KR100769399B1 - Jig apparatus for coating the cleaved facet of laser diode and spacer structure therefor - Google Patents

Abstract

The present invention relates to a jig device used in the cleavage surface coating process of the laser diode chip bar, the holder is mounted on the laser diode chip bar to be subjected to the cleavage surface coating; The laser diode chip bar provides a seating space that can be erected with its one cleaved surface exposed to the top, and the recessed groove is provided at the bottom portion corresponding to the other cleaved surface of the laser diode chip bar so that the other cleaved surface is not in contact with the bottom surface. Formed spacer blocks; And a conveying means for picking up the laser diode chip bar mounted on the holder and moving it to a seating space of the spacer block.

According to the present invention can increase the work efficiency to expose the cleaved surface of the laser diode chip bar, there is an advantage that can prevent damage to the cleaved surface.

Laser diode chip bar, cleavage surface, jig device, spacer, step motor

Description

Jig apparatus for coating the cleaved facet of laser diode and spacer structure therefor}

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to

1 is a perspective view showing a configuration of a general laser diode chip bar.

2 is a perspective view showing a conventional jig structure used for cleavage coating of a laser diode chip bar.

3 is a block diagram of a jig device according to a preferred embodiment of the present invention.

<Description of main reference numerals in the drawings>

1 ... laser diode chip bar 3,3 '...

100 ... holder 106 ... spacer block

107 seating space 108.

109 Spacer support 110 Spacer movement stage

111 ... Spacer motor 112 ... Frame

113 ... Transportation 114 ... Finger

115 ... 1st step motor 116 ... 2nd step motor

117 ... 3rd step motor 118 ... Automatic control device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig device for cleaving a cleavage surface of a laser diode and a spacer structure thereof, and more particularly, to a jig device for performing an operation of vertically aligning a chip bar to expose a cleaved facet of a laser diode chip bar. And a spacer structure thereof.

After all the manufacturing processes of the semiconductor laser diode, the wafer is processed into a chip bar (see 1 in FIG. 1) by a scriber. The laser diode fabricated in the form of a chip bar exposing the P-type metal electrode 2 and the cleaved surface 3 has a high-reflection coating on the cleaved surface 3 for light efficiency control. Anti-reflection coating is performed. Here, the coating process is mainly carried out using a sputter, and in the case of high reflection coating, silicon (Si) and silicon dioxide (SiO ₂ ) thin films are alternately deposited, and in the case of antireflective coating, silicon nitride (SiNx) thin films are coated. Deposit.

In order to perform the cleaved surface coating process of the laser diode chip bar 1, the work of exposing the cleaved surface 3 of the laser diode chip bar 1 to the outside must be preceded. To this end, a relatively narrow spacer 10, which is disposed adjacent to the laser diode chip bar 1 and supports the chip bar, as shown in FIG. 2, and the narrow spacer 10 ) And a relatively wide spacer (11) for supporting the chip bars and the chip bars at the outermost ends, and a base substrate (12) for placing the laser diode chip bar (1) and the spacers (10, 11). The jig device provided was widely used.

In general, the conventional jig device, first put a wide spacer 11 on the base substrate 12 and then fixed with vinyl tape, the narrow spacer 10, the laser diode chip bar (1), After repeating the arrangement in the order of the narrow spacer 10 or the like, it was used to finally arrange the wide spacer 11.

In particular, the laser diode chip bar (1) is usually provided in a fine size of 300 ~ 500㎛ length, 120㎛ thickness bar, the operator picks up the laser diode chip bar (1) by using a tweezers to base substrate (12) The work to build up was to be carried out.

By the way, the operation of setting up the chip bar on the base substrate 12 as described above is not easy even for a skilled worker, it takes a lot of work time has a disadvantage of low productivity.

In addition, when the tweezers are used, the laser diode chip bar 1 may be damaged due to an inadequate force adjustment or carelessness of the operator. There is a vulnerability that can damage the cleaved surface because it is placed in contact with the upper.

The present invention has been made to solve the above problems, and can automate the operation of exposing the cleavage surface by standing the laser diode chip bar, the cleavage surface of the laser diode having a structure that can prevent damage to the cleavage surface It is an object to provide a jig device for coating and its spacer structure.

In order to achieve the above object, a jig device according to the present invention includes a holder on which a laser diode chip bar to be coated on a cleaved surface is mounted; The laser diode chip bar provides a seating space that can be erected with its one cleaved surface exposed to the top, and the recessed groove is provided at the bottom portion corresponding to the other cleaved surface of the laser diode chip bar so that the other cleaved surface is not in contact with the bottom surface. Formed spacer blocks; And transport means for picking up the laser diode chip bar mounted in the holder and moving the mounting space of the spacer block.

Preferably, the holder may include a trench having an inclined portion that obliquely supports one surface of the mounted laser diode chip bar, and an edge at which the lower end of the laser diode chip bar extends.

Preferably, the conveying means has a finger capable of picking up both sides of the laser diode chip bar.

In the finger, it is preferable that a cushioning member is provided on a surface of the finger contacting the laser diode chip bar.

Preferably, a plurality of spacer blocks are provided to be horizontally movable and fixed along the spacer support, and the width of the seating space in which the laser diode chip bar is erected is adjusted according to the distance between neighboring spacer blocks.

A plurality of holders are provided on the holder moving stage, the plurality of spacer blocks and the spacer support are installed on the spacer moving stage, and each time the coating process for one laser diode chip bar is completed, the next laser diode chip Preferably, the holder movement stage and the spacer movement stage are moved one step each for the supply of the bar.

According to another aspect of the invention, in the spacer structure used in the cleavage surface coating process of the laser diode chip bar, the laser diode chip bar provides a seating space in which the cleavage surface on one side can be raised, and the laser diode The bottom portion corresponding to the other cleaved surface of the chip bar is provided with a spacer structure, characterized in that the other cleaved surface is provided with a spacer block formed with a recessed groove such that the other cleaved surface is in non-contact.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

3 is a block diagram of a jig device according to a preferred embodiment of the present invention.

Referring to FIG. 3, the jig device according to the preferred embodiment of the present invention is used in the cleavage coating process of the laser diode chip bar 1, and the holder 100 on which the laser diode chip bar 1 is mounted, and the laser beam. A plurality of spacer blocks 106 which provide a seating space 107 for erecting the diode chip bar 1, and a laser diode chip mounted on the holder 100 while reciprocating between the holder 100 and the spacer block 106. And a conveying means 113 for supplying the bar 1 to the spacer block 106.

The holder 100 is a portion for mounting the laser diode chip bar 1 to be coated on the cleavage surface, and includes an inclined portion 101 that obliquely supports one surface of the laser diode chip bar 1, and a laser diode chip bar 1. A trench 102 having an edge over which the bottom of the span spans. According to the structure of the holder 100, since the mounted laser diode chip bar 1 is stably supported while being placed obliquely, no additional supporting means is required.

The holder 100 is provided on the holder support 103 in a plurality at regular intervals, it is preferable that the holder is fixed on the holder movement stage 104 connected to the motor 105 for movement.

A plurality of spacer blocks 106 are installed along the spacer support 109 so as to be movable horizontally, and are selectively fixed to the spacer support 109 by a predetermined fixing member (not shown).

The spacer block 106 provides a seating space 107 in which the supplied laser diode chip bar 1 can be erected with its one cleaved surface 3 exposed upward. Here, the seating space 107 is preferably formed by utilizing the space between the adjacent spacer block 106, in this case, the laser diode chip bar (1) is set up according to the spacing between the spacer block 106 The width of the space 107 can be adjusted.

In the spacer block 106, the recessed groove 108 is formed in the bottom portion of the spacer block 106 facing the other cleaved surface 3 'so that the other cleaved surface 3' is not in contact with the bottom surface. do.

Therefore, when the laser diode chip bar 1 is placed upright against the seating space 107 between the spacer blocks 106, one side of the cleaved surface 3 of the laser diode chip bar 1 is exposed to face upward, The other cleaved surface 3 'faces the bottom surface of the spacer block 106 but is not contacted by the recess groove 108 structure.

The spacer block 106 may be provided in plural on the spacer support 109 at predetermined intervals, and fixed to the spacer movement stage 110 connected to the spacer movement motor 111.

The conveying means 113 is installed to be transported along a predetermined frame 112, and picks up the laser diode chip bar 1 mounted on the holder 100 and automatically moves to the seating space 107 of the spacer block 106. Perform the move function. To this end, the transfer means 113 is provided with a finger 114 for picking up both sides of the laser diode chip bar 1, the direction of the finger 114 to smoothly pick up the laser diode chip bar (1) and A first step motor 115, a second step motor 116, and a third step motor 117 are provided to provide a driving force.

Here, the first step motor 115 provides a driving force for reciprocating the transfer means 113 between the holder 100 and the spacer block 106 and a driving force for elevating the transfer means 113. The second step motor 116 provides a driving force for tilting or inclining the finger 114 provided in the conveying means 113 to the original position. In addition, the third step motor 117 provides forceps for driving the finger 114 to selectively pick or place the laser diode chip bar 1.

In the finger 114 of the conveying means 113, the surface in contact with the laser diode chip bar 1 is provided with a buffer member 119 made of urethane rubber or the like having relatively high mechanical strength, abrasion resistance, and impact resistance. It is desirable to prevent excessive mechanical stress from being applied to the chip bar 1.

The motors 105, 111, 115, 116, 117 that provide the driving force as described above are controlled and operated by an automatic control device 118 such as a computer. In particular, the automatic control device 118 moves the holder movement stage 104 and the spacer movement stage 110 by one step each time the coating process for each laser diode chip bar 1 is completed. It is preferable to perform the control operation to align the point 113 approaches.

Hereinafter, the operation of the jig device according to a preferred embodiment of the present invention will be described.

In the present invention, the laser diode chip bar 1 to be subjected to the cleavage surface coating is mounted on the holder 100 in an oblique state.

During operation of the jig device, the conveying means 113 is conveyed along the frame 112 by the first step motor 115 to stop above the holder 100 located at the pick-up point. Thereafter, the finger 107 of the transfer means 113 descends toward the holder 100 by the first step motor 115, and the second step motor 116 is operated to move the finger 107 by a predetermined angle. Tilting by as much as possible, the third step motor 117 is operated to pick up the laser diode chip bar 1, and the second step motor 116 is operated to return the finger 107 to the original position. The vertical step of the bar 1, the first step motor 115 is operated to raise the finger 107, and then the conveying means 113 along the frame 112 above the spacer block 106 at the seating point. Conveying, the first step motor 115 is operated to lower the finger 107 in the direction of the spacer block 106, and the third step motor 117 is operated to open the finger 107. Lowering the laser diode chip bar 1 in the seating space 107, and the first step motor 115 is operated to ping. After raising the giant 107, the step of transferring the holder 100 along the frame 112 is continuously performed.

Here, the laser diode chip bar 1 erected in the seating space 107 between the spacer blocks 106 is exposed so that one cleaved surface 3 faces upward, and the other cleaved surface 3 'is a spacer block 106. Toward the bottom surface of the) but not in contact with the bottom surface by the recess groove 108 structure.

Thereafter, the holder movement motor 105 is operated so that the holder movement stage 104 moves one step to align the holder 100 on which the next laser diode chip bar 1 is mounted at the pickup point, while the motor for spacer movement ( 111 is operated so that the spacer movement stage 110 moves one step to align the next spacer block 106 to the seating point, and the process as described above is repeated in the same manner.

Although the present invention has been described above by means of limited embodiments and drawings, the present invention is not limited thereto and will be described below by the person skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of the claims.

In the jig device according to the present invention, the operation of picking up the laser diode chip bar, or the operation of raising the cleavage surface to be exposed is performed through automatic control, so that the operation can be facilitated and the productivity can be improved. There is an advantage that can prevent damage to the chip bar.

In particular, according to the present invention, since the spacer structure having the recessed groove is provided in the bottom, the cleaved surface of the laser diode chip bar and the supporting bottom surface can be prevented from physically contacting each other.

Claims (8)

In the jig device used in the cleavage coating process of the laser diode chip bar, A holder on which a laser diode chip bar to be cleaved is coated; A spacer having a recessed groove formed on the bottom portion corresponding to the other cleaved surface of the laser diode chip bar so that the other cleaved surface is not in contact with the bottom surface. block; And And a conveying means for picking up the laser diode chip bar mounted in the holder and moving it to the seating space of the spacer block. The method of claim 1, And the holder comprises a trench having an inclined portion which obliquely supports one surface of the mounted laser diode chip bar, and a trench having an edge over which the lower end of the laser diode chip bar extends. The method of claim 1, The conveying means is a jig device characterized in that it comprises a finger that can pick up both sides of the laser diode chip bar. The method of claim 3, In the finger, jig device characterized in that the buffer member is provided on the surface in contact with the laser diode chip bar. The method of claim 1, The spacer block is provided with a plurality is provided to be horizontally movable and fixed along the spacer support, The jig device, characterized in that the width of the mounting space in which the laser diode chip bar is erected according to the distance between neighboring spacer blocks. The method of claim 5, The holder is provided with a plurality is installed on the holder movement stage, The plurality of spacer blocks and spacer supports are installed on a spacer moving stage, Each time the coating process for one laser diode chip bar is completed, the jig device for moving the holder movement stage and the spacer movement stage by one step for supplying the next laser diode chip bar. delete In the spacer structure used in the cleavage coating process of the laser diode chip bar, A spacer having a recessed groove formed on the bottom portion corresponding to the other cleaved surface of the laser diode chip bar so that the other cleaved surface is not in contact with the bottom surface. With blocks, The spacer block is provided with a plurality is provided to be horizontally movable and fixed along the spacer support, The spacer structure, characterized in that the width of the seating space in which the laser diode chip bar is erected in accordance with the interval between neighboring spacer blocks.

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