodes; Forming external terminals on an element substrate on which a wiring substrate is stacked and mounted; and a wiring substrate excluding a first-layer wiring substrate directly in contact with the element substrate among the wiring substrates on which the at least one semiconductor element is mounted. Forming a notch at a predetermined position; laminating the plurality of wiring boards with the first-layer wiring board being the lowest layer; and enclosing the notch in the first-layer wiring board. Transporting the laminated wiring substrate by adsorbing the suction nozzle to the region that has been stacked, and placing the substrate on the element substrate; and heating the element substrate and the plurality of wiring substrates laminated on the element substrate by heating. Press Method of manufacturing a semiconductor device is characterized in that; and a step of connecting said external terminal connection electrodes of the wiring board by.