JPWO2015097880A1 - Electronic component mounting machine - Google Patents

Abstract

An electronic component mounting machine includes a mounting head that sucks and holds at least one electronic component, a vacuum pump that supplies a negative pressure for sucking the electronic component to the mounting head, and a substrate transfer device that carries a circuit board to a predetermined position. And a head moving device that moves the mounting head that sucks and holds the electronic component with respect to the circuit board carried into the predetermined position, and a control device that controls at least the head moving device and the vacuum pump. The control device interrupts the movement of the mounting head by the head moving device and saves the power of the vacuum pump when the mounting head completes the suction of the electronic component and the substrate transport device does not complete the loading of the circuit board. Run the operation.

Description

  The technology disclosed herein relates to an electronic component mounting machine that mounts electronic components on a circuit board, and more particularly, to an electronic component mounting machine having a mounting head that sucks electronic components.

  There is known an electronic component mounting machine for mounting electronic components on a circuit board. An electronic component mounting machine typically includes a mounting head that sucks and holds at least one electronic component, a substrate transport device that carries a circuit board to a predetermined position, and a mounting head that sucks and holds an electronic component. And a head moving device that moves with respect to the circuit board carried into the position. The electronic component mounting machine further includes a vacuum pump, and a negative pressure for adsorbing the electronic components is supplied to the mounting head by the vacuum pump. For example, JP 2008-508740A discloses a vacuum pump for supplying negative pressure to the mounting head.

  In the electronic component mounting machine, for example, the board transfer device may not be able to complete the loading of the circuit board on time due to a delay of other devices arranged on the same production line. In such a case, the electronic component mounting machine interrupts a series of operations after the mounting head completes the suction of the electronic component until the substrate transport device completes the loading of the circuit board. However, even when the electronic component mounting machine is interrupting a series of operations, the mounting head needs to keep sucking and holding the electronic components, so the operation of the vacuum pump cannot be interrupted. For this reason, power is consumed by the vacuum pump even while the electronic component mounting machine is interrupting a series of operations.

  In order to solve or reduce the above problem, the technology disclosed in the present specification performs power-saving operation of the vacuum pump while the electronic component mounting machine interrupts a series of operations and the mounting head is stationary. . If the mounting head is stationary, the mounting head can continue to suck and hold electronic components even if the negative pressure supplied by the vacuum pump is relatively small. Therefore, even if the power supplied to the vacuum pump is limited, the vacuum pump can supply a sufficient negative pressure to the mounting head. In the power saving operation of the vacuum pump, it is preferable to reduce the voltage applied to the vacuum pump. As an example, the voltage applied to the vacuum pump can be reduced by PWM control.

  According to one aspect of the technology described above, a new and useful electronic component mounting machine is provided. This electronic component mounting machine includes a mounting head that sucks and holds at least one electronic component, a vacuum pump that supplies a negative pressure for sucking the electronic component to the mounting head, and a substrate transfer that carries the circuit board to a predetermined position. An apparatus, a head moving device that moves a mounting head that sucks and holds electronic components with respect to the circuit board carried into the predetermined position, and a control device that controls at least the head moving device and the vacuum pump. The control device interrupts the movement of the mounting head by the head moving device and saves the power of the vacuum pump when the mounting head completes the suction of the electronic component and the substrate transport device does not complete the loading of the circuit board. Run the operation.

  In one embodiment of the present technology, it is preferable that the control device lowers a voltage applied to the vacuum pump in the power saving operation of the vacuum pump. According to such a configuration, the power saving operation of the vacuum pump can be easily performed.

  In the above-described embodiment, it is preferable that the control device reduces the voltage applied to the vacuum pump by executing PWM control. The voltage applied to the vacuum pump can be substantially reduced by intermittently connecting the power source and the vacuum pump by PWM control. In the PWM control, the voltage drop width can be arbitrarily adjusted by adjusting the duty ratio.

FIG. 1 is an elevation view schematically showing the configuration of the electronic component mounting machine of the embodiment. FIG. 2 is a plan view schematically showing the configuration of the electronic component mounting machine according to the embodiment. FIG. 3 is a block diagram schematically showing the configuration of the negative pressure supply device. FIG. 4 shows an example of a PWM control waveform (S1) during normal operation and a PWM control waveform (S2) during power saving operation, respectively. FIG. 5 is a diagram illustrating an example of a voltage (V1) applied to the vacuum pump during normal operation and a voltage (V2) applied to the vacuum pump during power saving operation. FIG. 6 is a block diagram illustrating an electrical configuration of the electronic component mounting machine according to the embodiment. FIG. 7 is a flowchart illustrating a process related to the power saving operation executed by the control device. FIG. 8 is a flowchart showing a modification of the process shown in FIG.

  In one embodiment of the present technology, it is preferable that the control device starts the power saving operation of the vacuum pump when the magnitude of the negative pressure by the vacuum pump exceeds a first threshold value. According to such a configuration, it is possible to avoid starting the power saving operation of the vacuum pump in a state where the magnitude of the negative pressure by the vacuum pump is insufficient. As used herein, “the magnitude of negative pressure” means the absolute value of the difference from atmospheric pressure. Therefore, as the absolute pressure decreases, the “negative pressure magnitude” increases.

  In one embodiment of the present technology, it is preferable that the control device interrupts the power saving operation of the vacuum pump when the magnitude of the negative pressure by the vacuum pump falls below the second threshold during the power saving operation of the vacuum pump. According to such a configuration, it is possible to avoid that the magnitude of the negative pressure due to the vacuum pump is excessively reduced (that is, approaches the atmospheric pressure) due to the power saving operation of the vacuum pump.

  In the above-described embodiment, when the negative pressure by the vacuum pump exceeds the first threshold value larger than the second threshold value during the interruption of the power saving operation of the vacuum pump, the control device performs the power saving operation of the vacuum pump. It is preferable to resume. According to such a configuration, it is possible to appropriately execute the power saving operation of the vacuum pump while maintaining the magnitude of the negative pressure by the vacuum pump within an appropriate range.

  In one embodiment of the present technology, it is preferable that the control device interrupts the power saving operation of the vacuum pump after the first predetermined time from the start of the power saving operation of the vacuum pump. According to such a configuration, it is possible to avoid an excessive decrease in the magnitude of the negative pressure due to the vacuum pump without monitoring the negative pressure due to the vacuum pump.

  In the above-described embodiment, it is preferable that the control device restarts the power saving operation of the vacuum pump after the second predetermined time after interrupting the power saving operation of the vacuum pump. According to such a configuration, it is possible to appropriately execute the power saving operation of the vacuum pump while maintaining the magnitude of the negative pressure in an appropriate range without monitoring the negative pressure by the vacuum pump.

  In one embodiment of the present technology, it is preferable that the control device changes the mode of power saving operation of the vacuum pump based on at least one of the number and type of electronic components that the mounting head is adsorbing. For example, the smaller the number of electronic components that are picked up by the mounting head, the smaller the amount of negative pressure leak at the suction portion (for example, nozzle) of the mounting head. In such a case, the control device can more greatly limit the power supplied to the vacuum pump. Further, the amount of negative pressure leakage at the suction portion (for example, nozzle) of the mounting head also varies depending on the type of electronic component that the mounting head sucks. In consideration of these matters, the control device determines the mode of power saving operation of the vacuum pump (that is, the limit of power supplied to the vacuum pump) based on at least one of the number and type of electronic components that the mounting head adsorbs. By changing the amount), power saving operation can be performed effectively.

  An electronic component mounting machine 10 according to an embodiment will be described with reference to the drawings. The electronic component mounting machine 10 is a device that mounts the electronic component 4 on the circuit board 2. The electronic component mounting machine 10 is also referred to as a surface mounter or a chip mounter. The electronic component mounting machine 10 is provided together with other board working machines such as a solder printer, another electronic component mounting machine, and a board inspection machine, and constitutes a series of mounting lines.

  As shown in FIGS. 1 and 2, the electronic component mounting machine 10 includes a plurality of component feeders 12. Each component feeder 12 accommodates a plurality of electronic components 4 and sequentially supplies the electronic components 4. The configuration of the component feeder 12 is not particularly limited. For example, the component feeder 12 may be a tape feeder that accommodates a plurality of electronic components 4 on a winding tape, or may be a tray feeder that accommodates a plurality of electronic components 4 on a tray. The plurality of component feeders 12 are arranged along the X direction.

  The electronic component mounting machine 10 includes a mounting head 14 and a head moving device 16. The mounting head 14 has a plurality of nozzles 6, and the electronic component 4 can be sucked and held by each nozzle 6. The mounting head 14 picks up the electronic component 4 supplied by the component feeder 12 by moving each nozzle 6 in the vertical direction. The head moving device 16 is a biaxial robot, and moves the mounting head 14 in the X direction and the Y direction with respect to the component feeder 12 and other component devices. The mounting head 14 is moved by the head moving device 16 between a position where the electronic component 4 is picked up from the component feeder 12 and a position where the electronic component 4 is mounted on the circuit board 2. The configuration of the head moving device 16 is not particularly limited, and for example, an arm type robot having a plurality of joints may be used.

  The electronic component mounting machine 10 includes a substrate transfer device 18 and a substrate sensor 20. The substrate transfer device 18 is a device that transfers the circuit board 2. The circuit board 2 is carried into a predetermined position within the movable range of the mounting head 14 by the board transfer device 18, and after the planned electronic component 4 is mounted, the board transfer device 18 uses the electronic component mounting machine 10. To the outside. Although the board | substrate conveyance apparatus 18 of a present Example is a belt conveyor, the structure of the board | substrate conveyance apparatus 18 is not specifically limited. In this specification, for convenience, the transport direction of the substrate transport device 18 is the X direction, the direction perpendicular to the transport direction is the Y direction, and the direction perpendicular to the X direction and the Y direction is the Z direction. The X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction. The board sensor 20 detects the carry-in and carry-out of the circuit board 2 by the board transfer device 18.

  As shown in FIG. 3, the electronic component mounting machine 10 includes a negative pressure supply device 50. The negative pressure supply device 50 includes a vacuum pump 30 and a pump driver 40. The vacuum pump 30 is connected to each nozzle 6 of the mounting head 14 through a pipe line 32, and supplies a negative pressure for adsorbing the electronic component 4 to each nozzle 6. The vacuum pump 30 includes a DC motor 30a as a prime mover. The pump driver 40 adjusts the power supplied to the vacuum pump 30. The configuration of the pump driver 40 is not particularly limited.

  Although it is an example, the pump driver 40 in the present embodiment includes a switching element 42 and a smoothing circuit 44, and is applied to the vacuum pump 30 (more precisely, the motor 30a) by PWM control of on / off of the switching element 42. To adjust the voltage to be supplied to the vacuum pump 30.

  FIG. 4 shows an example of a PWM control waveform used by the pump driver 40. As will be described in detail later, the electronic component mounting machine 10 of the present embodiment can switch the operation mode of the vacuum pump 30 between normal operation and power saving operation. In normal operation, the pump driver 40 intermittently turns on the switching element 42 using the waveform S1 of FIG. On the other hand, in the power saving operation, the pump driver 40 intermittently turns on the switching element 42 using the waveform S2 of FIG. As is apparent from FIG. 4, the duty ratio (ratio of the period during which the switching element 42 is turned on) is smaller in the power saving operation than in the normal operation. As a result, as shown in FIG. 5, the voltage applied to the vacuum pump 30 is also smaller in the power saving operation (V2) than in the normal operation (V1).

  Returning to FIG. 3, the negative pressure supply device 50 further includes a first pressure switch 51, a second pressure switch 52, and a third pressure switch 53. These pressure switches 51 to 53 are sensors for monitoring the negative pressure supplied to the mounting head 14 by the vacuum pump 30. The first pressure switch 51 is turned on when the magnitude of the negative pressure by the vacuum pump 30 (absolute value of the difference from the atmospheric pressure) exceeds the first threshold, and the magnitude of the negative pressure by the vacuum pump 30 decreases the first threshold. Turns off when below. Similarly, the second and third pressure switches 52 and 53 are turned on when the magnitude of the negative pressure by the vacuum pump 30 exceeds the second threshold and the third threshold, respectively, and the magnitude of the negative pressure by the vacuum pump 30 is the first. It turns off when it falls below the second threshold and the third threshold. Here, the first threshold value is larger than the second threshold value, and the second threshold value is larger than the third threshold value. That is, first threshold> second threshold> third threshold. Here, “the magnitude of the negative pressure” means the absolute value of the difference from the atmospheric pressure. That is, the larger the “negative pressure”, the smaller the absolute pressure.

  Next, the electrical configuration of the electronic component mounting machine 10 will be described with reference to FIG. As shown in FIG. 6, the electronic component mounting machine 10 includes a control device 60. The control device 60 operates each part of the electronic component mounting machine 10 such as the plurality of component feeders 12, the mounting head 14, the head moving device 16, the substrate transport device 18, and the pump driver 40 based on an operation program stored in advance. To control. Thereby, a series of operations for mounting one or a plurality of electronic components 4 on the circuit board 2 is executed. As shown in FIG. 6, the substrate sensor 20 and the first to third pressure switches 51 to 53 are connected to the control device 60, and their output signals are input to the control device 60. .

  A series of operations performed by the electronic component mounting machine 10 will be briefly described. First, the board transfer device 18 carries the circuit board 2 into a predetermined position. In parallel with this, the mounting head 14 sucks and holds one or more electronic components 4 from the component feeder 12. When the mounting head 14 completes the suction holding of the electronic component 4, the head moving device 16 moves the mounting head 14 toward the circuit board 2. The mounting head 14 lowers the nozzle 6 from above the circuit board 2 to mount the electronic component 4 on the circuit board 2. The mounting head 14 repeatedly moves between the component feeder 12 and the circuit board 2 and repeats the operation of mounting the electronic component 4 from the component feeder 12 on the circuit board 2. When all the planned electronic components 4 are mounted on the circuit board 2, the circuit board 2 is carried out of the machine by the board transfer device 18. After carrying out the circuit board 2, the board transfer device 18 carries in the next circuit board 2.

  In the above-described series of operations, the substrate transfer device 18 may not be able to complete the loading of the circuit board 2 on time due to, for example, a delay of another device arranged on the same production line. In such a case, the electronic component mounting machine 10 interrupts a series of operations until the substrate transport device 18 completes the carry-in of the circuit board 2 after the mounting head 14 completes the suction of the one or more electronic components 4. To do. At this time, the electronic component mounting machine 10 of the present embodiment can execute the power saving operation of the vacuum pump 30 in order to suppress the power consumption by the vacuum pump 30.

  With reference to FIG. 7, the power-saving operation of the vacuum pump 30 will be described. FIG. 7 is a flowchart illustrating processing executed by the control device 60 regarding the power saving operation of the vacuum pump 30. As shown in FIG. 7, the control device 60, when the mounting head 14 completes the suction of the electronic component 4 (YES in S12), the substrate transport device 18 does not complete the loading of the circuit board 2 (S14). YES), the operation of the head moving device 16 is stopped (S16). As a result, the electronic component mounting machine 10 interrupts a series of operations until the circuit board 2 is carried in by the substrate transport device 18, and the mounting head 14 stops while holding one or a plurality of electronic components 4 by suction. Since the mounting head 14 is stationary, each nozzle 6 can continue to hold the electronic component 4 by suction even if the negative pressure supplied to the nozzle 6 is relatively small. Therefore, the control device 60 gives a command to the pump driver 40 and starts the power saving operation of the vacuum pump 30 (S18). As described above, in the power saving operation of the vacuum pump 30, the voltage applied to the vacuum pump 30 is smaller than in the normal operation, thereby reducing the power supplied to the vacuum pump 30.

  Note that the control device 60 may check the output signal of the first pressure switch 51 before starting the power saving operation (that is, before S18). When the first pressure switch 51 is on, the negative pressure by the vacuum pump 30 exceeds the first threshold value. Therefore, even if the power saving operation of the vacuum pump 30 is started, the negative pressure by the vacuum pump 30 immediately becomes insufficient. There is no. Therefore, the control device 60 may start the power saving operation of the vacuum pump 30 when the first pressure switch 51 is on, that is, when the negative pressure by the vacuum pump 30 exceeds the first threshold.

  When the power saving operation of the vacuum pump 30 is started, the magnitude of the negative pressure by the vacuum pump 30 may gradually decrease. Therefore, when the second pressure switch 52 is turned off (YES in S20), the control device 60 gives a command to the pump driver 40 and starts normal operation of the vacuum pump 30 (S22). That is, when the negative pressure falls below the second threshold, the power saving operation of the vacuum pump 30 is interrupted. Thereafter, when the first pressure switch 51 is turned on (YES in S24), the control device 60 resumes the power saving operation of the vacuum pump 30 (S18). That is, when the negative pressure recovers to a level exceeding the first threshold, the power saving operation of the vacuum pump 30 is resumed. According to such a configuration, the power saving operation of the vacuum pump 30 can be appropriately executed while maintaining the magnitude of the negative pressure within an appropriate range.

  Note that the control device 60 determines that the negative pressure by the vacuum pump 30 is abnormally reduced when the third pressure switch 53 is turned off during both the normal operation and the power saving operation. Stop a series of operations. This is because it is estimated that an abnormality has occurred in the vacuum pump 30 or a portion related thereto.

  As mentioned above, although the specific example of this invention was demonstrated in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  In the above-described embodiment, the power saving operation of the vacuum pump 30 is interrupted and restarted according to the magnitude of the negative pressure by the vacuum pump 30. On the other hand, as shown in FIG. 8, the control device 60 may interrupt and restart the power saving operation of the vacuum pump 30 according to the measurement time by the timer. That is, the control device 60 may interrupt the power saving operation after the first predetermined time after starting the power saving operation of the vacuum pump 30 (YES in S120) (S22). Further, the control device 60 may restart the power saving operation of the vacuum pump 30 after the second predetermined time after the interruption of the power saving operation (YES in S124). Note that the control device 60 may interrupt and restart the power saving operation of the vacuum pump 30 according to both the magnitude of the negative pressure by the vacuum pump 30 and the measurement time by the timer.

  It is also preferable that the control device 60 can selectively execute different modes of power saving operation for the power saving operation of the vacuum pump 30. For example, the control device 60 may be able to selectively execute normal operation, power saving operation of the first mode, and power saving operation of the second mode with less power supply than the first power saving operation. In this case, the control device 60 selectively selects one of the first mode power saving operation and the second mode power saving operation based on at least one of the number and type of the electronic components 4 attracted by the mounting head 14. It is preferable to carry out.

  The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

2: Circuit board 4: Electronic component 6: Nozzle 10: Electronic component mounting machine 12: Component feeder 14: Mounting head 16: Head moving device 18: Substrate transport device 20: Substrate sensor 30: Vacuum pump 30a: Motor 40: Pump driver 50: Negative pressure supply devices 51 to 53: First to third pressure switches 60: Control device

Claims (9)

An electronic component mounting machine for mounting electronic components on a circuit board,
A mounting head that holds and holds at least one electronic component;
A vacuum pump for supplying a negative pressure for adsorbing the electronic component to the mounting head;
A board transfer device for carrying the circuit board into a predetermined position;
A head moving device for moving the mounting head holding the electronic component by suction with respect to the circuit board carried into the predetermined position;
A control device for controlling at least the head moving device and the vacuum pump;
With
The control device interrupts the movement of the mounting head by the head moving device when the mounting head completes the suction of the electronic component while the substrate transport device does not complete the loading of the circuit board. And performing a power saving operation of the vacuum pump,
Electronic component mounting machine.   The electronic component mounting machine according to claim 1, wherein the control device reduces a voltage applied to the vacuum pump in a power saving operation of the vacuum pump.   The electronic component mounting machine according to claim 2, wherein the control device reduces the voltage applied to the vacuum pump by executing PWM control.   4. The electronic component mounting machine according to claim 1, wherein the control device starts a power saving operation of the vacuum pump when a negative pressure by the vacuum pump exceeds a first threshold. 5. .   5. The control device according to claim 1, wherein the control device interrupts the power saving operation of the vacuum pump when the magnitude of the negative pressure by the vacuum pump falls below a second threshold during the power saving operation of the vacuum pump. An electronic component mounting machine according to claim 1.   The controller restarts the power saving operation of the vacuum pump when the negative pressure by the vacuum pump exceeds a first threshold value that is larger than the second threshold value during interruption of the power saving operation of the vacuum pump. The electronic component mounting machine according to claim 5.   The electronic component mounting machine according to any one of claims 1 to 6, wherein the control device interrupts the power saving operation of the vacuum pump after a first predetermined time from the start of the power saving operation of the vacuum pump.   The electronic component mounting machine according to claim 7, wherein the control device restarts the power saving operation of the vacuum pump after a second predetermined time after interrupting the power saving operation of the vacuum pump.   The said control apparatus changes the aspect of the power saving operation of the said vacuum pump based on at least one of the number and the kind of the electronic component which the said mounting head adsorb | sucks. Electronic component mounting machine.

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