JP2014192213A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To further reduce the consumption power of the entire device by a simple configuration.SOLUTION: As part of a production plan, component-related information Dc (the heaviest component weight Wmax), head-related information Dh (the number Nn of attached nozzles), nozzle-related information Dm (nozzle diameter An) are acquired (S100 to S140). On the basis of these acquired pieces of information, the target number of revolutions Vp* of a pump motor 65a is set (s150). A vacuum pump 64 is driven by controlling the drive of the pump motor 65a by use of the set target number Vp* of revolutions (S160). Thus, the need for a dedicated sensor for obtaining these pieces of information is eliminated, and power consumption of the vacuum pump 64 can be reduced while suction force required for sucking components to the suction nozzle 40 is ensured.

Description

  The present invention relates to an electronic component mounting apparatus that picks up an electronic component by a head and mounts the electronic component on a substrate.

  Conventionally, as this type of electronic component mounting apparatus, in which an electronic component is sucked and mounted on a substrate by a suction nozzle mounted on a head, a vacuum pump, a pipe connected to the vacuum pump, and a branch from the pipe And an air tube connected to each suction nozzle, and a vacuum pump is driven to generate a suction force necessary to suck the electronic component to the suction nozzle (for example, a patent) Reference 1). In this device, a pressure sensor is provided in the pipe, and when the detected pressure detected by the pressure sensor exceeds the upper limit value, the vacuum pump is driven. When the detected pressure becomes lower than the upper limit value, the vacuum pump is driven. Is stopped. As a result, the power consumption of the entire apparatus can be reduced as compared with the case where the vacuum pump is always driven.

JP 2012-69836 A

  However, although the electronic component mounting apparatus described above can reduce the power consumption of the vacuum pump, a dedicated sensor for monitoring the pressure state in the pipe is required, so there is a space for installing the sensor. As a result, the apparatus becomes larger and disadvantageous in terms of cost.

  The main object of the electronic component mounting apparatus of the present invention is to further reduce the power consumption of the entire apparatus with a simple configuration.

  The electronic component mounting apparatus of the present invention employs the following means in order to achieve the main object described above.

The electronic component mounting apparatus of the present invention is
An electronic component mounting apparatus for picking up an electronic component by a head and mounting it on a substrate,
A suction nozzle mounted on the head and capable of sucking the electronic component into a suction port;
A negative pressure generating source for generating a negative pressure for applying a suction force to the suction port of the suction nozzle;
Information acquisition means for acquiring at least one of component-related information regarding the electronic component, head-related information regarding the head, and nozzle-related information regarding the suction nozzle as device-related information;
Negative pressure generation source control means for controlling the negative pressure generation source so that the generated negative pressure is adjusted based on the acquired device-related information;
It is a summary to provide.

  The electronic component mounting apparatus according to the present invention includes a negative pressure generation source that generates a negative pressure for applying a suction force to the suction port of the suction nozzle mounted on the head. At least one of component-related information regarding electronic components, head-related information regarding the head, and nozzle-related information regarding the suction nozzle is acquired as device-related information, and negatives generated based on the acquired device-related information are acquired. The negative pressure source is controlled so that the pressure is adjusted. Thereby, with a simple configuration, it is possible to secure a suction force necessary for the suction of the electronic component to the suction nozzle and to further reduce the power consumption of the negative pressure generation source, thereby reducing the power consumption of the entire apparatus. It can be further reduced.

  In such an electronic component mounting apparatus of the present invention, the information acquisition means acquires component weight related information that is information related to the weight of the electronic component to be mounted as the component related information, and the negative pressure generation source control means includes: The negative pressure generation source may be controlled so that the generated negative pressure is adjusted based on the acquired component weight related information. In this way, it is possible to secure a suction force necessary for the suction of the electronic component regardless of the weight of the electronic component to be mounted, and to further reduce the power consumption of the negative pressure generation source. In the electronic component mounting apparatus according to this aspect of the present invention, the head is configured to be capable of picking up a plurality of types of electronic components and mounting them on the substrate, and the negative pressure generation source control means is configured to control the plurality of types of electronic components. The negative pressure generation source may be controlled so that the generated negative pressure is adjusted based on the component weight related information of the heaviest electronic component among the components. In this way, it is possible to secure the suction force necessary for the suction of the electronic component to the suction nozzle regardless of the type of the electronic component to be mounted, and to further reduce the power consumption of the negative pressure generating source.

  In the electronic component mounting apparatus of the present invention, the information acquisition unit acquires head type related information regarding the type of the head as the head related information, and the negative pressure generation source control unit acquires the acquired head. The negative pressure generating source may be controlled so that the generated negative pressure is adjusted based on the species related information. In this way, it is possible to secure a suction force necessary for the suction of the electronic component regardless of the type of the head and to further reduce the power consumption of the negative pressure generation source.

  Furthermore, in the electronic component mounting apparatus of the present invention, the head is configured to be capable of mounting a plurality of types of suction nozzles, and the information acquisition unit is configured to use the suction nozzles mounted on the head as the nozzle-related information. The negative pressure generation source control means acquires the negative pressure generation source so that the negative pressure to be generated is adjusted based on the acquired nozzle type related information. It can also be controlled. In this way, it is possible to secure a suction force necessary for the suction of the electronic component regardless of the type of the suction nozzle and to further reduce the power consumption of the negative pressure generation source.

  The electronic component mounting apparatus according to the present invention further includes negative pressure detection means for detecting a negative pressure generated at the negative pressure generation source, and the negative pressure generation source control means includes the acquired apparatus related information. It is also possible to set a target negative pressure based on this, and to control the negative pressure generating source so that a deviation between the set target negative pressure and the detected negative pressure becomes small.

1 is a schematic explanatory diagram of a component mounting system 1. FIG. The perspective view of the component mounting machine 11. FIG. The block diagram showing the electrical connection relation of the component mounting system. Explanatory drawing which shows an example of the data contained in a production plan. The flowchart which shows the pump control routine of this embodiment. Explanatory drawing which shows the relationship between each of the heaviest part weight Wmax, the number Nn of nozzles mounted, the nozzle diameter An, and the target rotation speed Vp *. The flowchart which shows the pump control routine of a modification.

  Preferred embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic explanatory diagram of the component mounting system 1, FIG. 2 is a perspective view of the component mounting machine 11, and FIG. 3 is a block diagram showing an electrical connection relationship of the component mounting system 1. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

  The component mounting system 1 includes a mounting line 10 and a management computer 80.

  The mounting line 10 is arranged such that the first to fourth component mounting machines 11a to 11d that respectively perform the first to fourth steps are in ascending order from upstream to downstream. The first to fourth steps are steps for mounting an electronic component (hereinafter referred to as “component”) on the circuit board 16. In the present embodiment, since the first to fourth component mounting machines 11a to 11d have the same configuration, the ordinal numbers and alphabets at the end of the reference numerals are omitted in FIG. However, in the following description, the components of the first to fourth component mounters 11a to 11d are denoted by a to d at the end of the reference numerals.

  As shown in FIG. 2, the component mounting machine 11 includes a base 12, a mounting machine main body 14 installed on the base 12, and a reel unit 76 attached to the mounting machine main body 14.

  The base 12 is a heavy object formed in a rectangular parallelepiped, and casters (not shown) are attached to the four corners of the back surface.

  The mounting machine main body 14 is installed so as to be replaceable with respect to the base 12. The mounting machine main body 14 is mounted on the circuit board 16, the board transport device 18 that transports the circuit board 16, the head 24 that can move on the XY plane, the suction nozzle 40 that is attached to the head 24 and can move to the Z axis, and the circuit board 16. A mark camera 68 that captures the captured component, a parts camera 70 that captures the component sucked by the suction nozzle 40, a nozzle stocker 72 that stocks a plurality of types of suction nozzles that can be attached to the head 24, and various controls. And a control device 74 (see FIG. 3).

  The substrate transport device 18 is provided with support plates 20 and 20 provided at intervals in the front and rear direction of FIG. 2 and extending in the left-right direction, and conveyor belts 22 and 22 provided on the mutually opposing surfaces of the support plates 20 and 20 (FIG. 2 shows only one of them). The conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The circuit board 16 is placed on the upper surfaces of the pair of conveyor belts 22 and 22 and is conveyed from left to right. The circuit board 16 is supported by a large number of support pins 23 erected on the back side.

  The head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the component mounter 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26 and 30 are driven by drive motors 261 and 301 (see FIG. 3), respectively. The head 24 incorporates a Z-axis motor 34 and adjusts the height of the suction nozzle 40 integrated with a holder 50 attached to a ball screw 36 extending along the Z-axis by the Z-axis motor 34.

  The head 24 is detachably attached to the X-axis slider 26 and is replaced with a head suitable for the number and type of suction nozzles 40 to be attached.

  The suction nozzle 40 uses a negative pressure, which is lower than the atmospheric pressure, to suck a component at the tip of the nozzle or to release a component sucked at the tip of the nozzle. The suction nozzle 40 is connected to one of a vacuum pump 64 and an air pipe 66 via an electromagnetic valve 62. In order to suck the parts to the suction nozzle 40, the electromagnetic valve 62 is positioned so that the vacuum pump 64 and the suction nozzle 40 communicate with each other. As a result, the inside of the suction nozzle 40 has a negative pressure, and the component is sucked to the tip of the suction nozzle 40. On the other hand, in order to remove the component from the suction nozzle 40, the electromagnetic valve 62 is positioned so that the air pipe 66 and the suction nozzle 40 communicate with each other. As a result, the inside of the suction nozzle 40 becomes a positive pressure, and the part sucked at the tip of the suction nozzle 40 is removed. Further, the suction nozzle 40 includes a nozzle pressure sensor 42 (see FIG. 3) that detects the internal pressure. Of course, the nozzle pressure sensor 42 may not be provided.

  The vacuum pump 64 is configured as a negative pressure generation source for generating a suction force at the nozzle tip (suction port) of the suction nozzle 40, and is driven by a pump motor 65a (see FIG. 3). The pump motor 65a is configured as a permanent magnet type synchronous motor, for example, and rotates by forming a rotating magnetic field in each phase coil by switching control (PWM control) of a drive circuit 65b (see FIG. 3) as an inverter circuit. To drive. In the present embodiment, the vacuum pump 64 is mounted on each of the plurality of component mounters 11a to 11d. Of course, one vacuum pump 64 may be shared by a plurality of component mounting machines 11a to 11d.

  The mark camera 68 is fixed behind the lower end of the X-axis slider 26. The imaging range of the mark camera 68 is below the mark camera 68. The mark camera 68 takes an image of the component mounted on the circuit board 16 by the suction nozzle 40 and outputs the image to the control device 74. The control device 74 determines whether or not the component is normally mounted by comparing the image photographed by the mark camera 68 with an image of a normal mounting state stored in advance.

  The parts camera 70 is disposed in front of the support plate 20 on the front side of the substrate transfer device 18. The imaging range of the parts camera 70 is above the parts camera 70. When the suction nozzle 40 that sucks a part passes above the parts camera 70, the part camera 70 captures the state of the part sucked by the suction nozzle 40 and outputs the image to the control device 74. The control device 74 determines whether or not the component is normally sucked by comparing the image photographed by the parts camera 70 with the image of the normal sucking state stored in advance.

  The nozzle stocker 72 is a box that stocks a plurality of types of suction nozzles 40. The suction nozzle 40 is detachably attached to the holder 50 of the head 24, and is replaced with one suitable for the type of circuit board 16 on which the component is mounted and the type of component.

  As shown in FIG. 3, the control device 74 is configured as a microprocessor centered on a CPU 741, a ROM 742 that stores processing programs, an HDD 743 that stores various data, a RAM 744 that is used as a work area, and an external device and an electric device. An input / output interface 745 for exchanging signals is provided, and these are connected via a bus 746. The control device 74 outputs drive signals to the substrate transport device 18, the drive motor 261 of the X-axis slider 26, the drive motor 301 of the Y-axis slider 30, the Z-axis motor 34 of the head 24, the electromagnetic valve 62, and the drive circuit 65b. The detection signal from the nozzle pressure sensor 42 and the image signal from the mark camera 68 and the part camera 70 are input. The control device 74 is connected to the reel unit 76 and the management computer 80 so as to be capable of bidirectional communication. Each slider 26, 30 is equipped with a position sensor (not shown), and the control device 74 controls the drive motors 261, 301 of each slider 26, 30 while inputting position information from these position sensors. .

  As shown in FIG. 2, the reel unit 76 includes a plurality of reels 77 and is detachably attached to the front side of the mounting machine body 14. A tape is wound around each reel 77, and parts are held along the longitudinal direction on the surface of the tape. These parts are protected by a film covering the surface of the tape. Such a tape is unwound from the reel toward the rear, and the film is peeled off at the feeder section 78 so that the components are exposed.

  As shown in FIG. 3, the management computer 80 is configured as a microprocessor centered on a CPU 801, a ROM 802 that stores a processing program, an HDD 803 that stores a production plan of a circuit board, a RAM 804 that is used as a work area, An input / output interface 805 for exchanging electrical signals with an external device is provided, and these are connected via a bus 806. Further, the management computer 80 can input signals from an input device 82 typified by a mouse and a keyboard via an input / output interface 805 and is connected to the display 84 so that various images can be output. Here, the circuit board production plan is a plan that defines which components are mounted on the circuit board in each of the component mounting machines 11a to 11d, and how many circuit boards are mounted in such a manner. Say. FIG. 4 shows an example of data included in the production plan. As shown in FIG. 4, the production plan includes production date and time, the number of circuit boards to be manufactured, component related information Dc which is information related to components mounted on the circuit board, head related information Dh which is data related to the head 24 to be used, head Nozzle-related information Dn, which is information related to the suction nozzle 40 attached to 24, is included. Here, the component information Dc is data unique to each component. For example, the weight (component weight W) and size of the component, the suction position when the component is sucked by the suction nozzle 40, and the suction surface of the component. The material (smoothness), the moving speed when the component sucked by the suction nozzle 40 is moved by the substrate transfer device, and the like are included. The head-related information Dh is data unique to the head 24, and includes, for example, the types of suction nozzles 40 that can be mounted and the number thereof (nozzle mounting number Nn). The nozzle-related information Dn is data unique to the suction nozzle 40, and includes the type of the suction nozzle 40 used for component mounting, the nozzle diameter (nozzle diameter An), and the like. Such a production plan is input to the management computer 80 when the operator operates the input device 82. The management computer 80 that has input the production plan outputs a command signal to each of the component mounting machines 11a to 11d so that the components are mounted on the circuit board according to the production plan. The component-related information Dc, the head-related information Dh, and the nozzle-related information Dn are created for each of the component mounters 11a to 11d and transmitted from the management computer 80 to the component mounters 11a to 11d.

  Next, a procedure for mounting various components on the circuit board 16 using the component mounting system 1 of the present embodiment will be briefly described.

  The management computer 80 transmits a command signal to the first to fourth component mounters 11a to 11d based on the production plan. The control devices 74a to 74d of the first to fourth component mounters 11a to 11d execute component mounting according to the received command signal.

  Specifically, in the mounting line 10 shown in FIG. 1, the circuit board 16 supplied to the first component mounter 11a is subjected to a first step of component mounting, and then discharged from the first component mounter 11a. To the second component mounting machine 11b. Then, the second component mounting process is performed on the circuit board 16 by the second component mounter 11b, and thereafter, the second component mounter 11b is discharged from the second component mounter 11b and sent to the third component mounter 11c. In this way, the circuit board 16 is sequentially sent to the first to fourth component mounting machines 11a to 11d in ascending order, and the first to fourth steps of component mounting are executed. Thereafter, the circuit board 16 after the completion of all processes is discharged from the fourth component mounting machine 11d. When various components are actually mounted on the circuit board 16, a solder coating device (not shown) is arranged on the upstream side of the mounting line 10, and a solder reflow device (not shown) is arranged on the downstream side of the mounting line 10. Is done. The circuit board 16 is subjected to the first to fourth steps after the solder is applied by the solder applying device. Then, the reflow process is executed by the solder reflow apparatus on the circuit board 16 after all the component mounting processes are completed.

  Here, the component mounting process will be described using the component mounter 11 of FIG. The control device 74 (see FIG. 3) of the component mounter 11 rotates and drives the reel 77 of the reel unit 76 to unwind the tape wound around the reel 77 toward the rear. It is assumed that the surface is exposed. Thereafter, the control device 74 controls the X-axis slider 26 and the Y-axis slider 30 so that the suction nozzle 40 comes directly above the exposed part. Subsequently, the control device 74 controls the Z-axis motor 34 to lower the suction nozzle 40 by the ball screw 36 and controls the electromagnetic valve 62 so that the suction nozzle 40 and the vacuum pump 64 communicate with each other. Then, since a negative pressure is applied to the tip of the suction nozzle 40, the component is sucked to the tip. Thereafter, the control device 74 raises the suction nozzle 40 and controls the sliders 26 and 30 so that the components are located immediately above the predetermined position of the circuit board 16. 40 is supplied with positive pressure. Then, the component is separated from the suction nozzle 40, and the component is mounted at a predetermined position on the circuit board 16. In this way, each component is mounted on the circuit board 16.

  Next, the operation of the vacuum pump 64 for supplying negative pressure to the suction nozzle 40 in the component mounting system 1 of the present embodiment will be described. FIG. 5 is a flowchart showing an example of a pump control routine executed by the CPU 741 of the control device 74. This routine is executed when a command signal for instructing component mounting is received from the management computer 80. As described above, in this embodiment, since the vacuum pump 64 is mounted on each of the plurality of component mounters 11a to 11d, the control device 74 of each of the component mounters 11a to 11d performs a pump control routine. Executed.

  When the pump control routine is executed, the CPU 741 of the control device 74 first executes a process of inputting various data such as the component related information Dc (1,..., N), the head related information Dh, and the nozzle related information Dn. (Step S100). Here, as described above, the component-related information Dc, the head-related information Dh, and the nozzle-related information Dn are included in the production plan and input from the management computer 80 to the component mounters 11a to 11d. . Note that the component-related information Dc is individually input for each type of component to be mounted, and in this embodiment, an identification number of 1 to n is added to the end of Dc in order to identify the type of component.

  When various data are input in this way, the component weight W (1,..., N) included in the input component-related information Dc (1,..., N) is extracted (step S110), and the extracted component weight W (1,. , N), the weight of the heaviest part is set to the heaviest part weight Wmax (step S120). Subsequently, the number Nn of nozzles included in the input head related information Dh is extracted (step S130), and the nozzle diameter An included in the input nozzle related information Dn is extracted (step S140).

  Then, the target rotational speed Vp * of the pump motor 65a is set on the basis of the heaviest component weight Wmax, the nozzle mounting number Nn, and the nozzle diameter An (S150), and is driven to rotate at the set target rotational speed Vp *. The pump motor 65a is driven and controlled (step S160), and this routine is finished. FIG. 6 shows the relationship among the heaviest component weight Wmax, the number Nn of nozzles mounted, the nozzle diameter An, and the target rotational speed Vp *. As shown in the figure, the target rotational speed Vp * is set so as to increase as the heaviest part weight Wmax increases, increase as the nozzle mounting number Nn increases, and increase as the nozzle diameter An increases. This is because the suction force of the suction nozzle 40 necessary for sucking the part increases as the heaviest part weight Wmax increases, and the pressure from the suction nozzle 40 increases as the number Nn of nozzles increases and the nozzle diameter An increases. Since the amount of leakage increases, it is necessary to increase the negative pressure. In the present embodiment, since the heaviest part weight Wmax, the number Nn of nozzles installed, and the nozzle diameter An are used as production plans, a dedicated sensor for grasping these states is not required. The drive control of the pump motor 65a is performed, for example, by switching control of a switching element included in the drive circuit 65b so that torque necessary for rotation at the target rotation speed Vp * is output from the pump motor 65a. It is. As a result, the rotational speed of the pump motor 65a can be reduced while securing the suction force required to suck the component to the suction nozzle 40, and thus the power consumption of the vacuum pump 64 can be reduced.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The component mounting system 1 of this embodiment corresponds to the component mounting apparatus of the present invention, the suction nozzle 40 corresponds to a suction nozzle, the vacuum pump 64 corresponds to a negative pressure generation source, and the input device 82 of the management computer 80 is information. The control device 74 corresponds to an acquisition unit and the negative pressure generation source control unit.

  According to the component mounting system 1 of the present embodiment described above, based on the component related information Dc (the heaviest component weight Wmax), the head related information Dh (nozzle mounting number Nn), and the nozzle related information Dn (nozzle diameter An). Since the vacuum pump 64 is driven by setting the target rotational speed Vp * of the pump motor 65a and driving the pump motor 65a at the set target rotational speed Vp *, the pump motor 65a is always kept at a constant rotational speed. By controlling the driving, the power consumption of the vacuum pump 64 can be further reduced while securing the suction force necessary for sucking the components to the suction nozzle 40 as compared to driving the vacuum pump 64. As a result, the power consumption of the entire apparatus can be further reduced. Moreover, since the parts-related information Dc (the heaviest part weight Wmax), the head-related information Dh (the number of nozzles installed Nn), and the nozzle-related information Dn (nozzle diameter An) are used as part of the production plan, they are used exclusively. No need for sensors. Therefore, the power consumption of the vacuum pump 64 can be reduced without increasing the size of the apparatus or complicating the apparatus.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the component related information Dc is input via the input device of the management computer 80. However, the present invention is not limited to this, and the component related information Dc and component identification information (such as an identification number) are included. The database may be associated and stored in the HDD 803, and when the component identification information is input, the component related information Dc may be acquired by referring to the database. Similarly, the head related information Dh and the nozzle related information Dn are stored in the HDD 803 by associating the head related information Dh with the identification information of the head 24 and stored in the HDD 803. Are stored in the HDD 803 and the head related information Dh and the nozzle related information Dn are obtained by referring to the database when the identification information of the head 24 and the identification information of the suction nozzle 40 are input. It is good.

  In the above-described embodiment, the pump motor 65a is driven and controlled based on the heaviest component weight Wmax, the number of nozzles installed Nn, and the nozzle diameter An, but some of them may be omitted. Good. Further, based on information other than these, for example, the material (smoothness) of the suction surface of the component included in the component-related information Dc, the moving speed when the component sucked by the suction nozzle 40 is moved by the substrate transfer device, and the like. The pump motor 65a may be driven and controlled.

  In the above-described embodiment, the pump motor 65a is driven and controlled by so-called feedforward control in which the target rotational speed Vp * is set based on the heaviest component weight Wmax, the number of nozzles installed Nn, and the nozzle diameter An. The pressure sensor for detecting the actual negative pressure P generated by the vacuum pump 64, such as the nozzle pressure sensor 42 described above, is provided, and the pump motor 65a is driven and controlled by feedback control based on the actual negative pressure P. It is good. FIG. 7 shows a pump control routine of this modification. In the pump control routine of FIG. 7, the same processes as those in the pump control routine of FIG. In the pump control routine of FIG. 7, the actual negative pressure P is input from the nozzle pressure sensor 42 in addition to the component-related information Dc, the head-related information Dh, and the nozzle-related information Dn in step S100B, and extracted in steps S110 to S140. The target negative pressure P * is set based on the heaviest component weight Wmax, the number Nn of nozzles mounted, and the nozzle diameter An (step S145). Here, the target negative pressure P * can be set so as to increase as the heaviest weight Wmax increases, increase as the number Nn of nozzles increases, and increase as the nozzle diameter An increases. Based on the deviation between the target negative pressure P * and the actual negative pressure P, the target rotational speed V * of the pump motor 65a is set by the following equation (1) (step S150B), and the set target rotational speed V * is set. The pump motor 65a is driven and controlled (step S160), and this routine is finished. Here, Expression (1) is a relational expression in feedback control for setting the actual negative pressure P to the target negative pressure P *, “kp” is a coefficient in the proportional term, and “ki” is a coefficient in the integral term. is there. As a result, the negative pressure of the vacuum pump 64 can be managed with high accuracy, so that the power consumption of the vacuum pump 64 can be further reduced while securing the suction force of the suction nozzle 40 necessary for sucking parts. It becomes possible. In this modification, proportional-integral control (PI control) is used as feedback control. However, the present invention is not limited to this, and proportional control (P control) in which an integral term is omitted may be used, or a differential term. Proportional integral derivative control (PID control) to which is added may be used.

  V * = kp (P * -P) + ki∫ (P * -P) dt (1)

  In the embodiment described above, the present invention is applied to a component mounting machine including a plurality of component mounting machines 11a to 11d as a component mounting machine for mounting an electronic component on a board. However, a single component mounting machine 11 is provided. It may be applied to things.

  In the above-described embodiment, the reel unit 76 that supplies components with a tape wound around a reel is used. However, a tray unit that supplies components with a tray may be used.

  DESCRIPTION OF SYMBOLS 1 Component mounting system, 10 Mounting line, 11, 11a-11d Component mounting machine, 12 base, 14 Mounting machine main body, 16 Circuit board, 18 Substrate conveyance apparatus, 20 Support plate, 22, 22a-22d Conveyor belt, 23 Support Pin, 24 head, 26 X-axis slider, 261 drive motor, 28 guide rail, 30 Y-axis slider, 301 drive motor, 32 guide rail, 34 Z-axis motor, 36 ball screw, 40 suction nozzle, 42 nozzle pressure sensor, 50 holder 62, Solenoid valve, 64 Vacuum pump, 65a Drive circuit, 65b Motor for pump, 66 Air piping, 68 Mark camera, 70 Parts camera, 72 Nozzle stocker, 74, 74a to 74d Controller, 741, 741a to 741d CPU, 742 ROM, 743 HDD, 74 744a to 744d RAM, 745 input / output interface, 746 bus, 76 reel unit, 77 reel, 78 feeder section, 80 management computer, 801 CPU, 802 ROM, 803 HDD, 804 RAM, 805 input / output interface, 806 bus, 82 Input device, 84 display.

Claims (6)

An electronic component mounting apparatus for picking up an electronic component by a head and mounting it on a substrate,
A suction nozzle mounted on the head and capable of sucking the electronic component into a suction port;
A negative pressure generating source for generating a negative pressure for applying a suction force to the suction port of the suction nozzle;
Information acquisition means for acquiring at least one of component-related information regarding the electronic component, head-related information regarding the head, and nozzle-related information regarding the suction nozzle as device-related information;
Negative pressure generation source control means for controlling the negative pressure generation source so that the generated negative pressure is adjusted based on the acquired device-related information;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 1,
The information acquisition means acquires component weight related information, which is information related to the weight of the electronic component to be mounted, as the component related information.
The electronic component mounting apparatus, wherein the negative pressure generation source control means controls the negative pressure generation source so that the generated negative pressure is adjusted based on the acquired component weight related information. The electronic component mounting apparatus according to claim 2,
The head is configured to be able to pick up a plurality of types of electronic components and mount them on the substrate,
The negative pressure generation source control means controls the negative pressure generation source so that the generated negative pressure is adjusted based on the component weight related information of the heaviest electronic component among the plurality of types of electronic components. An electronic component mounting apparatus characterized by that. The electronic component mounting apparatus according to any one of claims 1 to 3,
The information acquisition means acquires head type related information regarding the type of the head as the head related information,
The electronic component mounting apparatus, wherein the negative pressure generation source control means controls the negative pressure generation source so that the generated negative pressure is adjusted based on the acquired head type related information. The electronic component mounting apparatus according to any one of claims 1 to 4,
The head is configured to be capable of mounting a plurality of types of the suction nozzles,
The information acquisition means acquires nozzle type related information related to the type of the suction nozzle attached to the head as the nozzle related information,
The electronic component mounting apparatus, wherein the negative pressure generation source control means controls the negative pressure generation source so that the generated negative pressure is adjusted based on the acquired nozzle type related information. An electronic component mounting apparatus according to any one of claims 1 to 5,
Comprising negative pressure detecting means for detecting negative pressure generated at the negative pressure generating source;
The negative pressure generation source control means sets a target negative pressure based on the acquired device-related information, and generates the negative pressure so that a deviation between the set target negative pressure and the detected negative pressure becomes small. An electronic component mounting apparatus characterized by controlling a light source.

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