JP2001023489A - Protection switch - Google Patents

Protection switch

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Publication number
JP2001023489A
JP2001023489A JP11194363A JP19436399A JP2001023489A JP 2001023489 A JP2001023489 A JP 2001023489A JP 11194363 A JP11194363 A JP 11194363A JP 19436399 A JP19436399 A JP 19436399A JP 2001023489 A JP2001023489 A JP 2001023489A
Authority
JP
Japan
Prior art keywords
movable contact
contact plate
bimetal
temperature
protection switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11194363A
Other languages
Japanese (ja)
Inventor
Masaaki Tone
政彰 刀根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP11194363A priority Critical patent/JP2001023489A/en
Publication of JP2001023489A publication Critical patent/JP2001023489A/en
Pending legal-status Critical Current

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  • Thermally Actuated Switches (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a protection switch equipped with a bimetal having good response. SOLUTION: A protection switch is structured so that a contact material is adhered to the tip of a movable contact plate while a contact material is adhered to the tip of a stationary contact plate, and on/off are repeated in accordance with the operation of a temp./current sensing element such as bimetal. Therein the movable contact plate is given a smaller section area in the neighbourhood of the contacting position of the temp./current sensing element than the other parts.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は保護スイッチに関
し、特に、温度・電流検知素子を備える保護スイッチに
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protection switch, and more particularly, to a protection switch having a temperature / current detecting element.

【0002】[0002]

【従来の技術】携帯電話の電源電池から回路に必要な電
力を導く配線の途中には、回路故障等に起因して過電流
が流れたときに、回路及び電池の両方を保護する目的で
過電流保護スイッチが設けられている。
2. Description of the Related Art In the course of conducting electric power required for a circuit from a power supply battery of a mobile phone, an overcurrent is supplied for the purpose of protecting both the circuit and the battery when an overcurrent flows due to a circuit failure or the like. A current protection switch is provided.

【0003】図5は、上記保護スイッチの構成を簡略的
に示す構成図である。可動接点板11の基端はケース1
に固定され、該可動接点板11の先端に可動接点材12
が接着されている。一方、固定接点板21はケース1に
固定され先端の上記可動接点板11の先端の可動接点材
12に対応する位置に、固定接点材22が接着された状
態となっている。また、第1の温度(例えば70°)で
変形し、第2の温度(例えば40°)で復帰する第1の
バイメタル31が固定接点板21と可動接点板11の基
端部とに跨がって、すなわち、可動接点板11の上側に
配置された構成となっている。更に、上記第1のバイメ
タル31のケース側(可動接点板11と反対側)に、上
記第1の温度より高い第3の温度(例えば80°)で変
形し、上記第2の温度より低い第4の温度(例えば−1
0°)で復帰する第2のバイメタル32が重ねて配置さ
れるようになっている。
FIG. 5 is a configuration diagram schematically showing the configuration of the protection switch. The base end of the movable contact plate 11 is the case 1
The movable contact plate 11 is fixed to
Is glued. On the other hand, the fixed contact plate 21 is fixed to the case 1 and the fixed contact material 22 is adhered to a position corresponding to the movable contact material 12 at the tip of the movable contact plate 11 at the tip. Further, the first bimetal 31 that deforms at the first temperature (for example, 70 °) and returns at the second temperature (for example, 40 °) straddles the fixed contact plate 21 and the base end of the movable contact plate 11. That is, it is configured to be disposed above the movable contact plate 11. Further, the first bimetal 31 is deformed on the case side (the side opposite to the movable contact plate 11) at a third temperature (for example, 80 °) higher than the first temperature, and is deformed at a third temperature lower than the second temperature. 4 (for example, -1
The second bimetal 32 that returns at 0 °) is arranged in an overlapping manner.

【0004】上記構成において、回路20が正常な状態
であるときは、図4(a)に示すように、接点は閉じた
状態になっている。ここで、回路20に異常が発生して
電池30から過電流(正常状態で1〜3mA)が流れ、
可動接点板11、固定接点板21等が熱を持つようにな
ると、当然上記2枚のバイメタル31、32も加熱され
ることになる。バイメタル31が上記第1の温度になっ
たときに、図4(b)に示すように、該第1のバイメタ
ル31が変形して上記可動接点板11を押圧して上記接
点をOFFにし、上記第2の温度になったときに、該第
1のバイメタル31がもとの状態に復帰し、可動接点板
11が自己の備える弾性で接点を閉じる状態(図4
(a)の状態)に戻るようになっている。
In the above configuration, when the circuit 20 is in a normal state, the contacts are closed as shown in FIG. Here, an abnormality occurs in the circuit 20, and an overcurrent (1 to 3 mA in a normal state) flows from the battery 30,
When the movable contact plate 11, the fixed contact plate 21 and the like have heat, the two bimetals 31 and 32 are naturally heated. When the bimetal 31 reaches the first temperature, as shown in FIG. 4B, the first bimetal 31 deforms and presses the movable contact plate 11 to turn off the contact, When the temperature reaches the second temperature, the first bimetal 31 returns to the original state, and the movable contact plate 11 closes the contacts due to its own elasticity (FIG. 4).
(State of (a)).

【0005】このON→OFF→ONの状態変化は、過
電流が余り大きくない限り電池の容量がなくなるまで繰
り返されることになるが、過電流が大きいと発熱量も大
きく、上記第1の温度を越した状態が発生する。ここ
で、上記2枚のバイメタルの温度が第2の温度より高く
なると、第1のバイメタル31とともに、図4(c)に
示すように、第2のバイメタル32も変形し接点をOF
Fにし、この状態は第1のバイメタル31が復帰する第
2の温度以下になっても第2のバイメタル32で保持さ
れる。第2のバイメタル32は上記のように負の温度に
設定されているので、特殊な状態(例えば冷蔵庫入れ
る)にしない限り復帰しないことになる。
This change of state from ON to OFF to ON is repeated until the battery capacity is exhausted unless the overcurrent is too large. However, if the overcurrent is large, the amount of heat generated is large, and the first temperature is reduced. Passed state occurs. Here, when the temperature of the two bimetals becomes higher than the second temperature, the first bimetal 31 and the second bimetal 32 are deformed as shown in FIG.
F, and this state is maintained by the second bimetal 32 even when the temperature falls below the second temperature at which the first bimetal 31 returns. Since the second bimetal 32 is set at a negative temperature as described above, it will not return unless it is brought into a special state (for example, put in a refrigerator).

【0006】上記第2のバイメタル32に代えて、可動
接点板11の一部を細くしてヒューズ機能を持たせ、上
記第2の温度が近辺になると該細くした部分が溶断する
ように構成された製品もある。
In place of the second bimetal 32, a part of the movable contact plate 11 is thinned to have a fuse function, and when the second temperature is near, the thinned portion is blown. There are also products.

【0007】上記の構成において、可動接点板は弾性を
備え、バイメタルが復帰すると、自己の弾性によって接
点をONする位置に復帰する費用がある。そこで、従来
は当該可動接点板を弾性を持った材質たとえば銅−ベリ
リウムを使用するようにしていた。
In the above arrangement, the movable contact plate has elasticity, and when the bimetal returns, there is a cost to return to the position where the contact is turned ON by its own elasticity. Therefore, conventionally, an elastic material such as copper-beryllium has been used for the movable contact plate.

【0008】[0008]

【発明が解決しようとする課題】上記従来例では可動接
点板として、均一の幅の可動接点を用いている。従って
回路に異常が発生して、過電流が流れたときに可動接点
板に発生する熱は、該可動接点板の各部に分散し、例え
ば、可動接点板の基端部に熱が集中したときには、バイ
メタルの作動までに時間がかかり熱伝導率の悪いケース
に熱が蓄積し、ケースが破壊される現象が発生すること
になる。
In the above prior art, a movable contact having a uniform width is used as a movable contact plate. Therefore, when an abnormality occurs in the circuit and heat generated in the movable contact plate when an overcurrent flows, the heat is dispersed to each part of the movable contact plate, for example, when heat is concentrated at the base end of the movable contact plate. In addition, it takes a long time to operate the bimetal, and heat is accumulated in a case having poor thermal conductivity, causing a phenomenon that the case is broken.

【0009】このようにケースが破壊された場合には、
たとえ回路部分の異常が復旧しても、当該保護スイッチ
を取り替えない限り製品全体の機能が回復しないことに
なり、不都合となる。
When the case is broken in this way,
Even if the abnormality of the circuit part is restored, the function of the whole product will not be restored unless the protection switch is replaced, which is inconvenient.

【0010】[0010]

【課題を解決するための手段】本発明は上記従来の事情
に鑑みて提案されたものであって、まず、可動接点板の
先端に可動接点板を接着するとともに、固定接点板の先
端に固定接点材を接着した状態で、バイメタル等の温度
・電流検知素子の稼働に応じてON、OFFを繰り返す
保護スイッチを前提とする。
SUMMARY OF THE INVENTION The present invention has been proposed in view of the above-mentioned conventional circumstances. First, a movable contact plate is adhered to the tip of a movable contact plate and fixed to the tip of a fixed contact plate. It is assumed that a protection switch that repeats ON and OFF in accordance with the operation of a temperature / current detection element such as a bimetal in a state where the contact material is adhered.

【0011】上記構成において、上記可動接点板の上記
温度・電流検知素子の接触位置近辺の断面積を他の部分
より小さくした構成とする。
In the above configuration, a cross-sectional area of the movable contact plate in the vicinity of a contact position of the temperature / current detection element is smaller than other portions.

【0012】上記によって、当該断面積が小さい部分の
電気抵抗は可動接点板の他の部分より高くなり、異常時
にこの部分に熱が手中して発生することになる。これに
よって、該部分が接触するバイメタルにすぐに熱が伝達
され、該バイメタルの応答が破約なることになる。
As described above, the electric resistance of the portion having a small cross-sectional area becomes higher than that of the other portion of the movable contact plate, and heat is generated in this portion when an abnormality occurs. This results in the immediate transfer of heat to the bimetal contacted by the part, resulting in a diminished response of the bimetal.

【0013】[0013]

【実施の形態】図1は、本発明が適用された保護スイッ
チの構成を簡略的に示す構成図である。可動接点板11
の基端部はケース1に固定され、該可動接点板11(例
えば燐−青銅)の先端に可動接点材12(例えば銀−ニ
ッケル合金)が接着されている。また上記基端部のケー
ス1に取り付けられた部分より後端(図1上左)は当該
可動接点板11と同じ材質でケース1の外部に導出さ
れ、電池との接続のための一方のリード113を形成し
ている。
FIG. 1 is a configuration diagram schematically showing the configuration of a protection switch to which the present invention is applied. Movable contact plate 11
Is fixed to the case 1, and a movable contact material 12 (for example, a silver-nickel alloy) is bonded to a distal end of the movable contact plate 11 (for example, phosphor-bronze). The rear end (the upper left in FIG. 1) of the base end portion attached to the case 1 is led out of the case 1 with the same material as the movable contact plate 11, and one lead for connection to a battery. 113 are formed.

【0014】上記において、ケース1の下蓋1aの上記
可動接点11の取り付け位置には固定ピン2が立ち上げ
られ、一方、上記ケース1の上蓋1bの該固定ピン2に
符合する位置に設差し込み孔3が設けられ、上記固定ピ
ン2を可動接点板11の基端部後方の固定部111に設
けられたピン孔112に差し込んだ状態で、上記差し込
み孔3に上記固定ピン2を差し込むことによって、下蓋
1aと上蓋1bが固定されるようになっている。
In the above description, the fixing pin 2 is raised at the position where the movable contact 11 is mounted on the lower lid 1a of the case 1, while the fixing pin 2 is inserted and inserted into the upper lid 1b of the case 1 at a position corresponding to the fixing pin 2. A hole 3 is provided, and the fixing pin 2 is inserted into the insertion hole 3 in a state where the fixing pin 2 is inserted into a pin hole 112 provided in a fixing portion 111 behind the base end of the movable contact plate 11. , The lower lid 1a and the upper lid 1b are fixed.

【0015】更に、上記において、可動接点板11の基
端部には幅方向に渡ってくびれ部110が形成されてい
る。このくびれ部110は他の部分より僅かに厚みが小
さくなっており(例えば0.1mm厚の可動接点板が3
/100mm程度薄くなる)、またこのくびれ部の長手
方向の幅は0.1〜0.5mmである。このくびれ部1
10によって、本来は弾性が低い材料(例えば燐−青銅
を用いても)を可動接点11として用いても、後に説明
する保護スイッチとして充分に機能するに耐える弾性を
確保できる。
Further, in the above, a constricted portion 110 is formed at the base end of the movable contact plate 11 in the width direction. The constricted portion 110 has a slightly smaller thickness than the other portions (for example, a movable contact plate having a thickness of 0.1 mm is 3 mm thick).
/ 100 mm thinner), and the width of this constricted portion in the longitudinal direction is 0.1 to 0.5 mm. This constricted part 1
By using 10, even if a material having low elasticity (for example, using phosphor-bronze) is used as the movable contact 11, elasticity enough to sufficiently function as a protection switch described later can be secured.

【0016】また、上記の可動接点板11としてスポッ
ト溶接ができるだけの抵抗率を備えた材質の金属(例え
ば燐−青銅を用いても)を用いると、該可動接点板11
と該可動接点板11よりケース1の外部に導出されるリ
ードを同一材質の金属とすることができる。すなわち、
当該リードは直接電池の端子とスポット溶接によって接
続することが可能であるためである。
If the above-mentioned movable contact plate 11 is made of a metal (for example, using phosphorus-bronze) having a resistivity enough to allow spot welding, the movable contact plate 11 is used.
And the lead led out of the case 1 from the movable contact plate 11 can be made of the same material metal. That is,
This is because the lead can be directly connected to the terminal of the battery by spot welding.

【0017】一方、固定接点板21(可動接点板11と
同じ材質)はケース1の底部に固定され上記可動接点板
11の先端の可動接点材12に対応する先端の位置に固
定接点材22(可動接点材12と同じ材質)が接着され
た状態となっている。当該固定接点板21の先端はケー
ス底部より逆L字状に立ち上げられたストッパ50の基
端部に当接され、後端は同じ材質でケース1の外部に導
出されて電池との接続のための他方のリードを形成して
いる。この場合も、電池の端子とスポット溶接が可能な
程度の抵抗率を持った材質の金属を、上記固定設定板2
1とリード213とで一体にして使用することで、上記
固定設定板21とリード213を分ける必要がなくな
る。
On the other hand, the fixed contact plate 21 (the same material as the movable contact plate 11) is fixed to the bottom of the case 1 and is fixed at the position of the front end of the movable contact plate 11 corresponding to the movable contact material 12 at the front end. The same material as the movable contact material 12) is adhered. The front end of the fixed contact plate 21 is brought into contact with the base end of a stopper 50 raised in an inverted L-shape from the bottom of the case, and the rear end is drawn out of the case 1 with the same material and used for connection with a battery. The other lead is formed. Also in this case, a metal having a resistivity sufficient to enable spot welding with the battery terminal is fixed to the fixed setting plate 2.
By integrally using the lead 1 and the lead 213, there is no need to separate the fixed setting plate 21 and the lead 213.

【0018】上記ストッパ50は上記固定接点板21の
接点材22の高さより所定厚低い位置に設定されてお
り、また、可動接点材12と固定接点材22に以下に説
明する磨耗がないときに両者が当接した状態で、上記ス
トッパ50の先端と可動接点材12の下面とに間に、上
記所定厚の間隙が設けられている。すなわち、上記スト
ッパ50の先端に上記所定厚の間隙を置いて可動接点材
12の固定接点材12との非接触部分が位置するように
なっている。
The stopper 50 is set at a position lower than the height of the contact member 22 of the fixed contact plate 21 by a predetermined thickness, and when the movable contact member 12 and the fixed contact member 22 do not have the wear described below. The gap having the predetermined thickness is provided between the tip of the stopper 50 and the lower surface of the movable contact member 12 in a state where the two are in contact with each other. That is, the non-contact portion of the movable contact member 12 with the fixed contact member 12 is positioned at the tip of the stopper 50 with the gap having the predetermined thickness.

【0019】更に、第1の温度(例えば70°)で変形
し、第2の温度(例えば40°)で復帰する弓状のバイ
メタル41が該弓状の脚部がケース壁(図面上上側壁)
に当接され、腹部が可動接点板11に当接するように配
置されて、異常がない状態では該バイメタル41の弾性
で、該バイメタル41の腹部が可動接点板11を押圧す
るようになっている。これによって、該バイメタル41
は可動接点板11の先端の接点材12と、固定接点21
の先端の接点材22とが当接し、ONの状態を形成する
ようにしている。
Further, an arcuate bimetal 41 which is deformed at a first temperature (for example, 70 °) and returns at a second temperature (for example, 40 °) is formed by the arc-shaped legs formed on the case wall (upper side wall in the drawing). )
And the abdomen is disposed so as to abut the movable contact plate 11, and the abdomen of the bimetal 41 presses the movable contact plate 11 due to the elasticity of the bimetal 41 when there is no abnormality. . Thereby, the bimetal 41
Is a contact material 12 at the tip of the movable contact plate 11 and a fixed contact 21
Is in contact with the contact material 22 at the tip of the contact member to form an ON state.

【0020】上記において、可動接点板11の上記バイ
メタル41と当接部近傍116はその断面積を小さくし
抵抗が他の部分より高くなるように構成される。例え
ば、当接部近傍116の表面積が小さく構成され、例え
ば図3(a) に示すように平面視において幅を小さくす
る。また、図3(b) に示すように当該部分に衝撃を加え
て、厚みを薄くして断面積を小さくして抵抗を高くする
等である。図面上は上記のように幅を狭くするととも
に、中央部に裏側から衝撃を加えて、表面側に小突起1
15を形成し、上記衝撃による圧縮によってこの部分の
断面積を小さくして抵抗を高くしている。従って、この
部分の幅方向の抵抗が高くなり(上記のように幅方向の
寸法が小さくなるとともに衝撃を受けなかった部分の幅
が狭くなり)この部分に熱が集中するようになってい
る。
In the above description, the vicinity 116 of the contact portion between the bimetal 41 of the movable contact plate 11 is configured to have a smaller cross-sectional area and a higher resistance than other portions. For example, the surface area of the vicinity 116 of the contact portion is configured to be small, and the width is reduced in plan view, for example, as shown in FIG. Further, as shown in FIG. 3 (b), an impact is applied to the portion to reduce the thickness, reduce the cross-sectional area, and increase the resistance. In the drawing, the width is reduced as described above, and an impact is applied to the center from the back side, and the small protrusion 1 is formed on the front side.
15 is formed, and the compression by the impact reduces the cross-sectional area of this portion to increase the resistance. Therefore, the resistance in the width direction of this portion is increased (the width in the width direction is reduced as described above and the width of the portion that has not been subjected to impact is reduced), and heat is concentrated in this portion.

【0021】尚、上記の突起115の先端は直接上記バ
イメタル41の腹部に当接するようになっており、この
小突起115がない場合には、湾曲の曲率に小さい上記
バイメタル41の腹部と当該可動接点板11とが当接部
を形成しにくくなるのを防止している。
The tip of the projection 115 directly comes into contact with the abdomen of the bimetal 41. If the small projection 115 is not provided, the abdomen of the bimetal 41 having a small curvature and the movable portion of the bimetal 41 can be used. The contact plate 11 is prevented from forming a contact portion.

【0022】上記の構成において、回路20に異常が発
生して、電池より異常な電流が流れはじめ、上記バイメ
タル41の温度が上記第1の温度以上になると、図2に
示すように、該バイメタル41が変形し、上記可動接点
板11に接しなくなり、該可動接点板11は自己の弾性
で接点を開くようになっている。このとき、可動接点板
11の断面積の小さい上記バイメタル41との当接部近
傍116の温度上昇率が最も高くなり、それだけバイメ
タル41の反応も早くなる。また一旦上昇した温度が上
記第2の温度以下になると、バイメタル41の形状は再
びもとの状態に復帰し、接点はONの状態になる。
In the above configuration, when an abnormality occurs in the circuit 20 and an abnormal current starts flowing from the battery, and the temperature of the bimetal 41 becomes equal to or higher than the first temperature, as shown in FIG. 41 is deformed and no longer contacts the movable contact plate 11, and the movable contact plate 11 opens its contacts by its own elasticity. At this time, the rate of temperature rise in the vicinity 116 of the contact portion with the bimetal 41 having a small cross-sectional area of the movable contact plate 11 becomes the highest, and the reaction of the bimetal 41 becomes faster accordingly. Once the temperature rises below the second temperature, the shape of the bimetal 41 returns to the original state again, and the contacts are turned ON.

【0023】このように、回路20の異常状態が継続す
ると上記第1の温度と第2の温度の間で接点がON、O
FFを繰り返すことになる。この繰り返しが継続する
と、可動接点材12、固定接点材22ともに次第に磨耗
し、それにともなって上記所定厚の間隙が次第に小さく
なっていくことになる。そして、上記ストッパ50の先
端と、上記可動接点板12の非接触部分とが当接するま
で磨耗すると、それ以上のON、OFFは継続しなくな
り、バイメタル41が復帰した状態であっても、OFF
の状態を維持することになる。
As described above, when the abnormal state of the circuit 20 continues, the contacts are turned ON and O between the first temperature and the second temperature.
FF will be repeated. When this repetition is continued, both the movable contact material 12 and the fixed contact material 22 gradually wear, and accordingly, the gap having the predetermined thickness gradually decreases. When the tip of the stopper 50 and the non-contact portion of the movable contact plate 12 are worn until they come into contact with each other, further ON and OFF are not continued, and even when the bimetal 41 is restored, the OFF state is maintained.
Will be maintained.

【0024】また、上記バイメタルは正常状態で可動接
点板に負勢を加える(接点をONする)構成としたが、
従来のように、異常状態で可動接点板を負勢する(接点
をOFFする)構成としてもよいことは勿論である。
The bimetal is configured to apply a negative force to the movable contact plate (turn on the contact) in a normal state.
Needless to say, a configuration may be adopted in which the movable contact plate is negatively urged (contacts are turned off) in an abnormal state as in the related art.

【0025】以上説明したように、本発明によると、可
動接点板の必要な部分の温度上昇率を高くすることがで
きるのでバイメタルの反応が早くなり保護スイッチとし
て必要な機能を有効に発揮できる効果がある。
As described above, according to the present invention, the rate of temperature rise in the required portion of the movable contact plate can be increased, so that the reaction of the bimetal is accelerated and the function required as a protection switch can be effectively exhibited. There is.

【図面の簡単な説明】[Brief description of the drawings]

【図1】正常状態の本発明の断面構成図である。FIG. 1 is a sectional configuration view of the present invention in a normal state.

【図2】異常状態の断面構成図である。FIG. 2 is a sectional configuration diagram of an abnormal state.

【図3】本発明の可動接点板の平面図である。FIG. 3 is a plan view of the movable contact plate of the present invention.

【図4】従来の保護スイッチの構成図である。FIG. 4 is a configuration diagram of a conventional protection switch.

【図5】保護スイッチの使用状態を示す回路図である。FIG. 5 is a circuit diagram showing a use state of a protection switch.

【符号の説明】[Explanation of symbols]

11 可動接点板 12 可動接点材 21 固定接点板 22 固定接点材 41 バイメタル 50 ストッパ Reference Signs List 11 movable contact plate 12 movable contact material 21 fixed contact plate 22 fixed contact material 41 bimetal 50 stopper

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 可動接点板の先端に可動接点材を接着す
るとともに、固定接点板の先端に固定接点材を接着した
状態で、温度・電流検知素子の稼働に応じてON、OF
Fを繰り返す保護スイッチにおいて、 上記可動接点板の上記温度・電流検知素子との接触位置
近辺の断面積を他の部分より小さくしたこを特徴とする
保護スイッチ。
1. A state in which a movable contact material is adhered to a tip of a movable contact plate and a fixed contact material is adhered to a tip of a fixed contact plate.
A protection switch in which F is repeated, wherein a cross-sectional area of the movable contact plate near a contact position with the temperature / current detection element is smaller than other portions.
JP11194363A 1999-07-08 1999-07-08 Protection switch Pending JP2001023489A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11194363A JP2001023489A (en) 1999-07-08 1999-07-08 Protection switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11194363A JP2001023489A (en) 1999-07-08 1999-07-08 Protection switch

Publications (1)

Publication Number Publication Date
JP2001023489A true JP2001023489A (en) 2001-01-26

Family

ID=16323344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11194363A Pending JP2001023489A (en) 1999-07-08 1999-07-08 Protection switch

Country Status (1)

Country Link
JP (1) JP2001023489A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166878A (en) * 2003-12-02 2005-06-23 Matsushita Electric Ind Co Ltd Electronic component mounting equipment and tray feeder
CN117612910A (en) * 2023-11-18 2024-02-27 东莞市竞沃电子科技有限公司 Anti-impact miniature circuit breaker

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166878A (en) * 2003-12-02 2005-06-23 Matsushita Electric Ind Co Ltd Electronic component mounting equipment and tray feeder
CN117612910A (en) * 2023-11-18 2024-02-27 东莞市竞沃电子科技有限公司 Anti-impact miniature circuit breaker
CN117612910B (en) * 2023-11-18 2024-05-28 东莞市竞沃电子科技有限公司 Anti-impact miniature circuit breaker

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