JP2004253447A - Packaging machine for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging machine for an electronic component which can remarkably improve the packaging throughput of an electronic component to a printed circuit board while completely eliminating the possibility of collisions among head units. <P>SOLUTION: In the packaging machine of an electronic component, electronic component movable regions A, B, C, D are arranged independently so as not to be overlapped with each other in a plurality of head units 3. A substrate holding means 4 moves printed circuit boards 1 sequentially to the respective packaging parts 8 of the plurality of head units 3. The substrate holding means 4 can mount electronic components held with the head units 3 which are in a still state in the packaging parts 8 on packaging positions of the printed circuit boards 1 by further moving them. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting machine for mounting an electronic component on a printed circuit board.
[0002]
[Prior art]
As an electronic component mounter that mounts electronic components on a printed board, generally, a board holding unit that holds the printed board, and the electronic components are transported and mounted on the printed board held by the board holding unit. 2. Description of the Related Art There is known a head unit that supports an electronic component so that electronic components can move in two directions, that is, an X axis and a Y axis, which are substantially orthogonal to each other.
[0003]
Some of such mounting machines are provided with a plurality of individually movable head units in order to improve mounting efficiency and the like.
[0004]
For example, Patent Literatures 1 and 2 disclose an X, Y gantry installed on a base frame, a plurality of head units installed at predetermined portions of the X, Y gantry, and a component supply device for electronic components. The technology of the surface mounting apparatus provided with the method and the method thereof is disclosed.
[0005]
[Patent Document 1]
JP-A-2002-171094
[Patent Document 2]
JP-A-2002-198693
[0006]
[Problems to be solved by the invention]
However, in the conventional technology such as the electronic component mounting machine disclosed in the above-mentioned publication, in the plurality of head units, the movable regions capable of transporting the electronic components structurally overlap with each other, and the head units are There is a problem that there is a possibility of collision. In these electronic component mounting machines, collisions between head units are generally avoided by controlling the movement of a plurality of head units by software of a control device. In the case of, there is a problem that the possibility of collision between the head units cannot be eliminated at all.
[0007]
In addition, in these conventional electronic component mounting machines, it takes time for the head unit to mount the electronic components on the printed circuit board and then return to the component supply device to receive the electronic components, resulting in a time loss. As a result, there is a problem that it is difficult to dramatically improve the mounting efficiency.
[0008]
The present invention has been made in view of the above-described problems, and has an electronic component mounting machine capable of dramatically improving the efficiency of mounting electronic components on a printed circuit board while eliminating the possibility of collision between head units. The challenge is to provide
[0009]
[Means for Solving the Problems]
The present invention for solving the above-mentioned problems provides a board holding means for holding a printed board movably in two directions of X-axis and Y-axis, and transports electronic components to the printed board held by the board holding means. A plurality of head units to be mounted and mounted, wherein the plurality of head units are provided independently so that the movable regions do not overlap with each other, and the electronic component supply provided at one position of each movable region. At least one electronic component is received from the device, and the received electronic component is mounted on a printed circuit board in a stopped state at a mounting unit set at another position of each movable area, and the board holding means is The printed circuit boards are sequentially moved to the respective mounting portions of the plurality of head units, and the mounting portions are kept stationary. The electronic part of the head unit is held, a mounter of the electronic component, characterized in that is for moving the printed circuit board so that it can be mounted on the mounting position of the printed circuit board.
[0010]
According to the present invention, the respective movable regions of the plurality of head units are independently provided so as not to overlap with each other, and the substrate holding means sequentially moves the printed circuit board to the respective mounting portions of the plurality of head units. Since the printed circuit board is moved so that the electronic components held by the head unit can be mounted at the mounting position of the printed circuit board, the printed circuit board is successively printed while eliminating the possibility of collision between the head units. The mounting efficiency of the electronic component to the device can be dramatically improved.
[0011]
It is preferable that the mounting portions of the plurality of head units are intensively arranged at the center of the movable range of the printed circuit board.
[0012]
According to this configuration, since the respective mounting portions of the head unit are intensively arranged at the center of the movable range of the printed board, the moving path of the board holding means can be shortened, and as a result, The mounting efficiency of electronic components can be dramatically improved.
[0013]
Further, it is preferable that the head unit is supported so that at least one electronic component can be moved in two directions, that is, an X axis and a Y axis, which are substantially orthogonal to each other.
[0014]
According to this configuration, the electronic component supply device and the mounting section can be provided regardless of where in the movable area of each head unit, and as a result, a highly versatile electronic component mounting machine can be provided. .
[0015]
Also, in the present invention, there is provided control means for controlling the operation of the head unit and the substrate holding means, wherein the control means is configured such that one of the plurality of head units mounts an electronic component on a printed circuit board. Is completed, and the board holding means conveys the printed circuit board, which has been mounted by one of the head units, to the mounting portion of the other head unit, and the other head unit is mounted on the other head unit. It is preferable to control the electronic component to be conveyed to the mounting unit so as to be completed.
[0016]
With this configuration, one head unit completes the mounting of the electronic component on the printed circuit board, and the board holding unit conveys the printed circuit board on which the mounting has been completed to the mounting unit of the other head unit. Since the head unit controls to complete the transfer of the electronic component to the mounting unit, the mounting of the electronic component on the printed circuit board can be started immediately in another head unit, resulting in less time loss. An efficient electronic component mounting machine can be obtained.
[0017]
Further, it is preferable that four head units are provided for the mounting machine, and each head unit can operate independently of each other.
[0018]
According to this configuration, since a plurality of the plurality of head units are provided for the mounting machine, there is a time margin in transporting the electronic components to the mounting unit of the head unit. After the components have been mounted on the printed circuit board and the board holding means has transported the mounted printed circuit board to the mounting section of another head unit, the other head unit transfers the electronic components to the mounting section. As a result, it is possible to obtain a more efficient electronic component mounting machine with less time loss.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a conceptual diagram illustrating a configuration of an electronic component mounter 10 according to an embodiment of the present invention, and FIG. 2 is a plan view illustrating a configuration of the electronic component mounter 10. FIG. 3 is a front view showing the configuration of the electronic component mounting machine 10. In the following description, in FIGS. 1 and 2, the left-right direction in the drawings is the X-axis direction, and the up-down direction is the Y-axis direction.
[0020]
As shown in these drawings, an electronic component mounter 10 according to an embodiment of the present invention holds four head units 3 for transporting and mounting electronic components on a printed circuit board 1, and holds the printed circuit board 1. Substrate holding means 4, an X and Y gantry 5 for supporting the four head units 3 movably in two directions of the X axis and the Y axis, respectively, and a base frame 6 for supporting the X and Y gantry 5 (FIG. 2, FIG. 3).
[0021]
In the present embodiment, the four head units 3 each have a plurality of suction nozzles 2, and each of the four head units 3 sucks and holds an electronic component (not shown) one by one with respect to one suction nozzle 2. It is configured.
[0022]
The X and Y gantry 5 includes four head unit support members 5a extending in the X-axis direction and three parallel Y-axis guide rails 5b provided orthogonal to the head unit support members 5a (see FIG. 2 (only the Y-axis guide rails 5b on both sides are shown in FIG. 1). Each head unit 3 is driven via a ball screw by an unillustrated X-axis servomotor provided on each head unit supporting member 5a, moves along the head unit supporting member 5a, and moves along each head unit supporting member 5a. The member 5a is driven via a ball screw by a Y-axis servomotor 5c (FIG. 2) provided for each member, and translates along the Y-axis guide rail 5b. In this manner, the head units 3 can move independently of each other in the two directions of the X axis and the Y axis.
[0023]
Here, two head unit support members 5a are disposed on each of the left and right sides of the base frame 6 substantially at the center line 5d (the line on the center Y-axis guide rail 5b). The left two head unit support members 5a are supported at both ends by left and center Y-axis guide rails 5b, and the right two Y-axis guide rails 5b have a stopper mechanism (not shown) substantially at the center in the Y-axis direction. With this stopper mechanism, the head unit supporting members 5a located on both sides of the center line 5e with respect to the center line 5e cannot move in the Y-axis direction beyond the center line 5e. I have.
[0024]
As a result, the four head units 3 are provided independently so that the electronic component movable areas A, B, C, and D do not overlap with each other.
[0025]
The four head units 3 receive electronic components from a feeder 7 (electronic component supply device) provided at one position of each of the movable areas A, B, C, and D, and receive the received electronic components, respectively. Are mounted on the printed circuit board 1 in a stopped state at the mounting portions 8 set at other positions of the movable regions A, B, C, and D. The mounting portions 8 of the four head units 3 are: It is arranged intensively at the center of the movable range of the printed circuit board.
[0026]
In the present embodiment, the board holding unit 4 receives the printed board 1 from a not-shown printed board transport conveyor that transports the printed board 1 in the Y-axis direction, and holds the printed board 1 so as to hold the four head units. 3 is configured to sequentially move the printed circuit board 1 to each mounting section 8.
[0027]
The board holding means 4 moves the printed circuit board 1 in the X and Y-axis directions within a range corresponding to the mounting section 8 in each mounting section 8 so that the head in a stationary state in the mounting section 8 is moved. The unit 3 can mount the held electronic components at the mounting positions of the respective electronic components on the printed circuit board 1.
[0028]
Next, as shown in FIGS. 4 and 5, the operation of the electronic component mounting machine 10 according to the embodiment of the present invention will be described.
[0029]
FIG. 4 is a flowchart showing control of the electronic component mounter 10 according to the embodiment of the present invention.
[0030]
For example, the movable region A will be described with reference to FIG. The same control is performed for the movable regions B, C, and D.
[0031]
In step S1, the head unit 3 is returned to the position of the feeder 7 (electronic component supply device) provided at one position of each movable area A.
[0032]
Next, in step S <b> 2, the electronic component is received from the feeder 7 by sucking and holding the electronic component by each of the suction nozzles 2 of the head unit 3.
[0033]
Further, in step S3, the head unit 3 is moved upward by a component recognition camera (not shown), and component recognition is performed based on the imaging of the component by the camera, so that the electronic component is correctly suctioned to the suction nozzle 2 of the head unit 3. Is determined, and the deviation of the component suction position is checked.
[0034]
Then, in step S4, the X-axis servo motor and the Y-axis servo motor 5c are controlled to move the head unit 3 to the mounting section 8 set at another position in the movable area A.
[0035]
Here, in step S5, it is determined whether or not the order of mounting on the printed circuit board 1 in the mounting section 8 of the movable area A has been reached. If YES, the process proceeds to step S6, and if NO, mounted on the printed circuit board 1. Step S5 is repeated until the order is reached.
[0036]
If it is determined that the order of mounting on the printed circuit board 1 has come, the electronic components are mounted on the printed circuit board 1 in the mounting section 8 in a stopped state in step S6. At this time, the board holding means 4 moves the printed board 1 so that the electronic components held by the head unit 3 in a stationary state in the mounting section 8 can be mounted at the mounting position of the printed board 1. Let it.
[0037]
In step S7, it is determined whether or not all of the electronic components held by the head unit 3 have been mounted. If YES, the process proceeds to step S8 to end the operation. If NO, the process returns to step S1 and repeats steps S1 to S7 until all the electronic components are mounted on the printed circuit board 1.
[0038]
FIG. 5 is a time chart of the electronic component mounting machine 10 according to the embodiment of the present invention.
[0039]
As shown in the drawing, in the movable area D, the head unit 3 moves from step S1 to step S4, that is, after the head unit 3 finishes mounting electronic components, the feeder 7 (electronic component supply device). Until the received electronic component is moved to the mounting section 8 set at another position of the movable area D, the steps from step S5 to step S7 of the movable areas A, B, and C, that is, the printed circuit board in the mounting section 8 1 (step S5), mounting on the printed circuit board 1 (step S6), and determining whether all the electronic components have been mounted (step S7) are the movable areas A and B. , C are sequentially completed.
[0040]
In the meantime, the board holding means 4 sequentially moves the printed circuit board 1 to the respective mounting portions 8 of the four head units 3, and the electronic components held by the head unit 3 which is stationary in the mounting portions 8. Of the printed circuit board 1 is moved so that can be mounted on the mounting position of the printed circuit board 1.
[0041]
Then, one of the four head units 3 completes the mounting of the electronic component on the printed board 1, and the board holding means 4 transports the printed board 1 to the mounting section 8 of the other head unit 3. In this state, the other head unit 3 has completed the transfer of the electronic component to the mounting portion 8 of the other head unit 3, and the other head unit 3 immediately mounts the electronic component on the printed circuit board 1. Be started.
[0042]
As described above, according to the electronic component mounter 10 according to the embodiment of the present invention, each of the movable areas A, B, C, and D of the plurality of head units 3 is independent so as not to overlap with each other. The substrate holding means 4 sequentially moves the printed circuit board 1 to the mounting portions 8 of the plurality of head units 3 and moves the electronic components held by the head unit 3 to the mounting position of the printed circuit board 1. Since the printed circuit board 1 is moved so that it can be mounted on the printed circuit board 1, electronic components can be efficiently mounted one after another on the mounting position of the printed circuit board 1 one after another while eliminating the possibility of collision between the head units 3.
[0043]
Further, since the respective mounting portions 8 of the head unit 3 are arranged intensively at the center of the movable range of the printed board, the moving path of the board holding means 4 can be shortened, and the electronic components can be efficiently used. The printed circuit board 1 can be mounted at a mounting position.
[0044]
Also, since each head unit 3 is configured to be able to transport electronic components in the X-axis and Y-axis directions that are substantially orthogonal to each other, the electronic component supply device and the mounting unit 8 are connected to the respective head units 3. Irrespective of which of the movable areas A, B, C, and D is provided, as a result, the versatile electronic component mounter 10 can be obtained.
[0045]
Further, in a state where one head unit 3 has completed the mounting of the electronic component on the printed board 1 and the board holding means 4 has transported the printed board 1 on which the mounting has been completed to the mounting section 8 of the other head unit 3, Since the control is performed so that the other head unit 3 completes the transfer of the electronic component to the mounting unit 8, the other head unit 3 can immediately start mounting the electronic component on the printed circuit board 1. In addition, it is possible to provide the electronic component mounter 10 with high efficiency with less time loss.
[0046]
If four of the plurality of head units 3 are provided for the mounting machine 10, there is a time margin in transporting the electronic components to the mounting unit 8 of the head unit 3, so that one head unit 3 is Is mounted on the printed circuit board 1 and the board holding means 4 transports the mounted printed circuit board 1 to the mounting section 8 of another head unit 3, and the other head unit 3 is mounted on the mounting section 8. As a result, the transfer of the electronic component to the electronic component can be surely completed. As a result, the electronic component mounting machine 10 can be provided with less time loss and high efficiency.
[0047]
The above-described embodiment is merely an example of a preferred specific example of the present invention, and the present invention is not limited to the above-described embodiment.
[0048]
For example, in this embodiment, four head units 3 for transporting and mounting electronic components on the printed circuit board 1 are provided, but the number of head units 3 is not necessarily limited to four. If the movable areas are provided independently so as not to overlap with each other, two cases can be adopted as shown in FIG.
[0049]
Further, the head unit 3 is not necessarily limited to the one having the suction nozzle 2. Various design changes are possible, such as mechanical holding of electronic components.
[0050]
【The invention's effect】
As described above, according to the present invention, there is a remarkable effect that the efficiency of mounting electronic components on a printed circuit board can be dramatically improved while eliminating the possibility of collision between head units.
[Brief description of the drawings]
FIG. 1 is a conceptual diagram showing a configuration of an electronic component mounting machine according to an embodiment of the present invention.
FIG. 2 is a plan view showing a configuration of an electronic component mounting machine according to an embodiment of the present invention.
FIG. 3 is a front view showing a configuration of an electronic component mounting machine according to the embodiment of the present invention.
FIG. 4 is a flowchart showing control by an unillustrated control device of the electronic component mounting machine according to the embodiment of the present invention.
FIG. 5 is a time chart of the electronic component mounting machine according to the embodiment of the present invention.
FIG. 6 is a conceptual diagram showing a modification of the electronic component mounter according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Electronic component 3 Head unit 4 Substrate holding means 7 Feeder (electronic component supply device)
8 Mounting part 10 Electronic parts mounting machines A, B, C, D Movable area

Claims (5)

A board holding means for holding the printed board movably in two directions of the X axis and the Y axis; and a plurality of head units for transporting and mounting electronic components on the printed board held by the board holding means. ,
The plurality of head units are provided independently so that the movable regions do not overlap each other, and receive and receive at least one electronic component from an electronic component supply device provided at one position of each movable region. The electronic components are mounted on a printed circuit board in a state where the electronic components are stopped at a mounting portion set at another position of each movable region,
The board holding means sequentially moves the printed board to each of the mounting units of the plurality of head units, and mounts the electronic component held by the head unit in a stationary state in the mounting unit on a mounting position of the printed board. An electronic component mounter for moving a printed circuit board so that the electronic component can be mounted on the electronic component mounter. 2. The electronic component mounting machine according to claim 1, wherein the mounting units of the plurality of head units are arranged intensively in a central portion of a movable range of the printed circuit board. 3. The electronic component according to claim 1, wherein the head unit supports at least one electronic component movably in two directions of an X axis and a Y axis that are substantially orthogonal to each other. 4. Mounting machine. Control means for controlling the operation of the head unit and the substrate holding means, wherein the control means completes mounting of an electronic component on a printed circuit board by one of the plurality of head units, and In a state in which the board holding means conveys the printed circuit board, which has been mounted by one of the head units, to the mounting part of the other head unit, the other head unit is mounted on the mounting part of the other head unit. The electronic component mounting machine according to any one of claims 1 to 3, wherein control is performed such that the transfer of the electronic component is completed. 5. The electronic device according to claim 1, wherein four of the plurality of head units are provided for a mounting machine, and each of the head units is operable independently of each other. 6. Component mounting machine.

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