JP2007158051A - Chip mounting device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip mounting device and method that improve mounting efficiency wherein a plurality of chips which are regularly arranged on one sheet are picked up by two moving heads and mounted on substrates, respectively. <P>SOLUTION: The mounting efficiency of the chip mounting device 1 is improved by alternately performing an operation to pick up a chip P1 arranged on one sheet 2 on the side of a first pickup position (b) by a first mounting head 3, and mounting it on a first substrate 5 and an operation to pick up a chip P2 arranged on the side of a second pickup position (c) by a second mounting head 4 and mount it on a second substrate 6. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip mounting apparatus and a chip mounting method for picking up chips sequentially from a sheet in which a plurality of chips are regularly arranged and mounting the chips on a substrate.

In the chip mounting field, there is known a mounting method for improving chip mounting efficiency by picking up a chip from a sheet in which a plurality of chips are regularly arranged by two transfer heads and mounting the chip on a substrate. ing. In order to realize such a mounting method, two transfer heads and a substrate are arranged for one sheet, and a chip mounting operation by the other transfer head during a chip pickup operation by one transfer head. There has been proposed a mounting apparatus and a mounting method that perform the above in parallel (for example, Patent Document 1).
JP 2005-72444 A

  In the apparatus disclosed in Patent Document 1, the movement direction of the transfer head when a chip is picked up and mounted on the substrate, and the movement direction of the sheet when the chip to be mounted is positioned at the pickup position of the transfer head. Are orthogonal to each other, it is necessary to coordinate the movement of the two transfer heads and the movement of one sheet. Therefore, controlling the two transfer heads and one sheet so that they move without waste is an important issue in improving chip mounting efficiency.

  Therefore, the present invention provides a chip mounting apparatus and a chip mounting method in which mounting efficiency is improved when a plurality of chips regularly arranged on one sheet are picked up by two transfer heads and mounted on a substrate, respectively. The purpose is to do.

  The invention according to claim 1 is provided at a position spaced apart from the substrate holding means in a second direction orthogonal to the first direction, and a substrate holding means for holding the substrate conveyed in the first direction. A sheet holding means for holding a sheet in which a plurality of chips are regularly arranged, a moving means for moving the sheet holding means in the first direction, and a first pickup position from the sheet held by the sheet holding means A first mounting head that picks up a chip and mounts it on a substrate held by the substrate holding means; and a chip is picked up at a second pickup position from the sheet held by the sheet holding means and A second mounting head to be mounted on the held substrate; and the sheet held by the sheet holding means in the first direction. The moving means is controlled so as to be positioned at the first pickup position in order from the chip arranged on the first pickup position side, and the second pickup position side in the first direction of the sheet And a control means for controlling the moving means so as to be positioned at the second pick-up position in order from the chips arranged on the chip.

According to the second aspect of the present invention, there is provided a first chip positioning step in which chips are arranged in order from a chip arranged on the first pickup position side of a sheet on which chips are regularly arranged, and the chips are regularly arranged. A second chip positioning step for positioning to the second pickup position in order from the chips arranged on the second pickup position side of the sheet, and the first chip positioning step for positioning to the first pickup position. A first pick-up process for picking up a chip with a first mounting head, and a second pick-up process for picking up a chip positioned at the second pick-up position in the second chip positioning process with a second mounting head And in the first pick-up step, the first mounting head Ri comprises a first mounting step of mounting the picked-up chip to a substrate, and a second mounting step of mounting the chips picked up by the second mounting head to the substrate at the second pickup step.

  According to a third aspect of the present invention, in the second aspect of the present invention, at least one of the second chip positioning step and the second pickup step is performed in parallel with the first mounting step. .

  According to a fourth aspect of the invention, in the second or third aspect of the invention, at least one of the first chip positioning step and the first pickup step is performed in parallel with the second mounting step. Do it.

  According to the present invention, among the chips regularly arranged on one sheet, the first mounting head sequentially picks up the chip from the side close to the first pickup position, and the second mounting head from the side close to the second pickup position. Since the pickup is sequentially picked up, the cooperation of the movement of the two mounting heads and one sheet can be rationalized to realize an efficient mounting operation.

  An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a chip mounting apparatus according to one embodiment of the present invention, FIG. 2 is a side view showing the chip mounting apparatus according to one embodiment of the present invention, and FIG. 3 is a chip according to one embodiment of the present invention. FIG. 4 is an explanatory diagram of a chip mounting operation of the chip mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a diagram of the chip mounting operation of the chip mounting apparatus according to the embodiment of the present invention. FIG. 6 is an explanatory diagram of the chip mounting operation of the chip mounting apparatus in one embodiment of the present invention, FIG. 7 is an explanatory diagram of the chip mounting operation of the chip mounting apparatus in one embodiment of the present invention, and FIG. FIG. 9 is an explanatory diagram of the pickup operation of the chip mounting apparatus according to the embodiment of the present invention. FIG. 9 is a flowchart illustrating the chip mounting operation of the chip mounting apparatus according to the embodiment of the present invention.

  1 and 2, a chip mounting apparatus 1 is an apparatus that performs an operation of sequentially picking up a plurality of chips P arranged in a sheet 2 by mounting heads 3 and 4 and mounting them on substrates 5 and 6. On one end side in the Y direction of the chip mounting apparatus 1, a pair of transport rails 7 and 8 that transport the first substrate 5 and the second substrate 6 are arranged adjacent to each other in the Y direction. In the present invention, the transport direction of the substrates 5 and 6 is the X direction, and the direction orthogonal to the substrate in the horizontal plane is the Y direction. The transfer rails 7 and 8 are configured to position and hold the first substrate 5 and the second substrate 6 at predetermined positions, and the transfer rail 7 functions as a first substrate holding unit. 8 functions as a second substrate holding means.

  A sheet holding table 9 that holds the sheet 2 is disposed on the other end side in the Y direction of the chip mounting apparatus 1 and at a position separated from the transport rail 8. The sheet holding table 9 functions as a sheet holding unit and a moving unit, and moves in the X direction on the other end side of the chip mounting apparatus 1 while holding the sheet 2 on which the chips P are regularly arranged on the upper surface. P is positioned at a predetermined position. Below the sheet holding table 9, an ejector 10 is disposed as a chip peeling assisting means. The ejector 10 includes an elevating mechanism and a horizontal movement mechanism. The mounting head 3 is configured such that an arbitrary chip among the chips P regularly arranged on the sheet 2 held by the sheet holding table is pushed up from below by a needle (not shown). 4 has a function of assisting the pickup by 4.

  A pair of Y beams 11 and 12 extending in the Y direction are disposed on the top of the chip mounting apparatus 1. X beams 13 and 14 are provided below the Y beams 11 and 12, respectively, and mounting heads 3 and 4 are attached to the lower portions of the X beams 13 and 14, respectively. The mounting heads 3 and 4 can move in the Y direction and the X direction on the upper part of the chip mounting apparatus 1 by the Y beams 11 and 12 and the X beams 13 and 14. In FIG. 1, the first mounting head 3 attached to the left first Y beam 11 and the first X beam 13 is pushed up by the needle of the ejector 10 from the sheet 2 held on the sheet holding table 9. The movement range is set so that P can be picked up by a plurality of (here, three) nozzles 3 c and mounted on the first substrate 5. The second mounting head 4 attached to the second Y beam 12 and the second X beam 14 on the right side is pushed by the needle of the ejector 10 from the sheet 2 held on the sheet holding table 9. The moving range is set so that a plurality of (here, three) nozzles 4 c can be picked up and mounted on the second substrate 6.

  A camera 15 serving as a recognition unit for recognizing the lower chip P is disposed above the chip mounting apparatus 1 and between the first Y beam 11 and the second Y beam 12. The camera 15 is attached to a camera moving mechanism 16 that extends in the Y direction, and can move in the Y direction above the sheet 2 held on the upper surface of the sheet holding table 9, so that the sheet holding table 9 moves in the X direction. The imaging range is set so that the positions of all the chips P regularly arranged on the sheet 2 can be recognized by combining with the movement.

  A lower part of the chip mounting apparatus 1 between the conveyance rail 8 and the sheet holding table 9 is a first recognition unit that recognizes the posture of the chip picked up by the first mounting head 3 and the second mounting head 4. One recognition camera 17 and a second recognition camera 18 are provided.

  Next, the configuration of the control system in the chip mounting apparatus 1 will be described. In FIG. 3, a chip suction mechanism 3 a that picks up a chip in the first mounting head 3, a chip posture changing mechanism 3 b that changes the posture of the picked-up chip, such as raising and lowering and rotation, and a chip in the second mounting head 4. A chip suction mechanism 4a for picking up the chip, a chip posture changing mechanism 4b for changing the posture of the picked-up chip, such as raising and lowering, rotation, and the transport mechanisms 7a and 8a and the holding mechanism 7b 8b, a sheet moving mechanism 9a for moving the sheet holding table 9 in the X direction, an elevating mechanism 10a and a horizontal moving mechanism 10b of the ejector 10, and a first Y beam 11 and a first X beam 13. A mounting head moving mechanism 20 and a second mounting head moving mechanism comprising the second Y beam 12 and the second X beam 14. The mechanism 21, the camera 15 and the camera moving mechanism 16, the first recognition camera 17, and the second recognition camera 18 can communicate with the control unit 30 and are stored in the storage unit 31. A predetermined operation is executed in response to a control command transmitted from the control unit 30 based on the control program.

  The storage unit 31 stores data related to pickup paths of chips regularly arranged on the sheet 2, and a control program is set so as to optimize the mounting operation in the chip mounting apparatus 1 corresponding to these. Yes. These data and control program can be input or selected in the storage unit 31 by the operation / input unit 32, and each operation in the chip mounting apparatus 1 is manually performed by the operation / input unit 32. It can be operated.

Next, a chip mounting operation in the chip mounting apparatus 1 will be described. 4 to 7 show the chip mounting operation in the chip mounting apparatus 1 in the order of steps, and FIG. 8 is a flowchart showing the chip mounting process by the first mounting head. 4 to 7, the broken line a indicates the chip recognition position a by the camera 15, the broken line b indicates the first pickup position b where the first mounting head 3 picks up the chip, and the broken line c indicates the first position. 2 shows a second pickup position c where the chip is picked up by the two mounting heads 4.

  In FIG. 4, chips are regularly arranged in a matrix in the X and Y directions on the sheet 2, and the chip P1 arranged in the m1 row and the n1 column and the chip P2 arranged in the m2 row and the n2 column are described as an example for mounting. I do. First, the sheet holding table 9 is moved in the X direction to align the n1 row of chip groups with the recognition position a (ST1). Next, when the camera 15 is moved in the Y direction, the imaging center of the camera 15 moves immediately above the chip P arranged in the n1 column, and the position of the chip P1 arranged in the m1 row is recognized (ST2). . When the position of the chip P1 to be mounted is recognized, as shown in FIG. 5, the sheet holding table 9 is moved to align the chip P1 with the first pickup position b (ST3). Next, the ejector 10 is moved in accordance with the chip P1 aligned in ST3 (ST4). Further, the first mounting head 3 is moved in accordance with the chip P1 aligned in ST3 (ST5). As a result, the ejector 10 is disposed below the chip P1, and the first mounting head 3 is disposed above the chip P1, and the chip P1 is peeled from the sheet 2 with the assistance of the ejector 10 and picked up by the first mounting head 3. (ST6). As shown in FIG. 6, the position of the chip P1 picked up by the first mounting head 3 is recognized by the first recognition camera 17 in the process of moving toward the first substrate 5 (ST7). Then, after correcting the adsorption position deviation of the chip P1, etc., as shown in FIG. 7, the chip P1 is mounted at a predetermined mounting position of the first substrate 5 (ST8).

  Since the chip mounting apparatus 1 is configured such that the first mounting head 3 and the second mounting head 4 can be moved independently of each other, the chip P1 to be mounted is picked up by the first mounting head 3. After that, the mounting operation by the second mounting head 4 can be started. The mounting process of the chip P2 by the second mounting head 4 is performed in the same manner as the mounting process of the chip P1 by the first mounting head 3, but the position is recognized by the camera 15 at the recognition position a as shown in FIG. The difference is that the chip P2 is aligned with the second pickup position c as shown in FIG.

  Therefore, in the chip mounting apparatus 1, in the step of mounting the chip P1 picked up by the first mounting head 3 on the first substrate 5 (first mounting step), the chip P2 is moved to the second pickup position c. A step of aligning (second chip positioning step) and a step of picking up the chip P2 by the second mounting head 4 (second pick-up step) can be performed in parallel. In the step of mounting the chip P2 picked up by the second mounting head 4 on the second substrate 6 (second mounting step), the step of aligning the chip P1 with the first pickup position b (first chip positioning) Step) and a step of picking up the chip P1 by the first mounting head 3 (first pickup step) can be performed in parallel.

  In this way, the step of picking up the chip P1 arranged on the first pickup position b side of one sheet 2 by the first mounting head 3 and mounting it on the first substrate 5, and the second pickup position c By alternately performing the process of picking up the chip P2 arranged on the side by the second mounting head 4 and mounting it on the second substrate 6, the mounting efficiency in the chip mounting apparatus 1 is improved.

Next, the order of picking up chips by the first mounting head 3 and the second mounting head 4 will be described. In FIG. 9, chips P are regularly arranged in a matrix in the XY direction on the sheet 2. The order of picking up the chips P regularly arranged in a matrix on the sheet 2 is roughly divided into two orders, one of which is the second pick-up position c from the first pick-up position b side in the X direction of the sheet 2. The other side picks up from the second pickup position c side in the X direction of the sheet 2 toward the first pickup position b side. An arrow q shown in FIG. 9 exemplifies a part of the first path for picking up from the first pickup position b side toward the second pickup position c side, and an arrow r indicates the second pickup position. A part of the second path for picking up from the position c side toward the first pickup position b side is illustrated.

  By controlling the movement of the first mounting head 3 in the Y direction and the movement of the sheet 2 in the X direction, the first mounting head 3 is illustrated by an arrow q at the first pickup position b. The chip P is picked up along the path 1. Further, by controlling the movement of the second mounting head 4 in the Y direction and the movement of the sheet 2 in the X direction, the second mounting head 4 moves along the second path exemplified by the arrow r. Pick up chip P.

  As described above, the chips P regularly arranged on one sheet 2 are sequentially picked up by the first mounting head 3 from the side close to the first pickup position b, and the second from the side close to the second pickup position c. By sequentially picking up by the mounting head 4, the cooperation of the movement of the two mounting heads 3, 4 and one sheet 2 is streamlined, and the wasteful movement in the X direction of the sheet 2 is eliminated and efficient mounting is achieved. realizable. Further, since the mounting heads 3 and 4 pick up the chip P from the side close to the mounting heads 3 and 4, the pick-up impossible area in the sheet 2 due to the restriction of the movable area in the X direction of the mounting heads 3 and 4 and the sheet 2 is minimal. Therefore, it is possible to suppress the remaining of the chip P. Thereby, it is easy to cope with an increase in the size of the sheet 2.

  Note that the configuration and mounting operation of the above chip mounting apparatus are one embodiment of the present invention, and the present invention is not limited to the above description. For example, the chip P may be mounted on the same substrate by the first mounting head 3 and the second mounting head 4.

  According to the chip mounting apparatus and the chip mounting method of the present invention, since the cooperation between the movement of two mounting heads and one sheet can be rationalized and an efficient mounting operation can be realized, a plurality of chips are arranged from a regularly arranged sheet. This is useful in the field where chips are sequentially picked up and mounted on a substrate.

The top view which shows the chip mounting apparatus in one embodiment of this invention The side view which shows the chip mounting apparatus in one embodiment of this invention 1 is a configuration diagram of a control system of a chip mounting apparatus according to an embodiment of the present invention. Explanatory drawing of chip | tip mounting operation | movement of the chip | tip mounting apparatus in one embodiment of this invention Explanatory drawing of chip | tip mounting operation | movement of the chip | tip mounting apparatus in one embodiment of this invention Explanatory drawing of chip | tip mounting operation | movement of the chip | tip mounting apparatus in one embodiment of this invention Explanatory drawing of chip | tip mounting operation | movement of the chip | tip mounting apparatus in one embodiment of this invention The flowchart which shows the mounting operation | movement of the chip | tip of the chip | tip mounting apparatus in one embodiment of this invention. Explanatory drawing of the pick-up operation | movement of the chip mounting apparatus in one embodiment of this invention

Explanation of symbols

2 sheet 3 1st mounting head 4 2nd mounting head 5 1st board | substrate 6 2nd board | substrate 7, 8 Conveyance rail (1st board | substrate holding means, 2nd board | substrate holding means)
9 Sheet holding table (sheet holding means)
9a Sheet moving mechanism (moving means)
30 Control unit (control means)
b First pick-up position c Second pick-up position P Chip

Claims (4)

Substrate holding means for holding a substrate conveyed in the first direction;
A sheet holding means for holding a sheet in which a plurality of chips are regularly arranged and provided at a position separated from the substrate holding means in a second direction orthogonal to the first direction;
Moving means for moving the sheet holding means in the first direction;
A first mounting head for picking up a chip from a sheet held by the sheet holding means at a first pickup position and mounting the chip on a substrate held by the substrate holding means;
A second mounting head for picking up a chip from the sheet held by the sheet holding means at a second pickup position and mounting the chip on the substrate held by the substrate holding means;
The moving means is controlled so that the sheet held by the sheet holding means is positioned at the first pickup position in order from the chip arranged on the first pickup position side in the first direction of the sheet. Control means for controlling the moving means so as to be positioned at the second pickup position in order from the chip arranged on the second pickup position side in the first direction of the sheet. A chip mounting device. A first chip positioning step of positioning the chips in order from the chips arranged on the first pickup position side of the sheet in which the chips are regularly arranged;
A second chip positioning step for positioning the chips in order from the chips arranged on the second pickup position side of the sheet on which the chips are regularly arranged;
A first pickup step of picking up a chip positioned at the first pickup position by the first mounting head in the first chip positioning step;
A second pickup step of picking up the chip positioned at the second pickup position in the second chip positioning step by a second mounting head;
A first mounting step of mounting the chip picked up by the first mounting head on the substrate in the first pickup step;
And a second mounting step of mounting the chip picked up by the second mounting head on the substrate in the second pickup step.   3. The chip mounting method according to claim 2, wherein at least one of the second chip positioning step and the second pickup step is performed in parallel with the first mounting step.   4. The chip mounting method according to claim 2, wherein at least one of the first chip positioning step and the first pickup step is performed in parallel with the second mounting step.

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