JP2016066698A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve control that stabilizes an absorption state of a component absorbed to an absorption nozzle of a component mounting device with low power consumption.SOLUTION: Each mounting head 24 holding an absorption nozzle 26 is provided with a vacuum pump 27. The vacuum pump 27 is constituted to adjust negative pressure supplied to the absorption nozzle 26 by adjusting the number of rotation of the pump. A control device 31 of a component mounting device 10 determines an absorption state (a displacement amount of the absorption position and a component absorption posture) of the component absorbed to the absorption nozzle 26 and adjusts the number of rotation of the pump of the vacuum pump 27 according to the determination result to adjust the negative pressure supplied from the vacuum pump 27 to the mounting head 24 and to adjust absorption force of the absorption nozzle 26, thereby stabilizing the absorption state of the component. This can eliminate the necessity of maintaining the negative pressure of the vacuum pump 27 at a constant relatively large negative pressure during production and achieve control that stabilizes an absorption state of the component absorbed to the absorption nozzle 26 with low power consumption.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a component mounting machine having a function of adjusting a negative pressure supplied to a suction nozzle that sucks a component.

  As this type of component mounting machine, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2012-69836), a pressure sensor that detects a negative pressure supplied to a suction nozzle from a vacuum pump is provided. There is one in which the driving / stopping of the vacuum pump is controlled so that the negative pressure detected by the sensor falls within a predetermined range set in advance.

JP 2012-69836 A

  However, in the configuration of Patent Document 1 described above, the vacuum pump is only driven / stopped so that the negative pressure supplied from the vacuum pump to the suction nozzle falls within a predetermined range. It cannot cope with variations in the suction state of the parts sucked by the nozzle. For example, even if the types of parts to be picked up by the suction nozzle are the same, if the amount of shift in the picked-up position of the parts increases, component picking mistakes and part picking posture abnormalities (standing sticking, slanting picking, etc.) are likely to occur. When the component sucked by the suction nozzle is transported from the suction position to the circuit board mounting position, there is a phenomenon in which the component suction position shifts due to the inertial force acting on the component sucked by the suction nozzle and the component mounting position shifts. It tends to occur. To prevent such component suction mistakes, component suction posture abnormalities, and component suction position shifts during transportation, increase the negative pressure (differential pressure from the atmospheric pressure) supplied from the vacuum pump to the suction nozzle. Since it is effective to increase the suction force of the suction nozzle to stabilize the suction state of the parts, the negative pressure of the vacuum pump is always maintained at a large constant negative pressure. If the negative pressure is always maintained at a large constant negative pressure, there is a drawback that the amount of power consumed to drive the vacuum pump increases.

  Therefore, the problem to be solved by the present invention is to provide a component mounting machine capable of realizing control for stabilizing the suction state of a component sucked by a suction nozzle with low power consumption.

  In order to solve the above-mentioned problem, the invention according to claim 1 is directed to a component mounting machine that supplies a negative pressure from a negative pressure source to a suction nozzle, sucks the component with the suction nozzle, and mounts it on a circuit board. A suction state determination unit that determines a suction state of a component sucked by the nozzle (a displacement amount of a suction position, a component suction posture, etc.), and a negative pressure source based on the suction state of the component determined by the suction state determination unit And a negative pressure adjusting means for adjusting the suction force of the suction nozzle by adjusting the pressure. In this configuration, the suction state of the part sucked by the suction nozzle is determined, and the suction force of the suction nozzle is adjusted by adjusting the negative pressure of the negative pressure source according to the determination result. In addition, the negative pressure of the negative pressure source need not always be maintained at a constant large negative pressure, and control for stabilizing the suction state of the parts sucked by the suction nozzle can be realized with low power consumption.

  In addition, when the component sucked by the suction nozzle is transported from the suction position to the mounting position of the circuit board, if the suction state of the component is not stable, the suction position of the component is shifted due to the inertial force acting on the component. There is a possibility that the mounting position of the parts will be shifted. The component mounting position deviation amount is a parameter reflecting instability of the component suction state (component adsorption position deviation amount during conveyance).

  Therefore, as described in claim 2, a mounting position deviation amount determining means for determining a mounting position deviation amount of a component mounted on the circuit board is provided, and the negative pressure adjusting means is configured to adsorb the component determined by the adsorption state determining means. The negative pressure of the negative pressure source may be adjusted based on the state and the mounting position shift amount of the component determined by the mounting position shift amount determination means. In this way, the suction force (negative pressure) of the suction nozzle is adjusted so as to prevent the displacement of the suction position of the component at the time of transport, which causes the mounting position shift of the component on the circuit board. Control to stabilize the adsorption state can also be realized with low power consumption.

  Specifically, as in claim 3, the negative pressure adjusting means is configured such that the negative pressure of the negative pressure source (when the suction state of the component determined by the suction state determination means does not fall within a predetermined range that can be considered stable) The suction pressure of the suction nozzle is increased by increasing the differential pressure from the atmospheric pressure, and the negative pressure of the negative pressure source is reduced by reducing the negative pressure of the negative pressure source when the suction state of the component is within a predetermined range that can be considered stable. What is necessary is just to make it reduce suction power.

  According to a fourth aspect of the present invention, the negative pressure adjusting means has a component mounting position deviation amount determined by the mounting position deviation amount determining means within a predetermined range in which the influence of the suction position deviation during conveyance can be ignored (that is, stable). When the pressure does not fall within the predetermined range (which can be regarded as suction), the negative pressure of the negative pressure source is increased to increase the suction power of the suction nozzle. When the pressure is within the range, the negative pressure of the negative pressure source may be reduced to reduce the suction force of the suction nozzle.

  According to a fifth aspect of the present invention, the apparatus includes a conveyance speed control unit that controls a conveyance speed for conveying the component adsorbed by the adsorption nozzle from the adsorption position to the circuit board mounting position, and the conveyance speed control unit includes the negative pressure adjustment unit. When the negative pressure of the negative pressure source adjusted by the means has reached the maximum adjustable negative pressure, the suction state of the component determined by the suction state determination means does not fall within a predetermined range that can be considered stable. You may make it reduce the conveyance speed of the component to the mounting position of a board | substrate. In short, when the negative pressure of the negative pressure source has reached the maximum adjustable negative pressure and the negative pressure cannot be increased any further, and the suction state of the component is determined to be unstable. , Decreasing the component conveyance speed to the circuit board mounting position and reducing the inertial force acting on the component adsorbed to the adsorption nozzle, stabilizing the component adsorption state, and the component adsorption position during conveyance This prevents the deviation.

  Further, according to a sixth aspect of the present invention, the transport speed control means is configured to determine the mounting position deviation amount when the negative pressure of the negative pressure source adjusted by the negative pressure adjustment means reaches an adjustable maximum negative pressure. If the component mounting position deviation amount determined in step 1 does not fall within a predetermined range in which the influence of the suction position deviation during conveyance can be ignored, the component conveyance speed to the circuit board mounting position may be reduced. . In short, when the negative pressure of the negative pressure source has reached the maximum adjustable negative pressure and the negative pressure cannot be increased any further, the component mounting position shift amount is the If the impact does not fall within the specified range that can be ignored, it is determined that the component suction position has shifted during transport, and the component transport speed to the mounting position on the circuit board is reduced. By reducing the inertial force acting on the sucked part, the suction state of the part is stabilized, and the suction position shift of the part during conveyance is prevented.

  In the present invention, the negative pressure initial value at the start of production may be set according to the type of the component to be sucked by the suction nozzle and / or the nozzle diameter of the suction nozzle as in claim 7 (here, The “component type and / or nozzle diameter of the suction nozzle” means “part type and / or nozzle diameter of the suction nozzle”). In short, since the negative pressure required to stably absorb parts varies depending on the type of parts to be sucked into the suction nozzle and the nozzle diameter of the suction nozzle, the initial negative pressure at the start of production is determined based on the type of parts and the suction nozzle. If the nozzle diameter is set according to the nozzle diameter, the difference between the initial negative pressure at the start of production and the appropriate negative pressure can be reduced. It can be adjusted to an appropriate negative pressure according to the nozzle diameter of the suction nozzle.

  Further, as in claim 8, the negative pressure source negative pressure data adjusted by the negative pressure adjusting means is stored in association with the type of component and / or the nozzle diameter of the suction nozzle, the negative pressure The adjustment means is responsive to the type of the component adsorbed to the adsorption nozzle and / or the nozzle diameter of the adsorption nozzle from the negative pressure data for each type of component and / or the nozzle diameter of the adsorption nozzle stored in the storage means. Alternatively, the negative pressure data may be selected and set to the initial negative pressure value at the start of production. In this way, the negative pressure adjusted during production can be learned, and the learned value can be set to the initial negative pressure value at the start of the next production. The negative pressure can be adjusted appropriately according to the type and the nozzle diameter of the suction nozzle.

  According to a ninth aspect of the present invention, the storage device stores the negative pressure history data of the negative pressure source adjusted by the negative pressure adjustment unit in association with the type of component and / or the nozzle diameter of the suction nozzle, The negative pressure adjusting means includes the type of the component adsorbed to the adsorption nozzle and / or the nozzle of the adsorption nozzle from the history data of the negative pressure for each type of component and / or the nozzle diameter of the adsorption nozzle stored in the storage unit. Alternatively, negative pressure history data corresponding to the diameter may be selected and statistically processed to set an initial negative pressure value at the start of production. In this way, even if there is a variation in negative pressure adjusted for each adsorption operation during past production, the history data is statistically processed to reduce the influence of variations in negative pressure adjusted for each adsorption operation. Thus, the negative pressure initial value at the start of production can be set.

  Further, as in claim 10, there may be provided a configuration including production management means for rearranging and setting the mounting order of components to be mounted on the circuit board before the start of production in order of increasing or decreasing negative pressure initial value. In short, as the amount of negative pressure change for each negative pressure adjustment increases, the power consumption of the negative pressure source increases.Therefore, the order of component mounting is rearranged in order of increasing or decreasing initial negative pressure value, and negative pressure for each negative pressure adjustment. This is to reduce the amount of pressure change, thereby further reducing the power consumption of the negative pressure source.

  Further, as in claim 11, a pressure sensor for detecting a negative pressure supplied to the suction nozzle is provided, and the negative pressure adjusting means adjusts the negative pressure of the negative pressure source based on the negative pressure detected by the pressure sensor. You may make it adjust. In this way, the actual negative pressure supplied to the suction nozzle can be reliably adjusted to the target negative pressure.

The present invention can be applied to a configuration in which a plurality of mounting heads are provided in one component mounting machine. In this case, it is necessary to adjust the negative pressure for each mounting head that holds the suction nozzle.
Therefore, as in claim 12, it is preferable to provide a vacuum pump as a negative pressure source for each mounting head. In this case, the vacuum pump may be configured to adjust the negative pressure by adjusting the pump rotation speed.

FIG. 1 is a side view of a component mounter according to an embodiment of the present invention. FIG. 2 is a block diagram showing the configuration of the control system of the component mounter. FIG. 3 is a diagram illustrating a configuration example of a component mounting line. FIG. 4 is a diagram illustrating a determination example of the component suction position deviation in the XY directions. FIG. 5 is a diagram illustrating a determination example of the component suction position deviation in the θ direction (rotation direction). FIG. 6 is a diagram for explaining an example in which the mounting order of components to be mounted on the circuit board before the start of production is rearranged and set in descending order of initial negative pressure value (pump rotation speed). FIG. 7 is a flowchart (part 1) showing the flow of processing of the negative pressure adjustment program. FIG. 8 is a flowchart (part 2) showing the flow of processing of the negative pressure adjustment program.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the configuration of the component mounting machine will be described with reference to FIG.
A conveyor 13 for conveying the circuit board 12 is provided on the base 11 of the component mounter 10 (hereinafter, the conveyance direction of the circuit board 12 by the conveyor 13 is referred to as X direction). Of the two support rails 13a and 13b and the support members 15a and 15b that support the conveyor belts 14a and 14b constituting the conveyor 13, one support member 15a is fixed at a fixed position, and the opposite support member The width of the conveyor 13 (the interval between the conveyor rails 13a and 13b) is adjusted to the width of the circuit board 12 by adjusting the position in the Y direction of 15b along the guide rail 16 by a feed screw mechanism (not shown) or the like. It can be done.

  A device pallet 22 is detachably attached to the side of the conveyor 13 on the base 11, and a plurality of feeders 23 for supplying parts are detachably attached on the device pallet 22.

  The component mounter 10 is provided with a head moving device 25 that moves the mounting head 24 in the horizontal direction (XY direction) and the vertical direction (Z direction). The mounting head 24 holds one or a plurality of suction nozzles 26 that suck the components sent to the suction position by the feeder 23.

  A negative pressure is supplied to the mounting head 24 holding the suction nozzle 26 from a vacuum pump 27 which is a negative pressure source. In the case where a plurality of mounting heads 24 are provided in one component mounting machine 10, one vacuum pump 27 is provided for each mounting head 24. As shown in FIG. 3, in the component mounting line in which a plurality of component mounting machines 10 are arranged side by side, one vacuum pump 27 is provided for each mounting head 24 of each component mounting machine 10. In short, one vacuum pump 27 is assigned to one mounting head 24. The vacuum pump 27 is configured to adjust the negative pressure by adjusting the pump rotation speed.

  The mounting head 24 includes an air passage (not shown) for supplying negative pressure supplied from the vacuum pump 27 to the suction nozzle 26, an on-off valve (not shown) for opening and closing the air passage, and a suction nozzle 26. A pressure sensor 28 for detecting the negative pressure to be supplied is provided.

  As shown in FIG. 2, the control device 31 of the component mounting machine 10 includes an input device 32 such as a keyboard, a mouse, and a touch panel, a display device 34 such as a liquid crystal display and a CRT, and the negative devices shown in FIGS. A storage device 33 (storage means) such as a ROM, a RAM, a hard disk or the like for storing a pressure adjustment program and negative pressure data after adjustment, which will be described later, and a parts camera 35 (for imaging a part adsorbed to the adsorption nozzle 26 from below. A component imaging camera) is connected to a mark camera 36 (reference mark imaging camera) that images a reference mark (not shown) on the upper surface of the circuit board 12 from above. The parts camera 35 is installed at a position where the component picked up by the suction nozzle 26 is picked up from a position at which the component is picked up from the suction position to the mounting position of the circuit board 12, while the mark camera 36 is a head camera. The moving device 25 is installed so as to move integrally with the mounting head 24. The parts camera 35 is also installed so as to move integrally with the mounting head 24 by the head moving device 25, and the parts sucked by the suction nozzle 26 are imaged by the parts camera 35 via a prism (not shown). You may comprise so that it may do.

  The control device 31 of the component mounter 10 has an image processing function for processing an image captured by the parts camera 35 or the mark camera 36, and when the component sucked by the suction nozzle 26 passes through the imaging area above the parts camera 35. In addition, the parts sucked by the suction nozzle 26 are imaged by the parts camera 35, and function as a suction state determination unit that determines the suction state of the parts sucked by the suction nozzle 26 by image processing. At this time, as the component suction state, the amount of displacement of the component suction position with respect to the suction nozzle 26 and the presence / absence of abnormality in the component suction posture (standing suction, oblique suction, etc.) are determined. The control device 31 of the component mounting machine 10 also functions as a transport speed control unit that controls a transport speed for transporting the component sucked by the suction nozzle 26 from the suction position to the mounting position of the circuit board 12.

  As shown in FIG. 3, a component mounting line is configured by arranging a plurality of component mounting machines 10 on a transport path 41 that transports the circuit board 12. In the component mounting line, a solder printer 42 is installed on the upstream side, and an inspection device 43 and a reflow device 44 are installed on the downstream side. The inspection device 43 functions as a mounting position deviation amount determination unit that determines a mounting position deviation amount of a component mounted on the circuit board 12, and inspects a mounting state such as a mounting position deviation amount of the component of the circuit board 12 by image processing. The information of the inspection result is transmitted to the production management computer 45. The production management computer 45 manages the operations of the component mounting machines 10, the solder printing machine 42 and the inspection device 43 that constitute the component mounting line, and receives information on the amount of component mounting position deviation transmitted from the inspection device 43. , To the control device 31 of the component mounter 10 on which the component is mounted.

  By the way, even if the types of the parts to be sucked by the suction nozzle 26 are the same, if the shift amount of the part suction position becomes large, a part suction error (part suction failure) or a part suction posture abnormality (standing suction, diagonal suction, etc.) ) Or the suction position of the component is shifted due to inertial force acting on the component sucked by the suction nozzle 26 when the component sucked by the suction nozzle 26 is transported from the suction position to the mounting position of the circuit board 12. As a result, the mounting position of the component tends to shift. In order to prevent such component suction mistakes, component suction posture abnormalities, and displacement of the suction position during component transportation, the negative pressure (differential pressure from the atmospheric pressure) supplied from the vacuum pump 27 to the suction nozzle 26 is increased. Although it is effective to increase the suction force of the suction nozzle 26 to stabilize the suction state of the parts, the negative pressure of the vacuum pump 27 is always maintained at a large constant negative pressure during production as in the prior art. As a result, the power consumption required to drive the vacuum pump 27 is increased.

  Therefore, in this embodiment, the control device 31 of the component mounting machine 10 executes a negative pressure adjustment program shown in FIGS. The negative pressure supplied from the vacuum pump 27 to the mounting head 24 is adjusted by adjusting the pump rotation speed of the vacuum pump 27 according to the determination result. It functions as a negative pressure adjusting means for adjusting the suction force. In this embodiment, in consideration of the correlation between the negative pressure generated by the vacuum pump 27 and the pump rotational speed, the pump rotational speed is adjusted to target the negative pressure of the vacuum pump 27. Although the pressure is adjusted to a negative pressure, the current or voltage of the drive motor of the vacuum pump 27 is adjusted because there is a correlation between the pump rotation speed of the vacuum pump 27 and the current and voltage of the drive motor. By adjusting the pump rotation speed, the negative pressure of the vacuum pump 27 may be adjusted to the target negative pressure.

  For example, when the suction state of the component sucked by the suction nozzle 26 does not fall within a predetermined range that can be regarded as stable (that is, when the deviation amount of the suction position of the component does not fall within a predetermined range where stable suction is possible, or when the component suction posture is In the case where it does not fall within a predetermined range that can be regarded as normal), the suction force of the suction nozzle 26 is increased by increasing the pump rotation speed of the vacuum pump 27 and increasing the negative pressure of the vacuum pump 27, so that the suction nozzle 26 prevents the component adsorbed on 26 from falling or prevents the component from adsorbing from being displaced during conveyance. In the next cycle, when picking up parts of the same type, the parts are picked up with the negative pressure that was increased last time. The negative pressure of the pump 27 is increased. Thus, the suction force of the suction nozzle 26 is gradually increased by gradually increasing the pump rotation speed of the vacuum pump 27 and gradually increasing the negative pressure of the vacuum pump 27 until the suction state of the components is stabilized.

  On the other hand, when the suction state of the component is within a predetermined range that can be regarded as stable, the suction nozzle 26 is configured by gradually decreasing the pump rotation speed of the vacuum pump 27 and gradually decreasing the negative pressure of the vacuum pump 27. Gradually reduce the suction power. Thereby, the power consumption of the vacuum pump 27 is reduced.

  Further, when the vacuum pressure of the vacuum pump 27 reaches the maximum adjustable negative pressure, if the suction state of the component does not fall within a predetermined range that can be regarded as stable, the component sucked by the suction nozzle 26 is moved to the suction position. The suction speed of the component is stabilized by lowering the conveyance speed at which the component is conveyed to the mounting position of the circuit board 12 and reducing the inertial force acting on the component during conveyance. In short, when the negative pressure of the vacuum pump 27 has reached the maximum negative pressure that can be adjusted and the negative pressure cannot be increased any more, and the suction state of the component is determined to be unstable. By lowering the conveying speed of the component to the mounting position of the circuit board 12 and reducing the inertial force acting on the component adsorbed by the adsorption nozzle 26, the adsorption state of the component is stabilized, and the component at the time of conveyance This prevents the adsorption position from shifting.

  Here, with reference to FIGS. 4 and 5, the relationship between the amount of displacement of the suction position of the component sucked by the suction nozzle 26 and the stability of the suction state will be described. FIG. 4 shows a determination example of the component suction position deviation in the XY directions, and FIG. 5 shows a determination example of the component suction position deviation in the θ direction (rotation direction).

  As shown in FIG. 4 and FIG. 5, the component adsorption position deviation amount is within the position deviation line (stable If it is within a predetermined range that can be regarded as suction), the stability of the suction state of the component can be ensured without increasing the negative pressure of the vacuum pump 27, but the displacement position of the component suction position can be stably absorbed. In order to ensure the stability of the suction state of the parts, it is necessary to increase the suction force of the suction nozzle 26 by increasing the negative pressure of the vacuum pump 27. However, if the component adsorption position deviation exceeds the allowable maximum adsorption position deviation line (allowable predetermined range), even if the negative pressure of the vacuum pump 27 is increased, the stability of the component adsorption state cannot be ensured. Discarded as abnormal. It should be noted that even if the component suction posture recognized by the captured image of the parts camera 35 is abnormal (standing suction, oblique suction, etc.), it is discarded as a suction abnormality.

  In addition, when the component sucked by the suction nozzle 26 is transported from the suction position to the mounting position of the circuit board 12, if the component suction state is not stable, the component suction position shifts due to inertial force acting on the component. There is a possibility that the mounting position of the component is shifted. The component mounting position deviation amount is a parameter reflecting instability of the component suction state (component adsorption position deviation amount during conveyance).

  Therefore, in this embodiment, the control device 31 of the component mounting machine 10 executes a negative pressure adjustment program shown in FIGS. 7 and 8 to be described later, so that the mounting position shift of the components of the circuit board 12 inspected by the inspection device 43 is performed. Information on the amount is received via the production management computer 45, and the vacuum pump 27 is adjusted by adjusting the pump rotation speed of the vacuum pump 27 in consideration of the component mounting position shift amount in addition to the above-described component adsorption state. The suction force of the suction nozzle 26 is adjusted by adjusting the negative pressure. For example, when the component mounting position deviation amount does not fall within a predetermined range in which the influence of the adsorption position deviation at the time of conveyance can be ignored (that is, within a predetermined range that can be regarded as stable adsorption), the negative pressure of the vacuum pump 27 is increased. When the suction force of the suction nozzle 26 is increased to prevent the displacement of the suction position of the component during transportation, and the amount of mounting position displacement of the component is within a predetermined range in which the influence of the suction position displacement during transportation can be ignored In order to reduce the suction pressure of the suction nozzle 26, the negative pressure of the vacuum pump 27 is decreased. In this way, the suction force (negative pressure) of the suction nozzle 26 is adjusted so as to prevent the displacement of the suction position of the component at the time of transport, which causes a shift in the mounting position of the component of the circuit board 12. Control that stabilizes the suction state of components can also be realized with low power consumption.

  Further, when the negative pressure of the vacuum pump 27 reaches the adjustable maximum negative pressure, the mounting position deviation amount of the components of the circuit board 12 does not fall within a predetermined range in which the influence of the adsorption position deviation at the time of conveyance can be ignored. In this case, by lowering the conveyance speed at which the component adsorbed by the adsorption nozzle 26 is conveyed from the adsorption position to the mounting position of the circuit board 12 and reducing the inertial force acting on the component at the time of conveyance, the component adsorption state is reduced. Stabilize. In short, when the negative pressure of the vacuum pump 27 reaches the maximum negative pressure that can be adjusted and the negative pressure cannot be increased any more, the mounting position shift amount of the components on the circuit board 12 is not improved. If it does not fall within a predetermined range in which the influence of the suction position shift can be ignored, it is determined that the component suction position has shifted during transport, and the transport speed of the component to the mounting position of the circuit board 12 is reduced. In this way, the suction state of the component sucked by the suction nozzle 26 is stabilized, and the shift of the suction position of the component during conveyance is prevented.

In the present invention, the negative pressure of the vacuum pump 27 may be adjusted from the same initial value (for example, standard value) every time production is started, but the negative pressure is adjusted until the negative pressure is adjusted from the initial value to an appropriate negative pressure. When the adjustment amount increases, the time until the negative pressure adjustment is completed (the time until the suction state of the parts becomes stable) becomes longer. After that, after the start of production, the part suction mistake, the fall of the suction parts during transportation, and the parts The frequency of occurrence of component mounting defects due to suction position deviation increases.
As a countermeasure, in this embodiment, the negative pressure initial value at the start of production is set by any of the following methods.

[Negative pressure initial value setting method (1)]
The negative pressure initial value at the start of production is set in accordance with the type of component sucked by the suction nozzle 26 and / or the nozzle diameter of the suction nozzle 26 (here, “type of component and / or nozzle diameter of the suction nozzle 26”). “Means“ the type of component and / or the nozzle diameter of the suction nozzle 26 ”). In short, since the negative pressure required to stably absorb the component differs depending on the type of component adsorbed on the adsorption nozzle 26 and the nozzle diameter of the adsorption nozzle 26, the initial negative pressure value at the start of production is changed to the type of component, If it is set according to the nozzle diameter of the suction nozzle 26, the difference between the negative pressure initial value at the start of production and the appropriate negative pressure can be reduced, and the negative pressure can be set in a short time after the start of production. It is possible to adjust to a proper negative pressure according to the type of nozzle and the nozzle diameter of the suction nozzle 26.

[Negative pressure initial value setting method (2)]
The negative pressure data of the vacuum pump 27 adjusted during production is stored in the storage device 33 in association with the type of component and / or the nozzle diameter of the suction nozzle 26, and stored for each type of component and / or suction. From the negative pressure data for each nozzle diameter of the nozzle 26, the negative pressure initial value at the start of production is selected by selecting the negative pressure data corresponding to the type of component to be sucked by the suction nozzle 26 and / or the nozzle diameter of the suction nozzle 26. Set to. In this way, the negative pressure adjusted during production can be learned, and the learned value can be set to the initial negative pressure value at the start of the next production. An appropriate negative pressure can be adjusted according to the type and the nozzle diameter of the suction nozzle 26.

[Negative pressure initial value setting method (part 3)]
The negative pressure history data of the vacuum pump 27 adjusted during production is stored in the storage device 33 in association with the type of component and / or the nozzle diameter of the suction nozzle 26, and for each type of stored component and / or Production of statistical data by selecting negative pressure history data corresponding to the type of parts adsorbed to the suction nozzle 26 and / or the nozzle diameter of the suction nozzle 26 from the negative pressure history data for each nozzle diameter of the suction nozzle 26 Set the negative pressure initial value at the start.

  Here, the statistical processing means, for example, processing for calculating a representative value such as an average value, a median value, or a mode value, and the average value calculation processing is an arithmetic average, a geometric average, a harmonic average, or the like. Alternatively, it may be a weighted average value (weighted average value) in which negative pressure history data is weighted and averaged. For example, the weighted average value is calculated by increasing the weight of new data. You may do it. In this way, even if there is a variation in negative pressure adjusted for each adsorption operation during past production, the history data is statistically processed to reduce the influence of variations in negative pressure adjusted for each adsorption operation. Thus, the negative pressure initial value at the start of production can be set.

  In the present embodiment, the control device 31 (or the production management computer 45) of the component mounting machine 10 sets the mounting order of components to be mounted on the circuit board 12 before the start of production as shown in FIG. It also functions as production management means for rearranging and setting (in order of increasing or decreasing pump speed, current, voltage). In short, since the power consumption of the vacuum pump 27 increases as the amount of change in negative pressure for each negative pressure adjustment increases, the component mounting order is rearranged in order of increasing or decreasing negative pressure initial value, and negative pressure for each negative pressure adjustment. This is to reduce the amount of change in pressure, thereby further reducing the power consumption of the vacuum pump 27.

  Further, the control device 31 of the component mounting machine 10 reads the output of the pressure sensor 28 provided in the mounting head 24, constantly monitors the negative pressure supplied to the suction nozzle 26, and the negative pressure suddenly increases due to a component suction error or the like. When the number decreases, the parts adsorbed at the same time or the parts that are adsorbed simultaneously by increasing the pump rotation speed of the vacuum pump 27 so as not to affect the adsorption of the next adsorption cycle and quickly recovering the negative pressure. In the next adsorption cycle, the parts can be adsorbed stably. After the negative pressure is recovered, the pump rotation speed of the vacuum pump 27 is quickly returned to the state before the increase, thereby preventing the negative pressure in the next adsorption cycle from becoming excessive.

  Further, the control device 31 of the component mounting machine 10 constantly monitors the negative pressure supplied from the vacuum pump 27 to the suction nozzle 26 based on the negative pressure detection value of the pressure sensor 28, and the negative pressure detection value is the target negative pressure. If it is determined that there is a deviation, the pump rotation speed of the vacuum pump 27 is adjusted according to the deviation amount, and the actual negative pressure supplied to the suction nozzle 26 is reliably adjusted to the target negative pressure. . In other words, the pump rotation speed of the vacuum pump 27 is feedback-controlled so that the negative pressure detection value of the pressure sensor 28 matches the target negative pressure.

  An example of the negative pressure adjustment of the present embodiment described above will be described using the negative pressure adjustment program of FIGS. 7 and 8 is executed by the control device 31 (or the production management computer 45) of the component mounter 10, and serves as a negative pressure adjusting means in the claims. This program is started at the start of production. First, in step 101, it is determined whether or not the negative pressure learning mode is selected. Here, the negative pressure learning mode is a mode in which the negative pressure (pump rotation speed of the vacuum pump 27) adjusted during production is learned and the initial negative pressure value at the start of production is set as the negative pressure learning value. If it is determined in step 101 that the negative pressure learning mode is selected, the process proceeds to step 102 where the initial negative pressure value at the start of production is stored in the storage device 33 in step 118 of FIG. Set to the negative pressure at the end of the previous production (the negative pressure adjusted last during the previous production). At this time, the negative pressure corresponding to the type of component and / or the nozzle diameter of the suction nozzle 26 out of the storage data of the negative pressure for each type of component and / or the nozzle diameter of the suction nozzle 26 is used. Select the stored data and set the initial negative pressure at the start of production. In addition, what is necessary is just to use the value converted into the pump rotation speed of the vacuum pump 27, an electric current, or a voltage as a negative pressure initial value.

  On the other hand, if it is determined in step 101 that the negative pressure learning mode is not selected, the process proceeds to step 103, where the initial negative pressure value at the start of production is set to the standard value. At this time, the standard value may always be a constant value, but a standard value is set in advance according to the type of component to be sucked to the suction nozzle 26 and the nozzle diameter of the suction nozzle 26, and the type of component and the suction You may make it set the standard value according to the nozzle diameter of the nozzle 26 to the negative pressure initial value at the time of a production start.

  After setting the negative pressure initial value at the start of production, the routine proceeds to step 104, where the pump rotation speed of the vacuum pump 27 is adjusted so that the negative pressure of the vacuum pump 27 matches the negative pressure initial value at the start of production. Thereafter, the process proceeds to step 105, the suction nozzle 26 of the mounting head 24 is moved to the suction position, and the component sent to the suction position by the feeder 23 is sucked to the suction nozzle 26. In the next step 106, when the part sucked by the suction nozzle 26 passes through the imaging area above the parts camera 35, the part camera 35 takes an image of the part sucked by the suction nozzle 26, and the suction nozzle 26 The suction state (the amount of suction position deviation or the part suction posture) of the part sucked on the part 26 is determined by image processing.

Thereafter, the process proceeds to step 107, and it is determined whether or not the adsorption is abnormal depending on whether one of the following (1) to (3) is satisfied.
(1) The amount of component adsorption position deviation exceeds the allowable maximum adsorption position deviation line.
(2) Absorption posture of parts is abnormal (standing adsorption, oblique adsorption, etc.)
(3) The parts are not picked up by the picking nozzle 26 due to a picking mistake.

  If it is determined in step 107 that the suction is abnormal, the process proceeds to step 108 where the part sucked by the suction nozzle 26 is discarded in a predetermined collection box (not shown), and the process returns to step 105 to suck the next part. To do. If there is a component suction error, the process of step 108 is omitted and the process returns to step 105.

  On the other hand, if it is determined in step 107 that there is no suction abnormality, the process proceeds to step 109, and information on the mounting position deviation amount of the component of the circuit board 12 inspected by the inspection device 43 is received via the production management computer 45. . At this time, the information on the mounting position deviation amount of the component to be received is information on the mounting position deviation amount of the same component mounted by the same suction nozzle 26.

  Thereafter, the process proceeds to step 110, where it is determined whether or not the component suction state (suction position deviation amount or component suction posture) and the mounting position deviation amount are within a predetermined range that can be regarded as stable suction. As a result, if it is determined that the suction state of the component and the mounting position deviation amount are within a predetermined range that can be regarded as stable suction, the process proceeds to step 111, the negative pressure of the vacuum pump 27 is decreased by a predetermined amount, and the step of FIG. Proceeding to 115, the component sucked by the suction nozzle 26 is transported to the mounting position of the circuit board 12, and the component is mounted at the mounting position.

  On the other hand, if it is determined in step 110 that the component suction state and the mounting position deviation amount are within a predetermined range that can be regarded as stable suction, the process proceeds to step 112, and the negative pressure of the vacuum pump 27 can be adjusted to the maximum. It is determined whether or not the negative pressure has been reached. As a result, if it is determined that the maximum negative pressure that can be adjusted has not been reached, the routine proceeds to step 113 where the negative pressure of the vacuum pump 27 is increased by a predetermined amount to By increasing the suction force of the nozzle 26, the suction state of the component is stabilized, and the process proceeds to step 115 in FIG. 8, the component sucked by the suction nozzle 26 is transported to the mounting position of the circuit board 12, and the component is Mount at the mounting position.

  On the other hand, if it is determined in step 112 that the negative pressure of the vacuum pump 27 has reached the maximum negative pressure that can be adjusted, the negative pressure cannot be increased any more. The suction speed of the component is stabilized by reducing the conveying speed for transporting the component sucked by the suction nozzle 26 to the mounting position of the circuit board 12 by a predetermined amount and reducing the inertial force acting on the component sucked by the suction nozzle 26. Thus, it is possible to prevent the displacement of the suction position of the parts during conveyance. Then, the process proceeds to step 115 in FIG. 8, and the component sucked by the suction nozzle 26 is mounted at the mounting position of the circuit board 12.

  After mounting the components, the process proceeds to step 116, where it is determined whether or not the production is finished. If it is judged that the production is not finished yet, the processes after step 105 described above are executed again. Thus, the suction force of the suction nozzle 26 is gradually increased by gradually increasing the pump rotation speed of the vacuum pump 27 and gradually increasing the negative pressure of the vacuum pump 27 until the suction state of the components is stabilized.

Thereafter, if it is determined in step 116 that production is finished, the process proceeds to step 117, where it is determined whether the negative pressure learning mode is selected, and if it is determined that the negative pressure learning mode is selected, Proceeding to step 118, information on negative pressure at the end of production (any of the pump speed, current, and voltage of the vacuum pump 27 at the end of production) is stored in association with the type of component and / or the nozzle diameter of the suction nozzle 26. The program is stored in the device 33 and the program is terminated.
On the other hand, if it is determined in step 117 that the negative pressure learning mode is not selected, the present program is terminated without performing the negative pressure learning process in step 118.

  In the present embodiment described above, the suction state of the parts sucked by the suction nozzle 26 is determined, and the negative pressure of the vacuum pump 27 is adjusted according to the determination result to adjust the suction force of the suction nozzle 26. Therefore, it is not necessary to always maintain the negative pressure of the vacuum pump 27 at a large constant negative pressure during production, and control for stabilizing the suction state of the parts sucked by the suction nozzle 26 can be realized with low power consumption.

  In addition, in this embodiment, the mounting position shift amount of the component mounted on the circuit board 12 is inspected by the inspection device 43, and the mounting position shift amount of the component is taken into consideration in addition to the suction state of the component. Since the suction force of the suction nozzle 26 is adjusted by adjusting the negative pressure, the suction force of the suction nozzle 26 is also prevented so as to prevent the displacement of the suction position of the component during conveyance, which causes a shift in the mounting position of the component. Control that adjusts (negative pressure) to stabilize the suction state of components during conveyance can also be realized with low power consumption.

  Also, when the negative pressure of the vacuum pump 27 has reached the maximum adjustable negative pressure and the negative pressure cannot be increased any further, and the component suction state is determined to be unstable. Since the conveying speed of the component to the mounting position of the circuit board is reduced, even in this case, the inertia force acting on the component adsorbed to the adsorption nozzle 26 can be reduced and the adsorbing state of the component can be stabilized. In this way, it is possible to prevent the displacement of the suction position of the parts during conveyance.

  Similarly, when the negative pressure of the vacuum pump 27 has reached the maximum adjustable negative pressure and the negative pressure cannot be increased any more, the mounting position shift amount of the component inspected by the inspection device 43 is increased. If it does not fall within the predetermined range where the influence of the suction position deviation during transportation can be ignored, it is determined that the part suction position deviation has occurred during transportation, and the part transportation speed to the mounting position of the circuit board is set. Even in this case, it is possible to reduce the inertial force acting on the component adsorbed to the suction nozzle 26 during conveyance, thereby stabilizing the component adsorption state, and preventing the component adsorption position shift during conveyance. can do.

  Further, in this embodiment, the mounting order of components to be mounted on the circuit board 12 before the start of production is set by rearranging the negative pressure initial values (pump rotation speed, current, voltage) in descending order or in ascending order. The amount of change in negative pressure for each negative pressure adjustment can be reduced, and the power consumption saving effect of the vacuum pump 27 can be increased.

  Needless to say, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention, such as changing the configuration of the component mounting machine 10.

  DESCRIPTION OF SYMBOLS 10 ... Component mounting machine, 12 ... Circuit board, 13 ... Conveyor, 23 ... Feeder, 24 ... Mounting head, 25 ... Head moving device, 26 ... Adsorption nozzle, 27 ... Vacuum pump (negative pressure source), 28 ... Pressure sensor, 31 ... Control device (negative pressure adjusting means, adsorption state determining means, conveyance speed control means, production management means), 33 ... storage device (storage means), 35 ... part camera (camera for imaging parts), 41 ... conveying path 43 ... Inspection device (mounting position deviation amount judging means) 44 ... Reflow device 45 ... Production management computer

Claims (12)

In a component mounting machine that supplies negative pressure from a negative pressure source to a suction nozzle, sucks components with the suction nozzle, and mounts them on a circuit board.
A suction state determination means for determining a suction state of a component sucked by the suction nozzle;
A negative pressure adjusting means for adjusting the suction force of the suction nozzle by adjusting the negative pressure of the negative pressure source based on the suction state of the part determined by the suction state determining means. Mounting machine. A mounting position deviation amount determining means for determining a mounting position deviation amount of a component mounted on the circuit board;
The negative pressure adjustment unit adjusts the negative pressure of the negative pressure source based on the component suction state determined by the suction state determination unit and the component mounting position shift amount determined by the mounting position shift amount determination unit. The component mounting machine according to claim 1, wherein:   The negative pressure adjusting means increases the negative pressure (differential pressure from the atmospheric pressure) of the negative pressure source when the suction state of the component determined by the suction state determination means does not fall within a predetermined range. The suction force of the suction nozzle is decreased by decreasing the negative pressure (differential pressure from the atmospheric pressure) of the negative pressure source when the suction state of the component is within a predetermined range. The component mounting machine according to claim 1 or 2, wherein   The negative pressure adjusting means increases the negative pressure (differential pressure from the atmospheric pressure) of the negative pressure source when the mounting position deviation amount of the component determined by the mounting position deviation amount determination means does not fall within a predetermined range. And increasing the suction force of the suction nozzle to reduce the negative pressure (differential pressure from the atmospheric pressure) of the negative pressure source when the amount of mounting position deviation of the component is within a predetermined range. The component mounting machine according to claim 2, wherein the suction force is reduced. A transport speed control means for controlling a transport speed for transporting the component sucked by the suction nozzle from the suction position to the mounting position of the circuit board;
The conveyance speed control means has a predetermined range of the suction state of the component determined by the suction state determination means when the negative pressure of the negative pressure source adjusted by the negative pressure adjustment means has reached a maximum adjustable negative pressure. 5. The component mounting machine according to claim 1, wherein the conveying speed is reduced when it does not fit inside. 5. A transport speed control means for controlling a transport speed for transporting the component sucked by the suction nozzle from the suction position to the mounting position of the circuit board;
The conveyance speed control means is a component mounting position deviation determined by the mounting position deviation amount determining means when the negative pressure of the negative pressure source adjusted by the negative pressure adjusting means reaches an adjustable maximum negative pressure. The component mounting machine according to claim 2, wherein when the amount does not fall within a predetermined range, the conveyance speed is decreased.   The negative pressure adjusting means sets a negative pressure initial value at the start of production in accordance with the type of component sucked by the suction nozzle and / or the nozzle diameter of the suction nozzle. The component mounting machine according to any one of the above. Storage means for storing negative pressure data of the negative pressure source adjusted by the negative pressure adjusting means in association with the type of component and / or the nozzle diameter of the suction nozzle;
The negative pressure adjusting means includes the type of the component adsorbed to the adsorption nozzle and / or the adsorption from the negative pressure data for each type of component and / or the nozzle diameter of the adsorption nozzle stored in the storage unit. 7. The component mounting machine according to claim 1, wherein negative pressure data corresponding to the nozzle diameter of the nozzle is selected and set to a negative pressure initial value at the start of production. Storage means for storing negative pressure history data of the negative pressure source adjusted by the negative pressure adjusting means in association with the type of component and / or the nozzle diameter of the suction nozzle;
The negative pressure adjusting means includes the type of the component adsorbed to the adsorption nozzle from the negative pressure history data for each type of component and / or the nozzle diameter of the adsorption nozzle stored in the storage unit and / or the 7. The component mounting machine according to claim 1, wherein negative pressure history data corresponding to the nozzle diameter of the suction nozzle is selected and statistically processed to set an initial negative pressure value at the start of production. .   The production management means for rearranging and setting the mounting order of components to be mounted on the circuit board before the start of production, in order of increasing or decreasing negative pressure initial value. The component mounting machine described. A pressure sensor for detecting a negative pressure supplied to the suction nozzle;
The component mounting machine according to claim 1, wherein the negative pressure adjusting unit adjusts a negative pressure of the negative pressure source based on a negative pressure detected by the pressure sensor.   The component mounting machine according to claim 1, wherein a vacuum pump is provided as the negative pressure source for each mounting head that holds the suction nozzle.

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