JP3462944B2 - Bump bonder and chip transport method for bump bonder - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump bonder used in a bumping process for mounting an IC chip.

[0002]

2. Description of the Related Art In recent years, opportunities for utilizing flip chip mounting have been increasing. In order to carry out flip-chip mounting, bumps must first be formed on the IC chip, but a conventional bump bonder for forming the bumps is constructed as shown in FIG.

In FIG. 8, reference numeral 30 denotes a stocker, which is a plurality of trays 4 in which IC chips for bumping are aligned.
It stores 0. Reference numeral 31 is an elevating unit that moves the stocker 30 up and down to position the tray 40 for supplying and storing the required tray 40. The tray 40 positioned by the elevating unit 31 is transferred to the tray transport unit 32.
Then, the IC chip is sucked and carried to the bonding stage 34 by the IC carrying unit 33. As shown in FIG. 9, the suction conveyance is performed by the IC chip a.
This is performed by adsorbing the upper surface of the with a suction nozzle 38.
IC chip a transferred onto the bonding stage 34
Is subjected to position regulation by the regulation unit 35, and the bump b (see FIG. 9) is formed by the bonding head 36. The IC chip a on which the bumps b are formed is again used in the IC transport unit 3
3 returns to the original position on the tray 40. By repeating the above operations, the bonding work is performed.

[0004]

However, in the above-mentioned conventional bump bander, since the IC carrying unit 33 has only one suction nozzle 38, the time required to form the bump of one IC chip a is the same as that of the IC chip a. Chip a
Is added, bumps are formed, and the IC chip a is collected. This is the sum of the respective times. When the time required to supply and collect the IC chip a is long compared to the time required to form the bumps, the productivity is improved. There was a problem from the point of view.

Further, when the IC chip a has a minute dimension such as 1 mm on one side, when the IC chip a is sucked as shown in FIG. 9, the formed bump b comes into contact with the suction nozzle 38. However, there is a problem that the bump shape may be defective.

[0006]

In order to solve the above problems, the first invention of the present application receives an IC chip from a component supply position, conveys the IC chip to a bonding stage, and mounts the IC chip on which bumps are formed. It is a bump bonder equipped with an IC transfer unit that receives this IC chip from the bonding stage and transfers this IC chip to the component ejection position.
One IC transport unit has a flat tip surface
The first suction nozzle and the IC chip when picking up the IC chip
Second suction nose with an inclined surface at the tip that contacts the ridgeline of
It is characterized by having

The second invention of the present application is that I
Receive the C chip and use this IC chip for bonding
IC chip with bumps formed on it
Received from the swing stage and ejected this IC chip
It is a chip transfer method for bump bonders
Has a flat tip surface for one IC transport unit.
The first suction nozzle that does
It is used to transfer to the bonding stage from
With an inclined surface at the tip of two IC transport units
The suction nozzle of No. 2 uses an IC chip on which bumps are formed.
It is characterized in that it is used for transporting from the bonding stage .

[0008]

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, 1 is a stocker on which a large number of trays 2 are stacked, 3 is an elevating unit that elevates and lowers the stocker 1 and sets it at a predetermined height position, 4 is a tray 2 from which the tray 2 is pulled out, and a component supply position A tray transport unit which is set to P and stores the tray 2 at the component supply position P in the stocker 3, 5 is a bonding head, 6 is an XY table, 7 is a bonding stage, 8 is an IC regulation unit, 9 is an IC transport unit, Reference numeral 10 is a leveling unit, and 11 is a microscope for bonding observation.

As shown in FIGS. 2 to 5, the IC carrying unit 9 is provided with a suction head 12 which is movable in the XY directions. The suction head 12 has two suction nozzles 13a and 1a.
3b. The suction head 12 is a guide rail 14
The guide rail 14 moves in the X direction while being guided in the direction of Y.

The suction nozzles 13a, 13b are constructed so as to be able to move up and down (Z direction) independently of each other. For that purpose, air cylinders 15a, 15b and connecting plates 16a, 16 are provided.
b, nozzle holding rods 17a and 17b for holding the suction nozzles 13a and 13b are provided on the suction head 12. The shape of the tip of each suction nozzle 13a, 13b is
As shown in FIG. 5, that is, the tip surface 18 is flat and the intake port 19 is opened at the center thereof.

Next, the operation of the apparatus having the above configuration will be described. The predetermined IC chip a in the tray 2 set at the component supply position P is attached to the suction nozzles 13a, 13 of the IC transport unit 9.
Then, the bumps are adsorbed by b and then conveyed to a predetermined position on the bonding stage 7, where bumps are formed on the IC chip a by the bonding head 5. The IC chip a on which the bumps are formed is sucked by the suction nozzles 13a and 13b, is then transported to the component supply position P, and is housed in a predetermined empty portion in the tray 2.

In this case, in the present invention, two suction nozzles 13 are used.
Since a and 13b are provided, the following operation is possible. That is, with the first suction nozzle 13 a sucking the IC chip a from the tray 2, the suction head 12 waits for the bonding work to be completed at the position of the bonding stage 7. When the bonding work is completed, the second suction nozzle 13b sucks the IC chip a having the bumps formed thereon. Next, the first suction nozzle 13a places the IC chip a, which is sucked by itself, on the bonding stage 7. After that, the suction head 12 returns to the component supply position P, and the IC chip a sucked by the second suction nozzle 13b.
Are accommodated in a predetermined empty portion of the tray 2.

By repeating such an operation, the bonding work can be advanced with little waiting time, and the production efficiency can be improved.

Next, another embodiment of the present invention will be described. In the above embodiment, the two suction nozzles 13 are provided.
Although a and 13b have the same shape, in this embodiment, the first suction nozzle 13a is formed as shown in FIG.
Specializing in carrying the C chip a, forming the second suction nozzle 13b as shown in FIG. 6, and carrying the IC chip a having the bumps b formed thereon from the bonding stage 7 to the tray 2. I am allowed to. The first suction nozzle 13a shown in FIG. 5 is as described above, and is a so-called solid type nozzle. On the other hand, the second suction nozzle 13b shown in FIG. 6 has an inclined surface 20 in which both sides of the intake port 19 in the central portion thereof spread downward, and the IC chip a has a traverse line c on the inclined surface 20. It is configured so that it can be adsorbed and held in a contact state, and is a so-called getter nozzle.

As described above, the two kinds of suction nozzles 13a, 1
By providing 3b and using them properly, it is possible to be suitable for carrying a micro IC chip a. That is, when the solid type nozzle attracts the IC chip a on which the bump b is formed, the bump b and the solid type nozzle are likely to come into contact with each other, and the tendency becomes large especially in the IC chip a having a side of about 1 mm. However, there is a problem that the bump shape becomes defective, but this problem can be solved by using the getter type nozzle. On the other hand, when a getter type nozzle is used to pick up the IC chip a from the tray 2 by suction, the I
Since the C chip a is housed, it becomes difficult to reliably perform the suction operation. Therefore, by using the solid nozzle, the IC chip a can be surely adsorbed and taken out from the tray 2, and the above problems can be solved.

As the second suction nozzle, as shown in FIG. 6, a suction nozzle 13c having inclined surfaces 20a on the four sides of the intake port 19 may be used as shown in FIG.
The suction nozzle 13c may be configured to suck and hold the IC chip a in a state where the traverse lines c on the four sides are in contact with the inclined surface 20a.

In the above embodiment, as shown in FIG. 1, the leveling unit 10 is provided, and if necessary,
The IC chip a on which the bumps b are formed is carried by the IC carrying unit 9 from the bonding stage 7 to the leveling stage 10a so that the leveling work for making the bumps b uniform in height can be performed. In this case, the IC chip a is conveyed in the order of component supply position P → bonding stage 7 → leveling stage 10a → component supply position P, but it is provided with two suction nozzles 13a and 13b as in the present invention. In this case, the replacement work of the IC chip a on the bonding stage 7 can be performed with almost no interruption time of the bonding work. Since the leveling work time (for example, 5 seconds) is significantly shorter than the bonding work time (for example, 30 seconds), the leveling-completed IC chip a on the leveling stage 10 is conveyed to the tray 2 at the component supply position P during the bonding work. It is preferable to do so. At that time,
It is preferable to use the suction nozzles 13b and 13c having the shape shown in FIG.

The present invention can be constructed in various modes other than the above-mentioned embodiment. For example, in the above-described embodiment, the IC chip a is conveyed from the tray 2 at the component supply position P to the bonding stage 7, and the IC chip a on which the bump b on the bonding stage 7 is formed is returned to the original tray 2. Although being conveyed, the IC chip a on which the bumps b are formed is transferred to another place (the leveling stage 10 described above).
a) or a tray arranged at the component discharge position). In addition, the IC transport unit 9 is shown in FIG.
It is also possible to adopt a configuration including two suction nozzles shown in. Further, the holder provided in the IC transport unit 9 is not limited to the suction nozzle, and the number thereof may be plural.
It is not limited to books.

[0021]

According to the first and second aspects of the present invention, the tip is
The flat nozzle ensures IC check from the component supply position.
Can be picked up and transferred to the bonding stage.
And the nozzle with an inclined surface at the tip
Do not contact the bumped IC chip with the bump.
Can be adsorbed from the bonding stage and ejected
Since it can be transported to the position, defective bump shape can be prevented and
An actual IC chip can be transported.

[0022]

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a schematic plan view showing an arrangement relationship of its main parts.

FIG. 3 is a perspective view showing an IC transport unit.

FIG. 4 is a sectional view thereof.

FIG. 5 shows a suction nozzle, (a) is a sectional view thereof,
(B) is the bottom view.

6A and 6B show another embodiment of a suction nozzle, in which FIG. 6A is a sectional view thereof and FIG. 6B is a bottom view thereof.

FIG. 7 is a bottom view of a suction nozzle of still another form.

FIG. 8 is a perspective view showing a conventional example.

FIG. 9 is a sectional view showing the suction nozzle and an IC chip.

[Explanation of symbols] 7 Bonding stage 9 IC transport unit 13a, 13b, 13c suction nozzle (holding tool) 18 flat tip 20, 20a inclined surface P Parts supply (discharge) position a IC chip b bump c ridge

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takahiro Yonezawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-5-226342 (JP, A) JP-A-6- 120269 (JP, A) JP 5-55351 (JP, A) JP 7-99227 (JP, A) JP 48-71181 (JP, A) JP 8-78418 (JP, A) JP-A-9-134935 (JP, A) JP-A-4-115541 (JP, A) Jitsuko Sho 45-24260 (JP, Y1) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60

Claims (2)

(57) [Claims] 1. An IC chip is received from a component supply position,
An IC that conveys this IC chip to the bonding stage, receives the IC chip on which bumps are formed from the bonding stage, and conveys this IC chip to the component ejection position.
A bump bonder including a carrying unit, wherein one IC carrying unit has a first suction nozzle having a flat tip surface and a tip end having an inclined surface that comes into contact with a ridge line of the IC chip when picking up the IC chip. A bump bonder having two suction nozzles. 2. An IC chip is received from a component supply position,
A bump bonder chip transport method of transporting the IC chip to a bonding stage, receiving the IC chip having bumps formed thereon from the bonding stage, and transporting the IC chip to a component discharge position, which is provided in one IC transport unit. The first suction nozzle having a flat tip surface is used for transporting the IC chip from the component supply position to the bonding stage, and the second suction nozzle having an inclined surface provided at the one IC transport unit at the tip. Is
A method for carrying a chip for a bump bonder, which is used for carrying an IC chip having a bump formed thereon from a bonding stage.