JP6055665B2 - Electronic component mounting method and surface mounter - Google Patents

Description

  The present invention relates to a surface mounter for mounting electronic components on a printed circuit board, and a mounting method of electronic components using the same.

  Conventionally, surface mounters for mounting electronic components on a printed circuit board are known. Such a surface mounter may include a tray supply device for supplying a tray holding a plurality of electronic components to a mounting work position. In the mounting method of electronic components using such a surface mounting machine, when mounting electronic components on a printed circuit board, the electronic components are mounted on the substrate in the wrong orientation by specifying the orientation of the electronic components. For example, Patent Document 1 discloses a mounting method that prevents or suppresses this.

JP 2006-245480 A

  However, when an electronic component is mounted on a printed circuit board, the above-described operation for specifying the orientation of the electronic component adds time to the electronic component mounting operation time. There may be a delay in mounting the components. As a result, the mounting cycle time in the mounting operation of the electronic component may become long.

  The technology disclosed in this specification has been created in view of the above problems. An object of the present specification is to provide a technique capable of preventing or suppressing an electronic component from being mounted on a substrate in a wrong direction without affecting the mounting cycle time.

  The technology disclosed in the present specification includes a base, a tray that holds a plurality of electronic components on a support surface, a tray supply device that accommodates the plurality of trays and supplies the tray onto the base. An angle for recognizing a rotation angle around an axis of an axis perpendicular to the support surface of the electronic component, a conveying device for conveying the substrate onto the base, a component mounting device for mounting the electronic component on the substrate, A method of mounting an electronic component using a surface mounter including a recognition device, wherein the electronic component is mounted on the substrate by the component mounting device, and the mounting step is not performed. A recognition step of recognizing the rotation angles of the plurality of electronic components held by the tray by the angle recognition device, and a storage step of storing the rotation angles of the electronic components recognized in the recognition step. , In serial mounting process for the electronic component that stores the rotation angle in said storage step, implemented on the substrate by the rotation angle set in advance, method for mounting electronic components.

  In the electronic component mounting method disclosed in this specification, when the electronic component mounting process is not performed, the rotation angle of each electronic component in the tray is recognized in advance, and the recognized rotation angle is stored. In the mounting step, the electronic component storing the rotation angle is mounted on the substrate at a preset rotation angle. At this time, for example, the stored rotation angle is compared with a preset rotation angle. When the stored rotation angle is different from the preset rotation angle, each electronic component is set in advance by correcting the electronic component to be mounted in the mounting operation to the preset rotation angle. It can be mounted on a substrate at a rotation angle. Thereby, it can prevent thru | or suppress that an electronic component is mounted on a board | substrate in a wrong direction. Furthermore, since the recognition process is performed when the mounting process is not performed, the operation of recognizing the rotation angle of the electronic component does not affect the mounting cycle time of the electronic component by the component mounting apparatus. As described above, in the above mounting method, it is possible to prevent or suppress the electronic component from being mounted in the wrong direction on the substrate without affecting the mounting cycle time.

  In the mounting step, mounting of the electronic component on which the rotation angle could not be recognized in the recognition step may be skipped.

  In this electronic component mounting method, it is avoided that an electronic component whose rotation angle could not be recognized is mounted on the board. Therefore, an electronic component whose rotation angle could not be recognized is mounted on the substrate in the wrong direction. This can be prevented or suppressed. As a result, a preset rotation angle can be set for all electronic components mounted on the board.

  In the recognition step, the rotation angles of a plurality of the electronic components may be recognized in accordance with the order of mounting on the substrate in the mounting step.

  In this electronic component mounting method, the rotation angle of an electronic component that is mounted in the mounting process is recognized first in the recognition process. For this reason, the number of electronic components in which the mounting process is performed before the recognition process is performed can be suppressed. As a result, the number of electronic components whose rotation angle is recognized can be increased, and the electronic components can be further prevented or suppressed from being mounted on the board in the wrong direction.

  The electronic component mounting method according to any one of the transporting step of transporting the substrate by the transporting device, the standby step of stopping the transport of the substrate and mounting of the electronic component, and the mounting step. And the said recognition process and the said memory | storage process are good also as what is performed in the said conveyance process or the said waiting | standby process.

  Another technique disclosed in the present specification includes a base, a tray that holds a plurality of electronic components on a support surface, and a tray supply that houses the plurality of trays and supplies the trays onto the base. Recognizing a rotation angle about an axis of an apparatus, a transport device for transporting a substrate onto the base, a component mounting device for mounting the electronic component on the substrate, and an axis perpendicular to the support surface of the electronic component An angle recognizing device, a control device, and a storage unit, wherein the control device holds the tray while the electronic component is not mounted on the substrate. The rotation angle of the plurality of electronic components is recognized by the angle recognition device, the rotation angle recognized by the angle recognition device is stored in the storage unit, and the electronic component having the rotation angle stored therein, The storage unit The rotation angle is read, and the electronic component is mounted on the substrate by the component mounting apparatus at the rotation angle set in advance by comparing the read rotation angle with the rotation angle set in advance. It relates to surface mounters.

  According to the surface mounter disclosed in this specification, the control device causes the angle recognition device to recognize the rotation angles of the plurality of electronic components held by the tray when the electronic component mounting process is not performed. The control device stores the rotation angle recognized by the angle recognition device in the storage unit. Further, the control device reads the rotation angle from the storage unit for the electronic component storing the rotation angle, and compares the read rotation angle with a preset rotation angle. At this time, when the rotation angle stored in the storage unit is different from the preset rotation angle, the control device corrects each electronic component to be mounted to the preset rotation angle, thereby correcting each electronic component. The component is mounted on the substrate at a preset rotation angle. Thereby, it can prevent thru | or suppress that an electronic component is mounted on a board | substrate in a wrong direction. Furthermore, since the control device recognizes the rotation angle of the electronic component when the electronic component is not being mounted, the rotation angle of the electronic component is affected without affecting the mounting cycle time of the electronic component by the component mounting device. Can be recognized. As described above, in the above surface mounter, it is possible to prevent or suppress the electronic component from being mounted in the wrong direction on the substrate without affecting the mounting cycle time.

  According to the technology disclosed in this specification, it is possible to prevent or suppress the electronic component from being mounted on the substrate in the wrong direction without affecting the mounting cycle time.

Plan view of surface mounter 1 Side view of tray supply device 30 Rear view of tray supply device 30 The elements on larger scale which show the support structure of the head unit 60 Block diagram showing the electrical configuration of the main body of the surface mounter 1 Flowchart diagram showing state monitoring processing Flowchart diagram showing the flow of recognition processing Flowchart diagram showing the flow of the mounting process Schematic diagram showing state transition of surface mounter 1 during automatic operation Top view of tray 32 holding a plurality of electronic components The schematic diagram which shows the recognition aspect of the electronic component 5 The component attitude | position memory table memorize | stored in the mounting program memory | storage part 112 is shown. Schematic diagram showing the correction mode of the electronic component 5

  Embodiments will be described with reference to the drawings. As shown in FIG. 1, the surface mounter 1 has a configuration in which various devices are arranged on a base 10 having a rectangular shape in plan view and a flat upper surface. In the following description, the long side direction (left-right direction in FIG. 1) of the base 10 is defined as the X-axis direction, and the short side direction (vertical direction in FIG. 1) of the base 10 is defined as the Y-axis direction. Is the Z-axis direction.

  In the center of the base 10, a transport conveyor (an example of a transport device) 20 for transporting the printed circuit board is disposed. The conveyor 20 includes a pair of conveyor belts 21 that are circulated and driven in the X-axis direction. When a printed circuit board (an example of a board) P is set so that both the transport belts 21 are installed, the printed circuit board P placed on the upper surface of the transport belt 21 is caused to be in contact with the transport belt 21 by friction between the transport belt 21 and the transport belt 21. It is sent in the driving direction (X-axis direction).

  In the surface mounter 1, the right side shown in FIG. 1 is an entrance, and the printed board P is carried into the machine through the conveyor 20 from the right side shown in FIG. The printed circuit board P carried into the machine is transported to the central work position of the base 10 (position surrounded by a two-dot chain line in FIG. 1) by the conveyor 20 and stops there.

  A tray supply device 30 for supplying the electronic component 5 to be mounted on the printed circuit board P is provided at one place around the work position (one side in the conveyance direction of the printed circuit board P). The tray supply device 30 stores a plurality of trays 32 for holding a plurality of electronic components 5 and supplies the pallets 34 storing these trays 32 one by one onto the base.

  At the work position, a mounting process for mounting the electronic component 5 in the tray 32 supplied through the tray supply device 30 on the printed circuit board P is performed by the component mounting device 40. The printed circuit board P on which the mounting process has been performed is transported to the left in FIG. 1 through the transport conveyor 20 and is carried out of the machine.

  Next, the tray supply device 30 will be described. As shown in FIGS. 2 and 3, the tray supply device 30 includes a pallet housing portion 30 </ b> A that extends in a rectangular tube shape along the Z-axis direction, a pallet drawer portion 30 </ b> B that extends in a rectangular tube shape along the Y-axis direction, It has. The pallet accommodating portion 30 </ b> A is disposed on the side of the surface mounter 1. The pallet drawer portion 30B extends from a part of the side surface of the pallet accommodating portion 30A toward the base 10 of the surface mounter 1.

  As shown in FIG. 3, a pallet rack 35 in which a plurality of pallets 34 are accommodated is attached in the pallet accommodating portion 30A. In the pallet rack 35, a pallet placing portion 36 having a size capable of accommodating one pallet 34 is provided in a form of being stacked in 10 stages along the Z-axis direction. On each pallet mounting part 36, the pallets 34 in which the trays 32 for holding the plurality of electronic components 5 are stored are mounted one by one.

  The pallet rack 35 is fitted with a pair of pallet replacement rails 37 and 37 whose both side surfaces extend in the Z-axis direction (vertical direction) in the pallet accommodating portion 30A, and the pallet accommodating rail 30 in the pallet accommodating portion 30A. It is possible to move up and down along the line.

  Below the pallet rack 35 in the pallet accommodating portion 30A, a Z-axis direction moving mechanism 31Z for moving the pallet rack 35 in the vertical direction along the pallet replacement rail 37 is provided. The Z-axis direction moving mechanism 31Z is configured to operate by driving a pallet replacement motor MP1 described later.

  As shown in FIG. 2, the pallet drawer 30 </ b> B is provided with a pallet supply base 38 positioned on the base 10. On the pallet supply base 38, one pallet 34 pulled out from the pallet accommodating portion 30A is placed. The pallet drawer portion 30B is provided with a Y-axis direction moving mechanism that pulls the pallet 34 from the pallet accommodating portion 30A onto the pallet supply base 48 along the Y-axis direction. The Y-axis direction moving mechanism 31Y is configured to operate by driving a pallet drawing motor MP2 described later.

  In the tray supply device 30, one pallet 34 is selected from among a plurality of pallets 34 stacked and accommodated in the pallet rack 35. When one pallet 34 is selected, the Z-axis direction moving mechanism 31Z operates in the pallet accommodating portion 30A, so that the pallet mounting table 36 on which the selected pallet 34 is mounted has the same height as the pallet supply table 38. Is done. Then, when the Y-axis direction moving mechanism 31Y is operated in the pallet drawing portion 30B, one selected pallet 34 is drawn onto the pallet supply base 38.

  Next, the component mounting apparatus 40 will be described. The component mounting apparatus 40 includes an X-axis servo mechanism, a Y-axis servo mechanism, a Z-axis servo mechanism, and a head unit 60 that is moved and operated in the X-axis direction, the Y-axis direction, and the Z-axis direction by driving these servo mechanisms. Etc.

  Specifically, as shown in FIG. 1, a pair of support legs 41 is installed on the base 10. Both support legs 41 are located on both sides of the working position in the X-axis direction, and both extend straight along the Y-axis direction.

  Both support legs 41 are provided with guide rails 42 extending along the Y-axis direction on the upper surfaces thereof. A head support 51 extending along the X-axis direction is attached to each guide rail 42 installed on both sides in the X-axis direction in a state where both ends in the long side direction are fitted.

  On one side (right side in FIG. 1), a Y-axis ball screw 45 extending along the Y-axis direction is attached. A ball nut (not shown) is screwed onto the Y-axis ball screw 45. A Y-axis motor 47 is attached to the Y-axis ball screw 45.

  When the Y-axis motor 47 is energized, the ball nut moves forward and backward along the Y-axis ball screw 45. As a result, the head support 51 fixed to the ball nut and the head unit 60 described below follow the guide rail 42. Moves in the Y-axis direction (Y-axis servo mechanism).

  As shown in FIG. 5, the head support 51 is provided with a guide member 53 extending along the X-axis direction. A head unit 60 is movably attached to the guide member 53 along the axial direction of the guide member 53. The head support 51 is mounted with an X-axis ball screw 55 that extends along the X-axis direction. A ball nut (not shown) is screwed to the X-axis ball screw 55.

  An X-axis motor 57 is attached to the X-axis ball screw 55. When the X-axis motor 57 is energized, the ball nut advances and retreats along the X-axis ball screw 55, and as a result, is fixed to the ball nut. The head unit 60 moves in the X-axis direction along the guide member 53 (X-axis servo mechanism).

  As described above, the head unit 60 can be moved in the horizontal direction (XY plane direction) on the base 10 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination. .

  As shown in FIG. 4, a plurality of mounting heads 63 that perform a mounting operation are mounted in a row on the head unit 60. The mounting head 63 protrudes downward from the lower surface of the head unit 60, and a suction nozzle 64 is provided at the tip thereof.

  Each mounting head 63 can rotate around its axis by driving an R-axis motor. Each mounting head 63 is configured to be movable up and down with respect to the frame 61 of the head unit 60 by driving a Z-axis motor (Z-axis servo mechanism). Each suction nozzle 64 is configured to be supplied with a negative pressure from a suction device (not shown), and a suction force is generated at the tip of the suction nozzle 64.

  With such a configuration, when each servo mechanism is operated at a predetermined timing, the plurality of electronic components 5 held on the tray 32 in the pallet 34 placed on the pallet supply base 38 are mounted on the mounting head. 63 is taken out from the tray 32 one by one and mounted on the printed circuit board P.

  In addition, the reference symbol C1 in FIG. 4 indicates a substrate recognition camera, and the reference symbol C2 in FIG. 1 indicates an angle recognition camera (an example of an angle recognition device). The substrate recognition camera C <b> 1 is fixed to the head unit 60 with the imaging surface facing down on the head unit 60, and is configured to move integrally with the head unit 60. Therefore, by driving the X-axis servo mechanism and the Y-axis servo mechanism described above, an image at an arbitrary position on the printed circuit board P at the work position can be captured by the substrate recognition camera C1.

  The angle recognition camera C2 is fixed on the base 10 on both sides in the Y-axis direction of the work position. The angle recognition camera C2 recognizes the suction posture (rotation angle) of each electronic component 5 by capturing an image of the electronic component 5 taken out from the tray 32 on the tray supply base 38 by the mounting head 63. A method for recognizing the suction posture (rotation angle) of the electronic component 5 by the angle recognition camera C2 will be described in detail later.

  Next, the electrical configuration of the surface mounter 1 will be described with reference to FIG. The main body of the surface mounter 1 is controlled and controlled by a controller (an example of a control device) 110 as a whole. The controller 110 includes an arithmetic processing unit 211 configured by a CPU or the like. The arithmetic processing unit 111 includes a mounting program storage unit (an example of a storage unit) 112, a transport system data storage unit 113, an equipment specific data storage unit 114, a motor control unit 115, an external input / output unit 116, an image processing unit 217, and a server. The communication unit 118, the pallet communication control unit 119, and the display device 100 are electrically connected.

  The mounting program storage unit 112 stores a mounting program for controlling a servo mechanism including various motors to be described later. The mounting program storage unit 112 also includes component information including the number of printed circuit boards P produced, the type and number of electronic components 5 mounted on the printed circuit boards P, and each tray 32 accommodated in the tray supply device 30. And tray information including the number and type of the electronic components 5 held by the. Further, the mounting program storage unit 112 stores information on the rotation angle of each electronic component 5 recognized by the angle recognition camera C2.

  The transport system data storage unit 113 stores data for controlling a transport system such as the transport conveyor 20. The equipment unique data storage unit 114 stores data unique to each equipment of the component mounting apparatus 40 (for example, raising and lowering of the suction nozzle 64). The motor control unit 115, together with the arithmetic processing unit 111, drives a motor MX that drives the X axis according to the mounting program, a MY that drives the motor that drives the Y axis, a motor MZ that drives the Z axis, and a motor MR that drives the R axis. , Are driven respectively. The motor control unit 115 is electrically connected to the various motors described above.

  The external input / output unit 116 is a so-called interface, and transmits and receives control signals to and from the tray supply device 30 and receives detection signals output from various sensors 126 provided in the main body of the surface mounter 1. It is configured as follows.

  Further, the board recognition camera C1 and the angle recognition camera C2 are electrically connected to the image processing unit 117, and the image pickup signals output from the cameras C1 and C2 are captured. In the image processing unit 117, the component image analysis and the board image analysis are performed based on the captured image signal.

  The pallet communication control unit 119 controls the Z-axis direction moving mechanism 31Z and the Y-axis direction moving mechanism 31Y in the tray supply device 30 by being electrically connected to the pallet control unit of the tray supply device. In addition, the display device 200 is electrically connected to the arithmetic processing unit 211. The display device 200 is configured to display various information notified from the arithmetic processing unit 211.

  The surface mounter 1 according to the present embodiment is configured as described above. Next, in the production work of the printed circuit board P, with reference to the flowcharts shown in FIGS. explain. In the surface mounter 1, when the automatic operation is started, the controller 110 executes the state monitoring process shown in FIG. First, the state monitoring process executed by the controller 110 in the production work of the printed circuit board P will be described.

  Here, in the surface mounting machine 1 of the present embodiment, when a mounting error of the electronic component 5 or a transport error of the printed circuit board P occurs, the production work of the printed circuit board P is stopped and waits until the error state is recovered. A standby state (an example of a standby process) is set. Here, the mounting error and the conveyance error include errors generated in other surface mounting machines when the production work of the printed circuit board P is performed using a plurality of surface mounting machines.

  As shown in FIG. 9, the surface mounter 1 of the present embodiment is in a mounting state where the electronic component 5 is mounted and a transport state where the printed circuit board P is transported (transport) as shown in FIG. 9. An example of a process) and the above-described standby state transition to each other.

  In the state monitoring process, as shown in FIG. 6, the controller 110 first determines whether or not the surface mounter 1 is in one of the above-described transport state or standby state (S2). If the controller 110 determines in S2 that the surface mounter 1 is in the transport state or the standby state (S2: YES), the controller 110 executes recognition processing described later (S4), and thereafter stores processing (described later). S6) is executed and the state monitoring process is continued.

  If the controller 110 determines in S2 that the surface mounter 1 is not in either the transport state or the standby state (S2: NO), that is, if the controller 110 determines that the surface mounter 1 is in the mounted state, the state monitoring process is continued. To do.

  Next, the recognition process executed by the controller in S4 and the storage process executed in S6 will be described. In the recognition process, as shown in FIG. 7, the controller 110 does not first recognize the rotation angle by the angle recognition camera C <b> 2 in the electronic component 5 in the tray 32 accommodated in the tray supply device 30. It is determined whether there is a part 5 (S8). The rotation angle referred to in the present embodiment refers to the rotation angle around the axis A of the axis A perpendicular to the support surface 33 (see FIG. 10) of the tray 32 described later in the electronic component 5 accommodated in the tray 32. And

  When the controller 110 determines that there is no electronic component 5 in which the rotation angle is not recognized by the angle recognition camera C2 in the electronic component 5 in the tray 32 accommodated in the tray supply device 30 (S8: NO). The recognition process is terminated.

  When the controller 110 determines that the electronic component 5 in the tray 32 accommodated in the tray supply device 30 includes the electronic component 5 whose rotation angle is not recognized by the angle recognition camera C2 (S8: YES). The priority is determined among the electronic components 5 whose rotation angle is not recognized (S9).

  The priority described above is determined according to the order in which the electronic components 5 are mounted in the mounting process. That is, a higher priority is assigned to an electronic component 5 that is mounted in the mounting process earlier. The priority may be assigned to each tray 32 accommodated in the tray supply device 30. Further, when the electronic component 5 includes a plurality of types of components, the priority may be further determined in each type. The priority is determined based on the component information and the tray information stored in the mounting program storage unit 112.

  When the processing of S <b> 10 is completed, the controller 110 supplies the tray 32 (pallet 34) holding the electronic component 5 having a high priority from the pallet accommodating unit 30 </ b> A of the tray supply device 30 via the pallet communication control unit 119. It is pulled out onto the table 30B (S10).

  Next, the controller specifies the electronic component 5 for recognizing the rotation angle according to the priority determined in S9 from among the electronic components 5 in the tray 32 drawn on the pallet supply base 30B in S10. Then, the controller 110 recognizes the specified rotation angle of the electronic component 5 by the angle recognition camera C2 (S11) (an example of a recognition process), and proceeds to S12.

  Here, a method of recognizing the rotation angle of the electronic component 5 by the angle recognition camera C2 will be described. FIG. 10 shows an example of a tray 32 that holds a plurality of electronic components 5. In the tray 32 shown in FIG. 10, a plurality of electronic components 5 are housed in a matrix in a state where they are placed on the support surface 33. Specifically, the tray 32 is partitioned into 6 rows along the X-axis direction and 4 rows along the Y-axis direction, and the electronic components 5 are accommodated in the partitioned spaces.

  In the present embodiment, each electronic component 5 is a square component in plan view. Each electronic component 5 is provided with an alignment mark 70 for recognizing the rotation angle at any one of the four corners. Note that there may be an NG product that does not have the alignment mark 70, such as the electronic component 5 arranged at the bottom left in the tray 32 shown in FIG. In the present embodiment, the one in which the alignment mark 70 is located on the upper right among the four corners of the electronic component 5 in the plan view shown in FIG.

  When recognizing the rotation angle of the electronic component 5, the controller 110 first causes the suction nozzle 64 to suck the electronic component 5 to be recognized. Then, the controller 110 moves the electronic component 5 sucked by the suction nozzle 64 to the vicinity of the angle recognition camera C2, and recognizes the rotation angle.

  Specifically, the controller 110 sequentially captures the four corners of the electronic component 5 to be recognized while changing the imaging position R as shown in FIG. 11 by the angle recognition camera C2. And the controller 110 determines the rotation angle of the electronic component 5 from the imaging position R where the alignment mark 70 was imaged by imaging the alignment mark 70 of the electronic component 5 by the angle recognition camera C2.

  In the example shown in FIG. 11, since the alignment mark 70 is attached to the lower right of the four corners of the electronic component 5, the alignment mark 70 is imaged when the imaging position R by the angle recognition camera C2 is lower right. Accordingly, the electronic component 5 shown in FIG. 11 is determined to have a rotation angle shifted by 90 ° clockwise from the correct rotation angle.

  The continuation of the recognition process will be described with reference to the flowchart shown in FIG. In S12, the controller 110 determines whether or not the rotation angle of the electronic component 5 to be recognized in S11 has been recognized (S12). If the controller 110 determines in S12 that the rotation angle of the electronic component 5 has been recognized (S12: YES), the controller 110 determines the rotation angle of the electronic component 5 from the recognized rotation angle of the electronic component 5 (S14), and performs recognition processing. Exit.

  If the controller 110 determines in S12 that the rotation angle of the electronic component 5 has not been recognized (S12: NO), the controller 110 determines that the electronic component 5 is an NG product, and ends the recognition process. As an example of the electronic component 5 whose rotation angle cannot be recognized, the electronic component 5 without the alignment mark 70 described above can be cited.

  When the recognition process ends, as shown in FIG. 6, the controller 110 executes a storage process (S6) (an example of a storage process). In S <b> 6, the controller 110 stores the rotation angle of the electronic component 5 recognized in the recognition process in the mounting program storage unit 112. When the storage in the mounting program storage unit 112 is completed for the rotation angle of the electronic component 5 recognized in the recognition process, the controller 110 continues the state monitoring process.

  Here, a method of storing the rotation angle of each electronic component 5 by the controller 110 will be described with reference to FIGS. 10 and 12. The controller 110 stores the component orientation storage table shown in FIG. 12 in the mounting program storage unit 112 for each tray 32 with respect to the rotation angle of the electronic component 5.

  Each cell (X1 to X6, Y1 to Y4) of the component orientation storage table shown in FIG. 12 has each position (in the tray 32) partitioned into six rows in the X axis direction and four rows in the Y axis direction shown in FIG. This corresponds to the arrangement of each electronic component 5). For example, the cells at the coordinates X4 and Y2 in the table of FIG. 12 correspond to the electronic components 5 accommodated in the fourth column from the left and the second column from the top in the tray 32 shown in FIG.

  In the component orientation storage table shown in FIG. 12, the one that deviates counterclockwise from the correct rotation angle (in this embodiment, the angle at which the alignment mark 70 is located at the upper right of the electronic component 5 in the plan view shown in FIG. 10). Those that are displayed at a positive angle and that deviate clockwise from the correct rotation angle are displayed at a negative angle. Further, “0” is displayed for the correct rotation angle.

  The mounting program storage unit 112 stores a preset rotation angle for each electronic component 5 according to the mounting program. The controller 110 compares the imaging position R (rotation angle) at which the alignment mark 70 of the electronic component 5 is imaged with a preset rotation angle, and thus the difference between the two rotation angles is shown in the component orientation storage table shown in FIG. To remember.

  Accordingly, the cells of the coordinates X4 and Y3 in the component orientation storage table shown in FIG. 12 correspond to the electronic components 5 (the electrons stored in the fourth column from the left and the third column from the top in the tray 32 in FIG. 10). Part 5) shows a 90 ° counterclockwise deviation from the correct rotation angle.

  Also, the cells at coordinates X5 and Y2 in the component orientation storage table shown in FIG. 12 are the electronic components 5 corresponding to the cells (the fifth row from the left and the second row from the top in the tray 32 in FIG. 10). Part 5) shows a 90 ° counterclockwise deviation from the correct rotation angle.

  Further, the cells of the coordinates X2 and Y4 in the component orientation storage table shown in FIG. 12 are the electronic components 5 corresponding to the cells (the electrons stored in the second column from the left and the fourth column from the top in the tray 32 in FIG. 10). Part 5) shows a deviation of 180 ° from the correct rotation angle.

  In addition, the cells of the coordinates X1 and Y4 in the component orientation storage table shown in FIG. 12 are the electronic components 5 corresponding to the cells (the electrons contained in the first column from the left and the fourth column from the top in the tray 32 in FIG. 10). The part 5) indicates that it is an NG product for which the alignment mark 70 could not be recognized.

  On the other hand, 0 is displayed in the cells other than the above in the component orientation storage table shown in FIG. 12, indicating that the rotation angle of the electronic component 5 corresponding to these cells is the correct rotation angle.

  Next, the mounting process of the electronic component 5 performed by the controller 110 will be described with reference to FIG. In the mounting process, the controller 110 mounts the electronic component 5 according to the mounting program stored in the mounting program storage unit 112. In the mounting process, the controller 110 first determines whether the recognition process performed in S4 or the storage process performed in S6 is being executed (S18).

  If the controller 110 determines in S18 that the recognition process or storage process is being executed (S18: YES), the controller 110 interrupts the recognition process or storage process being executed (S20), and proceeds to S22. When the controller 110 determines in S18 that the recognition process or the storage process is not being executed (S18: NO), the controller 110 proceeds to S22.

  In S <b> 22, the controller 110 determines whether there is an electronic component 5 to be mounted on the printed circuit board P transported to the work position on the base 10. When the controller 110 determines that there is no electronic component 5 to be mounted, that is, when there is no electronic component 5 that can be mounted, or when all the electronic components 5 have been mounted (S22: NO), the mounting process ends. .

  When the controller 110 determines that there is an electronic component 5 to be mounted in S22 (S22: YES), the controller 110 determines whether or not information on the rotation angle is stored in the mounting program storage unit 112 for the electronic component 5 to be mounted. (S24).

  If the controller 110 determines in step S24 that information on the rotation angle is not stored for the electronic component 5 to be mounted (S24: NO), the controller 110 skips suction by the suction nozzle 64 (skips mounting). (S28), returning to S22, the process of S22 is executed.

  If the controller 110 determines in S24 that the rotation angle information is stored for the electronic component 5 to be mounted (S24: YES), the rotation angle information for the electronic component 5 is stored in the mounting program storage unit 112. (S26), and the process proceeds to S30.

  In S30, the controller 110 determines whether or not the rotation angle read from the component orientation storage table is the correct rotation angle (whether the suction angle is correct), that is, in the present embodiment, the corresponding cell of the component orientation storage table. Is stored as “0” (S30).

  When the controller 110 determines in S30 that the electronic component 5 to be mounted has the correct rotation angle (S30: YES), the electronic component 5 is placed on the printed circuit board P without correcting the rotation angle of the electronic component 5. (S32) (an example of a mounting process), the process returns to S22 and executes the process of S22.

  When the controller 110 determines in S30 that the electronic component 5 to be mounted does not have the correct rotation angle (S30: NO), the controller 110 corrects the rotation angle of the electronic component 5 to the correct rotation angle. That is, from the rotation angle read from the component orientation storage table, the number of deviations with respect to the correct rotation angle is specified, and the suction nozzle 64 is used to correct the rotation angle.

  For example, the electronic components shown in FIG. 11 (the electronic components 5 corresponding to the cells of coordinates X5 and Y2 in the component suction posture table shown in FIG. 12, the fifth row from the left of the tray 32 shown in FIG. When correcting the rotation angle of the electronic component 5) housed in the controller 110, as shown in FIG. 13, the controller 110 performs correction to rotate the electronic component 5 by 90 ° counterclockwise using the suction nozzle 64. Then, the controller 110 mounts the electronic component 5 whose angle is corrected on the printed circuit board P (S34) (an example of a mounting process), and returns to S22 to execute the process of S22.

  As described above, in the mounting method of the electronic component 5 according to the present embodiment, when the mounting process of the electronic component 5 is not performed, that is, when the surface mounter 1 is in the conveyance state or the standby state, The rotation angle of each electronic component 5 is recognized in advance, and the recognized rotation angle is stored. In the mounting process, the electronic component 5 storing the rotation angle is compared with a preset rotation angle. At this time, if the rotation angle read from the component orientation storage table is different from a preset rotation angle (correct rotation angle), the electronic component 5 to be mounted in the mounting operation is corrected to the preset rotation angle. Thus, each electronic component 5 is mounted on the printed circuit board P at a preset rotation angle. For this reason, it is possible to prevent or suppress the electronic component 5 from being mounted on the printed circuit board P in the wrong direction. Further, since the recognition process is performed when the mounting process is not performed (when in the transport state or the standby state), the process for recognizing the rotation angle of the electronic component 5 is performed by the mounting process of the electronic component 5 by the component mounting apparatus 40. Does not affect time. As described above, in the mounting method of the present embodiment, it is possible to prevent or suppress the electronic component 5 from being mounted on the printed board P in the wrong direction without affecting the mounting cycle time.

  Moreover, in the mounting method of the electronic component 5 of this embodiment, the mounting on the printed circuit board P of the electronic component 5 whose rotation angle could not be recognized in the recognition step is skipped in the mounting step. This prevents the electronic component 5 whose rotation angle could not be recognized from being mounted on the printed circuit board P. Therefore, the electronic component 5 whose rotation angle could not be recognized is mounted on the printed circuit board P in the wrong direction. Can be prevented or suppressed. As a result, the rotation angle set in advance can be set for all the electronic components 5 mounted on the printed circuit board P.

  Moreover, in the mounting method of the electronic component 5 of this embodiment, the rotation angle of a several electronic component is recognized by the recognition process according to the order (priority) mounted on the printed circuit board P at a mounting process. That is, the rotation angle of the electronic component 5 that is mounted in the mounting process is recognized first in the recognition process. For this reason, the number of electronic components 5 in which the mounting process is performed before the recognition process is performed can be suppressed. Thereby, the number of the electronic components 5 in which the rotation angle is recognized can be increased, and the electronic components 5 can be further prevented or suppressed from being mounted on the printed circuit board P in the wrong direction.

  Further, according to the surface mounter 1 of the present embodiment, the controller 110 determines the rotation angle of the plurality of electronic components 5 held by the tray 32 by the angle recognition camera C2 when the mounting process of the electronic components 5 is not performed. Recognize. Then, the controller 110 stores the rotation angle recognized by the angle recognition camera C2 in the mounting program storage unit 112. Further, the controller 110 reads the rotation angle from the mounting program storage unit 112 for the electronic component storing the rotation angle, and compares the read rotation angle with a preset rotation angle. At this time, when the rotation angle stored in the mounting program storage unit 112 is different from the preset rotation angle, the controller 110 corrects the electronic component 5 to be mounted to the preset rotation angle. Thus, each electronic component 5 is mounted on the printed circuit board P at a preset rotation angle. Thereby, it can prevent thru | or suppress that the electronic component 5 is mounted on the printed circuit board P in the wrong direction. Further, since the controller 110 recognizes the rotation angle of the electronic component 5 while the electronic component 5 is not being mounted, the controller 110 does not affect the mounting cycle time of the electronic component 5 by the component mounting apparatus 40. The rotation angle of the component 5 can be recognized. As described above, in the surface mounter 1 of the present embodiment, it is possible to prevent or suppress the electronic component 5 from being mounted on the printed circuit board P in the wrong direction without affecting the mounting cycle time. .

<Other embodiments>
The present invention is not limited to the embodiments described above and with reference to the drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the above embodiment, the imaging position at which the alignment mark is imaged is compared with a preset rotation angle, and the difference between the two rotation angles is stored in the component orientation storage table, so that the electronic component can be used in the mounting process. However, the configuration and method for mounting the electronic component by correcting it to the correct rotation angle are not limited. For example, storing the rotation angle recognized by the angle recognition camera without comparing with a preset rotation angle, and comparing the stored rotation angle with a preset rotation angle when mounting an electronic component Thus, the electronic component may be mounted with a correct rotation angle.

(2) In the above-described embodiment, the configuration in which the angle recognition camera recognizes the rotation angles of the electronic components one by one is illustrated, but the angle recognition camera may simultaneously recognize the rotation angles of a plurality of electronic components. Good.

(3) In the above embodiment, the configuration in which the rotation angle of each electronic component is recognized by imaging the alignment mark attached to each electronic component with the angle recognition camera is exemplified. However, the rotation angle of each electronic component is recognized. The configuration and method for doing so are not limited. Any configuration and method may be used as long as the rotation angle of each electronic component can be recognized by the angle recognition camera.

(4) In the above-described embodiment, a configuration in which one tray supply device is arranged around the base is illustrated, but a configuration in which a plurality of tray supply devices are arranged around the base may be used. . In this case, while the electronic component is not mounted on the printed circuit board, the operation of recognizing the rotation angle of the electronic component in the tray is performed on the plurality of trays accommodated by each of the plurality of tray supply devices. Also good.

(5) In the above embodiment, the configuration in which the recognition process and the storage process are performed when the surface mounter is in the transport state or the standby state is illustrated. However, the recognition process and the storage process are performed by the surface mounter. Any configuration may be used as long as it is not (when not mounted). For example, the surface mounter may be configured to transit to other states other than the transport state, standby state, and mount state, and the surface mounter may be configured to perform recognition processing and storage processing when the surface mounter is in the other state. Good.

(6) In addition to the above embodiment, the configuration of the surface mounter can be changed as appropriate.

  As mentioned above, although embodiment of this invention was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  In addition, the technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

DESCRIPTION OF SYMBOLS 1 ... Surface mounter 5 ... Electronic component 10 ... Base 20 ... Conveyor 30 ... Tray supply apparatus 32 ... Tray 33 ... Support surface 40 ... Component supply apparatus 110 ... Controller 112 ... Mounting program memory | storage part C1 ... Board | substrate recognition camera C2 ... Angle recognition camera P ... Printed circuit board

Claims (4)

A base, a tray for holding a plurality of electronic components on a support surface, a tray supply device that accommodates the plurality of trays and supplies the tray onto the base, and a substrate is transported onto the base A surface mounter comprising: a transfer device; a component mounting device for mounting the electronic component on the substrate; and an angle recognition device for recognizing a rotation angle about an axis perpendicular to the support surface of the electronic component. A method of mounting electronic components using:
A mounting step of mounting the electronic component on the substrate by the component mounting apparatus;
A recognition step of recognizing the rotation angles of the plurality of electronic components held by the tray by the angle recognition device when the mounting step is not performed;
A storage step of storing a value based on the result recognized in the recognition step ,
In the recognition step, the rotation angles of a plurality of the electronic components are recognized according to the order of mounting on the substrate in the mounting step,
In the mounting step, for the electronic component whose rotation angle has been recognized in the recognition step, the electronic component has a rotation angle around the axis set in advance on the substrate in accordance with the value stored in the storage step. Mounted by the component mounting apparatus so that
Electronic component mounting method.   The electronic component mounting method according to claim 1, wherein in the mounting step, mounting of the electronic component on which the rotation angle could not be recognized in the recognition step is skipped.   3. The method according to claim 1, wherein any one of a transport process for transporting the substrate by the transport device, a standby process for stopping transport of the substrate and mounting of the electronic component, and the mounting process is always performed. The electronic component mounting method according to any one of the above,
  The electronic component mounting method, wherein the recognition step and the storage step are performed in the transport step or the standby step.   A base, a tray for holding a plurality of electronic components on a support surface, a tray supply device that accommodates the plurality of trays and supplies the tray onto the base, and a substrate is transported onto the base A conveying device; a component mounting device that mounts the electronic component on the substrate; an angle recognition device that recognizes a rotation angle around an axis perpendicular to the support surface of the electronic component; a control device; and a storage unit A surface mounting machine comprising:
  The controller is
  When the electronic component is not mounted on the substrate, the angle recognition device recognizes the rotation angles of the plurality of electronic components held by the tray according to the order of mounting on the substrate. And storing a value based on the recognition result in the storage unit,
  The electronic component that has recognized the rotation angle by the component mounting apparatus is mounted so that the electronic component has a rotation angle around the axis set in advance on the substrate according to the stored value.
  Surface mount machine.

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